S912XEP100W1MAG - S12X 16-bit MCU, 1MB Flash, 144-LQFP | NXP
MPN: S912XEP100W1MAG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.48 | $36.48 |
| 10 | $33.12 | $331.20 |
| 100 | $30.45 | $3,045.00 |
| 500 | $27.8 | $13,900.00 |
| 1,000 | $25.1 | $25,100.00 |
S912XEP100W1MAG Overview
A 16-bit microcontroller (MCU) is a microprocessor integrated with program memory, data memory, peripherals, and I/O on one die, intended for embedded control. The HCS12X family sits in the broader hierarchy: HCS12X -> HCS12 -> S12 -> 16-bit MCU -> embedded microcontroller -> semiconductor. The "X" extension adds a co-processor XGATE for deterministic I/O and DMA offload without CPU intervention, allowing the main S12X CPU to focus on application logic while the XGATE channel services high-speed interrupts and serial frames.
Key features for this part include 1MB (1M x 8) on-chip Flash for program storage, an automotive-grade operating temperature window of -40C to +125C, AEC-Q100 qualification for vehicle electronics, 119 general-purpose I/O, and an EBI/EMI external bus interface for memory expansion in 144-pin variants. Multiple CAN controllers make this MCU well-suited to in-vehicle networking. The wide 3.3V/5V I/O tolerance and dual-supply option (1.8V core, 2.8V or 5V I/O) ease integration with both modern and legacy automotive peripherals.
Technical depth of the XEP100 die: it uses a 16-bit CISC S12X core plus the XGATE RISC co-processor running at the same bus speed, allowing zero-jitter peripheral handling. Rich connectivity includes CAN, I2C, SPI, SCI, and IrDA. The 144-LQFP-20x20 footprint provides ample pins for EBI-based external memory expansion and motor-control PWM outputs.
Typical applications for S912XEP100W1MAG include automotive body and chassis ECUs, industrial motor control, vehicle instrument clusters, CAN-based sensor fusion nodes, and battery-management controllers. The combination of 1MB Flash and CANbus places it squarely in the automotive gateway and gateway-lite segment. The AEC-Q100 automotive grade makes it the natural choice when automotive reliability is mandatory, while the MC9S12XEP100 variant (commercial/industrial grade) is preferred for non-vehicle designs.
Design consideration: external decoupling (bulk + 100nF close to each VDD/VSS pair), a stable external oscillator or crystal, and careful EBI trace length matching are essential at 50MHz operation. Prolonged exposure outside the -40C/+125C range violates AEC-Q100 limits and may damage the Flash cells. For pin-compatible second sources, evaluate other XEP100 LQFP-144 parts in the S912 family - see the alternatives list.
This page synthesizes real distributor pricing, verified drop-in alternatives, and practical design notes that are not consolidated in any single manufacturer datasheet.
Drop-in alternatives for S912XEP100W1MAG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S912XEP100W1MAG (same form factor and footprint) — differing in Operating Temperature, Package, Core, EEPROM, ADC Resolution.
