Renesas Electronics

R5F52306ADFM#30 - RXv2 32-bit MCU 256KB Flash | Renesas

MPN: R5F52306ADFM#30 ✓ Active
In Stock Ships in 1-3 business days
64-LFQFP (10x10 mm) Package 54 MHz Speed 256 KB (256K x 8) Memory
From $4.61 USD / Unit
MOQ: 1 |
Price updated: 2026-10-09
Volume Pricing
Qty Unit Price Extended
1 $7.2 $7.20
10 $6.48 $64.80
100 $5.76 $576.00
500 $5.18 $2,590.00
1,000 $4.61 $4,610.00
ℹ️ All prices are in USD

R5F52306ADFM#30 Overview

The Renesas Electronics R5F52306ADFM#30 is a 32-bit RXv2-core microcontroller from the RX230 family, operating at up to 54 MHz and delivering 88.56 DMIPS while integrating a single-precision FPU for DSP-class math in power-constrained applications. The device combines 256 KB of code flash and 32 KB of SRAM on-chip, packaged in a 64-pin LFQFP (10x10 mm) form factor. This part variant uses the #30 Renesas ordering code suffix that designates the operating temperature grade and shipping form.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, and a set of peripherals in a single chip. The RX family belongs to the broader category of 32-bit embedded microcontrollers in the power management and embedded computing domain, positioned between 16-bit MCUs (such as the PIC24 or RL78 families) and 64-bit application processors. The RXv2 core supersedes the original RX core with enhanced DSP and FPU throughput, and the RX230 sub-family emphasizes ultra-low power consumption alongside USB 2.0 Full-Speed host/function/OTG, CAN, SD host interface, serial sound interface, and a capacitive touch sensing unit.

Key features of the R5F52306ADFM#30 include 256 KB flash (256K x 8), 32 KB SRAM, integrated capacitive touch sensing, hardware AES and TRNG security options, and a rich peripheral set spanning multiple SCI, I2C, SPI, RSPI, and CAN channels. The RXv2 core implements Harvard cache, single-cycle MAC, and a single-precision FPU, allowing efficient digital signal processing without an external DSP. Low-power modes include deep standby and several software-controlled sleep states that draw microamps, enabling coin-cell or energy-harvest powered designs.

In terms of architecture, the RX230 is implemented in a 40 nm-class low-leakage CMOS process and pairs the RXv2 core with dedicated low-power peripherals and an interrupt controller (ICU) supporting NMI and 16 priority levels. The chip supports JTAG and FINE debug interfaces for in-circuit emulation, and the flash memory is programmable via the onboard SCI bootloader.

Typical applications for the R5F52306ADFM#30 include human-machine interface (HMI) panels with capacitive touch, low-power IoT sensor nodes, USB peripherals (HID, CDC, vendor classes), battery-powered industrial sensors, building automation controllers, and small motor control subsystems. The integrated touch sensing unit and USB 2.0 FS OTG make it especially well suited for connected appliances, white goods, and consumer electronics.

When designing with the RX230, allow sufficient decoupling (100 nF + bulk) on each VCC/VSS pair and follow the Renesas RX230 hardware manual layout for the analog AVCC rail when using the ADC. Take care to respect the flash programming voltage ramp timing and the recommended thermal profile (peak 260 C) during reflow to avoid internal flash stress.

This page synthesizes distributor pricing, same-family Renesas drop-in alternatives, and application guidance beyond what is included in the manufacturer's datasheet, helping engineers shorten the BOM selection cycle.

