R7F7010323AFP - 32-bit 80MHz 768KB Flash Automotive MCU | Renesas
MPN: R7F7010323AFP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $15.2 | $1,520.00 |
| 500 | $13.9 | $6,950.00 |
| 1,000 | $12.75 | $12,750.00 |
R7F7010323AFP Overview
An automotive microcontroller (MCU) is a ruggedized 32-bit microprocessor with tightly integrated flash, RAM, analog peripherals and communication interfaces qualified for the -40C to +125C automotive temperature range. The RH850 family uses a Harvard-style V850-derived core with multi-layer AHB bus, dedicated hardware for functional safety (ECC on flash/SRAM, lockstep, watchdog) and timers tuned for automotive PWM and capture. Within the broader hierarchy, the R7F7010323AFP sits at MCU -> microcontroller -> embedded processor -> semiconductor.
Key features include 768KB program flash, 80MHz maximum CPU clock, integrated CAN/LIN/UART peripherals, multi-channel 12-bit ADCs, programmable timer arrays and hardware CRC. Memory protection, error correction code and a window watchdog support ISO 26262 functional safety integration. The 176-pin LFQFP package provides sufficient I/O count (typically >120 GPIO pins) and excellent thermal performance for body domain ECUs.
Technical depth: the RH850G3K core uses a 32-bit RISC architecture with single-cycle multiply, hardware divide and tightly-coupled interrupt controller. The flash macro supports background programming and ECC single-bit correction with double-bit detection. The peripheral bus is split across AHB-Lite and APB bridges to balance DMA and CPU access latency. Power management integrates a low-power timer, standby RAM retention and multiple run/idle/stop modes for quiescent current reduction when the vehicle bus is asleep.
Typical applications include body control modules, HVAC door-zone controllers, lighting ECUs, instrument clusters and gateway nodes where CAN-FD connectivity and ASIL-B functional safety are required. The on-chip motor timer/PWM blocks also support small BLDC and brushed-DC loads such as seat or mirror actuators.
When designing with this part, plan the flash programming sequence against the 80MHz instruction budget and verify LIN/CAN transceivers separately. ECC initialization must be run before first code execution and the watchdog serviced in the locked window to remain ASIL-B compliant.
This page synthesizes distributor pricing, same-family drop-in variants and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for R7F7010323AFP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with R7F7010323AFP (same form factor and footprint) — differing in Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
R7F7010324EAFP
✅ Drop-In📋 Reference alternative (not in catalog)
R7F7010323AFP-C
✅ Drop-In📋 Reference alternative (not in catalog)
R7F7010322AFP
✅ Drop-In📋 Reference alternative (not in catalog)
R7F7010325AFP
✅ Drop-In📋 Reference alternative (not in catalog)
R5F5631BCDFP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.05 / Unit
View Datasheet →R7F7010323AFP Maximum Ratings & Electrical Characteristics
| Core | RH850G3K 32-bit RISC |
| Family | RH850/F1L |
| Maximum CPU Clock | 80 MHz |
| Program Flash | 768 KB (768K x 8) |
| Package | 176-LFQFP (24x24 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40C to +125C (automotive) |
| Communication Interfaces | CAN, LIN, UART, SPI, I2C |
| Watchdog | Window watchdog |
| Memory Protection | ECC on flash, SRAM protection |
| RoHS Status | Compliant |
| Lead-Free | Yes |
R7F7010323AFP 176-lfqfp (24x24 mm) Pin Configuration Guide
Pin configuration for R7F7010323AFP (176-lfqfp (24x24 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for R7F7010323AFP.
Refer to the datasheet for full pin configuration.
Typical Applications
R7F7010323AFP is suitable for 6 applications: Body Control Module, HVAC Door-Zone Controller, Lighting ECU / LED Matrix Driver, Instrument Cluster Controller, Automotive Gateway Node, Seat / Mirror / Window Actuator ECU.
Body Control Module
The R7F7010323AFP fits body control module designs by integrating 768KB flash for BCM application code plus bootloader and CAN/LIN stacks, while the 80MHz RH850G3K core executes door/window/lamp state machines within typical CAN-FD cycle budgets. The 176-LFQFP exposes >120 GPIO needed to drive MOSFET pre-drivers and read switch matrices. ASIL-B capable ECC flash and window watchdog support functional safety targets without external supervisor ICs. This eliminates discrete parts versus older 16-bit BCM solutions, reducing BOM cost.
Recommended
HVAC Door-Zone Controller
HVAC door-zone ECUs use the R7F7010323AFP's PWM timers to drive multiple BLDC/brush-DC actuators controlling air-mix doors. The RH850/F1L integrates hardware dead-time and complementary PWM outputs, simplifying firmware and freeing CPU cycles for temperature-control loops. With 768KB flash, the controller hosts LIN-communicated smart-actuator drivers and diagnostic routines. The -40C to +125C operating range is required for under-dash locations where temperature swings are extreme.
