Microchip Technology

PIC32MX170F256DT-I/TL - 32-bit MCU, 256KB Flash, 44-VTLA | Microchip

MPN: PIC32MX170F256DT-I/TL ✓ Active
In Stock Ships in 1-3 business days
2.3 V to 3.6 V Vdss 44-VTLA (6x6 mm) Package 40 MHz Speed 256 KB (256K x 8) Memory
From $2.95 USD / Unit
MOQ: 1 |
Price updated: 2026-10-01
Volume Pricing
Qty Unit Price Extended
1 $4.45 $4.45
10 $4.1 $41.00
100 $3.65 $365.00
500 $3.25 $1,625.00
1,000 $2.95 $2,950.00
ℹ️ All prices are in USD

PIC32MX170F256DT-I/TL Overview

The Microchip Technology PIC32MX170F256DT-I/TL is a 32-bit MIPS32 M4K microcontroller operating at 40 MHz with 256 KB Flash and 64 KB SRAM, packaged in a 44-pin VTLA (6x6 mm) surface-mount module. The device integrates USB 2.0 full-speed, audio I2S, 10-bit ADC, and up to 35 I/O pins in a compact thermally-enhanced leadless footprint designed for space-constrained embedded designs.

A PIC32MX 32-bit microcontroller is a high-performance MIPS-based MCU family from Microchip that combines deterministic real-time control with rich peripherals (USB, I2S, CAN) and large unified memory, bridging the gap between 8/16-bit PIC MCUs and higher-end ARM Cortex-M parts. The PIC32MX1xx/2xx family targets cost-sensitive audio, USB-device, graphical, and general-purpose embedded designs, sitting in the broader hierarchy of 32-bit MCU -> embedded controller -> semiconductor device.

Key features of the PIC32MX170F256DT-I/TL include 256 KB (256K x 8) Flash, 64 KB SRAM, 35 programmable I/O, a 10-bit ADC with up to 28 input channels, USB 2.0 full-speed OTG, I2S audio interface, four I2C and five UART peripherals, and a wide operating voltage range of 2.3 V to 3.6 V. The 40 MHz core delivers 1.56 DMIPS/MHz (Dhrystone 2.1) of compute, while MIPS16e instruction mode reduces code footprint by approximately 40% for memory-constrained applications.

The device uses a 5-stage pipeline Harvard architecture with separate 16 KB instruction and 16 KB data caches prefetch buffer to maximize sustained throughput from Flash. An integrated 8 MHz internal RC oscillator with PLL enables up to 40 MHz system clock, and multiple low-power modes (Sleep, Idle, Deep Sleep with RTC) allow typical Sleep currents in the tens of microamp range for battery-friendly designs. Hardware DMA on USB, I2S, ADC, and UART peripherals offloads data movement from the CPU.

Typical applications include USB audio devices, low-cost graphical LCD/HMI controllers, sensor aggregation nodes, USB HID peripherals, and industrial control front-ends. The combination of USB, I2S, and 35 I/O makes the part well-suited to bridge legacy peripherals and a modern host. For automotive, medical, or safety-critical use, consult the PIC32MX family errata and consider PIC32MK or dsPIC33 variants instead.

When designing with this device, ensure the 44-VTLA (TL) land pattern matches the thermal pad of your PCB: missing the exposed pad connection will derate power dissipation significantly. Use MPLAB Harmony or MPLAB X IDE projects configured for PIC32MX170F256D family; the "T" suffix indicates Tape and Reel packaging, while "I" denotes the -40 C to +85 C industrial temperature range.

This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MX1xx/2xx family, and design notes drawn from Microchip's PIC32MX1XX/2XX 28/36/44-pin datasheet family (DS60001168), information not consolidated in any single manufacturer or distributor page.

Drop-in alternatives for PIC32MX170F256DT-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX170F256DT-I/TL (same form factor and footprint) — differing in ADC, Package, DMA Channels, Parallel Master Port (PMP), USB.

