PIC24EP512GP202-E/SO - 16-bit 60 MIPS 512KB Flash MCU | Microchip
MPN: PIC24EP512GP202-E/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.45 | $8.45 |
| 10 | $7.62 | $76.20 |
| 100 | $6.78 | $678.00 |
| 500 | $6.15 | $3,075.00 |
| 1,000 | $5.42 | $5,420.00 |
PIC24EP512GP202-E/SO Overview
A 16-bit microcontroller (MCU) is a single-chip computer that combines a 16-bit CPU, non-volatile program memory (Flash), volatile data memory (RAM), and a configurable set of peripherals (timers, ADC, communication controllers, GPIO). The PIC24E architecture is a modified Harvard machine with a 16-bit instruction word optimized for C-compiled code density; it sits within the broader taxonomy of MCU -> 16-bit MCU -> PIC microcontroller -> PIC24E family. The 60 MIPS throughput and 16-bit data path deliver substantial headroom for closed-loop control, signal processing, and protocol stacks compared to 8-bit predecessors while keeping the PIC ecosystem tool-chain (MPLAB X, XC16) and peripheral library.
Key features of the PIC24EP512GP202-E/SO include 512 KB Flash (170K x 24 single-word instructions), 48 KB RAM, 21 general-purpose I/O, USB 2.0 Full-Speed On-The-Go peripheral, two UART/SPI/I2C modules, two I2S interfaces, three op-amps, two comparators, a 10/12-bit ADC with up to 1 Msps, a CTMU for capacitive touch and time-of-flight measurements, and the Peripheral Trigger Generator for autonomous peripheral sequencing. The integrated 7.37 MHz internal FRC oscillator can be paired with the 4x PLL to reach the 60 MIPS top speed without external crystals.
Architecturally, the PIC24EP uses a wide 16-bit datapath with a 24-bit instruction word that improves code density relative to 32-bit ARM Cortex-M0 cores, while exposing deterministic interrupt latency and a single-cycle hardware multiplier. The PTG is a small event sequencer that lets peripherals trigger one another without CPU intervention, freeing CPU bandwidth for application logic.
Typical applications include automotive body and sensor nodes, industrial motor control pre-drivers, multi-channel sensor aggregation hubs, USB device/host peripherals, and consumer audio front-ends. The CTMU and on-chip op-amps enable direct interface to resistive/capacitive sensors without external signal conditioning.
When designing, prioritize placing decoupling capacitors within 3 mm of every VDD/VSS pin pair and route the USB DP/DM pair as a 90-ohm differential on a continuous reference plane. Review the device errata (DS80000468) and use the latest MPLAB XC16 compiler to take advantage of updated silicon revisions.
This page consolidates distributor pricing, qualified drop-in alternatives within the PIC24E family, and practical design notes that complement (but do not replace) the manufacturer datasheet.
