PIC32MX130F256DT-V/ML - 40MHz 32-bit MCU 256KB Flash | Microchip
MPN: PIC32MX130F256DT-V/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.71 | $3.71 |
| 10 | $3.5 | $35.00 |
| 100 | $3.1 | $310.00 |
| 500 | $2.75 | $1,375.00 |
| 1,000 | $2.45 | $2,450.00 |
PIC32MX130F256DT-V/ML Overview
A 32-bit microcontroller (MCU) is an integrated circuit combining a 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. PIC32MX parts sit in Microchip's mid-range 32-bit MCU hierarchy above the 16-bit PIC24F/PIC24H family and below the higher-performance PIC32MZ and PIC32MK lines. They are commonly used as main controllers in cost-sensitive embedded designs that still require deterministic real-time response and a familiar MPLAB X IDE / Harmony development ecosystem.
Key differentiating features include Peripheral Pin Select (PPS) for flexible remapping of digital peripherals to any I/O pin, an integrated 1 ns resolution timer/capture engine, an on-chip temperature sensor, and a low-power Sleep/Idle mode that drops the core current well below the typical 0.5 mA/MHz active figure. The 256 KB Flash supports self-programming via dual Flash panels, enabling robust in-field firmware updates without external boot memory.
Architecturally, the device pairs a single-issue 5-stage MIPS M4K pipeline with a multi-channel DMA controller and a 16-channel hardware PMP, allowing efficient data movement between USB, ADC, PMP graphics memory, and SRAM without CPU intervention. The USB 2.0 full-speed OTG PHY is embedded, eliminating the external transceiver often required on competing MCUs.
Typical applications include automotive body electronics, USB peripherals and Human Interface Devices, capacitive touch user interfaces, low-cost graphics displays, and general-purpose embedded control nodes that benefit from USB connectivity plus 32-bit performance. When laying out the PCB, designers should connect the exposed pad (EP) of the QFN to a continuous ground copper pour to achieve the datasheet-specified thermal and electrical performance and to provide a low-impedance ground return for the high-speed USB signals.
Drop-in alternatives for PIC32MX130F256DT-V/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX130F256DT-V/ML (same form factor and footprint) — differing in ADC, Package, USB, Core Architecture, Data Memory (SRAM).
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No drop-in alternatives available for this product.
Request AlternativesPIC32MX130F256DT-V/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz |
| Performance | 52 DMIPS |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Operating Temperature Range | -40C to +105C (AEC-Q100 Grade 3) |
| Package | 44-pin QFN-EP (8x8 mm) |
| ADC | 10-bit, up to 28 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG (embedded PHY) |
| I2S / SPI Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| Timers | 5 x 16-bit, 2 x 32-bit |
| Parallel Master Port (PMP) | Yes, 16-bit |
| mTouch Capacitive Touch Hardware | Yes |
| On-chip Temperature Sensor | Yes |
| DMA Channels | 4 |
| Active Current (Typical) | 0.5 mA/MHz |
| RoHS Status | Compliant |
PIC32MX130F256DT-V/ML 44-pin qfn-ep (8x8 mm) Pin Configuration Guide
Pin configuration for PIC32MX130F256DT-V/ML (44-pin qfn-ep (8x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX130F256DT-V/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX130F256DT-V/ML is suitable for 6 applications: Automotive Body Electronics, USB Human Interface Devices, Capacitive Touch User Interfaces, Low-Cost Graphics Display Modules, Industrial Sensor Hubs, Consumer Audio Accessories.
Automotive Body Electronics
The PIC32MX130F256DT-V/ML is a strong fit for automotive body electronics modules because its AEC-Q100 Grade 3 qualification (-40C to +105C) covers cabin and under-hood thermal environments, while the integrated USB OTG enables diagnostic interfaces and media playback. The 40 MHz MIPS M4K core delivers 52 DMIPS, which is sufficient for body control tasks like CAN-style message handling, motor PWM for seat/mirror actuators, and lighting fade algorithms. The 256 KB Flash supports complex LIN/J1939 stacks, while 16 KB SRAM buffers sensor data and USB HID descriptors for service tools. The 44-pin QFN-EP (8x8 mm) keeps PCB area small for tightly packed BCM modules, and the Parallel Master Port drives small graphical HMI displays directly. PPS flexibility shortens the schematic-to-layout cycle when assigning UART/I2C to automotive-grade transceivers.
Recommended
USB Human Interface Devices
The PIC32MX130F256DT-V/ML is purpose-built for USB HID applications such as keyboards, mice, game controllers, custom joysticks, and barcode scanners. The integrated USB 2.0 Full-Speed OTG PHY removes the need for an external transceiver, shrinking BOM cost and PCB area. The 256 KB Flash holds full HID stacks with bootloaders, while 16 KB SRAM buffers HID report queues. The 40 MHz core ensures low-latency HID polling intervals, which is critical for gaming peripherals and industrial input devices. The 10-bit 1 Msps ADC supports analog joystick and trigger sampling. PPS allows engineers to remap USB D+/D- to optimized package pins for signal integrity. The -V AEC-Q100 grade is a bonus for automotive cockpit HMI designs.
Recommended
Capacitive Touch User Interfaces
The PIC32MX130F256DT-V/ML integrates Microchip's mTouch capacitive touch hardware, enabling direct sensor scanning without an external touch IC. The CTMU peripheral combined with PPS allows up to 28 touch channels on the 44-pin QFN, supporting sliders, wheels, and matrix keypads. The 40 MHz core runs noise-robust touch algorithms such as Microchip's mTouch libraries with sub-millisecond scan rates. The 256 KB Flash stores touch profiles and gesture recognition firmware, while 16 KB SRAM buffers raw sensor data for DSP filtering. AEC-Q100 Grade 3 qualification permits use in automotive dashboards and appliance controls where reliable touch performance is required over wide temperature ranges. The 8x8 mm QFN package fits behind glass panels with thin overlay support.
