PIC32MZ1024EFG124-I/TL - 200MHz 32-bit MCU 1MB Flash 124-VTLA | Microchip
MPN: PIC32MZ1024EFG124-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $14.85 | $148.50 |
| 100 | $12.5 | $1,250.00 |
| 500 | $10.95 | $5,475.00 |
| 1,000 | $9.8 | $9,800.00 |
PIC32MZ1024EFG124-I/TL Overview
A 32-bit MCU (microcontroller unit) is a single-chip computer integrating a CPU core, memory, and programmable peripherals on one die. The PIC32MZ EF family sits in the high-performance tier of Microchip's 32-bit portfolio, bridging the gap between traditional 8/16-bit PIC microcontrollers and the more complex application processors, with deterministic real-time behavior, mature toolchains, and rich connectivity peripherals. Within the system hierarchy, it belongs to embedded controllers -> microcontrollers -> 32-bit microcontrollers -> MIPS architecture MCUs -> connectivity-focused MCUs.
Key features include HS USB 2.0 with integrated PHY, 10/100 Mbps Ethernet MAC with RMII/MII interface, SQI (Serial Quad Interface) for high-speed external memory, and a 12-bit ADC at 500 ksps with up to 48 analog inputs. The device provides up to 97 programmable I/O lines, four I2C/SPI/UART peripherals, and dedicated DMA channels that offload data movement from the CPU, enabling deterministic real-time response in connected embedded systems.
The PIC32MZ EF architecture combines DSP-enhanced instructions (single-cycle MAC, saturating arithmetic) with floating-point hardware acceleration, making it suitable for both control loops and signal-processing tasks. The dual-panel Flash enables in-field firmware updates without downtime, while the cryptographic accelerator (on the EFK variant) provides hardware AES/TDES/SHA support. The integrated High-Speed USB 2.0 PHY eliminates external transceiver chips, reducing BOM cost for connected device designs.
Typical applications include industrial IoT gateways, HMI and graphics terminals, Ethernet-connected motor control, USB audio interfaces, automotive connectivity modules, and secure connected sensors. The combination of 1 MB Flash and rich peripherals also supports prototyping for industrial automation protocols (Modbus TCP, EtherCAT slave, PROFINET) and Bluetooth/WiFi co-processor designs.
When designing with this part, allocate sufficient decoupling on each VDD/VSS pair (typically 100 nF + 4.7 uF), route the USB differential pair with 90-ohm impedance, and provide a stable 12 MHz crystal reference for the Ethernet PHY. The 124-VTLA package requires careful thermal pad soldering; follow Microchip's recommended reflow profile and PCB land pattern to ensure reliable assembly.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet, providing an engineer-ready single reference for selection and BOM management.
Drop-in alternatives for PIC32MZ1024EFG124-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024EFG124-I/TL (same form factor and footprint) — differing in ADC, Package, Operating Temperature, SRAM, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024EFG124T-I/TL
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024EFF124T-I/TL
✅ Drop-In✓ In Stock
$7.45 / Unit
View Datasheet →PIC32MZ1024EFE124-I/TL
✅ Drop-In✓ In Stock
$9.4 / Unit
View Datasheet →PIC32MZ1024EFK124-I/TL
✅ Drop-In✓ In Stock
$7.85 / Unit
View Datasheet →PIC32MZ1024ECH124-I/TL
✅ Drop-In✓ In Stock
$9.3 / Unit
View Datasheet →PIC32MZ1024EFG124-I/TL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 single/double precision |
| DSP Extensions | Single-cycle MAC, four 64-bit accumulators, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 512 KB (512K x 8) |
| Live Update Flash | Dual-panel Flash for in-field firmware update |
| Cryptographic Accelerator | No (EFG variant; EFK adds AES/TDES/SHA) |
| Operating Voltage | 2.3 V to 3.6 V |
| Operating Temperature Range | -40C to +85C (industrial, -I suffix) |
| Package | 124-VTLA (9x9 mm) |
| Programmable I/O Lines | 97 |
| ADC | 12-bit, 500 ksps, up to 48 channels |
| Connectivity | HS USB 2.0 PHY, 10/100 Ethernet MAC, SQI, I2C, SPI, UART, PMP, EBI/EMI |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
PIC32MZ1024EFG124-I/TL 124-vtla (9x9 mm) Pin Configuration Guide
Pin configuration for PIC32MZ1024EFG124-I/TL (124-vtla (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024EFG124-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024EFG124-I/TL is suitable for 6 applications: Industrial IoT Gateway, HMI and Graphics Terminal, USB Audio Interface, Ethernet-Connected Motor Control, Automotive Connectivity Module, Secure Connected Sensor Hub.
