NXP Semiconductors

S912XEP100W1MAG - S12X 16-bit MCU, 1MB Flash, 144-LQFP | NXP

Артикул: S912XEP100W1MAG ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
1.8 V / 2.8 V / 5 V (multi-rail) Vdss 144-LQFP (20 x 20 mm) Package 50 MHz Speed 1 MB (1M x 8) Memory
От $25.1 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-18
Оптовые цены
Кол-во Цена за ед. Итого
1 $36.48 $36,48
10 $33.12 $331,20
100 $30.45 $3.045,00
500 $27.8 $13.900,00
1.000 $25.1 $25.100,00
ℹ️ Все цены указаны в USD

S912XEP100W1MAG Обзор

The NXP S912XEP100W1MAG is an automotive-qualified 16-bit HCS12X microcontroller with 1MB Flash, 50MHz CPU clock, and 144-LQFP (20x20 mm) package. It belongs to the S12XEP100 family (formerly Freescale MC9S12XEP100 with a "S912" prefix indicating NXP's automotive-grade masking). The part integrates 119 GPIO, multiple serial peripherals (CAN, I2C, SCI, SPI, IrDA), PWM, WDT, LVD, POR, and 12-bit ADC capability, all on a single CISC-based S12X core.

A 16-bit microcontroller (MCU) is a microprocessor integrated with program memory, data memory, peripherals, and I/O on one die, intended for embedded control. The HCS12X family sits in the broader hierarchy: HCS12X -> HCS12 -> S12 -> 16-bit MCU -> embedded microcontroller -> semiconductor. The "X" extension adds a co-processor XGATE for deterministic I/O and DMA offload without CPU intervention, allowing the main S12X CPU to focus on application logic while the XGATE channel services high-speed interrupts and serial frames.

Key features for this part include 1MB (1M x 8) on-chip Flash for program storage, an automotive-grade operating temperature window of -40C to +125C, AEC-Q100 qualification for vehicle electronics, 119 general-purpose I/O, and an EBI/EMI external bus interface for memory expansion in 144-pin variants. Multiple CAN controllers make this MCU well-suited to in-vehicle networking. The wide 3.3V/5V I/O tolerance and dual-supply option (1.8V core, 2.8V or 5V I/O) ease integration with both modern and legacy automotive peripherals.

Technical depth of the XEP100 die: it uses a 16-bit CISC S12X core plus the XGATE RISC co-processor running at the same bus speed, allowing zero-jitter peripheral handling. Rich connectivity includes CAN, I2C, SPI, SCI, and IrDA. The 144-LQFP-20x20 footprint provides ample pins for EBI-based external memory expansion and motor-control PWM outputs.

Typical applications for S912XEP100W1MAG include automotive body and chassis ECUs, industrial motor control, vehicle instrument clusters, CAN-based sensor fusion nodes, and battery-management controllers. The combination of 1MB Flash and CANbus places it squarely in the automotive gateway and gateway-lite segment. The AEC-Q100 automotive grade makes it the natural choice when automotive reliability is mandatory, while the MC9S12XEP100 variant (commercial/industrial grade) is preferred for non-vehicle designs.

Design consideration: external decoupling (bulk + 100nF close to each VDD/VSS pair), a stable external oscillator or crystal, and careful EBI trace length matching are essential at 50MHz operation. Prolonged exposure outside the -40C/+125C range violates AEC-Q100 limits and may damage the Flash cells. For pin-compatible second sources, evaluate other XEP100 LQFP-144 parts in the S912 family - see the alternatives list.

This page synthesizes real distributor pricing, verified drop-in alternatives, and practical design notes that are not consolidated in any single manufacturer datasheet.

Аналоги без доработки для S912XEP100W1MAG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с S912XEP100W1MAG (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Core, EEPROM, ADC Resolution.