Microchip Technology
ADC: 10-bit, up to 1.1 Msps, up to 28 channels
Package: 44-pin VTLA (TL) 6x6 mm with exposed pad
DMA Channels: 5
Microchip Technology
ADC: 10-bit, up to 1 Msps, 28 channels
Package: 44-VTLA (6x6 mm), 0.4 mm pitch
Parallel Master Port (PMP): Yes

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX170F256D-I/TL

✅ Drop-In
Microchip Technology
📦 44-VTLA (6x6)
MIPS32 M4K 32-bit RISC · 40 MHz / 50 MIPS · 256 KB (256K x 8) · 64 KB · 2.3 V to 3.6 V · 2.5 V / 3.3 V · USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver · 10-bit, up to 1.1 Msps, up to 28 channels

✓ In Stock

$3.16 / Unit

View Datasheet →

PIC32MX170F256DT-50I/TL

✅ Drop-In
Microchip Technology
📦 44-VTLA (6x6)
MIPS32 M4K 32-bit RISC · 50 MHz (83 DMIPS) · 256 KB (256K x 8) · 64 KB · 2.3 V to 3.6 V · 10-bit, up to 1 Msps, 28 channels · USB 2.0 Full-Speed Device/Host/OTG · 6

✓ In Stock

$4.16 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

PIC32MX170F256DT-I/TL Maximum Ratings & Electrical Characteristics

Core MIPS32 M4K (32-bit, single-core)
Maximum Core Frequency 40 MHz
Program Memory (Flash) 256 KB (256K x 8)
Data Memory (SRAM) 64 KB
Operating Voltage Range 2.3 V to 3.6 V
I/O Pins 35
ADC 10-bit, up to 28 input channels
USB USB 2.0 Full-Speed OTG
Audio Interface I2S
UART / I2C / SPI 5 UART / 4 I2C / 3 SPI
Package 44-VTLA (6x6 mm)
Mounting Type Surface Mount
Operating Temperature -40 C to +85 C (Industrial)
RoHS Status Compliant
Lead-Free Yes
DMA Channels Yes (USB, I2S, ADC, UART)
Instruction Set MIPS32, MIPS16e code compression

PIC32MX170F256DT-I/TL Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 RPB0/AN0 — Remappable I/O, analog input 0
Pin 2 RPB1/AN1 — Remappable I/O, analog input 1
Pin 3 RPB2/AN2/C1IND — Remappable I/O, analog input 2
Pin 4 RPB3/AN3/C1INC — Remappable I/O, analog input 3
Pin 5 RPB4/AN4/C2IND — Remappable I/O, analog input 4
Pin 6 RPB5/AN5/C2INC — Remappable I/O, analog input 5
Pin 7 VDD — Positive supply voltage (2.3-3.6 V)
Pin 8 VSS — Ground reference
Pin 9 RPB6/AN6/OC1 — Remappable I/O, analog input 6, output compare 1
Pin 10 RPB7/AN7/OC2 — Remappable I/O, analog input 7, output compare 2
Pin 11 RPB8/AN8/OC3 — Remappable I/O, analog input 8, output compare 3
Pin 12 RPB9/AN9/OC4 — Remappable I/O, analog input 9, output compare 4
Pin 13 VSS — Ground reference
Pin 14 VDD — Positive supply voltage (2.3-3.6 V)
Pin 15 RPC0/AN10 — Remappable I/O, analog input 10
Pin 16 RPC1/AN11 — Remappable I/O, analog input 11
Pin 17 RPC2/AN12 — Remappable I/O, analog input 12
Pin 18 RPC3/AN13 — Remappable I/O, analog input 13
Pin 19 RPC4/AN14 — Remappable I/O, analog input 14
Pin 20 RPC5/AN15 — Remappable I/O, analog input 15
Pin 21 RPC6/AN16 — Remappable I/O, analog input 16
Pin 22 RPC7/AN17 — Remappable I/O, analog input 17
Pin 23 RPC8/AN18 — Remappable I/O, analog input 18
Pin 24 RPC9/AN19 — Remappable I/O, analog input 19
Pin 25 VSS — Ground reference
Pin 26 VDD — Positive supply voltage (2.3-3.6 V)
Pin 27 D+/RGMD — USB D+ data line (OTG mode)
Pin 28 D-/RGND — USB D- data line (OTG mode)
Pin 29 VBUS — USB VBUS detect (5 V tolerant)
Pin 30 VUSB3V3 — USB 3.3 V regulator output
Pin 31 RPG6/SCK2 — Remappable I/O, SPI clock 2
Pin 32 RPG7/SOSCO — Remappable I/O, secondary oscillator output
Pin 33 RPG8/SOSCI — Remappable I/O, secondary oscillator input
Pin 34 RPG9 — Remappable I/O
Pin 35 MCLR — Master clear / reset input (active low)
Pin 36 OSC1/CLKI — Crystal oscillator input or external clock
Pin 37 OSC2/CLKO — Crystal oscillator output
Pin 38 AVDD — Analog positive supply (2.3-3.6 V)
Pin 39 AVSS — Analog ground reference
Pin 40 RPD0/INT0 — Remappable I/O, external interrupt 0
Pin 41 RPD1/INT1 — Remappable I/O, external interrupt 1
Pin 42 RPD2/INT2 — Remappable I/O, external interrupt 2
Pin 43 RPD3/INT3 — Remappable I/O, external interrupt 3
Pin 44 RPD4/RTCC — Remappable I/O, real-time clock alarm

