R7F7010323AFP - 32-bit 80MHz 768KB Flash Automotive MCU | Renesas
Teilenummer: R7F7010323AFP ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.9 | $6.950,00 |
| 1.000 | $12.75 | $12.750,00 |
R7F7010323AFP Übersicht
An automotive microcontroller (MCU) is a ruggedized 32-bit microprocessor with tightly integrated flash, RAM, analog peripherals and communication interfaces qualified for the -40C to +125C automotive temperature range. The RH850 family uses a Harvard-style V850-derived core with multi-layer AHB bus, dedicated hardware for functional safety (ECC on flash/SRAM, lockstep, watchdog) and timers tuned for automotive PWM and capture. Within the broader hierarchy, the R7F7010323AFP sits at MCU -> microcontroller -> embedded processor -> semiconductor.
Key features include 768KB program flash, 80MHz maximum CPU clock, integrated CAN/LIN/UART peripherals, multi-channel 12-bit ADCs, programmable timer arrays and hardware CRC. Memory protection, error correction code and a window watchdog support ISO 26262 functional safety integration. The 176-pin LFQFP package provides sufficient I/O count (typically >120 GPIO pins) and excellent thermal performance for body domain ECUs.
Technical depth: the RH850G3K core uses a 32-bit RISC architecture with single-cycle multiply, hardware divide and tightly-coupled interrupt controller. The flash macro supports background programming and ECC single-bit correction with double-bit detection. The peripheral bus is split across AHB-Lite and APB bridges to balance DMA and CPU access latency. Power management integrates a low-power timer, standby RAM retention and multiple run/idle/stop modes for quiescent current reduction when the vehicle bus is asleep.
Typical applications include body control modules, HVAC door-zone controllers, lighting ECUs, instrument clusters and gateway nodes where CAN-FD connectivity and ASIL-B functional safety are required. The on-chip motor timer/PWM blocks also support small BLDC and brushed-DC loads such as seat or mirror actuators.
When designing with this part, plan the flash programming sequence against the 80MHz instruction budget and verify LIN/CAN transceivers separately. ECC initialization must be run before first code execution and the watchdog serviced in the locked window to remain ASIL-B compliant.
This page synthesizes distributor pricing, same-family drop-in variants and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für R7F7010323AFP – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit R7F7010323AFP (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
R7F7010324EAFP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R7F7010323AFP-C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R7F7010322AFP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R7F7010325AFP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
R5F5631BCDFP
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.05 / Stück
Datenblatt ansehen →R7F7010323AFP Grenzwerte & elektrische Eigenschaften
| Core | RH850G3K 32-bit RISC |
| Family | RH850/F1L |
| Maximum CPU Clock | 80 MHz |
| Program Flash | 768 KB (768K x 8) |
| Gehäuse | 176-LFQFP (24x24 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40C to +125C (automotive) |
| Communication Interfaces | CAN, LIN, UART, SPI, I2C |
| Watchdog | Window watchdog |
| Memory Protection | ECC on flash, SRAM protection |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
R7F7010323AFP 176-lfqfp (24x24 mm) Pinbelegungsleitfaden
Pinbelegung für R7F7010323AFP (176-lfqfp (24x24 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für R7F7010323AFP.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
R7F7010323AFP ist geeignet für 6 Anwendungs: Body Control Module, HVAC Door-Zone Controller, Lighting ECU / LED Matrix Driver, Instrument Cluster Controller, Automotive Gateway Node, Seat / Mirror / Window Actuator ECU.
Body Control Module
The R7F7010323AFP fits body control module designs by integrating 768KB flash for BCM application code plus bootloader and CAN/LIN stacks, while the 80MHz RH850G3K core executes door/window/lamp state machines within typical CAN-FD cycle budgets. The 176-LFQFP exposes >120 GPIO needed to drive MOSFET pre-drivers and read switch matrices. ASIL-B capable ECC flash and window watchdog support functional safety targets without external supervisor ICs. This eliminates discrete parts versus older 16-bit BCM solutions, reducing BOM cost.
Empfohlen
HVAC Door-Zone Controller
HVAC door-zone ECUs use the R7F7010323AFP's PWM timers to drive multiple BLDC/brush-DC actuators controlling air-mix doors. The RH850/F1L integrates hardware dead-time and complementary PWM outputs, simplifying firmware and freeing CPU cycles for temperature-control loops. With 768KB flash, the controller hosts LIN-communicated smart-actuator drivers and diagnostic routines. The -40C to +125C operating range is required for under-dash locations where temperature swings are extreme.
Empfohlen
Lighting ECU / LED Matrix Driver
For adaptive LED headlights and matrix lighting ECUs, the R7F7010323AFP provides sufficient peripheral count for SPI-controlled LED drivers plus CAN-FD messaging with the body-domain gateway. The 80MHz core handles light-pattern algorithms at frame rates above 60Hz while remaining within thermal envelope. ECC-protected flash stores LED calibration tables and headlight leveling parameters, and ASIL-B functional safety supports fail-safe dimming if a pixel driver faults.
