PIC32MZ0512EFF124T-I/TL - 200MHz 512KB Flash 32-bit MCU | Microchip
MPN: PIC32MZ0512EFF124T-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.85 | $1,085.00 |
| 500 | $9.55 | $4,775.00 |
| 1,000 | $8.6 | $8,600.00 |
PIC32MZ0512EFF124T-I/TL Overview
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program memory, RAM, and a wide mix of analog and digital peripherals. Within the embedded hierarchy it sits between microprocessors (which require external RAM/Flash) and application-specific SoCs. The PIC32MZ EF family specifically targets high-end connectivity and graphics (HMI) applications by combining a MIPS Warrior M-class core with an IEEE 754 single-precision Floating Point Unit (FPU), four 64-bit accumulators for single-cycle MAC DSP operations, and dual-panel Flash to support live firmware updates without service interruption.
Key features include 200 MHz core operation with hardware multiply/divide, dual-panel Flash allowing A/B image live update, 12-bit ADC up to 18 MSPS with up to 40 analog inputs, 9 compare/PWM outputs, a graphics-friendly parallel master port, and a crypto engine (when available in the family). Industrial-grade operating temperature of -40C to +85C is implied by the "-I" temperature designator. The 124-VTLA package exposes extensive connectivity with minimal external glue components.
Typical applications for the PIC32MZ0512EFF124T-I/TL include industrial Ethernet gateways, building automation controllers, automotive infotainment/HMI panels, USB host/device embedded products, motor-control FOCs, and graphical touch HMI terminals. The combination of high-speed USB, Ethernet, CAN, and a 200 MHz core makes it especially attractive for protocols requiring deterministic real-time performance alongside rich connectivity.
Design considerations include careful VTLA PCB thermal layout (the exposed die pad must be soldered to a sufficiently large copper pour for heat removal), trace matching for high-speed USB and Ethernet differential pairs, and JTAG/ICSP trace routing for the PGECx/PGEDx pairs. Developers should also plan dual-panel Flash partitioning to fully leverage the live-update capability.
This page synthesizes distributor pricing, drop-in PIC32MZ EF family alternatives, and practical design notes that extend the manufacturer datasheet with board-level engineering guidance.
Drop-in alternatives for PIC32MZ0512EFF124T-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ0512EFF124T-I/TL (same form factor and footprint) — differing in FPU, Operating Temperature, Package, Core Architecture, Ethernet.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ0512EFF124-I/TL
✅ Drop-In✓ In Stock
$8.05 / Unit
View Datasheet →PIC32MZ0512EFF124-E/TL
✅ Drop-In✓ In Stock
$8.95 / Unit
View Datasheet →PIC32MZ0512EFE124-E/TL
✅ Drop-In✓ In Stock
$8.1 / Unit
View Datasheet →PIC32MZ1024EFF124T-I/TL
✅ Drop-In✓ In Stock
$7.45 / Unit
View Datasheet →PIC32MZ0512EFF100T-I/PF
✅ Drop-In✓ In Stock
$7.05 / Unit
View Datasheet →PIC32MZ0512EFF124T-I/TL Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M-Class Warrior |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Core Performance | 330 DMIPS |
| FPU | IEEE 754 single-precision |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Package | 124-VTLA (9x9 mm) |
