PIC32MK1024GPK064-E/MR - 120MHz MCU, 1MB Flash, USB FS | Microchip
MPN: PIC32MK1024GPK064-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.85 | $11.85 |
| 10 | $10.66 | $106.60 |
| 100 | $9.48 | $948.00 |
| 500 | $8.52 | $4,260.00 |
| 1,000 | $7.93 | $7,930.00 |
PIC32MK1024GPK064-E/MR Overview
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data memory, and programmable peripherals. The PIC32MK belongs to the 32-bit MCU family within the broader embedded processor hierarchy (MCU -> embedded processor -> semiconductor), and it is specifically an application-specific variant aimed at motor control, industrial automation, and Industrial Internet of Things (IIoT) applications. As a Cortex-M4-class alternative with on-chip FPU and DSP, it occupies the high-performance tier of 32-bit microcontrollers.
Key features include four 12-bit ADC pairs with dedicated Sample-and-Hold for simultaneous current/voltage sensing in FOC loops, four operational amplifiers for motor current amplification, eight programmable comparators, and dual CAN-FD ports enabling high-bandwidth industrial communication. Hardware cryptographic acceleration is absent, but the DSP extensions and FPU accelerate complex math in real-time control loops. The 1 MB dual-panel Flash supports Live Update, allowing firmware swap without CPU stall.
Typical applications include industrial motor control, multi-channel BLDC/PMSM motor drives, industrial automation controllers, IIoT edge nodes, and industrial USB peripherals. The wide operating temperature range of -40C to +125C makes the part suitable for harsh industrial environments, while the USB Full-Speed and CAN-FD interfaces simplify integration into industrial networking topologies.
When designing with this part, allocate PCB copper area beneath the QFN-64 exposed pad (EP) for thermal dissipation; the device draws up to approximately 100 mA active. Plan decoupling capacitors per Microchip ANTC23C guidelines, and use a 12 MHz crystal or external clock reference.
This page synthesizes distributor pricing, drop-in alternative MPNs, and application-specific design notes not consolidated in the Microchip datasheet, enabling faster BOM decision-making for industrial and motor-control designs.
Drop-in alternatives for PIC32MK1024GPK064-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MK1024GPK064-E/MR (same form factor and footprint) — differing in ADC, Package, Operating Temperature, USB, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MK1024GPK064T-E/MR
✅ Drop-In✓ In Stock
$7.85 / Unit
View Datasheet →PIC32MK1024GPK064-I/MR
✅ Drop-In✓ In Stock
$6.2 / Unit
View Datasheet →PIC32MK1024GPD064-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MK1024MCM064-E/MR
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →PIC32MK1024GPD064T-I/MR
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →PIC32MK1024GPK064-E/MR Maximum Ratings & Electrical Characteristics
| Core | MIPS32 microAptiv MCU |
| Architecture | 32-bit RISC with FPU and DSP extensions |
| Maximum Clock Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) with ECC |
| SRAM | 256 KB |
| Floating Point Unit | IEEE 754 single and double precision |
| MicroMIPS Code Compression | Yes (up to 40% smaller code size) |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Package | 64-pin QFN (9x9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (Extended, -E suffix) |
| Supply Voltage | 2.3 V to 7 V |
| USB Interface | USB 2.0 Full-Speed |
| CAN Interface | 2x CAN-FD |
| ADC | 12-bit, up to 5 MSPS, multiple pairs with dedicated S&H |
| Live Update Flash | Yes (dual-panel) |
| RoHS Status | Compliant |
PIC32MK1024GPK064-E/MR 64-pin qfn (9x9 mm) Pin Configuration Guide
Pin configuration for PIC32MK1024GPK064-E/MR (64-pin qfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MK1024GPK064-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MK1024GPK064-E/MR is suitable for 6 applications: Three-Phase PMSM/BLDC Motor Control (FOC), Industrial IIoT Edge Controller, Industrial USB Peripherals and HMI, Multi-Axis Servo Drives, Solar Inverter and Power Conversion Control, Automotive Aftermarket and Industrial Sensors.