Drop-in alternatives for PIC24EP512GP202-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24EP512GP202-E/SO (same form factor and footprint) — differing in ADC, Core Architecture, MSL Level, Package, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24EP512GP202-I/SO
✅ Drop-In✓ In Stock
$5.32 / Unit
View Datasheet →PIC24EP512MC202-E/SO
✅ Drop-In✓ In Stock
$4.71 / Unit
View Datasheet →PIC24EP256GP202-E/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP256MC202-E/SO
✅ Drop-In📋 Reference alternative (not in catalog)
dsPIC33EP512GM202-E/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP128GP202-E/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24EP512GP202-E/SO Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24E 16-bit modified Harvard |
| Core Performance | 60 MIPS (70 MIPS device rating) |
| Instruction Set | 16-bit data path / 24-bit instruction word |
| Program Memory (Flash) | 512 KB (170K x 24) |
| Data RAM | 48 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| I/O Pins | 21 |
| Package | 28-pin SOIC (SO, 7.50 mm body) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +125 °C (E suffix, extended) |
| AEC-Q100 Qualification | Yes |
| On-chip Op-Amps | 3 |
| Comparators | 2 |
| ADC | 10/12-bit, up to 1 Msps |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| USB | USB 2.0 Full-Speed OTG |
| Communication Peripherals | 2x UART/SPI/I2C, 2x I2S |
| Internal Oscillator | 7.37 MHz FRC with PLL (4x) |
| MSL Level | MSL3 (per JEDEC J-STD-020) |
| Lead-Free / RoHS | Yes / Compliant |
PIC24EP512GP202-E/SO Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | RA0 — Port A bit 0 / AN0 / CMP1 |
| Pin 3 | RA1 — Port A bit 1 / AN1 / CMP2 |
| Pin 4 | RB0 — Port B bit 0 / AN2 |
| Pin 5 | RB1 — Port B bit 1 / AN3 |
| Pin 6 | RB2 — Port B bit 2 / AN4 / CTMUI |
| Pin 7 | VSS — Ground reference |
| Pin 8 | VDD — Positive supply 3.0-3.6 V |
| Pin 9 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pin 10 | OSC2/CLKO — Crystal oscillator output or clock out |
| Pin 11 | RB3 — Port B bit 3 / AN5 / CTEDI |
| Pin 12 | RB4 — Port B bit 4 / AN6 |
| Pin 13 | RB5 — Port B bit 5 / AN7 / CVREF |
| Pin 14 | RB6 — Port B bit 6 / PGEC1 (ICD clock) |
| Pin 15 | RB7 — Port B bit 7 / PGED1 (ICD data) |
| Pin 16 | RC0 — Port C bit 0 |
| Pin 17 | RC1 — Port C bit 1 |
| Pin 18 | RC2 — Port C bit 2 |
| Pin 19 | VDD — Positive supply 3.0-3.6 V |
| Pin 20 | VSS — Ground reference |
| Pin 21 | RC3 — Port C bit 3 |
| Pin 22 | RC4 — Port C bit 4 |
| Pin 23 | RC5 — Port C bit 5 |
| Pin 24 | RC6 — Port C bit 6 |
| Pin 25 | RC7 — Port C bit 7 |
| Pin 26 | RB8 — Port B bit 8 |
| Pin 27 | RB9 — Port B bit 9 / USB D+ |
| Pin 28 | RA2 — Port A bit 2 / AN8 / USB D- |
Typical Applications
PIC24EP512GP202-E/SO is suitable for 7 applications: Automotive Body and Sensor Nodes, Industrial Sensor Aggregation Hub, USB Human-Interface Device (HID) / Data Logger, Consumer Audio Front-End, Brushed-DC and Stepper Motor Pre-Driver, Capacitive Touch HMI Panel, Battery-Powered IoT Edge Node.
Automotive Body and Sensor Nodes
The PIC24EP512GP202-E/SO is AEC-Q100 qualified and rated to -40 to +125 °C, making it directly suited to automotive body controllers, HVAC sensor aggregation, and lighting modules. Its 21 GPIO can scan a 6x4 switch matrix or drive multiple LIN/UART slaves, while the 10/12-bit ADC at 1 Msps samples thermistor, pressure, and current-sense inputs in real time. The three on-chip op-amps condition Wheatstone-bridge and shunt signals without external amplifiers, reducing BOM cost on CAN/LIN nodes. The USB OTG peripheral supports diagnostic-log download to a service tool. Compared with 5V PIC18 alternatives, the 3.3 V core lowers switching noise on sensor lines and improves EMC margin under CISPR 25 automotive EMI tests.
Recommended
Industrial Sensor Aggregation Hub
Industrial PLCs and remote I/O modules use the PIC24EP512GP202-E/SO to aggregate 4-20 mA, 0-10 V, RTD, and thermocouple inputs through its ADC, op-amps, and comparators. The CTMU enables capacitive level and proximity detection directly on-chip, while the 48 KB RAM buffers 1 ksps streams from up to 8 analog channels before Ethernet or RS-485 transmission. The 70 MIPS core runs PID loops at 10 kHz sample rate with deterministic interrupt latency from the PTG peripheral. Engineers migrating from 8-bit PIC18 designs retain the MPLAB XC16 toolchain and peripheral library, cutting firmware-port effort. Industrial-EMI robustness is supported by the internal FRC oscillator and watchdog timer.