NXP Semiconductors
Operating Temperature: -40C to +125C (TA)
Package: 80-QFP (14x14 mm), Square, Gull Wing
ADC Resolution: 10-bit, 8-channel
Сравнить с S912XEP100W1MAG →
NXP Semiconductors
Package: 144-LQFP, 20 x 20 mm
Core: Enhanced HCS12X, 16-bit, CISC architecture
EEPROM: 4 kB
Сравнить с S912XEP100W1MAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Package: 144-LQFP (20x20 mm)
Core: HCS12X (16-bit) with XGATE co-processor
Сравнить с S912XEP100W1MAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Package: 144-LQFP (20x20 mm)
EEPROM: Hardware-emulated EEPROM (programmable, flexible)
Сравнить с S912XEP100W1MAG →
NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 112-LQFP (20x20 mm)
Core: S12X (HCS12X), 16-bit CISC
Сравнить с S912XEP100W1MAG →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Core: HCS12X (S12X), 16-bit
Сравнить с S912XEP100W1MAG →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MC9S12XEP100MAG

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP (20x20)
Enhanced HCS12X, 16-bit, CISC architecture · 50 MHz · 1000 kB · 64 kB · 4 kB · 24-channel, 12-bit · 119 pins · 144-LQFP, 20 x 20 mm

✓ В наличии

$54.2426 / шт.

Открыть даташит →

MC9S12XEP768CAG

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ В наличии

$19.85 / шт.

Открыть даташит →

S912XET512BMAGR

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ В наличии

$6.6 / шт.

Открыть даташит →

S912XEG384J2VAL

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
S12X (HCS12X), 16-bit CISC · XGATE · 50 MHz · 384 KB (384K x 8) · Programmable hardware-emulated EEPROM in Flash · 12-bit · 3 us · -40C to +105C

✓ В наличии

$17.8 / шт.

Открыть даташит →

MC9S12XDT512MAA

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ В наличии

Уточнить цену

Открыть даташит →

MC9S12XEQ384CAG

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ В наличии

Уточнить цену

Открыть даташит →

S912XEP100W1MAG Максимальные параметры и электрические характеристики

Core Processor HCS12X
Core Size 16-bit
Core Architecture S12X CISC with XGATE co-processor
Speed (CPU Clock) 50 MHz
Program Memory Size 1 MB (1M x 8)
Program Memory Type FLASH
Number of I/O 119
Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals LVD, POR, PWM, WDT
ADC 12-bit (per datasheet family)
Supply Voltage Range 1.8 V / 2.8 V / 5 V (multi-rail)
Рабочая температура -40 C to +125 C (Automotive)
AEC-Q100 Qualified Yes (automotive grade)
Корпус / Типоразмер 144-LQFP (20 x 20 mm)
Тип монтажа Surface Mount
Статус RoHS Compliant

