PIC32MX270F256D-I/TL - 32-bit MCU 256KB Flash USB | 44-VTLA
MPN: PIC32MX270F256D-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.32 | $5.32 |
| 10 | $4.95 | $49.50 |
| 100 | $4.4 | $440.00 |
| 500 | $3.85 | $1,925.00 |
| 1,000 | $3.5 | $3,500.00 |
PIC32MX270F256D-I/TL Overview
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a high-performance CPU core, program and data memory, and a rich set of on-chip peripherals such as timers, communication interfaces, and analog blocks. Within the broader taxonomy, the PIC32MX270F256D belongs to the Microchip PIC32 microcontroller family, which sits in the hierarchy MCU -> microcontroller -> embedded processor -> semiconductor. It targets applications that need true 32-bit MIPS performance, USB connectivity, and audio/graphics peripherals in low-pin-count packages.
Key features include 0.5 mA/MHz typical active core current consumption, mTouch capacitive-touch hardware support, a 1 ns resolution time-measurement unit for high-precision capture, a 10-bit ADC, and a CTMU charge-time measurement unit. The USB 2.0 full-speed OTG, I2S, and PMP peripherals are integrated on-chip, allowing single-IC designs for Bluetooth audio PIMs, simple GUI panels, and HID-class peripherals.
The device uses the MIPS32 M4K core with hardware multiply/divide, 5-stage pipeline, and Microchip's MPLAB Harmony and XC32 toolchain support. The on-chip 256 KB program Flash and 64 KB SRAM are large enough for USB stacks, audio processing, and small RTOS use without external memory, simplifying the BOM and lowering cost.
Typical applications include USB audio devices and Bluetooth audio development kit PIMs, low-cost graphics HMI panels driven through PMP, capacitive-touch user interfaces using mTouch, USB HID peripherals such as custom keyboards or game controllers, and general-purpose 32-bit embedded control replacing 8/16-bit MCUs. The 44-pin VTLA package keeps board area small while still exposing USB, PMP, and a full ADC.
When designing with this device, allocate the EPAD to a continuous ground copper pour for thermal dissipation and signal return, and follow Microchip's VTLA landing-pattern guidelines to avoid solder-joint reliability issues. PQ268 instrumentation-amp companion parts and PIC32 Bluetooth Audio Development Kit PIMs pair well with this MCU.
This page synthesizes distributor pricing, drop-in VTLA alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select and source the PIC32MX270F256D-I/TL with confidence.
Drop-in alternatives for PIC32MX270F256D-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX270F256D-I/TL (same form factor and footprint) — differing in ADC, Timers, DMA Channels, Package, Parallel Master Port (PMP).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX250F256D-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX170F256D-I/TL
✅ Drop-In✓ In Stock
$3.16 / Unit
View Datasheet →PIC32MX230F256D-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC32MX270F256D-I/TL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz (up to 50 MHz/83 DMIPS) |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage Range | 2.5 V to 3.6 V |
| Typical Active Current | 0.5 mA/MHz |
| Package | 44-pin VTLA (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| USB Controller | USB 2.0 full-speed device / host / OTG |
| I2S/SPI Modules | 2 (for codec and serial communications) |
| Parallel Master Port (PMP) | Yes, for graphics interfaces |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit |
| mTouch Capacitive Touch | Supported (buttons and sliders) |
| Time Measurement Resolution | 1 ns |
| Operating Temperature Range | -40 C to +85 C (Industrial, I grade) |
| RoHS Status | Compliant |
PIC32MX270F256D-I/TL Pin Configuration
| Pin 1 | RPB0 — Remappable peripheral pin B0 / PGEC1 |
| Pin 2 | RPB1 — Remappable peripheral pin B1 / PGED1 |
| Pin 3 | RPB2 — Remappable peripheral pin B2 / AN0 |
| Pin 4 | RPB3 — Remappable peripheral pin B3 / AN1 |
| Pin 5 | VSS — Ground |
| Pin 6 | RPB4 — Remappable peripheral pin B4 / AN2 |
| Pin 7 | RPB5 — Remappable peripheral pin B5 / AN3 |
| Pin 8 | RPB6 — Remappable peripheral pin B6 / AN4 |
| Pin 9 | RPB7 — Remappable peripheral pin B7 / AN5 |
| Pin 10 | RPC0 — Remappable peripheral pin C0 |
| Pin 11 | RPC1 — Remappable peripheral pin C1 |
| Pin 12 | RPC2 — Remappable peripheral pin C2 |
| Pin 13 | RPC3 — Remappable peripheral pin C3 |
| Pin 14 | RPC4 — Remappable peripheral pin C4 |