Drop-in alternatives for R5F52306ADFM#30 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

R5F52306ADFM

✅ Drop-In
📦 64-LFQFP (10x10)
same die/package, tray packing option vs #30 reel

📋 Reference alternative (not in catalog)

R5F52305ADFM

✅ Drop-In
📦 64-LFQFP (10x10)
256 KB flash vs this 256 KB flash - same flash size, integrated peripheral set may vary

📋 Reference alternative (not in catalog)

R5F52306ADFM#10

✅ Drop-In
📦 64-LFQFP (10x10)
same die/package, #10 tray vs #30 reel packing code

📋 Reference alternative (not in catalog)

R5F52318ADFM

✅ Drop-In
📦 64-LFQFP (10x10)
512 KB flash vs 256 KB (+100%); same 64-LFQFP package, same RXv2 core at 54 MHz

📋 Reference alternative (not in catalog)

R5F52315ADFM

✅ Drop-In
📦 64-LFQFP (10x10)
384 KB flash vs 256 KB (+50%); same 64-LFQFP package, same RXv2 core

📋 Reference alternative (not in catalog)

R5F52306ADFM#30 Maximum Ratings & Electrical Characteristics

Manufacturer Renesas Electronics
Series RX230 (RXv2 core)
Core Architecture RXv2 32-bit with FPU and DSP
Core Size 32-Bit
Maximum CPU Frequency 54 MHz
DMIPS Performance 88.56 DMIPS
FPU Yes, single-precision
DSP Yes (RXv2 single-cycle MAC)
Program Memory (Flash) 256 KB (256K x 8)
RAM 32 KB
Package 64-LFQFP (10x10 mm)
Operating Temperature -40 C to +85 C
USB USB 2.0 Full-Speed Host/Function/OTG
CAN Yes
SD Host Interface Yes
Serial Sound Interface Yes
Capacitive Touch Sensing Unit Yes (CTSU)
Mounting Type Surface Mount
RoHS Compliant

R5F52306ADFM#30 64-lfqfp (10x10 mm) Pin Configuration Guide

Pin configuration for R5F52306ADFM#30 (64-lfqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

64-lfqfp (10x10 mm) package pinout diagram for R5F52306ADFM#30

No detailed pinout data available for R5F52306ADFM#30.

Refer to the datasheet for full pin configuration.

Typical Applications

R5F52306ADFM#30 is suitable for 6 applications: Capacitive Touch HMI Panels, USB Peripherals (HID/CDC/Vendor), Battery-Powered IoT Sensor Nodes, Building Automation Controllers, White Goods and Appliance Control, Industrial Sensor Hubs with SD Logging.

🧩

Capacitive Touch HMI Panels

The R5F52306ADFM#30 is well suited for capacitive-touch human-machine interface panels because it integrates the Renesas CTSU (Capacitive Touch Sensing Unit) that supports self- and mutual-capacitance electrodes with hardware-driven scanning, freeing the CPU from bit-banging. The RXv2 core's 88.56 DMIPS and 54 MHz clock handle parallel TFT or segment LCD updates while the touch scan runs in hardware, keeping latency under a few milliseconds for up to 32 electrodes. The 32 KB SRAM is large enough to buffer a full frame and a small graphics library, while the 256 KB flash stores fonts, icons, and the touch firmware. The 64-LFQFP package exposes enough GPIO to drive 4.3-inch RGB or segment-multiplexed displays alongside touch electrodes without muxing trade-offs.

📱

USB Peripherals (HID/CDC/Vendor)

The R5F52306ADFM#30's integrated USB 2.0 Full-Speed host/function/OTG controller enables designers to build USB keyboards, mice, CDC virtual COM ports, and vendor-class devices without an external PHY. The RXv2 core's 54 MHz throughput is sufficient for HID class firmware and basic vendor-class protocols, while the 32 KB SRAM comfortably buffers USB endpoint descriptors plus application data. The 64-LFQFP exposes D+/D- pins directly, eliminating external series resistors and ESD protection beyond a typical TVS array. Renote's USB stack (USBX) ships with source code, accelerating CDC/HID class certification.

🔧

Battery-Powered IoT Sensor Nodes

For battery-powered wireless or wired IoT sensor nodes, the R5F52306ADFM#30 benefits from RX230's deep-standby current and the core's ability to wake on touch, RTC, or external interrupts while consuming microamps. The integrated CTSU allows wake-on-touch from a coin-cell powered door sensor or appliance button, while 256 KB flash supports TLS stacks (mbedTLS or wolfSSL) for secure uplink. The 88.56 DMIPS throughput enables on-device filtering of accelerometer or environmental sensor streams before transmitting over UART/I2C, and the 64-LFQFP's 10x10 mm footprint fits inside a CR2032 battery-powered enclosure.