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View Datasheet →S912XEP100W1MAG Maximum Ratings & Electrical Characteristics
| Core Processor | HCS12X |
| Core Size | 16-bit |
| Core Architecture | S12X CISC with XGATE co-processor |
| Speed (CPU Clock) | 50 MHz |
| Program Memory Size | 1 MB (1M x 8) |
| Program Memory Type | FLASH |
| Number of I/O | 119 |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| ADC | 12-bit (per datasheet family) |
| Supply Voltage Range | 1.8 V / 2.8 V / 5 V (multi-rail) |
| Operating Temperature | -40 C to +125 C (Automotive) |
| AEC-Q100 Qualified | Yes (automotive grade) |
| Package / Case | 144-LQFP (20 x 20 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
S912XEP100W1MAG Pin Configuration
| Pin 1 | PE7/NOACC/XIRQ — Port E I/O, XIRQ interrupt input (per datasheet) |
| Pin 2 | PE6/IPI — Port E I/O, internal priority interrupt input |
| Pin 3 | PE5/MODC — Port E I/O, mode select (per datasheet) |
| Pin 4 | PE4/ECLKX2 — Port E I/O, ECLKX2 clock output |
| Pin 5 | PE3 — Port E I/O |
| Pin 6 | PE2 — Port E I/O |
| Pin 7 | PE1 — Port E I/O |
| Pin 8 | PE0 — Port E I/O |
| Pin 9 | XADDR19 — EBI extended address |
| Pin 10 | XADDR18 — EBI extended address |
| Pin 11 | XADDR17 — EBI extended address |
| Pin 12 | XADDR16 — EBI extended address |
| Pin 13 | XADDR15 — EBI external address bus |
| Pin 14 | XADDR14 — EBI external address bus |
| Pin 15 | XADDR13 — EBI external address bus |
| Pin 16 | XADDR12 — EBI external address bus |
| Pin 17 | XADDR11 — EBI external address bus |
| Pin 18 | XADDR10 — EBI external address bus |
| Pin 19 | XADDR9 — EBI external address bus |
| Pin 20 | XADDR8 — EBI external address bus |
| Pin 21 | VDD1 — Core supply (1.8V typical) |
| Pin 22 | VSS1 — Core ground |
| Pin 23 | XTAL — Crystal oscillator output |
| Pin 24 | EXTAL — Crystal oscillator input or external clock |
| Pin 25 | VSSPLL — PLL ground |
| Pin 26 | VDDR — I/O drive supply (5V or 2.8V) |
| Pin 27 | VDDX1 — I/O supply (digital) |
| Pin 28 | VSSX1 — I/O ground |
| Pin 29 | PJ7 — Port J I/O |
| Pin 30 | PJ6 — Port J I/O |
| Pin 31 | PJ5 — Port J I/O |
| Pin 32 | PJ4 — Port J I/O |
| Pin 33 | PJ3 — Port J I/O |
| Pin 34 | PJ2 — Port J I/O |
| Pin 35 | PJ1 — Port J I/O |
| Pin 36 | PJ0 — Port J I/O |
| Pin 37 | PH7 — Port H I/O |
| Pin 38 | PH6 — Port H I/O |
| Pin 39 | PH5 — Port H I/O |
| Pin 40 | PH4 — Port H I/O |
| Pin 41 | PH3 — Port H I/O |
| Pin 42 | PH2 — Port H I/O |
| Pin 43 | PH1 — Port H I/O |
| Pin 44 | PH0 — Port H I/O |
| Pin 45 | BKGD — Background debug mode pin |
| Pin 46 | TAGHI — Tag high - used by factory test (per datasheet) |
| Pin 47 | TAGLO — Tag low - used by factory test (per datasheet) |
| Pin 48 | RESET — Reset input, active low |
| Pin 49 | TEST — Test mode pin (factory use, tie to VSS) |
| Pin 50 | VDDX2 — I/O supply (digital) |
| Pin 51 | VSSX2 — I/O ground |
| Pin 52 | XDATA15 — EBI external data bus |
| Pin 53 | XDATA14 — EBI external data bus |
| Pin 54 | XDATA13 — EBI external data bus |
| Pin 55 | XDATA12 — EBI external data bus |
| Pin 56 | XDATA11 — EBI external data bus |
| Pin 57 | XDATA10 — EBI external data bus |
| Pin 58 | XDATA9 — EBI external data bus |
| Pin 59 | XDATA8 — EBI external data bus |
| Pin 60 | VDDR — I/O drive supply |
| Pin 61 | PG7 — Port G I/O |
| Pin 62 | PG6 — Port G I/O |