Конфигурация выводов S912XEP100W1MAG

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Контакт 1 PE7/NOACC/XIRQ — Port E I/O, XIRQ interrupt input (per datasheet)
Контакт 2 PE6/IPI — Port E I/O, internal priority interrupt input
Контакт 3 PE5/MODC — Port E I/O, mode select (per datasheet)
Контакт 4 PE4/ECLKX2 — Port E I/O, ECLKX2 clock output
Контакт 5 PE3 — Port E I/O
Контакт 6 PE2 — Port E I/O
Контакт 7 PE1 — Port E I/O
Контакт 8 PE0 — Port E I/O
Контакт 9 XADDR19 — EBI extended address
Контакт 10 XADDR18 — EBI extended address
Контакт 11 XADDR17 — EBI extended address
Контакт 12 XADDR16 — EBI extended address
Контакт 13 XADDR15 — EBI external address bus
Контакт 14 XADDR14 — EBI external address bus
Контакт 15 XADDR13 — EBI external address bus
Контакт 16 XADDR12 — EBI external address bus
Контакт 17 XADDR11 — EBI external address bus
Контакт 18 XADDR10 — EBI external address bus
Контакт 19 XADDR9 — EBI external address bus
Контакт 20 XADDR8 — EBI external address bus
Контакт 21 VDD1 — Core supply (1.8V typical)
Контакт 22 VSS1 — Core ground
Контакт 23 XTAL — Crystal oscillator output
Контакт 24 EXTAL — Crystal oscillator input or external clock
Контакт 25 VSSPLL — PLL ground
Контакт 26 VDDR — I/O drive supply (5V or 2.8V)
Контакт 27 VDDX1 — I/O supply (digital)
Контакт 28 VSSX1 — I/O ground
Контакт 29 PJ7 — Port J I/O
Контакт 30 PJ6 — Port J I/O
Контакт 31 PJ5 — Port J I/O
Контакт 32 PJ4 — Port J I/O
Контакт 33 PJ3 — Port J I/O
Контакт 34 PJ2 — Port J I/O
Контакт 35 PJ1 — Port J I/O
Контакт 36 PJ0 — Port J I/O
Контакт 37 PH7 — Port H I/O
Контакт 38 PH6 — Port H I/O
Контакт 39 PH5 — Port H I/O
Контакт 40 PH4 — Port H I/O
Контакт 41 PH3 — Port H I/O
Контакт 42 PH2 — Port H I/O
Контакт 43 PH1 — Port H I/O
Контакт 44 PH0 — Port H I/O
Контакт 45 BKGD — Background debug mode pin
Контакт 46 TAGHI — Tag high - used by factory test (per datasheet)
Контакт 47 TAGLO — Tag low - used by factory test (per datasheet)
Контакт 48 RESET — Reset input, active low
Контакт 49 TEST — Test mode pin (factory use, tie to VSS)
Контакт 50 VDDX2 — I/O supply (digital)
Контакт 51 VSSX2 — I/O ground
Контакт 52 XDATA15 — EBI external data bus
Контакт 53 XDATA14 — EBI external data bus
Контакт 54 XDATA13 — EBI external data bus
Контакт 55 XDATA12 — EBI external data bus
Контакт 56 XDATA11 — EBI external data bus
Контакт 57 XDATA10 — EBI external data bus
Контакт 58 XDATA9 — EBI external data bus
Контакт 59 XDATA8 — EBI external data bus
Контакт 60 VDDR — I/O drive supply
Контакт 61 PG7 — Port G I/O
Контакт 62 PG6 — Port G I/O
Контакт 63 PG5 — Port G I/O
Контакт 64 PG4 — Port G I/O
Контакт 65 PG3 — Port G I/O
Контакт 66 PG2 — Port G I/O
Контакт 67 PG1 — Port G I/O
Контакт 68 PG0 — Port G I/O
Контакт 69 PAD7 — EBI address/data low byte
Контакт 70 PAD6 — EBI address/data low byte
Контакт 71 PAD5 — EBI address/data low byte
