PIC24FJ64GA104-I/ML - 16-Bit 32MHz 64KB Flash MCU | Microchip
MPN: PIC24FJ64GA104-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.04 | $30.40 |
| 100 | $2.66 | $266.00 |
| 500 | $2.32 | $1,160.00 |
| 1,000 | $2.05 | $2,050.00 |
PIC24FJ64GA104-I/ML Overview
A 16-bit microcontroller (MCU) is a programmable processor that uses a 16-bit data path and instruction set, sitting in the hierarchy: 16-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. PIC24F devices from Microchip are mid-range 16-bit MCUs that bridge 8-bit PIC® parts and 32-bit PIC32 parts, offering higher computational throughput and richer peripherals than 8-bit parts while remaining easier to use than ARM Cortex-M parts in many low-power designs. The 'FJ' series adds nanoWatt XLP extreme low-power technology, which makes the family well suited to battery-powered products.
Key features include a 32 MHz MIPS16e core delivering up to 16 MIPS, a 10-bit ADC with up to 13 channels, multiple UART/SPI/I2C peripherals, a hardware RTCC, and nanoWatt XLP sleep currents in the microamp range. The 64 KB Flash supports self-programming and the 8 KB SRAM provides ample workspace for TCP/IP stacks such as Microchip's free MPLAB® Harmony networking libraries. The 44-QFN package provides a small 8 mm x 8 mm footprint and uses an exposed thermal pad to reduce junction-to-PCB thermal resistance for higher-power peripherals.
Architecture-wise the PIC24FJ64GA104 is built on a modified Harvard architecture with separate program Flash and data SRAM buses, plus a 16-bit instruction word that allows single-cycle 16-bit ALU operations. The peripheral set includes five 16-bit timers, comparators, a charge-time-measurement-unit (CTMU) for touch and capacitance sensing, and parallel master port (PMP) for external bus interfaces. This combination makes the part unusually flexible for its small pin count.
Typical applications include portable consumer devices, IoT sensor nodes, low-power wireless sensor hubs, industrial control panels, and USB-CDC/HID human-interface peripherals. Industrial automation front-ends, e-paper / segment LCD control, and battery-powered data loggers also commonly use this family.
Design consideration: leverage the XLP sleep modes (typically <1 uA in deep sleep with RTCC running) and use the internal 8 MHz fast RC oscillator with PLL to maximise active-mode performance while still achieving nanoWatt-level standby. Always expose the thermal pad on the QFN to a continuous ground pour with multiple thermal vias for best thermal and EMI performance.
This page synthesizes distributor pricing, drop-in alternative MPNs (with same-brand priority), and practical design notes not found in the manufacturer datasheet alone, all anchored to Microchip's published 39951C family data sheet (DS39951C).
Drop-in alternatives for PIC24FJ64GA104-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ64GA104-I/ML (same form factor and footprint) — differing in Core Architecture, ADC, Program Memory (Flash), Package, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ64GA104T-I/ML
✅ Drop-In✓ In Stock
$3.34 / Unit
View Datasheet →PIC24FJ128GA104-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FJ64GA104-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24FJ64GA004-I/PT
✅ Drop-In✓ In Stock
$3.3 / Unit
View Datasheet →PIC24FJ128GB204-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.51 / Unit
View Datasheet →PIC24FJ64GA104-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC® XLP™ 24F (16-bit MIPS16e modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (22K x 24 instructions) |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 10-bit, up to 13 channels |
| Timers | 5 x 16-bit timers (T1-T5) |
| Communication Peripherals | 2x UART, 2x SPI, 2x I2C |
| RTCC / HW Calendar | Yes |
| CTMU (Touch / Capacitance) | Yes |
| PMP / Parallel Master Port | Yes |
| Package | 44-pin QFN (8x8 mm) with exposed thermal pad |
| Mounting Type | Surface Mount (ML suffix) |
| Operating Temperature (I grade) | -40 C to +85 C |
| Low-Power Technology | nanoWatt XLP™ |
| RoHS Status | Compliant |
PIC24FJ64GA104-I/ML Pin Configuration