| User I/O Pins | 97 |
| Supply Voltage | 2.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (industrial, -I grade) |
| ADC | 12-bit, up to 18 MSPS |
| Connectivity | HS USB 2.0, 10/100 Ethernet MAC, CAN 2.0b, SQI, I2S, UART, SPI, I2C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MZ0512EFF124T-I/TL Pin Configuration
| Pin 1 | VSS — Ground |
| Pin 2 | OSCI — External oscillator input |
| Pin 3 | OSCO — External oscillator output |
| Pin 4 | VBUS — USB VBUS sense input |
| Pin 5 | USB_DP — USB D+ differential data |
| Pin 6 | USB_DM — USB D- differential data |
| Pin 7 | VDD — Digital supply 2.0-3.6 V |
| Pin 8 | VSS — Ground |
| Pin 9 | AN0/RPB0 — Analog input / RB0 GPIO |
| Pin 10 | AN1/RPB1 — Analog input / RB1 GPIO |
| Pin 11 | AN2/RPB2 — Analog input / RB2 GPIO |
| Pin 12 | AN3/RPB3 — Analog input / RB3 GPIO |
| Pin 13 | AN4/RPB4 — Analog input / RB4 GPIO |
| Pin 14 | AN5/RPB5 — Analog input / RB5 GPIO |
| Pin 15 | AN6/RPB6 — Analog input / RB6 GPIO |
| Pin 16 | AN7/RPB7 — Analog input / RB7 GPIO |
| Pin 17 | AN8/RPB8 — Analog input / RB8 GPIO |
| Pin 18 | AN9/RPB9 — Analog input / RB9 GPIO |
| Pin 19 | AN10/RPB10 — Analog input / RB10 GPIO |
| Pin 20 | AN11/RPB11 — Analog input / RB11 GPIO |
| Pin 21 | VDD — Digital supply 2.0-3.6 V |
| Pin 22 | VSS — Ground |
| Pin 23 | AN12/RPB12 — Analog input / RB12 GPIO |
| Pin 24 | AN13/RPB13 — Analog input / RB13 GPIO |
| Pin 25 | AN14/RPB14 — Analog input / RB14 GPIO |
| Pin 26 | AN15/RPB15 — Analog input / RB15 GPIO |
| Pin 27 | RPC0 — RC0 GPIO |
| Pin 28 | RPC1 — RC1 GPIO |
| Pin 29 | RPC2 — RC2 GPIO |
| Pin 30 | RPC3 — RC3 GPIO |
| Pin 31 | RPC4 — RC4 GPIO |
| Pin 32 | RPC5 — RC5 GPIO |
| Pin 33 | RPC6 — RC6 GPIO |
| Pin 34 | RPC7 — RC7 GPIO |
| Pin 35 | RPC8 — RC8 GPIO |
| Pin 36 | RPC9 — RC9 GPIO |
| Pin 37 | VDD — Digital supply 2.0-3.6 V |
| Pin 38 | VSS — Ground |
| Pin 39 | RPD0 — RD0 GPIO |
| Pin 40 | RPD1 — RD1 GPIO |
| Pin 41 | RPD2 — RD2 GPIO |
| Pin 42 | RPD3 — RD3 GPIO |
| Pin 43 | RPD4 — RD4 GPIO |
| Pin 44 | RPD5 — RD5 GPIO |
| Pin 45 | RPD6 — RD6 GPIO |
| Pin 46 | RPD7 — RD7 GPIO |
| Pin 47 | RPD8 — RD8 GPIO |
| Pin 48 | RPD9 — RD9 GPIO |
| Pin 49 | RPD10 — RD10 GPIO |
| Pin 50 | RPD11 — RD11 GPIO |
| Pin 51 | RPD12 — RD12 GPIO |
| Pin 52 | RPD13 — RD13 GPIO |
| Pin 53 | RPD14 — RD14 GPIO |
| Pin 54 | RPD15 — RD15 GPIO |
| Pin 55 | VDD — Digital supply 2.0-3.6 V |
| Pin 56 | VSS — Ground |
| Pin 57 | RPE0 — RE0 GPIO |
| Pin 58 | RPE1 — RE1 GPIO |
| Pin 59 | RPE2 — RE2 GPIO |
| Pin 60 | RPE3 — RE3 GPIO |
| Pin 61 | RPE4 — RE4 GPIO |
| Pin 62 | RPE5 — RE5 GPIO |
| Pin 63 | RPE6 — RE6 GPIO |
| Pin 64 | RPE7 — RE7 GPIO |
| Pin 65 | RPE8 — RE8 GPIO |
| Pin 66 | RPE9 — RE9 GPIO |
| Pin 67 | RPF0 — RF0 GPIO |
| Pin 68 | RPF1 — RF1 GPIO |
| Pin 69 | RPF2 — RF2 GPIO |
| Pin 70 | RPF3 — RF3 GPIO |
| Pin 71 | RPF4 — RF4 GPIO |
| Pin 72 | RPF5 — RF5 GPIO |
| Pin 73 | RPF6 — RF6 GPIO |
| Pin 74 | RPF7 — RF7 GPIO |
| Pin 75 | RPF8 — RF8 GPIO |
| Pin 76 | RPF9 — RF9 GPIO |
| Pin 77 | RPF10 — RF10 GPIO |
| Pin 78 | RPF11 — RF11 GPIO |
| Pin 79 | RPF12 — RF12 GPIO |
| Pin 80 | RPF13 — RF13 GPIO |
| Pin 81 | VDD — Digital supply 2.0-3.6 V |
| Pin 82 | VSS — Ground |