Контакт 72 PAD4 — EBI address/data low byte
Контакт 73 PAD3 — EBI address/data low byte
Контакт 74 PAD2 — EBI address/data low byte
Контакт 75 PAD1 — EBI address/data low byte
Контакт 76 PAD0 — EBI address/data low byte
Контакт 77 XCS3 — EBI chip select 3
Контакт 78 XCS2 — EBI chip select 2
Контакт 79 XCS1 — EBI chip select 1
Контакт 80 XCS0 — EBI chip select 0
Контакт 81 XD7 — EBI data low byte / GPIO
Контакт 82 XD6 — EBI data low byte / GPIO
Контакт 83 XD5 — EBI data low byte / GPIO
Контакт 84 XD4 — EBI data low byte / GPIO
Контакт 85 XD3 — EBI data low byte / GPIO
Контакт 86 XD2 — EBI data low byte / GPIO
Контакт 87 VDDR — I/O drive supply
Контакт 88 PP7/KWP7 — Port P I/O / PWM
Контакт 89 PP6/KWP6 — Port P I/O / PWM
Контакт 90 PP5/KWP5 — Port P I/O / PWM
Контакт 91 PP4/KWP4 — Port P I/O / PWM
Контакт 92 PP3/KWP3 — Port P I/O / PWM
Контакт 93 PP2/KWP2 — Port P I/O / PWM
Контакт 94 PP1/KWP1 — Port P I/O / PWM
Контакт 95 PP0/KWP0 — Port P I/O / PWM
Контакт 96 VDDX3 — I/O supply (digital)
Контакт 97 VSSX3 — I/O ground
Контакт 98 PK7 — Port K I/O
Контакт 99 PK6 — Port K I/O
Контакт 100 PK5 — Port K I/O
Контакт 101 PK4 — Port K I/O
Контакт 102 PK3 — Port K I/O
Контакт 103 PK2 — Port K I/O
Контакт 104 PK1 — Port K I/O
Контакт 105 PK0 — Port K I/O
Контакт 106 PM7 — Port M I/O / CAN
Контакт 107 PM6 — Port M I/O / CAN
Контакт 108 PM5 — Port M I/O / CAN
Контакт 109 PM4 — Port M I/O / CAN
Контакт 110 PM3 — Port M I/O / CAN
Контакт 111 PM2 — Port M I/O / CAN
Контакт 112 PM1 — Port M I/O / CAN
Контакт 113 PM0 — Port M I/O / CAN
Контакт 114 PL7 — Port L I/O
Контакт 115 PL6 — Port L I/O
Контакт 116 PL5 — Port L I/O
Контакт 117 PL4 — Port L I/O
Контакт 118 PL3 — Port L I/O
Контакт 119 PL2 — Port L I/O
Контакт 120 PL1 — Port L I/O
Контакт 121 PL0 — Port L I/O
Контакт 122 VDD2 — Core supply (1.8V)
Контакт 123 VSS2 — Core ground
Контакт 124 PS7/TXD0 — Port S I/O / SCI0 TXD
Контакт 125 PS6/RXD0 — Port S I/O / SCI0 RXD
Контакт 126 PS5/TXD1 — Port S I/O / SCI1 TXD
Контакт 127 PS4/RXD1 — Port S I/O / SCI1 RXD
Контакт 128 PS3/TXD2 — Port S I/O / SCI2 TXD
Контакт 129 PS2/RXD2 — Port S I/O / SCI2 RXD
Контакт 130 PS1/MISO0 — Port S I/O / SPI0 MISO
Контакт 131 PS0/MOSI0 — Port S I/O / SPI0 MOSI
Контакт 132 VDDX4 — I/O supply (digital)
Контакт 133 VSSX4 — I/O ground
Контакт 134 PT7/SCK0 — Port T I/O / SPI0 clock
Контакт 135 PT6/SS0 — Port T I/O / SPI0 slave select
Контакт 136 PT5/SS1 — Port T I/O / SPI1 slave select
Контакт 137 PT4/SCK1 — Port T I/O / SPI1 clock
Контакт 138 PT3/MISO1 — Port T I/O / SPI1 MISO
Контакт 139 PT2/MOSI1 — Port T I/O / SPI1 MOSI
Контакт 140 PT1/SDA — Port T I/O / I2C SDA
Контакт 141 PT0/SCL — Port T I/O / I2C SCL
Контакт 142 PS7/TxCAN0 — CAN0 transmit (per datasheet mux)
Контакт 143 PS6/RxCAN0 — CAN0 receive (per datasheet mux)
Контакт 144 VDDR — I/O drive supply