Recommended
Low-Cost Graphics Display Modules
The PIC32MX130F256DT-V/ML includes a 16-bit Parallel Master Port (PMP) capable of driving small graphical TFT LCDs up to 480x272 pixels without an external graphics controller. The 40 MHz core refreshes the display at 30+ Hz with 8bpp or 16bpp color depths, and the 4-channel DMA offloads framebuffer updates to keep the CPU free for user interface logic. 256 KB Flash can store font tables and UI assets, while 16 KB SRAM holds the active framebuffer or page buffers for partial updates. USB OTG allows the display module to be updated from a host PC. The small 44-pin QFN-EP (8x8 mm) package enables integration into compact HMI panels for industrial, medical, and consumer appliances.
Recommended
Industrial Sensor Hubs
The PIC32MX130F256DT-V/ML serves as an industrial sensor hub, aggregating data from I2C sensors, SPI ADCs, and UART instruments and forwarding it via USB or PMP. The two I2C, two SPI, and two UART peripherals connect to multiple sensors simultaneously, and the 4-channel DMA moves conversion data without CPU intervention. The 256 KB Flash runs protocol stacks like Modbus RTU, while 16 KB SRAM buffers time-stamped sensor frames. AEC-Q100 Grade 3 qualification plus the wide -40C to +105C range allow deployment in factory floors, outdoor cabinets, and process control. The on-chip temperature sensor provides cold-junction compensation for thermocouple interfaces. The QFN-EP exposed pad provides the thermal path required for continuous 0.5 mA/MHz active operation.
Recommended
Consumer Audio Accessories
The PIC32MX130F256DT-V/ML is well suited to consumer audio accessories like USB headsets, audio control surfaces, and digital mixers. The two I2S modules interface directly to low-cost audio codecs, and the 10-bit ADC handles analog level meters and potentiometer scanning. The 40 MHz MIPS M4K core runs DSP-style volume and EQ processing at low latency, while 256 KB Flash stores user presets and audio processing graphs. USB Full-Speed OTG enables USB Audio Class 1.0 device operation without external transceivers. PPS routing keeps the schematic clean by remapping I2S clocks to optimal PCB traces. The small QFN-EP package fits into slim form-factor accessories while maintaining the thermal headroom required for sustained operation.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX130F256DT-V/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX130F256D-V/ML |
|---|---|---|
| Package | 44-pin QFN-EP (8x8 mm) | 44-pin QFN-EP (8x8 mm) |
| Brand | Microchip Technology | Microchip Technology |
| Flash | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB |
| Max CPU Frequency | 40 MHz | 40 MHz |
| Temperature Grade | -40C to +105C (AEC-Q100) | -40C to +105C (AEC-Q100) |
| USB OTG | Yes (integrated PHY) | Yes (integrated PHY) |
| AEC-Q100 Qualified | Yes | Yes |
Key Differentiators
- Only drop-in alternative in same 44-pin QFN-EP footprint and automotive grade (vs PIC32MX130F256D-V/ML)
- Integrated USB 2.0 OTG with embedded PHY (vs PIC32MX130F256B-V/ML)
- AEC-Q100 Grade 3 automotive qualification (vs PIC32MX130F256DT-I/PT)
Design Notes
The 44-pin QFN-EP package dissipates heat through the exposed pad, which must be soldered to a continuous ground copper pour with multiple thermal vias for datasheet-compliant thermal resistance. At 40 MHz and 3.3V, typical active current is around 20 mA (0.5 mA/MHz x 40 MHz), giving roughly 66 mW core dissipation; combined with I/O drive, total package dissipation stays well within the QFN-EP thermal envelope as long as the EP is properly soldered. Without proper EP soldering, junction temperature can exceed 105C and trigger thermal shutdown in AEC-Q100 environments.
Route the USB D+ and D- differential pair with 90 ohm differential impedance, length-matched within 150 mils, and keep them clear of switching signals like PWM outputs. Place the 12 MHz or 48 MHz crystal within 200 mils of the OSC1/OSC2 pins with a grounded guard ring. Decouple VDD with a 0.1 uF ceramic capacitor close to every supply pin and a single bulk 10 uF tantalum or ceramic on the main 3.3V rail. The exposed pad must connect to ground with at least 9 thermal vias for proper heat sinking.
Do not exceed 3.6V on any VDD pin - the PIC32MX130 is a 3.3V part, not 5V tolerant on most I/O. When migrating from PIC24F to PIC32MX, ensure C code is recompiled with the XC32 compiler; PIC24 object files are not binary-compatible. PPS configuration must be completed before any peripheral is enabled, otherwise the peripheral will hang waiting for the input/output function to be assigned. The T suffix in MPN denotes tape-and-reel; for prototype quantities order the non-T variant to avoid minimum order quantity constraints.
Use the on-chip voltage regulator (VCAP pin) with a 10 uF decoupling capacitor - this regulator converts 3.3V VDD to the 1.8V internal core voltage. Brown-out reset (BOR) should be enabled and configured for 2.85V minimum to prevent Flash corruption during brown-out events. Sleep mode reduces current draw to a few microamps and is useful for battery-powered USB devices; configure the on-chip low-power Sleep circuit before enabling USB suspend to meet USB 2.0 suspend current requirements of 2.5 mA maximum.
Compliance Information
AEC-Q100 Grade 3 automotive qualified per -V suffix. RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental compliance documentation.