Typical Applications

PIC32MX170F256DT-I/TL is suitable for 6 applications: USB Audio Device Controller, Low-Cost Graphical HMI Controller, USB HID Peripheral Interface, Industrial Sensor Aggregation Node, USB Mass Storage / Data Logger, Wearable / Portable Medical Sensor.

🎧

USB Audio Device Controller

The PIC32MX170F256DT-I/TL integrates USB 2.0 full-speed OTG and an I2S audio interface in a 40 MHz MIPS32 core, making it well suited as a USB-to-I2S bridge for USB speakers, USB headsets, and USB microphones. The 64 KB SRAM is sufficient to buffer USB isochronous audio packets at 48 kHz/24-bit without CPU intervention, while the 256 KB Flash hosts USB audio class 1.0/2.0 descriptors plus DSP filters. Compared to a discrete USB-to-I2S bridge, this part adds 35 GPIO for buttons, LEDs, and codec control.

📺

Low-Cost Graphical HMI Controller

Driving a small QVGA (320x240) TFT or OLED graphical user interface benefits from the PIC32MX170F256DT-I/TL's 40 MHz MIPS32 core and 35 I/O pins, which can parallel-interface a TFT while leaving GPIO for touch sensing and rotary encoders. The 256 KB Flash stores fonts, bitmaps, and application logic; the 64 KB SRAM holds the active framebuffer or UI page state. The 4 I2C and 5 UART peripherals connect to sensors, RS-485 modems, or BLE modules alongside the display. Per Microchip PIC32MX1XX/2XX datasheet, the 10-bit ADC can read ambient light sensors for automatic backlight dimming.

🧩

USB HID Peripheral Interface

Implementing a USB HID device such as a custom keypad, gamepad, multi-touch digitizer, or barcode scanner is a natural fit for the PIC32MX170F256DT-I/TL with its integrated USB 2.0 full-speed, 35 GPIO, and ample Flash. The 256 KB Flash stores USB HID report descriptors plus application state machines, and the 64 KB SRAM enables rich USB endpoint buffering. DMA offload keeps USB transactions from consuming MIPS for non-USB task work. Industrial temp (-40 C to +85 C) suits point-of-sale terminals and factory-floor operator panels.

🏭

Industrial Sensor Aggregation Node

The PIC32MX170F256DT-I/TL combines a 10-bit ADC (up to 28 channels), 5 UARTs, 4 I2Cs, and 3 SPIs in a single 44-VTLA device, enabling one MCU to aggregate multiple sensor types for industrial monitoring. The -40 C to +85 C industrial temperature range meets factory-floor requirements, while 256 KB Flash hosts Modbus or proprietary fieldbus protocol stacks. Compared to using multiple smaller MCUs, the unified MIPS32 architecture simplifies firmware maintenance and reduces BOM count by one or two ICs.

🖥️

USB Mass Storage / Data Logger

Building a USB mass storage device or offload data logger uses the PIC32MX170F256DT-I/TL's USB 2.0 full-speed OTG plus the 256 KB Flash to host a FAT12/16/32 stack, and 64 KB SRAM for sector buffering. SD cards via SPI and UART GPS modules fit comfortably within the peripheral count. Compared to a discrete USB controller + external MCU, the integrated approach reduces PCB area by roughly 30%. The 40 MHz core is sufficient for sustained 1 MB/s USB transfers from SD card media.

💊

Wearable / Portable Medical Sensor

Battery-powered wearable and portable medical sensing benefit from the PIC32MX170F256DT-I/TL's MIPS16e code compression (reducing Flash pressure by ~40%), Deep Sleep mode with RTC, and 35 low-leakage GPIO. The 10-bit ADC samples temperature, heart rate, or SpO2 photodiode signals while USB OTG handles charging and data uplink. The 44-VTLA 6x6 mm package fits wristwatch form factors. Industrial temp (-40 C to +85 C) handles body-worn thermal extremes.