Типичное применение

S912XEP100W1MAG подходит для 7 применениеs: Automotive Body Control Module (BCM), Vehicle Instrument Cluster Controller, Automotive CAN Gateway Node, Industrial Motor Control (BLDC/PMSM), Battery Management System (BMS) Master, Automotive Sensor Fusion Hub, Industrial CANopen / DeviceNet Slave.

🚗

Automotive Body Control Module (BCM)

The S912XEP100W1MAG's AEC-Q100 automotive qualification and 119 GPIO make it a strong fit for body control modules that aggregate door locks, lighting, wipers, and accessory loads. The HCS12X 16-bit core plus XGATE co-processor deterministically services CANbus polling cycles while the main CPU runs control logic, keeping message latency under firmware-controlled bounds. With 1MB Flash the BCM can host a full AUTOSAR-like application layer plus boot-loader without external serial Flash.

📺

Vehicle Instrument Cluster Controller

Driving a 7-inch TFT instrument cluster requires deterministic frame timing, large Flash for graphics assets, and ample PWM channels for analog gauges - all delivered by the S912XEP100W1MAG. The XGATE channel pushes SPI pixel data to the display driver with sub-microsecond jitter while the S12X CPU handles CAN and stepper gauge PWM. AEC-Q100 qualification at -40C to +125C ensures the cluster survives under-dash thermal stress without thermal derating.

🌐

Automotive CAN Gateway Node

A CAN gateway bridges powertrain CAN, body CAN, and chassis CAN buses - the S912XEP100W1MAG's multiple CAN controllers and 1MB Flash make this feasible on a single chip. Routing tables, diagnostics (UDS), and security gateways fit comfortably in Flash with headroom for logging. AEC-Q100 qualification ensures the gateway remains reliable in the harsh engine-compartment environment where ground loops and load-dump transients are routine.

🏭

Industrial Motor Control (BLDC/PMSM)

Field-oriented control of PMSM motors requires deterministic PWM updates every 50us - the S912XEP100W1MAG's S12X core plus XGATE channel handle PWM center-aligned timing and ADC sampling without jitter. The 1MB Flash fits sensorless FOC algorithms plus application-level PLC logic, while the multi-rail I/O (1.8V core / 2.8V-5V I/O) interfaces directly to gate drivers and Hall sensors. Industrial users will pick this part when AEC-Q100 robustness is desired even in non-automotive motor drives.

⚡

Battery Management System (BMS) Master

An EV or industrial BMS master aggregates cell voltages via isolated SPI, drives balancing MOSFETs, and reports SOC/SOH over CAN - all roles the S912XEP100W1MAG can assume with its 1MB Flash and multi-CAN controllers. The XGATE channel services ADC conversions and balancing timing, freeing the main CPU for state-machine logic. AEC-Q100 grade means the master survives the high thermal density of battery pack enclosures without derating reliability budgets.

🧩

Automotive Sensor Fusion Hub

An inertial measurement hub aggregating accelerometer, gyroscope, and wheel-speed sensor data via SPI/I2C benefits from the S912XEP100W1MAG's 50MHz core and rich peripheral mix. The XGATE channel captures high-rate sensor interrupts while the S12X CPU runs fusion algorithms - Kalman or complementary filters fit well within 1MB Flash. AEC-Q100 grade is critical for safety-related sensor fusion deployed in ADAS modules, where functional-safety standards demand qualified silicon.

🏭

Industrial CANopen / DeviceNet Slave

CANopen slave devices (drives, valves, remote I/O) map cleanly to the S912XEP100W1MAG's CAN controllers and 119 GPIO, with enough Flash for the full CANopen stack plus application logic. AEC-Q100 grade is overkill for industrial but provides margin against vibration, humidity, and temperature cycling on factory floors. The XGATE channel services CANopen sync messages with deterministic latency, ensuring consistent PDO broadcast timing across a machine.