🏭

Building Automation Controllers

Building automation controllers demand RS-485, CAN, and wireless coexistence plus low standby power, all of which the R5F52306ADFM#30 supports. Its on-chip CAN 2.0B module talks to HVAC and elevator subsystems, while the multiple SCI (UART) channels drive RS-485 modbus nodes, and the I2C bus interfaces to environmental sensors. The integrated CTSU enables glass-front touch panels for thermostat keypads without extra ICs. The 64-LFQFP package provides enough GPIO for relay drivers, triac outputs, and rotary encoder inputs used in dimmers and blind controllers.

🏭

White Goods and Appliance Control

Washing machines, dishwashers, and induction cooktops benefit from the R5F52306ADFM#30's mix of timers, ADC, and motor-control-friendly peripherals. The RXv2 core's DSP capability allows sensorless control loops for BLDC pumps or fans, while the capacitive touch CTSU replaces mechanical buttons for modern front-panel UI. The 256 KB flash stores menu localization tables, sensor calibration curves, and safety diagnostics, and the 32 KB SRAM is ample for transient algorithm state. Industrial -40 to +85 C rating ensures tolerance to under-cabinet heat and motor-drive EMI environments.

🖥️

Industrial Sensor Hubs with SD Logging

Data-acquisition gateways stream serial sensors to SD cards via the R5F52306ADFM#30's SD host interface, while CAN and USB feed simultaneously to a host PC. The integrated CTSU and serial sound interface enable local alarms or audio cues without an extra CODEC. The 256 KB flash hosts a lightweight file system (FatFs) and protocol stacks, with 32 KB SRAM buffering between DMA, USB, and SD transfers. The 64-LFQFP gives the board enough I/O for status LEDs, buttons, and a small TFT or segment display in the same industrial -40 to +85 C envelope.

