PIC32MZ1024EFM064T-I/MR - 32-bit 200MHz MCU 1MB Flash 64-QFN
Teilenummer: PIC32MZ1024EFM064T-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.85 | $128,50 |
| 100 | $11.42 | $1.142,00 |
| 500 | $10.18 | $5.090,00 |
| 1.000 | $9.05 | $9.050,00 |
PIC32MZ1024EFM064T-I/MR Übersicht
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich peripheral set. Within the broader taxonomy, a 32-bit MCU belongs to microcontrollers -> integrated circuits -> semiconductors. The PIC32MZ EF family uses the MIPS32 microAptiv core and is Microchip's flagship high-performance line for industrial, IoT, graphics (HMI), and motor control market segments, combining deterministic real-time behaviour with high-throughput connectivity stacks.
Key features include MIPS32 M-Class core with FPU and DSP extensions, 1 MB self-programmable Flash, 512 KB SRAM, hardware Cryptography engine (AES, 3DES, SHA, MD5, RNG), 200 MHz operation, 64-pin QFN (9x9 mm) package, integrated 10/100 Ethernet MAC, USB 2.0 High-Speed PHY/OTG, two CAN modules, six UART, four SPI, and five I2C peripherals. The 64-pin QFN package with an exposed pad enables compact PCB layouts while providing low thermal resistance.
From an architectural perspective, the PIC32MZ EF family employs a five-stage pipeline with branch prediction and a tightly-coupled prefetch buffer, allowing sustained 1.5 DMIPS/MHz. The integrated Crypto engine offloads AES-128/192/256 and hash operations from the CPU, allowing deterministic response times in TLS/DTLS stacks. The device supports up to 32 channels of DMA and dedicated peripherals for graphics and motor control.
Typical applications include industrial IoT gateways requiring Ethernet/USB connectivity, secure connected HMI with TFT displays, automotive telematics and V2X, motor-control drives, and medical monitoring equipment. The combination of high core speed and on-chip crypto acceleration makes it well suited to TLS/DTLS endpoints and OTA-firmware-update designs.
Design consideration: the 64-pin QFN exposed pad must be soldered to a continuous copper pour to achieve the rated thermal performance. Decoupling capacitors should be placed as close as possible to each power pin pair, and the Ethernet PHY side requires a 49.9 ohm 1% precision resistor for the centre tap.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering value beyond a typical product listing.
Drop-in-Alternativen für PIC32MZ1024EFM064T-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFM064T-I/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Ethernet, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1024EFM064-I/MR
✅ Drop-In✓ Auf Lager
$8.95 / Stück
Datenblatt ansehen →PIC32MZ1024EFM064-E/MR
✅ Drop-In✓ Auf Lager
$13.1 / Stück
Datenblatt ansehen →PIC32MZ1024EFK064T-I/MR
✅ Drop-In✓ Auf Lager
$10.85 / Stück
Datenblatt ansehen →PIC32MZ1024EFG064-I/MR
✅ Drop-In✓ Auf Lager
$7.99 / Stück
Datenblatt ansehen →PIC32MZ1024EFF064-I/MR
✅ Drop-In✓ Auf Lager
$6.65 / Stück
Datenblatt ansehen →PIC32MZ1024EFH064-I/MR
✅ Drop-In✓ Auf Lager
$7.25 / Stück
Datenblatt ansehen →PIC32MZ1024EFM064T-I/MR Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 microAptiv M-Class |
| Core Architecture | 32-bit RISC with FPU and DSP |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| Data Memory (SRAM) | 512 KB |
| Gehäuse | 64-pin QFN (MR) 9x9 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Cryptography Engine | AES, 3DES, SHA-256, MD5, RNG (hardware) |
| Ethernet | 10/100 MAC (RMII/MII) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2 modules (CAN 2.0B) |
| DMA Channels | 8 |
| Timers | 9 (16-bit) + 2 Watchdog + 1 RTC |
| UART | 6 |
| SPI | 4 |
| I2C | 5 |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC32MZ1024EFM064T-I/MR 64-pin qfn (mr) 9x9 mm Pinbelegungsleitfaden
Pinbelegung für PIC32MZ1024EFM064T-I/MR (64-pin qfn (mr) 9x9 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ1024EFM064T-I/MR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ1024EFM064T-I/MR ist geeignet für 6 Anwendungs: Industrial IoT Gateway with Ethernet, Secure Connected HMI with TFT Display, Automotive Telematics and V2X, Motor Control and Field-Oriented Control (FOC) Drives, Medical Monitoring and Diagnostic Devices, Smart Energy and Grid Edge Device.
Industrial IoT Gateway with Ethernet
The PIC32MZ1024EFM064T-I/MR's integrated 10/100 Ethernet MAC and 200 MHz MIPS32 core make it ideal for industrial IoT gateways aggregating field-bus data and serving it to upstream SCADA/IoT platforms. The 1 MB Flash holds a full TLS 1.3 + MQTT-SN stack plus a 6LoWPAN border router, while 512 KB SRAM supports concurrent TCP/IP socket buffers without external memory. The hardware AES engine offloads TLS handshake encryption, keeping the CPU free for protocol parsing; deterministic response times are achieved through 8 DMA channels offloading UART/SPI field-bus traffic. Compared with an MCU requiring an external MAC, this part saves PCB area and BOM cost in a typical 4-port gateway design.