Three-Phase PMSM/BLDC Motor Control (FOC)
The PIC32MK1024GPK064-E/MR is purpose-built for sensorless and sensored field-oriented control (FOC) of 3-phase PMSM and BLDC motors used in industrial drives, pumps, fans, and EV traction. The on-chip FPU executes Park/Clarke transforms and PID loops at full 120 MHz, while the eight dedicated PWM channels with complementary outputs and programmable dead-time directly drive a 3-phase inverter bridge. The four integrated operational amplifiers condition phase-current shunt signals, and the four 12-bit ADC pairs with dedicated sample-and-hold capture three phase currents plus DC-bus voltage simultaneously within a single PWM cycle - critical for accurate current reconstruction. Compared to software-FPU MCUs, the hardware FPU reduces ISR latency by 30-40%, enabling higher PWM switching frequencies and lower acoustic noise in variable-frequency motor control.
Recommended
Industrial IIoT Edge Controller
The PIC32MK1024GPK064-E/MR is well suited as an industrial IIoT edge node bridging sensor data to factory networks via dual CAN-FD or USB Full-Speed. Its 1 MB ECC Flash allows on-device storage of sensor-fusion algorithms, FFT routines, and edge analytics routines that compress raw data before transmission, reducing cloud bandwidth costs. The hardware FPU accelerates numerical filter kernels (FIR/IIR) running at 120 MHz, while the DSP extensions (single-cycle MAC, four 64-bit accumulators) speed up vibration-analysis transforms used in predictive-maintenance nodes. Dual CAN-FD ports let the same MCU serve as both sensor hub and actuator controller on industrial bus topologies such as CANopen or J1939. The extended -40C to +125C temperature range permits deployment in unconditioned factory cabinets and outdoor IIoT installations.
Recommended
Industrial USB Peripherals and HMI
The PIC32MK1024GPK064-E/MR's integrated USB 2.0 Full-Speed device/host/OTG controller with on-chip transceiver enables direct connection to PCs, industrial HMIs, and embedded hosts without an external PHY. The 120 MHz MIPS32 core plus FPU supports real-time graphics rendering, USB CDC class, and HID class firmware stacks concurrently. The 1 MB Flash accommodates full USB stacks plus application code with ample headroom for vendor-specific descriptors. Compared to PIC32MX parts, the 1024 KB Flash and 256 KB SRAM quadruple memory headroom for embedded USB+GUI workloads. The -40C to +125C operating range qualifies the device for industrial HMI panels and ruggedized USB peripherals.
Recommended
Multi-Axis Servo Drives
Multiple PIC32MK1024GPK064-E/MR devices can be coordinated via CAN-FD to drive multi-axis servo systems used in CNC machines, robotics, and pick-and-place automation. Each MCU handles one servo axis locally, executing a 10-20 kHz FOC current loop with sub-microsecond ISR latency thanks to the 120 MHz FPU. The on-chip 12-bit ADC with 5 MSPS sampling rate captures current and position feedback at high resolution. Dual CAN-FD ports allow one bus for command/trajectory reception from the host controller and a second bus for synchronized real-time motion feedback. The 256 KB SRAM buffers trajectory tables and diagnostic logs without external memory, simplifying multi-axis designs.
Recommended
Solar Inverter and Power Conversion Control
The PIC32MK1024GPK064-E/MR's combination of hardware FPU, DSP extensions, and 12-bit ADC with 5 MSPS sampling rate makes it a capable controller for solar micro-inverters, string inverters, and DC-DC power-conversion stages. The FPU accelerates MPPT (Maximum Power Point Tracking) algorithms, while the DSP extensions speed up control-loop math for digital PFC (Power Factor Correction) and LLC resonant converters. The eight PWM channels with programmable dead-time drive a full-bridge or totem-pole topology directly. Compared to fixed-point controllers, the hardware FPU delivers 2-3x faster MPPT convergence, improving energy harvest in partially shaded solar installations. The -40C to +125C range supports outdoor inverter enclosures.
