PIC32MZ1024EFM064T-I/MR - 32-bit 200MHz MCU 1MB Flash 64-QFN
MPN: PIC32MZ1024EFM064T-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.85 | $128.50 |
| 100 | $11.42 | $1,142.00 |
| 500 | $10.18 | $5,090.00 |
| 1,000 | $9.05 | $9,050.00 |
PIC32MZ1024EFM064T-I/MR Overview
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich peripheral set. Within the broader taxonomy, a 32-bit MCU belongs to microcontrollers -> integrated circuits -> semiconductors. The PIC32MZ EF family uses the MIPS32 microAptiv core and is Microchip's flagship high-performance line for industrial, IoT, graphics (HMI), and motor control market segments, combining deterministic real-time behaviour with high-throughput connectivity stacks.
Key features include MIPS32 M-Class core with FPU and DSP extensions, 1 MB self-programmable Flash, 512 KB SRAM, hardware Cryptography engine (AES, 3DES, SHA, MD5, RNG), 200 MHz operation, 64-pin QFN (9x9 mm) package, integrated 10/100 Ethernet MAC, USB 2.0 High-Speed PHY/OTG, two CAN modules, six UART, four SPI, and five I2C peripherals. The 64-pin QFN package with an exposed pad enables compact PCB layouts while providing low thermal resistance.
From an architectural perspective, the PIC32MZ EF family employs a five-stage pipeline with branch prediction and a tightly-coupled prefetch buffer, allowing sustained 1.5 DMIPS/MHz. The integrated Crypto engine offloads AES-128/192/256 and hash operations from the CPU, allowing deterministic response times in TLS/DTLS stacks. The device supports up to 32 channels of DMA and dedicated peripherals for graphics and motor control.
Typical applications include industrial IoT gateways requiring Ethernet/USB connectivity, secure connected HMI with TFT displays, automotive telematics and V2X, motor-control drives, and medical monitoring equipment. The combination of high core speed and on-chip crypto acceleration makes it well suited to TLS/DTLS endpoints and OTA-firmware-update designs.
Design consideration: the 64-pin QFN exposed pad must be soldered to a continuous copper pour to achieve the rated thermal performance. Decoupling capacitors should be placed as close as possible to each power pin pair, and the Ethernet PHY side requires a 49.9 ohm 1% precision resistor for the centre tap.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering value beyond a typical product listing.
Drop-in alternatives for PIC32MZ1024EFM064T-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024EFM064T-I/MR (same form factor and footprint) — differing in Package, ADC, Core Architecture, Ethernet, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024EFM064-I/MR
✅ Drop-In✓ In Stock
$8.95 / Unit
View Datasheet →PIC32MZ1024EFM064-E/MR
✅ Drop-In✓ In Stock
$13.1 / Unit
View Datasheet →PIC32MZ1024EFK064T-I/MR
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →PIC32MZ1024EFG064-I/MR
✅ Drop-In✓ In Stock
$7.99 / Unit
View Datasheet →PIC32MZ1024EFF064-I/MR
✅ Drop-In✓ In Stock
$6.65 / Unit
View Datasheet →PIC32MZ1024EFH064-I/MR
✅ Drop-In✓ In Stock
$7.25 / Unit
View Datasheet →PIC32MZ1024EFM064T-I/MR Maximum Ratings & Electrical Characteristics
| Core | MIPS32 microAptiv M-Class |
| Core Architecture | 32-bit RISC with FPU and DSP |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| Data Memory (SRAM) | 512 KB |
| Package | 64-pin QFN (MR) 9x9 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Cryptography Engine | AES, 3DES, SHA-256, MD5, RNG (hardware) |
| Ethernet | 10/100 MAC (RMII/MII) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2 modules (CAN 2.0B) |
| DMA Channels | 8 |
| Timers | 9 (16-bit) + 2 Watchdog + 1 RTC |
| UART | 6 |
| SPI | 4 |
| I2C | 5 |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
PIC32MZ1024EFM064T-I/MR 64-pin qfn (mr) 9x9 mm Pin Configuration Guide
Pin configuration for PIC32MZ1024EFM064T-I/MR (64-pin qfn (mr) 9x9 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024EFM064T-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024EFM064T-I/MR is suitable for 6 applications: Industrial IoT Gateway with Ethernet, Secure Connected HMI with TFT Display, Automotive Telematics and V2X, Motor Control and Field-Oriented Control (FOC) Drives, Medical Monitoring and Diagnostic Devices, Smart Energy and Grid Edge Device.
Industrial IoT Gateway with Ethernet
The PIC32MZ1024EFM064T-I/MR's integrated 10/100 Ethernet MAC and 200 MHz MIPS32 core make it ideal for industrial IoT gateways aggregating field-bus data and serving it to upstream SCADA/IoT platforms. The 1 MB Flash holds a full TLS 1.3 + MQTT-SN stack plus a 6LoWPAN border router, while 512 KB SRAM supports concurrent TCP/IP socket buffers without external memory. The hardware AES engine offloads TLS handshake encryption, keeping the CPU free for protocol parsing; deterministic response times are achieved through 8 DMA channels offloading UART/SPI field-bus traffic. Compared with an MCU requiring an external MAC, this part saves PCB area and BOM cost in a typical 4-port gateway design.
