PIC32MZ1024ECG124-I/TL - 200MHz 1MB Flash 32-bit MCU | Microchip
MPN: PIC32MZ1024ECG124-I/TL ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $17.83 | $17.83 |
| 10 | $16.49 | $164.90 |
| 100 | $14.92 | $1,492.00 |
| 500 | $13.41 | $6,705.00 |
| 1,000 | $11.85 | $11,850.00 |
PIC32MZ1024ECG124-I/TL Overview
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program and data memory, and a rich set of peripherals. In the broader taxonomy, a 32-bit MCU sits under microcontroller -> embedded processor -> semiconductor. The microAptiv core implements the MIPS32 Release 2 instruction set with DSP extensions, making it suitable for control loops and signal processing. Compared to 8-bit MCUs, 32-bit parts like the PIC32MZ EC family deliver higher throughput per MHz and addressable memory beyond the 16-bit boundary, simplifying large protocol-stack implementations.
Key features include 200 MHz core clock, 1 MB dual-bank Flash, 512 KB SRAM, an integrated 10/100 Ethernet MAC, USB 2.0 Hi-Speed OTG, dual CAN 2.0B modules, six UART, four SPI, and five I2C peripherals. The 124-pin VTLA package provides extensive GPIO plus high-speed analog (12-bit ADC, 1 MSPS) and timers. A Memory Protection Unit and hardware crypto engine accelerate secure firmware and TLS workloads.
Architecturally, the device uses a 5-stage pipelined microAptiv core with separate instruction and data caches, a dedicated peripheral bus, and bus-matrix arbitration. Dual-panel Flash allows one bank to execute while the other is being reprogrammed, enabling live firmware updates without downtime - critical for industrial gateways and connected appliances.
Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS, automotive V2X telematics, smart-energy HMI panels, and high-performance motor control. The wide peripheral mix also suits multi-protocol bridges and graphic-rich HMIs with parallel TFT or external QSPI memory interfaces.
When designing with this MCU, plan decoupling with 100 nF + 4.7 µF on every VDDCORE/VDDIO rail pair and follow Microchip's recommended 32 kHz low-ERTAK crystal plus 12 MHz primary oscillator layout. Reserve dedicated ground planes under analog traces to minimize ADC switching noise, and keep the trace from Vcap to the internal regulator pad shorter than 10 mm to avoid LDO instability.
This page synthesizes distributor pricing, same-family drop-in alternatives from the PIC32MZ portfolio, and practical layout/design notes not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MZ1024ECG124-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024ECG124-I/TL (same form factor and footprint) — differing in Package, ADC, Core Architecture, Ethernet, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024ECG124-E/TL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024ECK124T-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ0512ECG124-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024ECG124T-I/TL
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →PIC32MZ0512EFK124T-I/TL
✅ Drop-In✓ In Stock
$6.12 / Unit
View Datasheet →PIC32MZ1024ECG124-I/TL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum Core Clock | 200 MHz |
| DMIPS | 330 DMIPS |
| CoreMark/MHz | 3.28 CoreMark/MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB (128K x 32) |
| Pin Count | 124 |
| Package | 124-VTLA (9x9 mm) with exposed pad |
| Operating Voltage | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | USB 2.0 Hi-Speed OTG |
| CAN | 2x CAN 2.0B |
| ADC | 12-bit 1 MSPS |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount |
| Supply Voltage (VDDIO) | 3.3 V typical |
PIC32MZ1024ECG124-I/TL 124-vtla (9x9 mm) with exposed pad Pin Configuration Guide
Pin configuration for PIC32MZ1024ECG124-I/TL (124-vtla (9x9 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024ECG124-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024ECG124-I/TL is suitable for 6 applications: Industrial Ethernet Gateway, IoT Edge Node with TLS, Multi-Protocol Bridge (CAN/Ethernet/RS485), High-End HMI / Graphical Display Controller, Connected Appliance / Smart Energy, Motor Control and Drive Firmware Platform.
Industrial Ethernet Gateway
The PIC32MZ1024ECG124-I/TL is a strong fit for industrial Ethernet gateways because it integrates a 10/100 MAC with MII/RMII, dual CAN 2.0B, and 1 MB of dual-panel Flash for FOTA upgrades - exactly what Modbus TCP, PROFINET, and EtherNet/IP nodes require. The 200 MHz MIPS32 microAptiv core delivers 330 DMIPS, sufficient for TLS handshakes and lightweight protocol stacks without an external co-processor. Designers typically pair it with a Micrel KSZ8041 PHY and run Microchip's TCP/IP stack (NBMK) on top of FreeRTOS for deterministic response times. The wide GPIO also drives front-panel LEDs and a parallel TFT for diagnostics.
Recommended
IoT Edge Node with TLS
For IoT edge nodes performing TLS 1.2/1.3 handshakes to cloud brokers, the PIC32MZ1024ECG124-I/TL provides 512 KB of SRAM - large enough for wolfSSL or mbedTLS with a single TLS session without external memory. Its hardware crypto engine (AES, SHA) offloads expensive operations from the CPU, while the dual-panel Flash enables live firmware updates for security patches without taking the device offline. The device's USB 2.0 Hi-Speed OTG also simplifies commissioning over USB CDC. Compared to Cortex-M4 MCUs at 168 MHz, the PIC32MZ EC delivers higher DMIPS/MHz, though it lacks the M4's single-precision FPU.