Recommended
Lighting ECU / LED Matrix Driver
For adaptive LED headlights and matrix lighting ECUs, the R7F7010323AFP provides sufficient peripheral count for SPI-controlled LED drivers plus CAN-FD messaging with the body-domain gateway. The 80MHz core handles light-pattern algorithms at frame rates above 60Hz while remaining within thermal envelope. ECC-protected flash stores LED calibration tables and headlight leveling parameters, and ASIL-B functional safety supports fail-safe dimming if a pixel driver faults.
Recommended
Instrument Cluster Controller
Digital instrument clusters use the R7F7010323AFP to drive stepper motors for gauges, collect CAN-FD vehicle data and host graphic rendering for the display. The 768KB flash allows cluster animation assets and gauge LUTs to be stored on-chip. With window watchdog and ECC, cluster safety warnings and telltale indicators meet ISO 26262 ASIL-B. The 176-LFQFP I/O count accommodates multiple SPI display interfaces plus analog gauge drivers.
Recommended
Automotive Gateway Node
Central gateway nodes use the R7F7010323AFP as a CAN/LIN concentrator bridging body, chassis and powertrain domains. The hardware CAN-FD controller and multiple LIN channels aggregate bus traffic without CPU intervention. The 768KB flash holds routing tables, network management firmware and cybersecurity secOC stacks. ECC and memory protection prevent routing-table corruption that would otherwise black-out network domains.
Recommended
Seat / Mirror / Window Actuator ECU
For seat-position, mirror-fold and power-window actuators, the R7F7010323AFP drives low-side MOSFETs via its PWM/timer peripherals and reads Hall-sensor feedback via on-chip ADC. The integrated LIN/UART handles communication with the body controller, and ECC-protected flash stores position memory and anti-pinch calibration. The 176-LFQFP package's >120 GPIO supports multiple motors and end-position switches on one MCU, reducing ECU size and cost.
Recommended
Recommended Products Summary
Engineering reference data for R7F7010323AFP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | R7F7010324EAFP | R7F7010323AFP-C | R7F7010322AFP | R7F7010325AFP | R5F5631BCDFP |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP (24x24 mm) | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP - same footprint family |
| Core | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RX63N 32-bit 100MHz |
| Program Flash | 768 KB | 896 KB (+17%) | 768 KB (same) | 640 KB (-17%) | 512 KB (-33%) | 768 KB (same) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (industrial) |
| Functional Safety | ASIL-B capable (ECC + WDG) | ASIL-B capable | ASIL-B capable | ASIL-B capable | ASIL-B capable | Industrial grade, no ASIL rating |
| Firmware Portability | RH850 baseline | Drop-in, no port required | Drop-in, no port required | Drop-in, no port required | Drop-in, no port required | Requires RH850->RX core port |
| Price (1pc, USD as of 2026-10-10) | 18.50 | 20.50 | 18.50 | 16.20 | 14.10 | 12.00 |
Key Differentiators
- Drop-in flash upgrade path within the RH850/F1L family (vs R7F7010324EAFP)
- Full automotive ASIL-B functional safety on-chip (vs R5F5631BCDFP)
- Higher flash for same cost class vs lower-density sibling (vs R7F7010322AFP)
Design Notes
Flash ECC must be initialized before any code execution on the R7F7010323AFP. Renesas recommends enabling ECC by writing the initialization sequence early in the bootloader; otherwise single-bit errors will trigger spurious data-abort exceptions. Always clear ECC error status flags before enabling interrupts to avoid boot-time faults.
The 176-LFQFP 24x24 mm package has theta_JA around 30 C/W on a 4-layer JEDEC PCB. Estimated: at 80MHz with all peripherals active, internal dissipation is roughly 1.5W, giving a junction rise of 45C above ambient - manageable within the 125C limit but with limited margin in enclosed body-ECU housings. Use 4-layer PCB with thermal vias and adequate copper pour for headroom.
Place a 100 nF X7R ceramic bypass capacitor on every VDD/VSS pair within 5 mm of the package pin, plus a 4.7 uF bulk cap near the LDO output. Keep analog references (AVCC0/AVSS0) routed with short, parallel traces and a guard ring on the analog ground island to preserve ADC accuracy on the R7F7010323AFP.
CAN-FD signals on the R7F7010323AFP require matched 120 ohm termination at the bus ends and a split termination network on the transceiver. ISO 11898-1 specifies a 60 ohm parallel termination only at the two ends; mismatched termination causes ringing that corrupts CAN-FD CRC at higher bit rates.
Keep the external oscillator traces to the R7F7010323AFP main oscillator pins shorter than 8 mm and isolated from switching power traces. Use guard traces connected to ground on each side, and place the load capacitor symmetrically. Slow rise/fall times at the oscillator pins cause spurious baud-rate errors on CAN/LIN.
Compliance Information
AEC-Q100 qualified per Renesas automotive MCU marketing collateral. RoHS/REACH compliant per DigiKey product page.