Recommended
Automotive Aftermarket and Industrial Sensors
The PIC32MK1024GPK064-E/MR is suitable for ruggedized sensor hubs and automotive aftermarket controllers (non-safety-critical) due to its extended -40C to +125C temperature range and rich analog peripherals. Four 12-bit ADC pairs simultaneously sample multiple sensor channels (pressure, temperature, position), while the hardware FPU runs sensor-fusion algorithms to combine raw signals into calibrated outputs. The dual CAN-FD ports interface with vehicle CAN bus and a secondary diagnostic bus, while USB Full-Speed allows firmware updates and field diagnostics via laptop. Compared to PIC24FJ MCUs, the 32-bit MIPS core with FPU handles complex sensor-fusion math 4-5x faster for real-time responsiveness.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MK1024GPK064-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MK1024GPK064T-E/MR | PIC32MK1024GPK064-I/MR | PIC32MK1024GPD064-E/MR | PIC32MK1024MCM064-E/MR | PIC32MK1024GPD064T-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | MIPS32 microAptiv, 32-bit | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Max Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB ECC | 1 MB ECC | 1 MB ECC | 1 MB ECC | 1 MB ECC | 1 MB ECC |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Motor-Control PWM Set | K-variant (8 PWM + 4 op-amps) | K-variant (same) | K-variant (same) | D-variant (more ADC, fewer PWM) | MCM-variant (CAN-focused) | D-variant (more ADC) |
| FPU / DSP | FPU + DSP extensions | FPU + DSP | FPU + DSP | FPU + DSP | FPU + DSP | FPU + DSP |
Key Differentiators
- On-chip FPU + DSP extensions for vector motor control (vs PIC32MX (no FPU))
- Integrated 4 op-amps and 8 comparators eliminate external analog (vs PIC32MK1024GPD064-E/MR (D-variant))
- Extended -40C to +125C temperature range for harsh industrial (vs PIC32MK1024GPK064-I/MR (I-grade, -40C to +85C))
- Dual CAN-FD controllers for redundant industrial networking (vs PIC32MK1024MCM064-E/MR (MCM, single CAN-FD focus))
Design Notes
The 64-pin QFN (9x9 mm) package dissipates up to approximately 1.5 W peak during FOC current loops with all peripherals active. Solder the exposed thermal pad (EP) to a continuous ground copper pour of at least 1 square inch on the top and bottom PCB layers connected by thermal vias (8-12 vias, 0.3 mm drill). Without EP soldering, junction temperature can rise 40-60C above ambient at full load. Estimated: theta_JA on 4-layer JEDEC test board is approximately 28 C/W; solder EP to copper pour reduces theta_JA to ~15 C/W. For enclosed industrial cabinets with ambient up to 85C, design for junction below 110C by adequate PCB copper or heatsinking.
Place a 10 uF bulk capacitor and 100 nF decoupling capacitor within 5 mm of every VDD/VDDCORE pin pair. Per Microchip ANTC23 guidelines, use separate analog and digital ground planes joined at a single point near the MCU. The four 12-bit ADC inputs are noise-sensitive; route analog traces away from PWM outputs and clock lines, and guard them with ground traces. The 12 MHz crystal reference (or external clock) traces must be kept short (<10 mm) and surrounded by ground pour. Differential pair routing is required for the USB DP/DM lines per USB 2.0 Full-Speed specification, with 90 ohm differential impedance.
Avoid using the PIC32MK1024GPK064-E/MR's ADC in single-shot mode for FOC motor control - always use simultaneous sampling on paired ADCs (AN0/AN1, AN2/AN3, AN4/AN5) to capture all three phase currents at the same instant; sequential sampling introduces current measurement skew that destabilizes the FOC loop. The four on-chip op-amps have a limited slew rate (~10 V/us) unsuitable for very high di/dt motor currents above ~30 A peak; use external current-sense amplifiers for high-current drives. Always configure the live-update Flash dual panels before deploying firmware to fielded units; without proper configuration, firmware updates will require CPU reset.
The CAN-FD signals require a CAN transceiver IC (e.g. MCP2518FD); the MCU only has the CAN protocol controller, not the physical-layer transceiver. Match PCB trace impedance to 120 ohm differential for the CAN bus and add proper termination (120 ohm at each end of the bus). For USB Full-Speed, route DP/DM as a 90 ohm differential pair with length matching within 2 mm. Keep PWM outputs short to minimize switching noise; gate drivers like MCP8021 should be placed within 25 mm of the MCU. Use 4-layer PCB stack-up with continuous ground plane beneath high-speed signals to control EMI per IEC 61000-6-2 industrial EMC standards.
Compliance Information
RoHS compliant per Microchip product documentation. Not AEC-Q100 qualified (industrial MCU, not automotive grade; Microchip automotive parts use different suffixes). Operating temperature -40C to +125C is qualified per Microchip's PIC32MK family industrial specifications. Halogen-free packaging available; verify specific lot halogen status with Microchip for compliance with IEC 61249-2-21.