Empfohlen
Secure Connected HMI with TFT Display
The PIC32MZ1024EFM064T-I/MR's 200 MHz core, parallel graphics-friendly GPIO, and hardware crypto engine fit connected HMI designs with 4.3-inch TFT panels requiring TLS-authenticated cloud connectivity. The 1 MB Flash stores both an LVGL/MDK graphical stack and a firmware-update bootloader, while 512 KB SRAM holds display frame buffers without external PSRAM. Hardware AES-128/256 + SHA-256 keeps cloud authentication fast enough to avoid UI lag. The 64-QFN package footprint suits a small front-panel PCB behind the display. Compared with PIC32MX parts, the EF family's 5-stage pipeline delivers the throughput required for anti-aliased UI animation at 60 fps.
Empfohlen
Automotive Telematics and V2X
The PIC32MZ1024EFM064T-I/MR's dual CAN 2.0B modules, USB-HS, and hardware crypto engine fit automotive telematics control units bridging OBD-II/CAN bus data to cellular V2X backhaul. The 1 MB Flash holds a CAN-ISO-TP stack, TLS client, and OTA bootloader; 512 KB SRAM supports concurrent TCP/IP + CAN message buffers. The industrial -40C to +85C rating suits cabin-mounted TCUs; for under-hood deployment pair with the -E/MR extended-temperature sibling (180 MHz). Compared with a host CPU approach, this part runs AUTOSAR-classic MCAL drivers deterministically and boots in under 50 ms from Flash.
Empfohlen
Motor Control and Field-Oriented Control (FOC) Drives
The PIC32MZ1024EFM064T-I/MR's 200 MHz MIPS32 core with single-cycle MAC and DSP extensions is well matched to sensorless field-oriented control of 3-phase BLDC/PMSM motors up to ~5 kW. The hardware crypto engine is unused here but the part's 9 16-bit timers (with PWM mode), 8 DMA channels, and 200 MHz peripheral bus give the deterministic ADC->PWM latency required for low-speed torque-ripple-free commutation. The 64-QFN 9x9 mm exposed pad dissipates up to 1.5 W cleanly. Compared with PIC32MX motor-control parts, the EF family executes a full Park/Clarke transform in roughly half the cycles.
Empfohlen
Medical Monitoring and Diagnostic Devices
The PIC32MZ1024EFM064T-I/MR's 200 MHz throughput, 1 MB Flash for safety-critical firmware, and 512 KB SRAM for waveform buffers support portable patient-monitoring designs (pulse oximetry, ECG, spirometry). The hardware AES + SHA accelerates HIPAA-compliant data-at-rest encryption in a sealed enclosure. The 64-QFN exposed pad and low-power sleep modes (<10 µA) suit battery-powered handheld form factors. Compared with external-MAC designs, this part integrates USB-HS device for tethered PC sync plus Ethernet for bedside-monitor connectivity in one chip. Note: this is general-purpose silicon, not FDA-cleared.
Empfohlen
Smart Energy and Grid Edge Device
The PIC32MZ1024EFM064T-I/MR's integrated 10/100 Ethernet, USB-HS host, dual CAN, and hardware crypto engine target grid-edge devices such as solar inverters, smart meters, and energy-management controllers. The 1 MB Flash holds both a DLMS/COSEM metering stack and TLS 1.3 firmware-update client; 512 KB SRAM supports per-phase measurement buffers without external memory. The 64-QFN footprint fits the compact inside-the-enclosure PCB. Compared with separate MCU + MAC + crypto designs, this single-chip approach reduces BOM and PCB area by ~40% while delivering deterministic metering-cycle timing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1024EFM064T-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1024EFM064-I/MR | PIC32MZ1024EFM064-E/MR | PIC32MZ1024EFK064T-I/MR | PIC32MZ1024EFG064-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same | 64-QFN (MR) - same |
| Maximum CPU Speed | 200 MHz | 200 MHz | 180 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Cryptography Engine | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
Wichtigste Unterscheidungsmerkmale
- Industrial -40C to +85C temperature grade at 200 MHz (vs. PIC32MZ1024EFM064-E/MR)
- Tape-and-reel packaging for high-volume manufacturing (vs. PIC32MZ1024EFM064-I/MR)
- K-series extended connectivity (vs. PIC32MZ1024EFK064T-I/MR)
Designhinweise
The 64-QFN (MR) package has an exposed thermal pad that MUST be soldered to a continuous copper pour with thermal vias to achieve rated thermal performance. Estimated: at 200 MHz full peripheral activity, core power dissipation is approximately 0.6-0.9 W; without the exposed-pad solder connection, junction temperature can rise 40-50 C above ambient under sustained load. Provide at least 1 square inch of top-layer copper tied to the e-pad for reliable 85 C operation.
Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD/AVDD/VUSB/VDDIO pin pair, plus a 4.7 uF bulk capacitor near each voltage rail. The analog AVDD rail should be filtered through a ferrite bead from VDD and bypassed with 100 nF + 10 uF to maintain ADC accuracy. Estimated: insufficient decoupling can degrade ADC SNR by 3-6 dB.
Route the 50 MHz Ethernet RMII reference clock with a controlled-impedance 50 ohm trace and keep it under 25 mm to maintain signal integrity. Provide a 49.9 ohm 1% precision resistor at the PHY centre-tap (pin ETH_RBIAS). Keep USB DP/DM differential traces at 90 ohm impedance with length matching within 150 mm.
Do not leave the MCLR pin floating; it must be pulled high through a 10 kohm resistor to VDD for normal run-mode operation. The two CAN TX/RX pins require external transceivers (e.g., MCP2562) - they are logic-level only. Avoid enabling the crypto engine before the RNG has completed its first seed cycle or it will return deterministic outputs.
Compliance-Informationen
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC32MZ1024EFM064-E/MR for extended temperature or AEC-Q100 variants for automotive. Halogen-free status is unknown from the provided data.