DSPIC33EP128GP504-I/TL - 16-Bit 70 MIPS DSC, 128KB Flash | Microchip
MPN: DSPIC33EP128GP504-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.51 | $55.10 |
| 100 | $4.9 | $490.00 |
| 500 | $4.41 | $2,205.00 |
| 1,000 | $3.98 | $3,980.00 |
DSPIC33EP128GP504-I/TL Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and ease of use of a microcontroller. In the power-management hierarchy, the dsPIC33EP family sits within Microchip's 16-bit MCU/DSC portfolio, purpose-built to execute digital filter algorithms, control loops, and high-speed precision math in real time.
Key differentiating features of this part include the 70 MIPS dsPIC33E core with DSP engine, 128KB of self-programmable Flash with ECC, up to two onboard operational amplifiers, a 12-bit ADC, high-speed PWM modules suited for digital power conversion, and a CAN 2.0B interface. The rich analog front end reduces external component count in motor-control and power-supply designs.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with dedicated DSP multiply-accumulate hardware, X and Y data memories, and modulo/bit-reversed addressing for efficient FFT and FIR execution. Peripheral Trigger Generator support allows ADC sampling to be tightly coupled to PWM events, essential for deterministic closed-loop control.
Typical applications include digital power supplies (PFC, LLC), brushless DC and PMSM motor control, sensor conditioning with the onboard op amps, and general-purpose embedded control requiring CAN connectivity in industrial and automotive-adjacent systems.
Design consideration: the device operates from a single 3.3V supply and, like all dsPIC33EP parts, requires all VDD/VSS pairs to be connected and a matched PGECx/PGEDx pair used together for ICSP programming.
This page synthesizes verified distributor data, drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing references as of 2026-09-23.
Drop-in alternatives for DSPIC33EP128GP504-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GP504-I/TL (same form factor and footprint) — differing in Package, Operating Temperature, Core Performance, Flash Program Memory, Lifecycle Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GP504-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.25 / Unit
View Datasheet →DSPIC33EP64GP504-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP504-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.85 / Unit
View Datasheet →DSPIC33EP128GP504-E/TL
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP128GP504-H/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GP504T-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GP504-I/TL Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33E (16-bit DSC) |
| Core Size | 16-bit |
| Speed (MIPS) | 70 MIPS |
| Program Memory Size | 128KB (43K x 24) Flash |
| RAM Size | 16KB |
| Supply Voltage | 3.3 V |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 44-VTLA (6x6 mm) |
| Pin Count | 44 |
| Mounting Type | Surface Mount |
| Peripherals | High-Speed PWM, Op Amps, Comparators, PTG, CTMU |
| Communication Interfaces | CAN, UART, SPI, I2C |
| Onboard Op Amps | Yes |
| ADC | Yes (advanced analog) |
| Packaging | Tube |
| Lifecycle Status | In Production |
DSPIC33EP128GP504-I/TL 44-vtla (6x6 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP128GP504-I/TL (44-vtla (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GP504-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GP504-I/TL is suitable for 6 applications: Digital Power Supply Control, Brushless DC and PMSM Motor Control, Industrial CAN Networking Nodes, Sensor Signal Conditioning and Acquisition, Portable and Battery-Powered Instruments, Lighting and HID Electronic Ballasts.
Digital Power Supply Control
The DSPIC33EP128GP504-I/TL fits digital power conversion because its high-speed PWM modules offer fine duty-cycle and dead-time resolution, while the 70 MIPS DSP core closes voltage- and current-loop compensators in real time. Onboard op amps condition current-shunt signals directly, and the 12-bit ADC paired with the Peripheral Trigger Generator samples synchronously with PWM events, minimizing control-loop jitter in PFC, LLC, and buck stages. In a typical topology, the PWM drives the power stage, shunt or resistor-divider feedback enters the op amps, and the ADC triggers on PWM boundaries. The deterministic DSP pipeline sustains loop bandwidths well beyond what a general MCU achieves, and the CAN interface enables remote telemetry and firmware updates in modular power systems.
Recommended
Brushless DC and PMSM Motor Control
Sensorless BLDC and PMSM drives benefit directly from this device's combination of high-speed PWM with programmable dead time, onboard op amps for phase-current sensing, and DSP multiply-accumulate throughput for field-oriented control and sliding-mode observers. The 70 MIPS core executes Clarke/Park transforms and PI compensation with ample margin at switching frequencies typical of industrial drives. The 44-pin 6x6 mm VTLA keeps gate-drive and sensing circuitry on a compact footprint, shortening high-current loops. CTMU and comparators support over-current protection with hardware-latency responses independent of software. With 128KB Flash, full FOC firmware plus communication stacks coexist without external memory, and CAN 2.0B integrates the drive into factory fieldbus networks such as CANopen.
Recommended
Industrial CAN Networking Nodes
The integrated CAN 2.0B controller makes this DSC a strong node processor for industrial fieldbus systems. Unlike solutions requiring an external CAN transceiver MCU pair, the DSPIC33EP128GP504-I/TL handles protocol, application logic, and signal conditioning on one chip: onboard op amps filter sensor inputs, comparators provide threshold alarms, and the PTG automates routine measurement sequences without CPU intervention. The 128KB Flash accommodates CANopen or DeviceNet-style stacks alongside application code, and 16KB RAM buffers message objects. In a typical node, the DSC reads analog sensors through its ADC, executes local control, and reports over CAN at up to 1 Mbps, giving deterministic distributed control in factory automation, HVAC, and agricultural equipment.