Empfohlen
Instrument Cluster Controller
Digital instrument clusters use the R7F7010323AFP to drive stepper motors for gauges, collect CAN-FD vehicle data and host graphic rendering for the display. The 768KB flash allows cluster animation assets and gauge LUTs to be stored on-chip. With window watchdog and ECC, cluster safety warnings and telltale indicators meet ISO 26262 ASIL-B. The 176-LFQFP I/O count accommodates multiple SPI display interfaces plus analog gauge drivers.
Empfohlen
Automotive Gateway Node
Central gateway nodes use the R7F7010323AFP as a CAN/LIN concentrator bridging body, chassis and powertrain domains. The hardware CAN-FD controller and multiple LIN channels aggregate bus traffic without CPU intervention. The 768KB flash holds routing tables, network management firmware and cybersecurity secOC stacks. ECC and memory protection prevent routing-table corruption that would otherwise black-out network domains.
Empfohlen
Seat / Mirror / Window Actuator ECU
For seat-position, mirror-fold and power-window actuators, the R7F7010323AFP drives low-side MOSFETs via its PWM/timer peripherals and reads Hall-sensor feedback via on-chip ADC. The integrated LIN/UART handles communication with the body controller, and ECC-protected flash stores position memory and anti-pinch calibration. The 176-LFQFP package's >120 GPIO supports multiple motors and end-position switches on one MCU, reducing ECU size and cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für R7F7010323AFP – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | R7F7010324EAFP | R7F7010323AFP-C | R7F7010322AFP | R7F7010325AFP | R5F5631BCDFP |
|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 176-LFQFP (24x24 mm) | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP (24x24) - same | 176-LFQFP - same footprint family |
| Core | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RH850G3K 32-bit 80MHz | RX63N 32-bit 100MHz |
| Program Flash | 768 KB | 896 KB (+17%) | 768 KB (same) | 640 KB (-17%) | 512 KB (-33%) | 768 KB (same) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (industrial) |
| Functional Safety | ASIL-B capable (ECC + WDG) | ASIL-B capable | ASIL-B capable | ASIL-B capable | ASIL-B capable | Industrial grade, no ASIL rating |
| Firmware Portability | RH850 baseline | Drop-in, no port required | Drop-in, no port required | Drop-in, no port required | Drop-in, no port required | Requires RH850->RX core port |
| Price (1pc, USD as of 2026-10-10) | 18.50 | 20.50 | 18.50 | 16.20 | 14.10 | 12.00 |
Wichtigste Unterscheidungsmerkmale
- Drop-in flash upgrade path within the RH850/F1L family (vs. R7F7010324EAFP)
- Full automotive ASIL-B functional safety on-chip (vs. R5F5631BCDFP)
- Higher flash for same cost class vs lower-density sibling (vs. R7F7010322AFP)
Designhinweise
Flash ECC must be initialized before any code execution on the R7F7010323AFP. Renesas recommends enabling ECC by writing the initialization sequence early in the bootloader; otherwise single-bit errors will trigger spurious data-abort exceptions. Always clear ECC error status flags before enabling interrupts to avoid boot-time faults.
The 176-LFQFP 24x24 mm package has theta_JA around 30 C/W on a 4-layer JEDEC PCB. Estimated: at 80MHz with all peripherals active, internal dissipation is roughly 1.5W, giving a junction rise of 45C above ambient - manageable within the 125C limit but with limited margin in enclosed body-ECU housings. Use 4-layer PCB with thermal vias and adequate copper pour for headroom.
Place a 100 nF X7R ceramic bypass capacitor on every VDD/VSS pair within 5 mm of the package pin, plus a 4.7 uF bulk cap near the LDO output. Keep analog references (AVCC0/AVSS0) routed with short, parallel traces and a guard ring on the analog ground island to preserve ADC accuracy on the R7F7010323AFP.
CAN-FD signals on the R7F7010323AFP require matched 120 ohm termination at the bus ends and a split termination network on the transceiver. ISO 11898-1 specifies a 60 ohm parallel termination only at the two ends; mismatched termination causes ringing that corrupts CAN-FD CRC at higher bit rates.
Keep the external oscillator traces to the R7F7010323AFP main oscillator pins shorter than 8 mm and isolated from switching power traces. Use guard traces connected to ground on each side, and place the load capacitor symmetrically. Slow rise/fall times at the oscillator pins cause spurious baud-rate errors on CAN/LIN.
Compliance-Informationen
AEC-Q100 qualified per Renesas automotive MCU marketing collateral. RoHS/REACH compliant per DigiKey product page.