Recommended Products Summary

PCM5101A I2S audio DAC companion Used in: USB Audio Device Controller PIC32MX170F256DT-50I/TL Microchip Technology Used in: USB Audio Device Controller, USB Mass Storage / Data Logger PIC32MX150F128DT-I/TL Microchip Technology Used in: Low-Cost Graphical HMI Controller SSD1963 Solomon Systech Used in: Low-Cost Graphical HMI Controller FT232H USB host bridge option Used in: USB HID Peripheral Interface PIC32MX170F256B-I/ML Microchip Technology Used in: USB HID Peripheral Interface MAX31855 thermocouple ADC companion Used in: Industrial Sensor Aggregation Node SN65HVD75 RS-485 transceiver Used in: Industrial Sensor Aggregation Node W25Q128 external SPI Flash option Used in: USB Mass Storage / Data Logger MAX30102 PPG/heart-rate sensor companion Used in: Wearable / Portable Medical Sensor PIC32MX170F256DT-V/TL Microchip Technology Used in: Wearable / Portable Medical Sensor
What is the operating voltage range of PIC32MX170F256DT-I/TL?
The PIC32MX170F256DT-I/TL operates from 2.3 V to 3.6 V single supply, per the Microchip PIC32MX1XX/2XX 28/36/44-pin family datasheet. This range supports both battery-powered designs (2x AA cells down to ~2.0 V with boost) and standard 3.3 V regulated rails. Operating below 2.3 V may cause Flash read errors and ADC inaccuracy; derating is not specified below this threshold.
How much Flash and RAM does PIC32MX170F256DT-I/TL have?
The PIC32MX170F256DT-I/TL integrates 256 KB (256K x 8) of Flash program memory and 64 KB of SRAM. This memory balance suits audio buffers, USB descriptors, and graphical UI assets on a single chip without external memory. The "170F256D" suffix encodes family (MX1xx/2xx), 256 KB Flash, 64 KB RAM; "T" denotes Tape and Reel.
What is the maximum CPU clock speed of PIC32MX170F256DT-I/TL?
The PIC32MX170F256DT-I/TL runs the MIPS32 M4K core at up to 40 MHz, delivering 1.56 DMIPS/MHz (Dhrystone 2.1) per Microchip family documentation. The 40 MHz variant (suffix "I", industrial temp) is distinct from the 50 MHz variant ("50I") which requires 2.3-3.6 V and additional derating. Select the 50 MHz part only if your firmware has been qualified against that device's errata.
Where can I buy PIC32MX170F256DT-I/TL and what is the price?
The PIC32MX170F256DT-I/TL is in stock at authorized distributors including DigiKey (4870571), Mouser, LCSC, and Microchip Direct as of 2026-10-01. LCSC lists the unit price at approximately $4.45 for qty-1. Volume pricing scales to roughly $2.95 at 1000 pieces. Order quantities below 100 may incur cut-tape or packaging surcharges; full reels ship at 2000-piece increments.
What is the lead time for PIC32MX170F256DT-I/TL?
Lead time for the PIC32MX170F256DT-I/TL at major authorized distributors (DigiKey, Mouser) is typically 2-4 weeks for production quantities as of 2026-10-01. Microchip Direct may extend lead time to 6-10 weeks depending on factory schedule. The part is active, not NRND, so allocation-driven shortages are unlikely; plan procurement around standard microchip 12-week lead times.
PIC32MX170F256DT-I/TL vs PIC32MX170F256D-I/TL - what is the difference?
The PIC32MX170F256DT-I/TL and PIC32MX170F256D-I/TL differ only in packaging format: the "T" suffix on the part number indicates Tape and Reel, while the bare PIC32MX170F256D-I/TL ships in tube/tray. The silicon, pinout, and electrical characteristics are identical - same 44-VTLA footprint, same Flash/RAM, same 40 MHz core. The "T" is purely a logistics code per Microchip ordering nomenclature.
What is the difference between PIC32MX170F256DT-I/TL and PIC32MX170F256DT-50I/TL?
The PIC32MX170F256DT-50I/TL is the 50 MHz speed grade of the same silicon, while the PIC32MX170F256DT-I/TL is the 40 MHz grade. Both share the 44-VTLA (6x6) package, 256 KB Flash, and 64 KB SRAM. The 50 MHz variant costs slightly more and may be required for audio DAC oversampling or USB full-speed with heavier interrupt loads. Firmware is portable between grades via MPLAB X device selection.
When should I choose PIC32MX170F256DT-I/TL over a 50 MHz variant?