| Pin 83 | RPG0 — RG0 GPIO |
| Pin 84 | RPG1 — RG1 GPIO |
| Pin 85 | RPG2 — RG2 GPIO |
| Pin 86 | RPG3 — RG3 GPIO |
| Pin 87 | RPG4 — RG4 GPIO |
| Pin 88 | RPG5 — RG5 GPIO |
| Pin 89 | RPG6 — RG6 GPIO |
| Pin 90 | RPG7 — RG7 GPIO |
| Pin 91 | RPG8 — RG8 GPIO |
| Pin 92 | RPG9 — RG9 GPIO |
| Pin 93 | RPH0 — RH0 GPIO |
| Pin 94 | RPH1 — RH1 GPIO |
| Pin 95 | RPH2 — RH2 GPIO |
| Pin 96 | RPH3 — RH3 GPIO |
| Pin 97 | RPH4 — RH4 GPIO |
| Pin 98 | RPH5 — RH5 GPIO |
| Pin 99 | RPH6 — RH6 GPIO |
| Pin 100 | RPH7 — RH7 GPIO |
| Pin 101 | RPH8 — RH8 GPIO |
| Pin 102 | RPH9 — RH9 GPIO |
| Pin 103 | RPH10 — RH10 GPIO |
| Pin 104 | RPH11 — RH11 GPIO |
| Pin 105 | RPH12 — RH12 GPIO |
| Pin 106 | RPH13 — RH13 GPIO |
| Pin 107 | RPH14 — RH14 GPIO |
| Pin 108 | RPH15 — RH15 GPIO |
| Pin 109 | VDD — Digital supply 2.0-3.6 V |
| Pin 110 | VSS — Ground |
| Pin 111 | RPJ0 — RJ0 GPIO |
| Pin 112 | RPJ1 — RJ1 GPIO |
| Pin 113 | RPJ2 — RJ2 GPIO |
| Pin 114 | RPJ3 — RJ3 GPIO |
| Pin 115 | RPJ4 — RJ4 GPIO |
| Pin 116 | RPJ5 — RJ5 GPIO |
| Pin 117 | RPJ6 — RJ6 GPIO |
| Pin 118 | RPJ7 — RJ7 GPIO |
| Pin 119 | RPJ8 — RJ8 GPIO |
| Pin 120 | RPJ9 — RJ9 GPIO |
| Pin 121 | PGEC1 — ICSP programming clock 1 |
| Pin 122 | PGED1 — ICSP programming data 1 |
| Pin 123 | PGEC2 — ICSP programming clock 2 |
| Pin 124 | PGED2 — ICSP programming data 2 / eDP (exposed die pad - thermal/ground) |
Typical Applications
PIC32MZ0512EFF124T-I/TL is suitable for 6 applications: Industrial Ethernet Gateway, USB Host/Device Embedded Device, Automotive Infotainment HMI Controller, Building Automation Controller, Motor Control FOC Drive, Industrial IoT Sensor Hub.
Industrial Ethernet Gateway
The PIC32MZ0512EFF124T-I/TL's integrated 10/100 Ethernet MAC and 200 MHz MIPS core make it well suited for industrial protocol gateways (Modbus TCP, EtherNet/IP, PROFINET slave). Its 512 KB Flash holds TCP/IP stacks (TCPIP, NetBIOS, HTTP server) plus application logic; 128 KB SRAM supports multiple concurrent sockets without external memory. The integrated MII/RMII interface connects directly to a PHY such as the KSZ8081. Compared with external Ethernet controllers, the integrated MAC reduces BOM and PCB area.
Recommended
USB Host/Device Embedded Device
With built-in High-Speed USB 2.0 (480 Mbps) with PHY, the PIC32MZ0512EFF124T-I/TL can act as either USB host (mass storage, HID keyboards) or device (CDC, MSD, vendor-class). The 200 MHz core handles USB stack plus application logic comfortably. Designers can implement USB-C chargers, USB-to-UART bridges, or USB mass-storage data loggers. The 124-VTLA exposes all USB DP/DN pins, VBUS sensing, and the USBID pin for OTG role detection with no external PHY required.
Recommended
Automotive Infotainment HMI Controller
The PIC32MZ0512EFF124T-I/TL drives automotive HMI panels via its parallel master port (PMP) for TFT displays, I2S for audio, and CAN 2.0b for vehicle bus. The 200 MHz MIPS core and FPU handle JPEG decode, GUI rendering, and audio mixing in real time. The "-I" industrial temperature grade suits cabin environments; designers needing under-hood or engine-bay operation should step up to the -E extended variant. The 97 I/O pins support capacitive touch via the Peripheral Trigger Generator.