| Pin 63 | PG5 — Port G I/O |
| Pin 64 | PG4 — Port G I/O |
| Pin 65 | PG3 — Port G I/O |
| Pin 66 | PG2 — Port G I/O |
| Pin 67 | PG1 — Port G I/O |
| Pin 68 | PG0 — Port G I/O |
| Pin 69 | PAD7 — EBI address/data low byte |
| Pin 70 | PAD6 — EBI address/data low byte |
| Pin 71 | PAD5 — EBI address/data low byte |
| Pin 72 | PAD4 — EBI address/data low byte |
| Pin 73 | PAD3 — EBI address/data low byte |
| Pin 74 | PAD2 — EBI address/data low byte |
| Pin 75 | PAD1 — EBI address/data low byte |
| Pin 76 | PAD0 — EBI address/data low byte |
| Pin 77 | XCS3 — EBI chip select 3 |
| Pin 78 | XCS2 — EBI chip select 2 |
| Pin 79 | XCS1 — EBI chip select 1 |
| Pin 80 | XCS0 — EBI chip select 0 |
| Pin 81 | XD7 — EBI data low byte / GPIO |
| Pin 82 | XD6 — EBI data low byte / GPIO |
| Pin 83 | XD5 — EBI data low byte / GPIO |
| Pin 84 | XD4 — EBI data low byte / GPIO |
| Pin 85 | XD3 — EBI data low byte / GPIO |
| Pin 86 | XD2 — EBI data low byte / GPIO |
| Pin 87 | VDDR — I/O drive supply |
| Pin 88 | PP7/KWP7 — Port P I/O / PWM |
| Pin 89 | PP6/KWP6 — Port P I/O / PWM |
| Pin 90 | PP5/KWP5 — Port P I/O / PWM |
| Pin 91 | PP4/KWP4 — Port P I/O / PWM |
| Pin 92 | PP3/KWP3 — Port P I/O / PWM |
| Pin 93 | PP2/KWP2 — Port P I/O / PWM |
| Pin 94 | PP1/KWP1 — Port P I/O / PWM |
| Pin 95 | PP0/KWP0 — Port P I/O / PWM |
| Pin 96 | VDDX3 — I/O supply (digital) |
| Pin 97 | VSSX3 — I/O ground |
| Pin 98 | PK7 — Port K I/O |
| Pin 99 | PK6 — Port K I/O |
| Pin 100 | PK5 — Port K I/O |
| Pin 101 | PK4 — Port K I/O |
| Pin 102 | PK3 — Port K I/O |
| Pin 103 | PK2 — Port K I/O |
| Pin 104 | PK1 — Port K I/O |
| Pin 105 | PK0 — Port K I/O |
| Pin 106 | PM7 — Port M I/O / CAN |
| Pin 107 | PM6 — Port M I/O / CAN |
| Pin 108 | PM5 — Port M I/O / CAN |
| Pin 109 | PM4 — Port M I/O / CAN |
| Pin 110 | PM3 — Port M I/O / CAN |
| Pin 111 | PM2 — Port M I/O / CAN |
| Pin 112 | PM1 — Port M I/O / CAN |
| Pin 113 | PM0 — Port M I/O / CAN |
| Pin 114 | PL7 — Port L I/O |
| Pin 115 | PL6 — Port L I/O |
| Pin 116 | PL5 — Port L I/O |
| Pin 117 | PL4 — Port L I/O |
| Pin 118 | PL3 — Port L I/O |
| Pin 119 | PL2 — Port L I/O |
| Pin 120 | PL1 — Port L I/O |
| Pin 121 | PL0 — Port L I/O |
| Pin 122 | VDD2 — Core supply (1.8V) |
| Pin 123 | VSS2 — Core ground |
| Pin 124 | PS7/TXD0 — Port S I/O / SCI0 TXD |
| Pin 125 | PS6/RXD0 — Port S I/O / SCI0 RXD |
| Pin 126 | PS5/TXD1 — Port S I/O / SCI1 TXD |
| Pin 127 | PS4/RXD1 — Port S I/O / SCI1 RXD |
| Pin 128 | PS3/TXD2 — Port S I/O / SCI2 TXD |
| Pin 129 | PS2/RXD2 — Port S I/O / SCI2 RXD |
| Pin 130 | PS1/MISO0 — Port S I/O / SPI0 MISO |
| Pin 131 | PS0/MOSI0 — Port S I/O / SPI0 MOSI |
| Pin 132 | VDDX4 — I/O supply (digital) |
| Pin 133 | VSSX4 — I/O ground |
| Pin 134 | PT7/SCK0 — Port T I/O / SPI0 clock |
| Pin 135 | PT6/SS0 — Port T I/O / SPI0 slave select |
| Pin 136 | PT5/SS1 — Port T I/O / SPI1 slave select |
| Pin 137 | PT4/SCK1 — Port T I/O / SPI1 clock |
| Pin 138 | PT3/MISO1 — Port T I/O / SPI1 MISO |
| Pin 139 | PT2/MOSI1 — Port T I/O / SPI1 MOSI |
| Pin 140 | PT1/SDA — Port T I/O / I2C SDA |
| Pin 141 | PT0/SCL — Port T I/O / I2C SCL |
| Pin 142 | PS7/TxCAN0 — CAN0 transmit (per datasheet mux) |
| Pin 143 | PS6/RxCAN0 — CAN0 receive (per datasheet mux) |
| Pin 144 | VDDR — I/O drive supply |
Typical Applications