| Pin 1 | RA0 — Digital I/O / analog input AN0 |
| Pin 2 | RA1 — Digital I/O / analog input AN1 |
| Pin 3 | RA2 — Digital I/O / analog input AN2 / CVref |
| Pin 4 | RA3 — Digital I/O / analog input AN3 |
| Pin 5 | RA4 — Digital I/O / analog input AN4 |
| Pin 6 | RA5 — Digital I/O / analog input AN5 |
| Pin 7 | RA6 — Digital I/O / analog input AN6 / OSC2 |
| Pin 8 | RA7 — Digital I/O / analog input AN7 / OSC1 |
| Pin 9 | RB0 — Digital I/O / PGED1 programming data |
| Pin 10 | RB1 — Digital I/O / PGEC1 programming clock |
| Pin 11 | RB2 — Digital I/O / AN8 analog input |
| Pin 12 | RB3 — Digital I/O / AN9 analog input |
| Pin 13 | RB4 — Digital I/O / AN10 analog input |
| Pin 14 | RB5 — Digital I/O / AN11 analog input |
| Pin 15 | RB6 — Digital I/O / AN12 analog input |
| Pin 16 | RB7 — Digital I/O / AN13 analog input |
| Pin 17 | RB8 — Digital I/O |
| Pin 18 | RB9 — Digital I/O |
| Pin 19 | RB10 — Digital I/O |
| Pin 20 | RB11 — Digital I/O |
| Pin 21 | VSS — Ground reference |
| Pin 22 | RC0 — Digital I/O |
| Pin 23 | RC1 — Digital I/O |
| Pin 24 | RC2 — Digital I/O |
| Pin 25 | RC3 — Digital I/O |
| Pin 26 | RC4 — Digital I/O |
| Pin 27 | RC5 — Digital I/O |
| Pin 28 | RC6 — Digital I/O |
| Pin 29 | RC7 — Digital I/O |
| Pin 30 | RC8 — Digital I/O |
| Pin 31 | RC9 — Digital I/O |
| Pin 32 | VDD — Positive supply 2.0-3.6 V |
| Pin 33 | RD0 — Digital I/O / AN14 |
| Pin 34 | RD1 — Digital I/O / AN15 |
| Pin 35 | RD2 — Digital I/O / AN16 |
| Pin 36 | RD3 — Digital I/O / AN17 |
| Pin 37 | RD4 — Digital I/O / AN18 |
| Pin 38 | RD5 — Digital I/O / AN19 |
| Pin 39 | RD6 — Digital I/O / AN20 |
| Pin 40 | RD7 — Digital I/O / AN21 |
| Pin 41 | RD8 — Digital I/O / AN22 |
| Pin 42 | RD9 — Digital I/O / AN23 |
| Pin 43 | RD10 — Digital I/O |
| Pin 44 | RD11 — Digital I/O |
Typical Applications
PIC24FJ64GA104-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Portable Consumer Medical Device, Industrial Control Panel / HMI, Low-Power Wireless Sensor Hub, USB-CDC / HID Human Interface Device, Capacitive Touch Sensing Front-End.
Battery-Powered IoT Sensor Node
The PIC24FJ64GA104-I/ML is ideal for battery-powered IoT sensor nodes because its nanoWatt XLP technology delivers deep-sleep currents below 1 uA with RAM retention and a hardware RTCC ticking. With 64 KB Flash, the part can host small TCP/IP stacks or proprietary RF protocols such as LoRaWAN or Sub-GHz drivers alongside sensor drivers. The 32 MHz core performs DSP-like FFT preprocessing on vibration or acoustic sensors in active mode, then returns to deep sleep between samples for multi-year battery life on two AA cells.
Recommended
Portable Consumer Medical Device
For portable consumer medical devices such as glucose meters, pulse oximeters, and infrared thermometers, the PIC24FJ64GA104-I/ML provides 64 KB Flash for FDA-grade firmware with self-test routines, plus the CTMU peripheral for accurate thermistor measurement. The 10-bit ADC at up to 13 channels handles multiple analog sensors, while 8 KB SRAM buffers patient measurements before Bluetooth transmission. Industrial -40C to +85C temperature range covers home and clinical use cases.
Recommended
Industrial Control Panel / HMI
In industrial control panel and HMI front-ends, the PIC24FJ64GA104-I/ML drives segment LCDs or small TFTs via its PMP (parallel master port) and 8 KB SRAM enables smooth GUI rendering. Five 16-bit timers handle precise PWM generation for motor control or LED dimming, while 2x UART and 2x SPI connect to motor drivers, sensor arrays, and fieldbus bridges. The 44-QFN package fits slim panel-mount enclosures and the industrial temperature grade covers -40C to +85C factory environments.
Recommended
Low-Power Wireless Sensor Hub
As a low-power wireless sensor hub, the PIC24FJ64GA104-I/ML aggregates data from multiple SPI or I2C sensors and forwards it via UART or SPI to a Sub-GHz/BLE module. With 64 KB Flash the device can host multi-protocol sensor drivers and a lightweight RTOS such as FreeRTOS (Microchip port), while 8 KB SRAM supports buffered packet queuing during sleep. nanoWatt XLP deep sleep extends battery life between transmissions.