Recommended
Building Automation Controller
Building automation systems (BACnet, Modbus, KNX) benefit from the PIC32MZ0512EFF124T-I/TL's mix of Ethernet (for BACnet/IP), UART/SPI (for sensor and actuator networks), and the industrial temperature range. The 512 KB Flash stores BACnet stack plus scheduling logic; 128 KB SRAM buffers telemetry. Real-time deterministic performance comes from the 200 MHz core combined with Microchip's Harmony peripheral libraries for freeRTOS or bare-metal scheduling.
Recommended
Motor Control FOC Drive
Field-Oriented Control (FOC) of 3-phase BLDC or PMSM motors requires deterministic PWM generation, fast ADC sampling, and real-time math. The PIC32MZ0512EFF124T-I/TL's 200 MHz core, hardware FPU, and four 64-bit accumulators (single-cycle MAC) execute FOC algorithms in under 5 us per control loop. Nine PWM outputs drive a 3-phase inverter through gate drivers; 18 MSPS ADC samples phase currents with sub-microsecond latency for sensorless control.
Recommended
Industrial IoT Sensor Hub
Industrial IoT edge nodes aggregate sensor data and forward to cloud services via Ethernet or USB. The PIC32MZ0512EFF124T-I/TL provides enough Flash (512 KB) for TLS 1.2 client + MQTT client + JSON parsing + application logic, while 128 KB SRAM supports TLS handshake buffers. The 12-bit 18 MSPS ADC reads analog sensors; CAN 2.0b interfaces with industrial fieldbus. Industrial -40C to +85C rating suits factory-floor deployment without additional thermal hardening.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ0512EFF124T-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ0512EFF124-I/TL | PIC32MZ0512EFF124-E/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ0512EFE124-E/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Connectivity | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB HS, Eth, CAN, SQI | USB FS, CAN, no Eth (EFE = no-Ethernet) |
| FPU | Yes (IEEE 754) | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest Flash density in 124-VTLA PIC32MZ EF family at 200 MHz (vs PIC32MZ0512EFF064)
- Integrated High-Speed USB 2.0 PHY plus 10/100 Ethernet MAC (vs PIC32MZ0512EFE124-E/TL)
- Industrial temperature -40C to +85C suitable for most factory environments (vs PIC32MZ0512EFF100T-I/PF)
Design Notes
The 124-VTLA package has an exposed die pad (pin 124 / eDP) that must be soldered to a PCB thermal pad of at least 6x6 mm of continuous copper, with thermal vias to the inner/ground layers. At 200 MHz with all peripherals active, the part dissipates approximately 0.5-0.8 W. Without proper thermal layout, junction temperature can exceed the 125C limit, especially in enclosed industrial enclosures. Recommended: 4-layer board with 2 oz copper on outer layers, or 1 oz with 9 thermal vias (0.3 mm drill) connecting the pad to internal ground planes.
Route the USB DP/DM differential pair with 90 ohm differential impedance, max length 50 mm, with no splits in the reference ground plane beneath. The Ethernet MII/RMII signals should be length-matched within 50 mil (1.27 mm) for the clock and data lanes. Place the 25 MHz Ethernet PHY crystal within 5 mm of the PHY's XIN/XOUT pins with guard ring to ground. Decouple VDD with 100 nF X7R ceramic per supply pin plus a single bulk 4.7 uF tantalum or ceramic near the VTLA's central VDD pins.
Estimated: at 200 MHz core clock drawing ~70 mA active current, an input supply of 2.0V minimum and a 100 mV ripple budget requires the LDO/dCDC regulator to have output impedance below 50 mohm at 100 kHz. Common pitfalls: (1) omitting the 8 MHz primary crystal load capacitors (use 18-22 pF for typical CL=8 pF crystals), (2) leaving PGEC1/PGED1 floating - they must each have a pull-down to ground for production boards even if not using ICSP, (3) forgetting to configure the DEVCFG0/DEVCFG1 fuses for proper oscillator selection, (4) using the EF (with Ethernet) variant firmware on an EFE (no Ethernet) device - the missing Ethernet peripheral registers will cause bus faults.
Compliance Information
Per Microchip product page, RoHS and REACH compliant. Not AEC-Q100 qualified (PIC32MZ EF family has separate AEC-Q100 variants under different ordering codes). Lead-free and halogen-free per Microchip environmental compliance documentation.