Recommended
Multi-Protocol Bridge (CAN/Ethernet/RS485)
In multi-protocol bridges converting between CAN 2.0B, Ethernet, and RS485, the PIC32MZ1024ECG124-I/TL shines because it ships with 2x CAN, USB, six UART (RS485-capable), four SPI, and a 10/100 Ethernet MAC - all on a single chip. The 1 MB Flash supports a feature-rich protocol stack with local web configuration UI, while 512 KB SRAM buffers bursty CAN-to-Ethernet traffic without packet loss. At 200 MHz, a single CPU core is sufficient to forward thousands of CAN frames per second without DMA assist, making the BOM simpler.
Recommended
High-End HMI / Graphical Display Controller
The PIC32MZ1024ECG124-I/TL drives small TFT displays through its Parallel Master Port (PMP) and external QSPI memory interfaces, making it suitable for industrial HMI panels up to 4.3 inch WVGA. The 124-pin VTLA package exposes more GPIO than smaller 64- or 100-pin variants, so designers can run both a 16-bit PMP bus plus capacitive touch controller plus status LEDs simultaneously. The 200 MHz core is sufficient for animated LVGL-style UIs at 30 fps without external GPU. Designers typically add a dedicated SPI Flash for asset images and use DMA-chained PMP transfers to minimize CPU overhead.
Recommended
Connected Appliance / Smart Energy
For connected appliances such as smart thermostats, EV chargers, and solar inverters, the PIC32MZ1024ECG124-I/TL offers the perfect blend of connectivity and control: Ethernet MAC for cloud link, USB for service port, multiple UART for inverter/Modbus comms, and 12-bit 1 MSPS ADC for sensing voltage/current. The wide 2.3-3.6 V operating range simplifies direct connection to 3.3 V rails or 5 V-tolerant peripherals. Its industrial temperature grade (-40C to +85C) handles outdoor enclosures, and the dual-panel Flash lets utilities push firmware updates without disconnecting the appliance.
Recommended
Motor Control and Drive Firmware Platform
Although the EC family lacks an FPU, the PIC32MZ1024ECG124-I/TL still drives BLDC and PMSM motors in low-to-mid-power systems using fixed-point PI loops and the on-chip 12-bit ADC for back-EMF sensing. With 200 MHz core clock and dedicated PWM/OC modules, it achieves PWM frequencies up to 100 kHz with sub-microsecond dead-time control. The 1 MB Flash fits a sensorless FOC algorithm plus USB stack simultaneously, while 512 KB SRAM buffers 3-phase current samples per PWM cycle. Designers move to the PIC32MK or PIC32MZ EF family when floating-point accuracy becomes mandatory.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024ECG124-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024ECG124-E/TL | PIC32MZ1024ECK124T-I/TL | PIC32MZ0512ECG124-I/TL | PIC32MZ1024ECG124T-I/TL | PIC32MZ0512EFK124T-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9) | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 252 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB | 512 KB |
| SRAM | 512 KB | 512 KB | 512 KB | 128 KB | 512 KB | 128 KB |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Dual-Panel Flash (FOTA) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Identical Flash/SRAM with industrial temperature grade only (vs PIC32MZ1024ECG124-E/TL)
- Halved memory but same 124-VTLA footprint (vs PIC32MZ0512ECG124-I/TL)
- Higher 252 MHz clock for floating-point workloads (vs PIC32MZ0512EFK124T-I/TL)
Design Notes
Decouple every VDDCORE/VDDIO rail pair with a 100 nF ceramic cap placed within 5 mm of each pin and a bulk 4.7 µF ceramic on the package exposed pad. The internal 1.2 V core LDO (Vcap pin) requires a 4.7 µF low-ESR cap with traces shorter than 10 mm to the pad - long traces introduce phase-shift instability. Estimated core current at 200 MHz with all peripherals enabled is roughly 80-120 mA, so the bulk cap must handle peaks without droop.
Route the 50 MHz Ethernet RMII traces as a matched-length group with 50 Ω impedance to GND and keep them at least 3 trace-widths away from switching signals. The USB DP/DM traces must be 90 Ω differential with no stubs, and the 12 MHz primary oscillator should be surrounded by a guarded ground ring. Avoid routing the analog ADC traces through the digital switching region - use a dedicated analog ground island that joins the digital ground at a single point near the chip.
A frequent pitfall is leaving unused I/O pins floating: configure them as digital outputs driving low to avoid parasitic current draw. Another is omitting the external 32.768 kHz crystal on SOSC pins - without it the RTCC loses accuracy and the deep-sleep wakeup timing drifts. Lastly, do not rely on the dual-panel Flash FOTA feature without implementing the dual-image bootloader in firmware; jumping between banks requires a controlled sequence documented in the EC family reference manual.
Compliance Information
RoHS compliant per Microchip product page environmental information. AEC-Q100 not applicable (industrial MCU, not automotive-qualified). Lead-free matte tin finish. Halogen-free status not explicitly listed; consult Microchip environmental declarations portal for confirmation.