Recommended
Sensor Signal Conditioning and Acquisition
With up to two operational amplifiers, a 12-bit ADC, comparators, and the Charge Time Measurement Unit (CTMU) integrated on-chip, the DSPIC33EP128GP504-I/TL can amplify, filter, and digitize bridge, thermistor, and current-loop signals without external analog front-end ICs. The PTG sequences ADC sampling autonomously, offloading acquisition from the CPU and producing jitter-free timestamps for flow or energy metering. The 70 MIPS DSP engine then applies calibration, linearization, and FIR/IIR filtering using hardware MAC instructions. A practical chain routes a Wheatstone bridge into the onboard op amp, samples synchronously via PTG triggers, and streams results over UART or SPI. This integration cuts BOM cost and board area in transmitters, weigh scales, and portable instrumentation.
Recommended
Portable and Battery-Powered Instruments
The 3.3V single-supply operation, small 6x6 mm VTLA package, and integrated analog make this DSC suitable for handheld meters, dataloggers, and battery instruments where board area and component count dominate. The dsPIC33EP family provides power-managed operating modes that let designers trade MIPS for current in sleep and idle states between measurements. One chip replaces MCU plus op-amp plus comparator plus timing functions, simplifying BOM and lowering quiescent overhead. The 16KB RAM buffers measurement sessions, while Flash self-programming stores calibration tables and logging data in-system. A typical handheld design wakes on a periodic timer, samples sensors through the op amp and ADC under PTG control, computes results with DSP instructions, and returns to a low-power state.
Recommended
Lighting and HID Electronic Ballasts
High-intensity discharge and LED ballast control demands precise high-frequency PWM, fast analog feedback, and protection logic - all of which the DSPIC33EP128GP504-I/TL provides in one package. Its high-speed PWM generates the resonant-tank drive with programmable dead time, comparators catch lamp fault conditions with hardware speed, and the ADC monitors lamp current and bus voltage every switching cycle via PTG-triggered sampling. The DSP core runs resonance-tracking and dimming algorithms at 70 MIPS, supporting smooth intensity control and ignition sequencing. The 44-pin 6x6 mm footprint fits compact ballast PCBs near the power stage, minimizing gate-drive noise pickup. CAN or UART links enable remote dimming and monitoring in commercial lighting installations.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GP504-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GP504-I/TL | DSPIC33EP64GP504-I/TL | DSPIC33EP128GP504-E/TL | DSPIC33EP128GP504-I/PT |
|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-TQFP (10x10 mm) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS |
| Flash Memory | 128KB (43K x 24) | 256KB | 64KB | 128KB | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C |
| Analog Peripherals | Op amps, comparators, CTMU, ADC | Op amps, comparators, CTMU, ADC | Op amps, comparators, CTMU, ADC | Op amps, comparators, CTMU, ADC | Op amps, comparators, CTMU, ADC |
| Packaging / Supply Format | Tube | Tube | Tube | Tube | Tape & Reel |
Key Differentiators
- Twice the program memory in the same footprint (vs DSPIC33EP64GP504-I/TL)
- Extended temperature capability available as a true drop-in (vs DSPIC33EP128GP504-E/TL)
- Compact 6x6 mm VTLA versus 10x10 mm TQFP (vs DSPIC33EP128GP504-I/PT)
- Cost-down path without redesign (vs DSPIC33EP32GP504-I/TL)
Design Notes
The device operates from a single 3.3V supply. Per Microchip's ICSP guidance, all VDD and VSS pin pairs on the 44-VTLA package must be connected, even if some power pins appear redundant. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2-3 mm of the pin, plus one bulk 4.7-10 uF capacitor per board. During Flash self-programming the core draws transient current spikes; undersized decoupling manifests as spurious brown-out resets that are difficult to diagnose.
The 44-VTLA is a QFN-style 6x6 mm package with a thermal pad; connect the exposed pad to a grounded copper pour with an array of vias to inner/ground layers for both thermal dissipation and EMI performance. Keep the PGECx/PGEDx programming header traces short and route them away from high-dv/dt PWM nets. Place analog sensing traces (op amp inputs, ADC channels) over a quiet ground area, physically separated from the high-speed PWM and gate-drive region of the board.
Two frequent dsPIC33EP pitfalls: (1) mismatched ICSP pairs - PGEC2 and PGED2 must be used together for programming; mixing PGEC1 with PGED2 prevents device connection and wastes debug time. (2) Footprint confusion when cross-referencing: the /TL (VTLA 6x6) and /PT (TQFP 10x10) variants of the same die are NOT footprint-compatible despite identical electrical specs. Confirm the exact package suffix before releasing the PCB. Also verify RAM allocation, since some family variants differ in SRAM size.
Estimated: for a typical digital-power control application the DSPIC33EP128GP504-I/TL dissipates well under 0.5W (core and peripherals at 70 MIPS plus I/O loads), so with the exposed-pad via array described above, junction rise stays comfortably within the -40C to +85C (I grade) envelope. For the +125C capable E-grade variant, recalculate with actual I/O sink/source currents from the datasheet electrical characteristics tables before finalizing the thermal design.
Compliance Information
Compliance data was not explicitly stated in the provided web results. Microchip standard parts are typically RoHS-compliant for current production, but verify on the official Microchip product page before export documentation.