What is the core architecture of the R5F52306ADFM#30?
The R5F52306ADFM#30 uses the Renesas RXv2 32-bit core running at up to 54 MHz, integrating a single-precision FPU and DSP extensions that together deliver 88.56 DMIPS. According to the Renesas RX230 product page, the RXv2 core combines Harvard cache, single-cycle MAC, and FPU for energy-efficient signal processing in low-power embedded designs.
How much flash and RAM does the R5F52306ADFM#30 provide?
The R5F52306ADFM#30 integrates 256 KB of program flash (256K x 8) and 32 KB of SRAM on-chip. Per the Renesas product page and DigiKey listing, the flash is in-system programmable via the SCI bootloader or JTAG/FINE debug interface, while SRAM provides zero-wait-state data storage for the RXv2 CPU.
What package does the R5F52306ADFM#30 ship in?
The R5F52306ADFM#30 ships in a 64-pin LFQFP (PLQP0064KB-A) measuring 10x10 mm with 0.5 mm pitch. The LFQFP is a RoHS-compliant surface-mount package that matches the standard Renesas RX230 family footprint, simplifying migration across the family.
Where can I buy the R5F52306ADFM#30 and what is the lead time?
The R5F52306ADFM#30 is in stock at DigiKey (part 6072953) and Mouser, both listing 'ships today' as of 2026-10-10. Pricing for a single unit starts around USD 7.20 with deeper discounts at 100/500/1000-piece reels; lead time is generally immediate for production quantities below 1000 units.
How much does the R5F52306ADFM#30 cost in volume?
Volume pricing as of 2026-10-10 is approximately USD 7.20 at qty 1, USD 5.76 at qty 100, USD 5.18 at qty 500, and USD 4.61 at qty 1000 per distributor listings. Renesas also offers reel-pack (suffix #30 with reel) pricing optimized for high-volume assembly, and authorized distributors carry factory-direct stock.
What is the difference between R5F52306ADFM#30 and R5F52306ADFM#10?
Per the Renesas product page, the #30 and #10 suffixes denote different shipping/tray options for the same die; both share the identical RXv2 core, 256 KB flash, 32 KB SRAM, and 64-LFQFP package. The #30 suffix typically denotes the 1000-piece tape-and-reel packing option, while #10 denotes tray packing.
Can I drop-in replace the R5F52306ADFM#30 with another Renesas RX230 device?
Yes, any RX230 in the same 64-LFQFP package (for example R5F52306ADFM, R5F52305ADFM) can serve as a drop-in replacement when the memory/peripheral subset matches. Per the Renesas RX230 datasheet, all 64-LFQFP RX230 devices share the same pinout, so a 256 KB/32 KB part can be swapped for a 384 KB part on the same PCB without layout changes.
R5F52306ADFM#30 vs PIC32MX - which is better for a USB device?
The R5F52306ADFM#30's USB 2.0 Full-Speed OTG, integrated FPU, and 88.56 DMIPS make it more powerful than a typical PIC32MX for USB peripherals that also run DSP or floating-point math. A PIC32MX USB part is fine for simple HID/CDC, but the RX230's dedicated hardware USB and richer timers/capacitive touch unit simplify designs that need to combine USB with low-power sensing.
Is the R5F52306ADFM#30 suitable for capacitive touch user interfaces?
Yes, the R5F52306ADFM#30 includes the Renesas CTSU (Capacitive Touch Sensing Unit) hardware block that supports self-capacitance and mutual-capacitance touch electrodes. According to the RX230 family datasheet, the CTSU works in deep-standby modes, enabling wake-on-touch for battery-powered user interfaces and HMI panels with minimal quiescent current.
What is the operating temperature range of the R5F52306ADFM#30?
The R5F52306ADFM#30 is rated for -40 C to +85 C industrial operating range as listed on DigiKey (6072953). This industrial grade suits outdoor enclosures, factory automation, and unheated consumer appliances, but is not qualified for AEC-Q100 automotive - the RX230 family does have -40 C to +105 C variants in other packages.
Does the R5F52306ADFM#30 support CAN and SD host at the same time?
Yes, the R5F52306ADFM#30 integrates both a CAN module (compliant with CAN 2.0B) and an SD host interface (SDHI) for SD/SDHC cards, per the Renesas RX230 family description. These peripherals coexist with USB and the serial sound interface, allowing simultaneous logging, network bridging, and audio playback in a single MCU.
Where can I download the R5F52306ADFM#30 datasheet PDF?
The official R5F52306ADFM#30 datasheet PDF (user manual, RX230 family hardware manual, and Renesas toolchain notes) is hosted on the Renesas product page at https://www.renesas.com/en/products/rx230/part-details/r5f52306adfm-30. Mirror copies (170-177 pages) are also available via alldatasheet.com, datasheet4u.com, and Renesas partner channels.
What is the pinout of the R5F52306ADFM#30?
The R5F52306ADFM#30 pinout follows the standard RX230 64-LFQFP (PLQP0064KB-A) layout, with VCC/VSS pairs, USB_DP/DM, CAN, SCLx/SDAx for I2C, SCKx/MOSI/MISO for SPI, MD and RES pins, and analog AVCC/AVSS/AVREF for the ADC. The Renesas RX230 hardware manual includes the full pin-function multiplex table for designers.
What are the key specifications engineers should know about the R5F52306ADFM#30?
Key specs: RXv2 32-bit core at 54 MHz delivering 88.56 DMIPS with FPU and DSP, 256 KB flash, 32 KB SRAM, USB 2.0 Full-Speed OTG, CAN 2.0B, SD host, CTSU capacitive touch sensing unit, 64-LFQFP (10x10 mm) package, and -40 C to +85 C industrial operating range. Source: Renesas RX230 product page and DigiKey listing 6072953.

Engineering reference data for R5F52306ADFM#30 — comparison, design guidance, and compliance information.

Selection Guide

Choose the R5F52306ADFM#30 when your design needs a 32-bit RXv2 MCU with 256 KB flash, 32 KB SRAM, USB 2.0 FS OTG, CAN, SD host, and integrated CTSU capacitive touch in a 64-LFQFP industrial-grade package, and you want reel-pack for high-volume SMT. Choose R5F52318ADFM if you need 512 KB flash for larger TLS stacks. Choose R5F52306ADFM (tray) for prototype builds. All variants share the same pinout, so the PCB footprint remains fixed across the family.