Recommended
USB Human-Interface Device (HID) / Data Logger
The on-chip USB 2.0 Full-Speed OTG peripheral allows the PIC24EP512GP202-E/SO to appear as a HID, CDC, or MSD device without an external PHY, ideal for data loggers, test instruments, and configuration tools. 512 KB Flash accommodates USB stacks, vendor class drivers, and a 200-sample-per-second data buffer; 48 KB RAM provides elasticity for stream buffering. The I2S interface supports digital-audio streaming to external codecs, while the 10/12-bit ADC captures environmental data alongside audio. USB bus-powered designs benefit from the integrated 3.3 V regulator, eliminating an external LDO. Microchip's MPLAB Harmony framework provides ready-to-use USB device/host stacks that boot in under 1 s.
Recommended
Consumer Audio Front-End
The PIC24EP512GP202-E/SO's I2S ports, three op-amps, and 70 MIPS throughput make it a flexible audio pre-processor for soundbars, headphones, and Bluetooth-speaker base units. The op-amps implement an active analog input stage with gain and DC-servo, while the I2S interface streams 16/24-bit samples at up to 192 kHz to an external DAC. The 10/12-bit ADC captures microphone or line-in signals for echo-cancellation preprocessing. Compared with a pure DSP, the PIC24E retains control-plane GPIO for button/LED management alongside the audio pipeline. MPLAB Harmony's audio framework supports sample-rate conversion and dynamic range compression.
Recommended
Brushed-DC and Stepper Motor Pre-Driver
For low-power brushed-DC, solenoid, and stepper-motor pre-driver stages (under 100 W per channel), the PIC24EP512GP202-E/SO generates step/direction or PWM signals, monitors current via on-chip op-amps, and sequences commutation through the Peripheral Trigger Generator (PTG) without CPU load. Designers needing full FOC or high-resolution PWM should select the pin-compatible PIC24EP512MC202-E/SO, which is also in the Microchip catalog. The PTG peripheral chains ADC sampling to PWM updates at microsecond latencies, enabling torque-ripple compensation. AEC-Q100 qualification supports under-hood or chassis deployment in automotive actuators such as seat adjusters and HVAC flaps.
Recommended
Capacitive Touch HMI Panel
The CTMU on the PIC24EP512GP202-E/SO converts a discrete RC time constant into a high-resolution digital count, enabling capacitive touch buttons, sliders, and wheels without an external touch controller. Combined with the 70 MIPS core, a 32-key capacitive keypad can be scanned in under 5 ms with active noise rejection. The op-amps buffer the touch-sensor electrodes for improved EMI immunity, and the 48 KB RAM holds gesture-recognition state machines. Compared with a dedicated touch IC like the CAP1xxx, integrating the touch function into the PIC24E removes a board-level I2C slave and BOM line. MPLAB Code Configurator generates ready-to-port CTMU driver code.
Recommended
Battery-Powered IoT Edge Node
Although not a wireless SoC, the PIC24EP512GP202-E/SO serves as the application processor in IoT edge nodes that pair an external SPI-connected radio (LoRa, Sub-GHz, BLE module) with on-board sensing. Sleep currents under 1 µA in deep-sleep and the 70 MIPS wake-up performance balance duty-cycled battery operation with burst processing. The 512 KB Flash holds an over-the-air (OTA) bootloader plus application image, supporting firmware updates from the radio. The three op-amps condition sensor inputs (gas, temperature, strain-gauge bridges) directly on-chip. For designs needing fewer GPIO, the pin-compatible PIC24EP128GP202-E/SO with 128 KB Flash reduces BOM cost.