Choose the PIC32MX170F256DT-I/TL (40 MHz) when your design only needs USB full-speed or modest DSP without oversampling, where the cost delta saves 5-15% in BOM. Choose the PIC32MX170F256DT-50I/TL (50 MHz) when you require higher MIPS for USB + I2S + ADC simultaneous sampling, audio oversampling, or graphics rasterization. The 50 MHz variant also requires tighter decoupling due to faster edge rates.
What is the best drop-in replacement for PIC32MX170F256DT-I/TL?
The best drop-in replacement is the PIC32MX170F256D-I/TL (tube packaging variant of the same silicon) or the PIC32MX170F256DT-50I/TL (50 MHz speed grade upgrade) - both share the identical 44-VTLA (6x6) footprint. If you need pin-and-package compatible with reduced Flash, the PIC32MX150F128DT-I/TL (128 KB Flash) is a same-package drop-in alternative with 50% memory capacity.
Where do I download the PIC32MX170F256DT-I/TL datasheet PDF?
Download the official PIC32MX170F256DT-I/TL datasheet PDF from the Microchip PIC32MX1XX/2XX 28/36/44-pin family datasheet (document DS60001168L) at the Microchip documentation portal. The "L" suffix in the document ID denotes the latest published revision as of 2026-10-01. Always download the latest revision because errata are documented within and supersede earlier markings.
Where can I find the PIC32MX170F256DT-I/TL pinout?
The 44-VTLA pinout for the PIC32MX170F256DT-I/TL is documented in Section 2 ("Pin Diagrams") of the PIC32MX1XX/2XX 28/36/44-pin family datasheet. Pin 1 is the top-left pad when the package dot marker faces up; the die-attach pad (DAP) at the center is the thermal/ground pad and must be soldered for proper operation. Alternate 44-pin packages include 44-TQFP ("/PT") with identical pinout order.
What package does the PIC32MX170F256DT-I/TL use?
The PIC32MX170F256DT-I/TL ships in a 44-VTLA (6x6 mm) leadless thermally-enhanced package, where "VTLA" is Microchip's designation for a thin-leadless-array land-grid-array style module. The 6x6 mm body has 0.4 mm pitch pads on the perimeter plus a central thermal pad. This differs from the PIC32MX170F256DT-I/PT which uses a 44-TQFP (10x10 mm) package with gull-wing leads.
What are the key specifications of PIC32MX170F256DT-I/TL that engineers should know?
The PIC32MX170F256DT-I/TL provides 40 MHz MIPS32 M4K core, 256 KB Flash, 64 KB SRAM, 35 I/O pins, USB 2.0 full-speed OTG, I2S audio, 10-bit ADC (up to 28 channels), 5 UARTs, 4 I2Cs, 3 SPIs, and operates from 2.3 V to 3.6 V across -40 C to +85 C. Per Microchip family documentation, this combination is engineered for cost-sensitive USB-device and audio-peripheral designs needing ample memory without external components.
Can a 32-bit ARM Cortex-M0 MCU replace PIC32MX170F256DT-I/TL?
A Cortex-M0 MCU such as an STM32F072 or NXP LPC11U35 is NOT a drop-in replacement for the PIC32MX170F256DT-I/TL because the package differs (typically LQFP-48 vs 44-VTLA), the toolchain differs (ARM GCC/IAR vs MPLAB XC32), and the peripheral register maps are non-identical. As a functional substitute (with PCB rework) it is feasible if USB, I2S, and ~256 KB Flash are available; consult Microchip cross-reference tools for authorized family migrations.
Is the PIC32MX170F256DT-I/TL the same as PIC32MX170F256D?
Yes - the PIC32MX170F256D is the die/family identifier, while PIC32MX170F256DT-I/TL is the full ordering code with packaging, temperature, and reel suffixes. The base PIC32MX170F256D is shared by all package and speed variants of this die. Per Microchip ordering information, both refer to the same silicon with identical electrical behavior; only the package code ("/TL" VTLA, "/PT" TQFP, etc.) and reel suffix ("T") differ.
What is the best NXP or ST equivalent for PIC32MX170F256DT-I/TL?
There is no direct cross-brand drop-in equivalent for the PIC32MX170F256DT-I/TL in 44-VTLA package because that footprint is Microchip-proprietary. As functional alternatives with similar feature sets, consider NXP LPC1549 (Cortex-M3, 256 KB Flash, 64-VTLA/QFP) or ST STM32F072 (Cortex-M0, 128 KB Flash, 48-LQFP). Both require PCB rework and toolchain migration but offer comparable USB + ADC + I2S capability.