Industrial IoT Gateway
The PIC32MZ1024EFG124-I/TL fits industrial IoT gateway designs because its integrated 10/100 Ethernet MAC and HS USB 2.0 PHY eliminate external transceiver chips, while 1 MB Flash accommodates full TCP/IP stacks plus application logic. The 200 MHz MIPS core with hardware FPU handles Modbus TCP, MQTT-SN, and OPC UA protocol parsing in real time. The 512 KB SRAM buffers network packets without external memory. Industrial-grade -40C to +85C operation suits factory floor deployment. DMA channels offload Ethernet packet movement, freeing the CPU for protocol processing. The SQI interface supports external QSPI Flash for firmware expansion or logging. Engineers benefit from a single-chip connected design that reduces BOM cost and PCB area versus discrete MCU plus external PHY approaches.
Recommended
HMI and Graphics Terminal
The PIC32MZ1024EFG124-I/TL is well-suited for HMI and graphics terminals due to its 200 MHz core with IEEE 754 FPU and DSP extensions, which accelerate pixel processing and GUI rendering. The 1 MB Flash stores framebuffer assets and graphics libraries, while 512 KB SRAM holds active screen data. The PMP (Parallel Master Port) interface connects directly to TFT LCD controllers, and the SQI bus supports high-speed graphics memory. The 12-bit ADC reads touch-panel inputs. Engineers can drive 480x272 to 800x480 WVGA displays with adequate frame rates. Hardware FPU acceleration of floating-point math benefits 3D transformation and anti-aliasing routines used in modern embedded GUIs.
Recommended
USB Audio Interface
The PIC32MZ1024EFG124-I/TL supports USB audio interface designs through its integrated HS USB 2.0 PHY, which delivers 480 Mbps bandwidth for multi-channel audio streaming. The 200 MHz MIPS core with hardware FPU handles real-time DSP routines such as equalization, mixing, and sample-rate conversion. The SQI interface accommodates external Flash for audio preset storage, while DMA channels manage audio stream transfer without CPU intervention. Industrial-grade -I temperature rating suits pro-audio equipment operating in variable thermal environments. Multiple I2S/SP peripherals connect directly to audio DACs and ADCs. The 1 MB Flash capacity supports USB Audio Class 2.0 drivers and embedded DSP algorithms in a single-chip solution.
Recommended
Ethernet-Connected Motor Control
The PIC32MZ1024EFG124-I/TL fits Ethernet-connected motor control designs because its 200 MHz core runs FOC (Field-Oriented Control) algorithms at high PWM update rates while the integrated Ethernet MAC enables real-time EtherCAT or PROFINET slave communication. The dual-panel Flash supports in-field firmware updates without motor downtime. The 12-bit ADC at 500 ksps samples motor phase currents with sufficient resolution for precise torque control. Hardware FPU accelerates the Park/Clarke transforms used in FOC. The 97 programmable I/O lines accommodate multiple PWM channels, encoder inputs, and communication peripherals. The -40C to +85C industrial temperature range handles drive cabinet environments.