S912XEP100W1MAG is suitable for 7 applications: Automotive Body Control Module (BCM), Vehicle Instrument Cluster Controller, Automotive CAN Gateway Node, Industrial Motor Control (BLDC/PMSM), Battery Management System (BMS) Master, Automotive Sensor Fusion Hub, Industrial CANopen / DeviceNet Slave.
Automotive Body Control Module (BCM)
The S912XEP100W1MAG's AEC-Q100 automotive qualification and 119 GPIO make it a strong fit for body control modules that aggregate door locks, lighting, wipers, and accessory loads. The HCS12X 16-bit core plus XGATE co-processor deterministically services CANbus polling cycles while the main CPU runs control logic, keeping message latency under firmware-controlled bounds. With 1MB Flash the BCM can host a full AUTOSAR-like application layer plus boot-loader without external serial Flash.
Recommended
Vehicle Instrument Cluster Controller
Driving a 7-inch TFT instrument cluster requires deterministic frame timing, large Flash for graphics assets, and ample PWM channels for analog gauges - all delivered by the S912XEP100W1MAG. The XGATE channel pushes SPI pixel data to the display driver with sub-microsecond jitter while the S12X CPU handles CAN and stepper gauge PWM. AEC-Q100 qualification at -40C to +125C ensures the cluster survives under-dash thermal stress without thermal derating.
Recommended
Automotive CAN Gateway Node
A CAN gateway bridges powertrain CAN, body CAN, and chassis CAN buses - the S912XEP100W1MAG's multiple CAN controllers and 1MB Flash make this feasible on a single chip. Routing tables, diagnostics (UDS), and security gateways fit comfortably in Flash with headroom for logging. AEC-Q100 qualification ensures the gateway remains reliable in the harsh engine-compartment environment where ground loops and load-dump transients are routine.
Recommended
Industrial Motor Control (BLDC/PMSM)
Field-oriented control of PMSM motors requires deterministic PWM updates every 50us - the S912XEP100W1MAG's S12X core plus XGATE channel handle PWM center-aligned timing and ADC sampling without jitter. The 1MB Flash fits sensorless FOC algorithms plus application-level PLC logic, while the multi-rail I/O (1.8V core / 2.8V-5V I/O) interfaces directly to gate drivers and Hall sensors. Industrial users will pick this part when AEC-Q100 robustness is desired even in non-automotive motor drives.
Recommended
Battery Management System (BMS) Master
An EV or industrial BMS master aggregates cell voltages via isolated SPI, drives balancing MOSFETs, and reports SOC/SOH over CAN - all roles the S912XEP100W1MAG can assume with its 1MB Flash and multi-CAN controllers. The XGATE channel services ADC conversions and balancing timing, freeing the main CPU for state-machine logic. AEC-Q100 grade means the master survives the high thermal density of battery pack enclosures without derating reliability budgets.
Recommended
Automotive Sensor Fusion Hub
An inertial measurement hub aggregating accelerometer, gyroscope, and wheel-speed sensor data via SPI/I2C benefits from the S912XEP100W1MAG's 50MHz core and rich peripheral mix. The XGATE channel captures high-rate sensor interrupts while the S12X CPU runs fusion algorithms - Kalman or complementary filters fit well within 1MB Flash. AEC-Q100 grade is critical for safety-related sensor fusion deployed in ADAS modules, where functional-safety standards demand qualified silicon.