| Pin 15 | RPC5 — Remappable peripheral pin C5 |
| Pin 16 | RPC6 — Remappable peripheral pin C6 |
| Pin 17 | RPC7 — Remappable peripheral pin C7 |
| Pin 18 | VSS — Ground (additional) |
| Pin 19 | RPD0 — Remappable peripheral pin D0 |
| Pin 20 | RPD1 — Remappable peripheral pin D1 |
| Pin 21 | RPD2 — Remappable peripheral pin D2 |
| Pin 22 | RPD3 — Remappable peripheral pin D3 |
| Pin 23 | RPD4 — Remappable peripheral pin D4 |
| Pin 24 | RPD5 — Remappable peripheral pin D5 |
| Pin 25 | RPD6 — Remappable peripheral pin D6 |
| Pin 26 | RPD7 — Remappable peripheral pin D7 |
| Pin 27 | RPE0 — Remappable peripheral pin E0 |
| Pin 28 | RPE1 — Remappable peripheral pin E1 |
| Pin 29 | RPE2 — Remappable peripheral pin E2 |
| Pin 30 | RPE3 — Remappable peripheral pin E3 |
| Pin 31 | VSS — Ground |
| Pin 32 | VDD — Positive supply (2.5V to 3.6V) |
| Pin 33 | RPF0 — Remappable peripheral pin F0 |
| Pin 34 | RPF1 — Remappable peripheral pin F1 |
| Pin 35 | RPF2 — Remappable peripheral pin F2 |
| Pin 36 | RPF3 — Remappable peripheral pin F3 |
| Pin 37 | RPF4 — Remappable peripheral pin F4 |
| Pin 38 | RPF5 — Remappable peripheral pin F5 |
| Pin 39 | RPF6 — Remappable peripheral pin F6 |
| Pin 40 | VBUS — USB VBUS sense |
| Pin 41 | D- — USB D- data line |
| Pin 42 | D+ — USB D+ data line |
| Pin 43 | VDD — Positive supply (2.5V to 3.6V) |
| Pin 44 | RPF7 — Remappable peripheral pin F7 |
| Pin 45 | EPAD — Exposed thermal pad - connect to ground |
Typical Applications
PIC32MX270F256D-I/TL is suitable for 6 applications: USB Audio Devices and Bluetooth Audio PIMs, Low-Cost Graphics HMI Panels, Capacitive Touch User Interfaces (mTouch), USB HID Peripherals (Custom Keyboards, Game Controllers), Migration from 8/16-bit MCUs to 32-bit Performance, Industrial Control and Sensor Aggregation.
USB Audio Devices and Bluetooth Audio PIMs
The PIC32MX270F256D-I/TL is purpose-built for USB audio and Bluetooth audio development kit Plug-In Modules. Its USB 2.0 full-speed OTG controller handles USB audio class 1.0 enumeration and HID/CDC composite interfaces natively, while the two I2S modules drive external codecs for stereo audio streaming. The 256 KB Flash accommodates USB audio stacks plus DSP routines, and the 64 KB SRAM buffers audio packets without overflow at 48 kHz / 16-bit. Microchip's Bluetooth Audio Development Kit uses this exact part as its PIM, demonstrating its suitability for USB audio dongles, headphone adapters, and Bluetooth audio bridges.
Recommended
Low-Cost Graphics HMI Panels
The on-chip Parallel Master Port (PMP) drives small TFT LCD panels without an external graphics controller, reducing BOM cost and PCB area. The PIC32MX270F256D-I/TL's 40 MHz MIPS32 M4K core renders simple GUIs and updates small framebuffers efficiently. Combined with 256 KB Flash for asset storage and 64 KB SRAM for buffer management, the part supports 320x240 QVGA panels driven through PMP. The Peripheral Pin Select (PPS) feature routes PMP data and control signals to convenient pins, simplifying PCB layout in compact HMI designs such as appliance displays, instrument panels, and control modules.
Recommended
Capacitive Touch User Interfaces (mTouch)
The PIC32MX270F256D-I/TL integrates Microchip's mTouch capacitive-touch hardware with the CTMU (Charge Time Measurement Unit), enabling robust touch-button and slider interfaces without external touch ICs. The 1 ns time-measurement resolution captures capacitive charge/discharge events with high signal-to-noise ratio, supporting moisture-tolerant touch designs. With up to 13 ADC channels and the PPS-routed analog peripherals, designers can implement multi-button control panels, slider controls, and proximity sensors. The 44-pin VTLA package keeps the touch panel PCB compact for kitchen appliances, industrial controls, and consumer electronics.
Recommended
USB HID Peripherals (Custom Keyboards, Game Controllers)
The PIC32MX270F256D-I/TL's USB 2.0 full-speed controller with on-chip transceiver enables USB HID-class peripherals such as custom keyboards, game controllers, and pointing devices without an external PHY. The on-chip 256 KB Flash stores USB HID descriptors, keymaps, and macro logic, while the 40 MHz MIPS32 M4K core scans matrices and processes HID reports within USB polling intervals. The PPS-routed USB D+/D- pins simplify PCB layout, and the 44-pin VTLA footprint allows compact device enclosures. This part is widely used in custom input devices and USB peripherals requiring low BOM cost.