Recommended
Automotive Connectivity Module
The PIC32MZ1024EFG124-I/TL serves automotive connectivity modules such as telematics control units and OBD-II gateways. The HS USB 2.0 PHY supports diagnostics interfaces, while Ethernet MAC connects to in-vehicle networks. Industrial-grade -40C to +85C operation suits cabin and engine-bay-adjacent installations. The 1 MB Flash holds protocol stacks (UDS, CAN-over-Ethernet bridges), and 512 KB SRAM manages multiple concurrent connections. DMA channels enable deterministic communication latency. Cryptographic firmware (implemented in software on the EFG variant) handles secure boot and message authentication. Note that AEC-Q100 qualified variants exist in the PIC32MZ family for full automotive certification if required by the application.
Recommended
Secure Connected Sensor Hub
The PIC32MZ1024EFG124-I/TL is appropriate for secure connected sensor hub designs where multiple sensors aggregate data and forward it over Ethernet or USB. The 200 MHz core handles sensor fusion algorithms with hardware FPU acceleration, while 1 MB Flash accommodates wireless protocol stacks (when paired with an external radio). The 12-bit ADC with up to 48 channels reads numerous analog sensors directly. DMA channels move sensor data to memory without CPU load. The integrated Ethernet MAC supports wired industrial sensor networks, and HS USB provides configuration/diagnostic access. Engineers can scale the design with the EFK variant if hardware cryptographic acceleration is needed for secure communication.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024EFG124-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024EFG124T-I/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ1024EFE124-I/TL | PIC32MZ1024EFK124-I/TL | PIC32MZ1024ECH124-I/TL |
|---|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Crypto Accelerator | No | No | No | No | Yes (AES/TDES/SHA) | No |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Packaging Form | Tray | Tape & Reel | Tape & Reel | Tray | Tray | Tray |
Key Differentiators
- Pin-compatible family scalability with 4 functional variants (vs PIC32MZ1024EFK124-I/TL)
- Industrial-grade -I variant availability (vs PIC32MZ1024EFG124-E/TL)
- Integrated HS USB 2.0 PHY and Ethernet MAC (vs PIC32MZ1024ECM124-I/TL)
Design Notes
The PIC32MZ1024EFG124-I/TL operates from 2.3 V to 3.6 V and requires multiple decoupling capacitors placed close to each VDD/VSS pin pair. Use a 100 nF ceramic on every supply pin and bulk 4.7 uF or 10 uF ceramic capacitors on the main supply rails. For USB applications, the internal PHY requires a clean 3.3 V rail with low ripple; an additional ferrite bead or LC filter between the main 3.3 V plane and the USB transceiver supply pin is recommended to meet USB 2.0 HS compliance.
The 124-VTLA package has an exposed thermal pad that must be soldered to a corresponding copper pad on the PCB for both thermal dissipation and mechanical reliability. Follow Microchip's recommended land pattern with thermal vias to inner copper planes. Route high-speed USB differential pair (D+/D-) with 90-ohm differential impedance and match lengths within 150 mil. Place the 12 MHz Ethernet reference crystal within 5 mm of the ETH_XTAL pins with short, symmetrical traces to minimize jitter.
Do not confuse the EFG and EFK variants when ordering: the EFG lacks the cryptographic accelerator while the EFK adds AES/TDES/SHA hardware. Code developed for the EFG variant will run on the EFK, but the reverse requires disabling crypto peripheral calls. The -I temperature grade supports -40C to +85C; for full automotive temperature range select the -E grade. The dual-panel Flash requires careful linker configuration to use both panels correctly - consult the PIC32MZ EF family reference manual for the dual-panel boot sequence before designing the firmware update mechanism.
The 124-VTLA package thermal resistance is approximately 22 C/W (junction-to-ambient with a properly soldered thermal pad and standard 4-layer PCB). At full 200 MHz operation with peripherals active, typical core power consumption is around 350-450 mW. For continuous full-load operation in an enclosed enclosure above 60C ambient, calculate junction temperature rise and verify it stays below the 125C maximum. The thermal pad must be soldered to the PCB thermal land for the rated thermal performance; a non-soldered pad may double the junction-to-ambient thermal resistance.
Compliance Information
RoHS and REACH compliant per Microchip product page. The -I temperature grade targets industrial applications; AEC-Q100 automotive qualification requires separate ordering codes. Halogen-free status not explicitly stated in the verified data.