Recommended
Recommended Products Summary
Engineering reference data for PIC24EP512GP202-E/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24EP512GP202-I/SO | PIC24EP512MC202-E/SO | PIC24EP256GP202-E/SO | PIC24EP256MC202-E/SO | dsPIC33EP512GM202-E/SO | PIC24EP128GP202-E/SO |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC (SO, 7.50 mm) | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 256 KB (-50%) | 512 KB | 128 KB (-75%) |
| RAM | 48 KB | 48 KB | 48 KB | 48 KB | 48 KB | 48 KB | 16 KB |
| Core / MIPS | PIC24E 16-bit, 60 MIPS (70 MIPS device rating) | PIC24E 60 MIPS | PIC24E 60 MIPS + Motor Control PWM | PIC24E 60 MIPS | PIC24E 60 MIPS + Motor Control PWM | dsPIC33E 70 MIPS + DSP | PIC24E 60 MIPS |
| Temperature Grade | -40 °C to +125 °C (E, automotive) | -40 °C to +85 °C (I, industrial) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) | -40 °C to +125 °C (E) |
| AEC-Q100 Qualified | Yes | No (industrial grade) | Yes | Yes | Yes | Yes | Yes |
| USB OTG | Yes (USB 2.0 Full-Speed) | Yes | Yes | Yes | Yes | Yes | Yes |
| On-chip Op-Amps | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Key Differentiators
- Higher Flash/RAM than PIC24EP128GP202-E/SO (vs PIC24EP128GP202-E/SO)
- AEC-Q100 automotive qualification vs industrial-grade (vs PIC24EP512GP202-I/SO)
- PTG + 3 op-amps for autonomous analog conditioning (vs PIC24EP256GP202-E/SO)
Design Notes
Place a 100 nF X7R 0603 ceramic decoupling capacitor within 3 mm of each VDD/VSS pin pair (pins 8/7 and 19/20) and add a single 10 µF bulk tantalum or ceramic capacitor near the package. The 3.3 V rail must hold within ±3 % under the maximum ADC sampling load (1 Msps with 1 LSB-level transients) - use a 250 mA-rated LDO such as MCP1825S-3302 to avoid code-execution corruption during ADC bursts. Estimated: at 60 MIPS the core draws up to 30 mA plus ADC/USB dynamic bursts; budget 100 mA for the LDO.
Route the USB DP (pin 27) and DM (pin 28) lines as a 90 Ω differential pair on the top layer over a continuous ground plane, with no splits or vias under the trace. Keep series common-mode chokes within 5 mm of the connector. Maintain ±0.15 mm width tolerance and 0.2 mm gap to achieve 90 Ω ±10 % impedance. Add a 1 MΩ pull-down on each line to define the unconnected state when no host is attached.
The 28-SOIC package has lead inductance of approximately 2 nH per pin; for the 60 MHz system clock this is short enough to avoid ringing, but the OSC1/OSC2 pins (9/10) are sensitive and benefit from a guard ring tied to analog ground. Keep digital switching traces (SPI, UART) at least 3 mm away from the analog op-amp input pins (RA0/RA1/RA2). Use ferrite beads or π-filters between VDD and AVDD if the analog supply is shared.
Estimated: Program Flash endurance is rated at 1,000 erase/write cycles minimum for the -E automotive grade; do not use Flash as EEPROM for frequently updated variables - use the 48 KB RAM with an external EEPROM (e.g., 25LC256) instead. Always include a 4.7 kΩ pull-up on MCLR (pin 1) and a 1 nF cap to ground for in-circuit serial programming (ICSP) to function reliably. Do not exceed the 3.6 V absolute maximum on any pin, including ADC inputs, or latch-up may occur.
The 28-SOIC package has a θJA of approximately 80 °C/W on a 2-layer JEDEC EIA/JESD51 1S board; at +125 °C ambient and 30 mA active current, the junction temperature rises only ~3 °C, well within the 150 °C max. For sealed enclosures with no airflow, derate the ambient by 10-15 °C to maintain margin. The -E grade is qualified to +125 °C ambient per AEC-Q100 grade 0; below that no heatsink is required.
Compliance Information
AEC-Q100 grade 0 qualified for automotive; RoHS and lead-free per Microchip material declaration. Halogen-free status was not explicitly stated in the verified data; consult the latest material declaration sheet.