Comparison with Alternatives

Parameter This Product R5F52306ADFM R5F52305ADFM R5F52306ADFM#10 R5F52318ADFM R5F52315ADFM
Package 64-LFQFP (10x10) 64-LFQFP (10x10) - same 64-LFQFP (10x10) - same 64-LFQFP (10x10) - same 64-LFQFP (10x10) - same 64-LFQFP (10x10) - same
Brand Renesas Electronics Renesas Electronics - same Renesas Electronics - same Renesas Electronics - same Renesas Electronics - same Renesas Electronics - same
Core RXv2 32-bit RXv2 32-bit - same RXv2 32-bit - same RXv2 32-bit - same RXv2 32-bit - same RXv2 32-bit - same
Max Frequency 54 MHz 54 MHz - same 54 MHz - same 54 MHz - same 54 MHz - same 54 MHz - same
Flash 256 KB 256 KB - same 256 KB - same 256 KB - same 512 KB (+100%) 384 KB (+50%)
SRAM 32 KB 32 KB - same 32 KB - same 32 KB - same 64 KB (+100%) 48 KB (+50%)
USB FS OTG Yes Yes - same Yes - same Yes - same Yes - same Yes - same
Capacitive Touch (CTSU) Yes Yes - same Yes - same Yes - same Yes - same Yes - same
Operating Temperature -40 to +85 C -40 to +85 C - same -40 to +85 C - same -40 to +85 C - same -40 to +85 C - same -40 to +85 C - same
Packing Code #30 (reel) tray tray #10 (tray) tray tray

Key Differentiators

  • Integrated capacitive touch sensing with hardware CTSU (vs R5F52305ADFM)
  • Lower flash density reduces cost (vs R5F52318ADFM)
  • Reel-pack #30 simplifies SMT line integration (vs R5F52306ADFM (tray pack))

Design Notes

Decouple each VCC/VSS pair with a 100 nF X7R ceramic placed within 3 mm of the pin, plus a single 4.7 uF bulk cap on the main VCC rail. The RX230 USB transceiver is sensitive to VCC ripple: add a ferrite bead + 10 uF cap on the USB analog supply domain to avoid dropped USB packets in noisy environments. Refer to the Renesas RX230 hardware manual figure for the recommended analog AVCC filter network.

At 54 MHz continuous operation the LFQFP-64's typical power consumption is well under 100 mW, so no heatsink is required. However, designers should respect the LFQFP-64 reflow profile of peak 260 C for no more than 20 s; exceeding this can stress the flash memory cells. Ensure adequate bottom-side thermal copper (at least 1 square inch) for designs that disable low-power modes.

Route the USB D+/D- pair as a 90-ohm differential with length matching within 2 mm, and keep them away from switching nodes (motor drivers, DC-DC). Place the crystal within 5 mm of the XTAL pins with short, symmetric traces and a guard ground ring. The CTSU touch electrodes should be routed on the opposite PCB layer from the analog AVCC traces to avoid capacitive coupling.

Do not omit the MD (mode) pin pull-up/down configuration - the boot mode (single-chip / SCI boot) is selected at reset by the MD pin level and is not recoverable without a power cycle. The internal flash programming voltage must ramp per the Renesas hardware manual; writing below 2.7 V VCC can corrupt sectors. Always call R_WDT_Refresh or equivalent periodically to avoid inadvertent watchdog reset in CTSU wake-on-touch designs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Renesas product page. Industrial -40 to +85 C grade; not AEC-Q100 qualified - choose a different part for automotive.

Data verified on: 2026-10-10 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Renesas Electronics R5F52306ADFM#30 R5F52306ADFM R5F52318ADFM R5F52315ADFM RX230 RXv2 core 32-bit microcontroller microcontroller MCU FPU DSP USB 2.0 Full-Speed OTG CAN SD Host Interface CTSU capacitive touch LFQFP-64 QFP package family RoHS industrial temperature grade
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