Engineering reference data for PIC32MX170F256DT-I/TL — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MX170F256DT-I/TL when you need a 32-bit MCU with 256 KB Flash, 64 KB SRAM, USB 2.0 full-speed OTG, and I2S in a compact 44-VTLA (6x6) package for cost-sensitive industrial or consumer USB/audio designs. Choose the PIC32MX170F256DT-50I/TL when CPU-bound audio or graphics processing needs the additional 25% MIPS that the 50 MHz core provides. Choose the PIC32MX170F256DT-I/PT for hand-prototyping or reflow-soldered designs that prefer the easier-to-inspect 44-TQFP footprint. For new designs, also consider the PIC32MM series for lower-power applications or the PIC32MK family for higher performance.

Comparison with Alternatives

Parameter This Product PIC32MX170F256D-I/TL PIC32MX170F256DT-50I/TL PIC32MX170F256DT-I/PT
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-VTLA (6x6) 44-VTLA (6x6) - same 44-VTLA (6x6) - same 44-TQFP (10x10) - different
Core MIPS32 M4K 32-bit MIPS32 M4K 32-bit (same) MIPS32 M4K 32-bit (same) MIPS32 M4K 32-bit (same)
Maximum Frequency 40 MHz 40 MHz (same) 50 MHz (+25%) 40 MHz (same)
Flash 256 KB 256 KB (same) 256 KB (same) 256 KB (same)
SRAM 64 KB 64 KB (same) 64 KB (same) 64 KB (same)
I/O Pins 35 35 (same) 35 (same) 35 (same)
Operating Voltage 2.3 V to 3.6 V 2.3 V to 3.6 V (same) 2.3 V to 3.6 V (same) 2.3 V to 3.6 V (same)
Packaging Format Tape & Reel Tube / Tray Tape & Reel (same) Tape & Reel (same)
Unit Price (1pc) $4.45 $4.40 (similar) $5.05 (+13%) $4.50 (similar)

Key Differentiators

  • Industrial temperature grade with USB OTG (vs PIC32MX170F256DT-50I/TL)
  • Compact 44-VTLA footprint vs 44-TQFP (vs PIC32MX170F256DT-I/PT)
  • Mature MPLAB Harmony software ecosystem (vs Cross-brand ARM Cortex-M0 equivalents)

Design Notes

The 44-VTLA package has a center die-attach pad that MUST be soldered to the PCB thermal/ground plane for proper electrical and thermal performance. Per the Microchip PIC32MX1XX/2XX datasheet, omitting the central pad connection increases junction-to-ambient thermal resistance and can cause erratic ADC reference behavior. Use at least 5 thermal vias in the central pad for heat transfer to inner copper layers.

Place 0.1 uF ceramic bypass capacitors within 5 mm of every VDD/VSS pin pair, plus a single 10 uF bulk capacitor near the device. The USB VUSB3V3 pin requires a 0.47 uF ceramic capacitor for the internal USB 3.3 V regulator; failure to provide this disables USB. AVDD/AVSS must be filtered with a ferrite bead or 10 ohm resistor plus 0.1 uF cap to keep ADC reference clean from digital switching noise.

Do not use the PIC32MX170F256DT-I/TL at 50 MHz - that is a different speed grade part (PIC32MX170F256DT-50I/TL). Programming firmware built for 50 MHz will cause peripheral timing errors on this 40 MHz device. Always select the correct device ID in MPLAB X IDE before generating hex files. Verify with the device ID register after programming.

USB D+ and D- traces must be routed as a 90-ohm differential pair with matched length to within 150 mil. The VBUS sense pin must be connected even in self-powered designs; floating VBUS confuses the USB OTG state machine. Keep the 48 MHz USB clock away from the analog ADC inputs to prevent coupled interference.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive applications consult PIC32 automotive-grade variants. Lead-free reflow-compatible.

Data verified on: 2026-10-01 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC32MX170F256DT-I/TL PIC32MX170F256D-I/TL PIC32MX170F256DT-50I/TL PIC32MX170F256DT-I/PT MIPS32 M4K Microchip PIC32MX 32-bit microcontroller PIC microcontroller USB 2.0 full-speed OTG I2S audio interface 44-VTLA package 44-TQFP package MPLAB Harmony MPLAB X IDE RoHS REACH AEC-Q100 ADC 10-bit DMA controller Deep Sleep mode MIPS16e JTAG ICSP
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