Recommended
Migration from 8/16-bit MCUs to 32-bit Performance
The PIC32MX270F256D-I/TL provides a migration path for designs transitioning from PIC16, PIC18, or other 8/16-bit MCUs to true 32-bit MIPS performance. Its peripheral set (USB, I2S, PMP) and 256 KB Flash / 64 KB SRAM match the headroom needed for richer firmware, RTOS use, and USB stacks. The MPLAB Harmony framework, XC32 compiler, and PIC32 software libraries ease migration with familiar MPLAB X IDE workflows. The 44-pin VTLA footprint offers comparable I/O count to popular 8/16-bit 40-44 pin parts, allowing direct PCB-level migration with minimal rework.
Recommended
Industrial Control and Sensor Aggregation
The PIC32MX270F256D-I/TL's 10-bit ADC with multiple channels, combined with I2C/SPI/UART peripherals, makes it suitable for industrial sensor aggregation nodes reading temperature, pressure, flow, and analog sensors. The 0.5 mA/MHz typical active current keeps power budgets reasonable in always-on industrial installations. The 44-pin VTLA package provides ample GPIO for sensor interfacing, and the PPS feature allows flexible peripheral-to-pin mapping for EMC-robust layouts. Industrial temperature grade (-40 C to +85 C, I suffix) ensures operation in factory automation, building control, and HVAC equipment.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX270F256D-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX270F256D-I/ML | PIC32MX274F256D-I/ML | PIC32MX250F256D-I/TL | PIC32MX170F256D-I/TL | PIC32MX230F256D-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VTLA (6x6 mm) | 44-QFN (8x8 mm) - different footprint | 44-QFN (8x8 mm) - different footprint | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same |
| CPU Speed | 40 MHz (83 DMIPS class) | 40 MHz | 40 MHz | 50 MHz (+25%) | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | No | No | No |
| I2S Modules | 2 | 2 | 2 | 2 | 1 | 2 |
| PMP (Graphics) | Yes | Yes | Yes | Yes | Yes | No |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
Key Differentiators
- Integrated USB 2.0 full-speed OTG with on-chip transceiver (vs PIC32MX250F256D-I/TL)
- Dual I2S modules for stereo audio codec interfacing (vs PIC32MX170F256D-I/TL)
- Compact 6x6 mm VTLA package for space-limited PCBs (vs PIC32MX270F256D-I/ML)
- mTouch capacitive touch hardware integration (vs PIC32MX230F256D-I/TL)
Design Notes
Estimated thermal resistance for the 44-pin VTLA (6x6 mm) package with exposed pad: theta_JA is approximately 35-40 C/W on a standard 4-layer JEDEC test board with a continuous ground pour under the EPAD. For reliable operation, ensure the EPAD is soldered to a continuous ground copper pour of at least 25 mm x 25 mm with multiple 0.3 mm thermal vias to inner ground layers. Insufficient EPAD soldering can increase junction temperature by 20-30 C, reducing long-term reliability.
Place the 0.1 uF VDD decoupling capacitor as close as possible to each VDD pin (pins 32 and 43), with traces short and wide. Add a bulk 10 uF tantalum or ceramic capacitor near the VDD pins to handle USB inrush current. Route the USB D+/D- differential pair with 90-ohm differential impedance, matched length within 150 mil, and keep them away from noisy switching signals. For PMP graphics interfaces, group data, control, and address lines to minimize skew and route over a continuous ground plane.
Common pitfalls with the PIC32MX270F256D-I/TL include: (1) Forgetting to solder the EPAD - this causes overheating and USB communication failures; (2) Not configuring the PPS registers before using remappable peripherals, leading to silent peripheral failures; (3) Programming the device with the wrong configuration bits - the I-grade part requires industrial-range configuration (IESO, POSCMOD settings); (4) Exceeding 3.6 V on any pin - the part is not 5 V tolerant on I/O, even though USB VBUS can be 5 V; (5) Forgetting to enable the JTAG port locks in DEBUG mode - configure FSEC<7:0> correctly to allow ICD3/PICkit4 access.
Estimated power consumption at 40 MHz active CPU, USB enabled, 3.3 V VDD: roughly 20 mA core current (0.5 mA/MHz typical). With USB active and I2S codecs active, total current can reach 30-35 mA. For USB suspend current, the part must drop below 2.5 mA - configure the USB module to enter low-power suspend when USB host suspends. Add a 10 uF bulk decoupling capacitor near the USB VBUS sense pin to handle USB bus-powered inrush current. Use a LDO with at least 100 mA capacity for stable USB operation.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C) but not AEC-Q100 qualified - select AEC-Q100 automotive variants for automotive applications.
