PIC24FJ128GA606T-I/MR - 16-bit MCU, 128KB Flash, 64-QFN | Microchip
MPN: PIC24FJ128GA606T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.6 | $5.60 |
| 10 | $5.2 | $52.00 |
| 100 | $4.62 | $462.00 |
| 500 | $4.05 | $2,025.00 |
| 1,000 | $3.65 | $3,650.00 |
PIC24FJ128GA606T-I/MR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and peripherals onto one die. The PIC24FJ family belongs to the broader 16-bit microcontroller category and to the wider power-managed embedded controller class used in industrial and consumer products. These devices execute deterministic real-time firmware while keeping quiescent current low enough for battery-powered applications.
Key features of the PIC24FJ128GA606 include 128 KB of self-programmable Flash with Live Update dual-partition support, 32 KB of SRAM for data buffering, hardware CryptoEngine options on certain family members, and a 12-bit A/D converter with multiple input channels for sensor acquisition. The on-chip USB 2.0 full-speed transceiver, multiple UART/I2C/SPI peripherals, and up to 53 general-purpose I/O pins let one device drive displays, radios, and user interfaces without external glue logic.
The PIC24FJ128GA606 is built on a CMOS process with multiple power-saving modes including Deep Sleep and Retention modes that drop current to microampere levels. Its modified Harvard architecture executes most instructions in one cycle at 32 MHz, giving 16 MIPS throughput while keeping code density high thanks to the 24-bit instruction word.
Typical applications include industrial automation controllers, portable medical and fitness devices, computer peripherals, USB human-interface devices, and battery-powered IoT sensor nodes. The dual-partition Flash enables Live Update firmware upgrades in the field without taking the system offline, which is critical for remote or service-call-free products.
When designing with this device, plan the bypass network with 100 nF ceramic capacitors near each VDD pin and a 4.7-10 uF bulk capacitor on the main rail. Decoupling placement matters because QFN packages have lead inductance that can couple switching noise into the analog reference.
This page synthesizes distributor pricing, drop-in alternative MPNs, and design notes not found in the Microchip datasheet alone, giving a single starting point for both procurement and engineering decisions.
Drop-in alternatives for PIC24FJ128GA606T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ128GA606T-I/MR (same form factor and footprint) — differing in ADC, Package, Core Architecture, Timers, MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ128GA606-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FJ128GA606-E/MR
✅ Drop-In✓ In Stock
$3.5 / Unit
View Datasheet →PIC24FJ1024GA606T-I/MR
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →PIC24FJ1024GA606-I/MR
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →PIC24FJ128GA606T-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory | 128 KB Flash (dual partition, Live Update) |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 12-bit, up to 16 channels |
| Package | 64-pin QFN (9x9 mm) |
| Pin/Package Code | MR |
| Operating Temperature | -40C to +85C (Industrial) |
| I/O Pins | Up to 53 |
| USB | USB 2.0 Full-Speed OTG |
| Serial Interfaces | Multiple UART/I2C/SPI |
| Timers | Multiple 16-bit and 32-bit |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Supply Form | Tape & Reel |
PIC24FJ128GA606T-I/MR mr Pin Configuration Guide
Pin configuration for PIC24FJ128GA606T-I/MR (mr package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24FJ128GA606T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24FJ128GA606T-I/MR is suitable for 6 applications: Industrial Automation Controller, Portable Medical and Fitness Devices, USB Human Interface Devices, Battery-Powered IoT Sensor Nodes, Computer Peripherals and Storage Devices, Consumer Display and GUI Controllers.
Industrial Automation Controller
The PIC24FJ128GA606T-I/MR fits industrial automation controllers because of its 32 MHz PIC24F core, 128 KB Flash, and 32 KB SRAM. These resources run real-time control loops and Modbus or CANopen stacks without off-chip memory. The 12-bit ADC samples analog sensor inputs directly, while the multiple UART/SPI/I2C interfaces drive motor drivers and HMI panels. The -40C to +85C industrial temperature grade and dual-partition Flash with Live Update simplify on-the-machine firmware upgrades.
Recommended
Portable Medical and Fitness Devices
The PIC24FJ128GA606T-I/MR suits portable medical and fitness devices because its Deep Sleep and Retention modes drop current into the microampere range, preserving battery life between patient measurements. The 12-bit ADC reads heart-rate and SpO2 analog front-ends, while the integrated USB Full-Speed transceiver streams logged data to a host PC for clinical review. The 32 KB RAM handles buffer and packetization without external memory.
Recommended
USB Human Interface Devices
The PIC24FJ128GA606T-I/MR drives USB Human Interface Devices because its on-chip USB 2.0 Full-Speed OTG transceiver eliminates an external PHY, saving BOM cost and PCB area. The 32 MHz core sustains HID class polling at 1 kHz without jitter, and 128 KB Flash holds composite HID stacks with manufacturer pages. Its wide operating voltage from 2.0 V to 3.6 V supports bus-powered designs directly from the USB 5 V rail after regulation.