Recommended
Secure Connected HMI with TFT Display
The PIC32MZ1024EFM064T-I/MR's 200 MHz core, parallel graphics-friendly GPIO, and hardware crypto engine fit connected HMI designs with 4.3-inch TFT panels requiring TLS-authenticated cloud connectivity. The 1 MB Flash stores both an LVGL/MDK graphical stack and a firmware-update bootloader, while 512 KB SRAM holds display frame buffers without external PSRAM. Hardware AES-128/256 + SHA-256 keeps cloud authentication fast enough to avoid UI lag. The 64-QFN package footprint suits a small front-panel PCB behind the display. Compared with PIC32MX parts, the EF family's 5-stage pipeline delivers the throughput required for anti-aliased UI animation at 60 fps.
Recommended
Automotive Telematics and V2X
The PIC32MZ1024EFM064T-I/MR's dual CAN 2.0B modules, USB-HS, and hardware crypto engine fit automotive telematics control units bridging OBD-II/CAN bus data to cellular V2X backhaul. The 1 MB Flash holds a CAN-ISO-TP stack, TLS client, and OTA bootloader; 512 KB SRAM supports concurrent TCP/IP + CAN message buffers. The industrial -40C to +85C rating suits cabin-mounted TCUs; for under-hood deployment pair with the -E/MR extended-temperature sibling (180 MHz). Compared with a host CPU approach, this part runs AUTOSAR-classic MCAL drivers deterministically and boots in under 50 ms from Flash.
Recommended
Motor Control and Field-Oriented Control (FOC) Drives
The PIC32MZ1024EFM064T-I/MR's 200 MHz MIPS32 core with single-cycle MAC and DSP extensions is well matched to sensorless field-oriented control of 3-phase BLDC/PMSM motors up to ~5 kW. The hardware crypto engine is unused here but the part's 9 16-bit timers (with PWM mode), 8 DMA channels, and 200 MHz peripheral bus give the deterministic ADC->PWM latency required for low-speed torque-ripple-free commutation. The 64-QFN 9x9 mm exposed pad dissipates up to 1.5 W cleanly. Compared with PIC32MX motor-control parts, the EF family executes a full Park/Clarke transform in roughly half the cycles.
Recommended
Medical Monitoring and Diagnostic Devices
The PIC32MZ1024EFM064T-I/MR's 200 MHz throughput, 1 MB Flash for safety-critical firmware, and 512 KB SRAM for waveform buffers support portable patient-monitoring designs (pulse oximetry, ECG, spirometry). The hardware AES + SHA accelerates HIPAA-compliant data-at-rest encryption in a sealed enclosure. The 64-QFN exposed pad and low-power sleep modes (<10 µA) suit battery-powered handheld form factors. Compared with external-MAC designs, this part integrates USB-HS device for tethered PC sync plus Ethernet for bedside-monitor connectivity in one chip. Note: this is general-purpose silicon, not FDA-cleared.
Recommended
Smart Energy and Grid Edge Device
The PIC32MZ1024EFM064T-I/MR's integrated 10/100 Ethernet, USB-HS host, dual CAN, and hardware crypto engine target grid-edge devices such as solar inverters, smart meters, and energy-management controllers. The 1 MB Flash holds both a DLMS/COSEM metering stack and TLS 1.3 firmware-update client; 512 KB SRAM supports per-phase measurement buffers without external memory. The 64-QFN footprint fits the compact inside-the-enclosure PCB. Compared with separate MCU + MAC + crypto designs, this single-chip approach reduces BOM and PCB area by ~40% while delivering deterministic metering-cycle timing.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024EFM064T-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024EFM064-I/MR | PIC32MZ1024EFM064-E/MR | PIC32MZ1024EFK064T-I/MR | PIC32MZ1024EFG064-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same |
| Maximum CPU Speed | 200 MHz | 200 MHz | 180 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Cryptography Engine | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
Key Differentiators
- Industrial -40C to +85C temperature grade at 200 MHz (vs PIC32MZ1024EFM064-E/MR)
- Tape-and-reel packaging for high-volume manufacturing (vs PIC32MZ1024EFM064-I/MR)
- K-series extended connectivity (vs PIC32MZ1024EFK064T-I/MR)
Design Notes
The 64-QFN (MR) package has an exposed thermal pad that MUST be soldered to a continuous copper pour with thermal vias to achieve rated thermal performance. Estimated: at 200 MHz full peripheral activity, core power dissipation is approximately 0.6-0.9 W; without the exposed-pad solder connection, junction temperature can rise 40-50 C above ambient under sustained load. Provide at least 1 square inch of top-layer copper tied to the e-pad for reliable 85 C operation.
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD/AVDD/VUSB/VDDIO pin pair, plus a 4.7 uF bulk capacitor near each voltage rail. The analog AVDD rail should be filtered through a ferrite bead from VDD and bypassed with 100 nF + 10 uF to maintain ADC accuracy. Estimated: insufficient decoupling can degrade ADC SNR by 3-6 dB.
Route the 50 MHz Ethernet RMII reference clock with a controlled-impedance 50 ohm trace and keep it under 25 mm to maintain signal integrity. Provide a 49.9 ohm 1% precision resistor at the PHY centre-tap (pin ETH_RBIAS). Keep USB DP/DM differential traces at 90 ohm impedance with length matching within 150 mm.
Do not leave the MCLR pin floating; it must be pulled high through a 10 kohm resistor to VDD for normal run-mode operation. The two CAN TX/RX pins require external transceivers (e.g., MCP2562) - they are logic-level only. Avoid enabling the crypto engine before the RNG has completed its first seed cycle or it will return deterministic outputs.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC32MZ1024EFM064-E/MR for extended temperature or AEC-Q100 variants for automotive. Halogen-free status is unknown from the provided data.