Recommended
USB-CDC / HID Human Interface Device
The PIC24FJ64GA104-I/ML can serve as a USB-CDC or HID device (with an external USB pull-up resistor and software stack) for HID peripherals such as numeric keypads, control surfaces, and custom input devices. 64 KB Flash hosts the USB stack and HID report descriptors, 8 KB SRAM handles boot loader and HID report buffers, and 5x USB enabled variants (PIC24FJ...GB...) can also be considered for native USB. Industrial temperature range suits test and measurement front-ends.
Recommended
Capacitive Touch Sensing Front-End
With its on-chip CTMU (charge-time measurement unit) and 8 KB SRAM for sliding-window filters, the PIC24FJ64GA104-I/ML implements up to 13 self-capacitance or mutual-capacitance touch channels for control panels and slider interfaces. The 32 MHz MIPS16e core runs Microchip's mTouch firmware in real time while still leaving Flash headroom for application logic and power management. The 44-QFN exposed thermal pad helps dissipate heat during sustained scanning of large touch matrices.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ64GA104-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ64GA104T-I/ML | PIC24FJ128GA104-I/ML | PIC24FJ64GA104-E/ML | PIC24FJ64GA004-I/PT | PIC24FJ128GB204-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-TQFP (pin-compatible 44-pin) | 44-QFN (8x8 mm) - same |
| CPU Core | PIC24F 16-bit MIPS16e @ 32 MHz | PIC24F 16-bit MIPS16e @ 32 MHz | PIC24F 16-bit MIPS16e @ 32 MHz | PIC24F 16-bit MIPS16e @ 32 MHz | PIC24F 16-bit MIPS16e @ 32 MHz | PIC24F 16-bit MIPS16e @ 32 MHz |
| Program Flash | 64 KB | 64 KB (same) | 128 KB (+100%) | 64 KB (same) | 64 KB (same) | 128 KB (+100%) |
| SRAM | 8 KB | 8 KB (same) | 8 KB (same) | 8 KB (same) | 8 KB (same) | 8 KB (same) |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +85 C |
| USB 2.0 FS OTG | No | No | No | No | No | Yes (native) |
Key Differentiators
- Industry-leading nanoWatt XLP ultra-low-power technology (vs PIC24HJ and PIC24EP families)
- Full PIC24FJ peripheral set in 44-pin package (vs PIC24FJ64GA102 (28-pin))
- On-chip CTMU for capacitive touch and capacitance sensing (vs PIC24FJ64GA008 (no CTMU))
Design Notes
The 44-QFN package exposes the central die pad on the bottom side, which must be soldered to a continuous ground pour with multiple thermal vias to achieve rated thermal performance and lowest junction-to-PCB thermal resistance. A standard pattern is a 3x3 array of 0.3 mm thermal vias on the central pad tied to the inner ground plane; this typically delivers theta_JA of 30-35 C/W, well below the 50 C/W achieved with only a small solder-fill at the center pad. For high-current or high-toggle applications, this thermal pad is mandatory.
Use a 100 nF ceramic bypass capacitor within 5 mm of the VDD pin and a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor close to the device to suppress switching-induced supply droop during PLL acquisition or peripheral bursts. For battery-powered designs, place a 10 uF bulk capacitor at the battery terminal so the PIC24FJ64GA104's nanoWatt XLP deep-sleep current does not fall through long PCB traces with high impedance. Brown-out reset (BOR) should be enabled to ensure predictable reset behavior below 2.0 V VDD.
Three common pitfalls on the PIC24FJ64GA104-I/ML: (1) forgetting that the 44-QFN package requires the exposed pad to be soldered for mechanical reliability - skipping this step causes field failures under thermal cycling. (2) Assuming /ML suffix means QFN while /PT means TQFP, but writing firmware that bit-bangs an external pin before verifying pin multiplexing - peripheral pin select (PPS) must be configured to map UART/SPI/I2C to physical pins on the 44-QFN. (3) Leaving the on-chip debug pins PGED1/PGEC1 floating on a production design - always tie them through 4.7 kohm pull-ups or leave them in their default high-impedance state with the debugger disconnected.
Route the analog pins AN0-AN23 with adjacent ground traces or ground pours to minimize digital noise coupling into the ADC. On the 44-QFN, group all AN pins (RA, RB, RD banks) on one side of the package if possible, and keep SPI/UART signals on the opposite side. Use a 4-layer PCB (signal / ground / power / signal) for best EMI performance; for 2-layer boards, dedicate the bottom layer as a continuous ground plane under the MCU and avoid routing signal traces beneath the QFN thermal pad area.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 not applicable for industrial-grade part - AEC-Q100 qualified variants exist in PIC24FJ QFN with automotive qualification. Lead-free finish confirmed. Halogen-free status not stated in retrieved excerpts; refer to Microchip material declaration. Conflict minerals compliant per Microchip standard reporting.