Recommended
Battery-Powered IoT Sensor Nodes
The PIC24FJ128GA606T-I/MR is a strong fit for battery-powered IoT sensor nodes because the 16 MIPS core runs sensor fusion algorithms in active mode, then drops into microampere-level sleep to extend coin-cell life. The 12-bit ADC samples thermistor, photocell, or load-cell analog sensors directly, and multiple UART/SPI ports pair with sub-GHz radios such as the MRF89XA. Dual-partition Flash allows remote firmware updates over LoRa or Sigfox links.
Recommended
Computer Peripherals and Storage Devices
The PIC24FJ128GA606T-I/MR powers computer peripherals because it integrates USB, SD-card-friendly SPI, and 32 KB RAM for protocol buffering without external memory. The 128 KB Flash fits USB Mass Storage, HID, and vendor-class stacks side-by-side. Its industrial temperature range supports deployment in printers, scanners, and external SSDs that must operate reliably across mixed office and warehouse environments.
Recommended
Consumer Display and GUI Controllers
The PIC24FJ128GA606T-I/MR drives consumer display and GUI controllers because its 32 MHz PIC24F core drives small TFT panels via parallel or SPI interfaces, and 32 KB RAM stores frame buffers for animated icons. The 12-bit ADC supports touch-screen sampling and backlight feedback. The dual-partition Flash enables over-the-air display skin updates without taking the device offline, which improves perceived product freshness.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ128GA606T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ128GA606-I/MR | PIC24FJ128GA606-E/MR | PIC24FJ1024GA606T-I/MR | PIC24FJ1024GA606-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core Architecture | PIC24F (16-bit) | PIC24F (16-bit) - same | PIC24F (16-bit) - same | PIC24F (16-bit) - same | PIC24F (16-bit) - same |
| Maximum CPU Speed | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Program Flash | 128 KB | 128 KB - same | 128 KB - same | 1024 KB (+700%) | 1024 KB (+700%) |
| SRAM | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same | 32 KB - same |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +125C (Extended) | -40C to +85C - same | -40C to +85C - same |
| Packaging Form | Tape & Reel | Tray | Tray | Tape & Reel - same | Tray |
| Approx. Qty-1 Price (USD) | $5.60 | $5.40 (slightly lower, tray) | $6.20 (extended-temp premium) | $7.10 (larger Flash) | $6.90 |
Key Differentiators
- Tape-and-reel form factor optimized for SMT production (vs PIC24FJ128GA606-I/MR)
- Extended temperature variant available in same footprint (vs PIC24FJ128GA606-E/MR)
- Migration path to 1024 KB Flash in identical footprint (vs PIC24FJ1024GA606T-I/MR)
- Industrial -40C to +85C grade (vs PIC24FJ128GA606T-E/MR (extended))
Design Notes
Estimated: Decoupling strategy for the PIC24FJ128GA606T-I/MR should include one 100 nF 0402 ceramic cap on every VDD/AVDD pin pair, placed within 2 mm of the IC pads, plus a single 4.7 uF to 10 uF bulk cap on the main 3.3 V rail. The QFN exposed pad must be soldered to a continuous ground plane and electrically tied to GND with at least 8 thermal vias to a bottom-side copper pour to keep junction temperature under 100C at full CPU load.
Estimated: At 32 MHz and 3.3 V with all peripherals active, the PIC24FJ128GA606T-I/MR draws approximately 25-30 mA, dissipating ~85-100 mW. The 64-QFN (9x9 mm) exposed-pad package has a theta_JA around 28-32 C/W on a 4-layer JEDEC test board, so junction temperature rise above 25C ambient is roughly 2.4-3.2 C. Designers do not need a heatsink, but a continuous ground-pour under the exposed pad is mandatory for the datasheet thermal numbers to hold.
Do not skip the 4.7 uF bulk capacitor on VDD when the device drives USB peripherals - inrush during USB connect events can collapse the rail if only 100 nF caps are present. Also, ensure the MCLR pin is pulled to VDD through a 10 kohm resistor (or tied to VDD in production) because floating MCLR causes spurious resets. For USB applications, the D+/D- lines need 15 kohm pull-down resistors per USB spec; missing pulls prevent host enumeration.
Recommended: Route the USB D+ and D- traces as a 90-ohm differential pair on the top layer, with no splits in the reference plane below them. Keep the pair length-matched within 150 mil. If the design uses the analog ADC channels, isolate AGND and DGND at the device's GND pins and join them at the bulk cap ground return, or use a single-ground approach on a four-layer board. This avoids ground-loop noise coupling into ADC readings.
Compliance Information
RoHS compliant per Microchip product page. Standard industrial -40C to +85C grade; AEC-Q100 automotive variants are separate -E/MR-AEC parts in the family. Lead-free NiPdAu terminations.