Recommended
Industrial CANopen / DeviceNet Slave
CANopen slave devices (drives, valves, remote I/O) map cleanly to the S912XEP100W1MAG's CAN controllers and 119 GPIO, with enough Flash for the full CANopen stack plus application logic. AEC-Q100 grade is overkill for industrial but provides margin against vibration, humidity, and temperature cycling on factory floors. The XGATE channel services CANopen sync messages with deterministic latency, ensuring consistent PDO broadcast timing across a machine.
Recommended
Recommended Products Summary
Engineering reference data for S912XEP100W1MAG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S12XEP100MAG | MC9S12XEP768CAG | S912XET512BMAGR | S912XEG384J2VAL | MC9S12XDT512MAA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | HCS12X 16-bit | HCS12X 16-bit - same | HCS12X 16-bit - same | HCS12X 16-bit - same | HCS12X 16-bit - same | HCS12X 16-bit - same |
| CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 1 MB | 1 MB | 768 KB (-23%) | 512 KB (-50%) | 384 KB (-62%) | 512 KB (-50%) |
| AEC-Q100 Automotive Grade | Yes | No (commercial grade) | No (commercial grade) | Yes (automotive) | Yes (automotive) | No (commercial grade) |
| Operating Temperature | -40C to +125C | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +125C | -40C to +125C | -40C to +85C (industrial) |
| Number of I/O | 119 | 119 | 119 | 119 | 119 | 119 |
| Lifecycle Status | active | active | active | active | active | active |
Key Differentiators
- 1MB Flash for code-dense automotive ECUs (vs MC9S12XEP100MAG)
- Automotive grade (AEC-Q100) and -40C/+125C operation (vs S912XET512BMAGR (512KB Flash, automotive grade))
- Single-chip EBI for memory expansion (vs MC9S12XEP768CAG (768KB Flash, commercial grade))
Design Notes
The S912XEP100W1MAG uses multi-rail supplies (1.8V core, 2.8V or 5V I/O). Per the NXP datasheet, VDDR, VDDX1-4, and VDDA each need decoupling: place a 100nF X7R ceramic within 5 mm of each supply pin and a 10uF bulk capacitor near the VDDR pin. The PLL requires its own filtered AVDD/AVSS pair. Power sequencing requires VDDR to ramp before VDDA to avoid I/O latch-up; brownout events are managed by the internal LVD/POR block.
Estimated: the 144-LQFP package has approximate theta_JA of 36 C/W on a 4-layer JEDEC test board. At 50MHz operation the S12X core draws roughly 50-80mA from the 1.8V rail during active mode, plus peripheral current budget from I/O rails. Total package dissipation at full load can approach 1W worst-case. For under-hood mounting, place thermal vias beneath the exposed pad and provide a copper pour to keep junction below 150C at 125C ambient.
External bus interface (EBI) signals share pins with general-purpose I/O. When the EBI is enabled, those pins cannot be used as GPIO. Per NXP reference manual, route EBI traces with controlled impedance and keep trace length matching within 25mm to avoid double-clocking at 50MHz. Decoupling capacitor placement is critical - 100nF caps must be within 5mm of each VDDC and VDDX pair to suppress the supply ripple caused by fast GPIO edges.
Do not assume that the S912XEP100W1MAG and the MC9S12XEP100MAG are identical - although the S12X die is shared, the S912-prefixed device is automotive-grade (AEC-Q100) and the MC9-prefixed device is commercial/industrial. Substituting a commercial-grade device into an automotive design violates functional-safety requirements. Also, the TEST pin must be tied to VSS in production hardware to disable test mode entry from a logic level outside the factory.
Compliance Information
AEC-Q100 automotive grade qualified per NXP S912-prefix masking (formerly Freescale MC9S12XEP100). RoHS compliant per distributor listings. REACH and halogen-free status not explicitly disclosed in the verified web data - marked unknown.