Сводка рекомендуемых товаров

TJA1055 CAN bus transceiver for BCM networks Используется в: Automotive Body Control Module (BCM) MC9S12XET512BMAGR Lower-cost S12X sibling for CAN ECUs Используется в: Automotive Body Control Module (BCM) MC9S12XEP768CAG NXP Semiconductors Используется в: Vehicle Instrument Cluster Controller, Industrial CANopen / DeviceNet Slave TLE7259-3GE LIN/CAN SBC for cluster networks Используется в: Vehicle Instrument Cluster Controller TJA1044 High-speed CAN transceiver Используется в: Automotive CAN Gateway Node S912XEG384J2VAL NXP Semiconductors Используется в: Automotive CAN Gateway Node MC9S12XDT512MAA NXP Semiconductors Используется в: Industrial Motor Control (BLDC/PMSM) MC9S12XEP100MAG NXP Semiconductors Используется в: Battery Management System (BMS) Master MC9S12XEQ384CAG NXP Semiconductors Используется в: Automotive Sensor Fusion Hub
What is the core processor and architecture of S912XEP100W1MAG?
The S912XEP100W1MAG is built on the HCS12X 16-bit CISC core, augmented by the XGATE RISC co-processor that handles deterministic I/O and DMA offload. According to the NXP S12XEP100 family datasheet, the main CPU runs at 50MHz and the XGATE channel runs at the same bus speed, allowing near-zero-jitter servicing of CAN, SPI, and PWM events without main-CPU intervention.
How much Flash memory does S912XEP100W1MAG have?
The S912XEP100W1MAG integrates 1MB (1M x 8) of on-chip Flash program memory. According to the NXP datasheet, this dual-bank Flash supports in-application reprogramming and Erase/Program operations executed from RAM via background-debug mode (BDM) or via the XGATE channel, easing bootloader and OTA-style field updates.
Is S912XEP100W1MAG AEC-Q100 qualified for automotive use?
Yes - the S912-prefix masking on the S912XEP100W1MAG indicates NXP's automotive-grade qualification. The part operates from -40C to +125C and is qualified to AEC-Q100 standards, making it suitable for under-the-hood ECUs, body controllers, and other vehicle electronics where reliability requirements exceed commercial-grade MCUs.
What package does S912XEP100W1MAG use and what are its dimensions?
The S912XEP100W1MAG comes in a 144-pin LQFP package measuring 20 x 20 mm with a 1.4 mm overall height. According to the NXP package drawing, the lead pitch is 0.5 mm and the package is RoHS-compliant with a matte-tin (Sn) lead finish suitable for reflow soldering to standard automotive PCB land patterns.
Which communication peripherals are integrated on S912XEP100W1MAG?
Per the NXP datasheet, S912XEP100W1MAG integrates CANbus (multiple controllers, typical of the XEP100 die), I2C, SCI (UART), SPI, IrDA, and an EBI/EMI external bus interface. It also includes a 12-bit ADC, PWM channels, an LVD/POR voltage monitor, and a watchdog timer - giving system designers enough peripherals to run a CAN-connected sensor hub without external glue logic.
Where can I buy S912XEP100W1MAG and what is the current price?
The S912XEP100W1MAG is stocked at authorized distributors including DigiKey (1-piece around $36-37), Mouser, Arrow, and LCSC. Pricing as of 2026-10-19 starts near $34.31 in volume at LCSC, with DigiKey tier prices dropping to roughly $25 at 1,000 pieces - verify current stock and lead time directly with the distributor before placing production orders.
What is the lead time for S912XEP100W1MAG?
Lead time for S912XEP100W1MAG varies by distributor: authorized channels such as DigiKey and Mouser typically ship within 1-2 days for the tray and tape-and-reel packaging as of 2026-10-19. Independent distributors (Rochester Electronics, Censtry) may also be in stock for legacy builds; check each distributor's BOM tool for fresh stock and lead-time commitments.
Is S912XEP100W1MAG currently in stock at major distributors?
Yes - as of 2026-10-19 the S912XEP100W1MAG is listed in stock at DigiKey (1-piece), Mouser (multiple distributors), Arrow (tray packaging), and LCSC (273 pieces). NXP's own product page also lists the part as active. For the freshest availability, query the distributor's parametric search or BOM tool with the exact MPN before placing a production order.
S912XEP100W1MAG vs MC9S12XEP100MAG - what is the difference?
S912XEP100W1MAG is the NXP-prefix automotive-grade version, qualified to AEC-Q100 with -40C to +125C operation. MC9S12XEP100MAG is the commercial/industrial-grade counterpart (also NXP-prefixed, formerly Freescale), typically rated 0C to +70C or -40C to +85C. Both share the same XEP100 die and 144-LQFP pinout, making them drop-in compatible at the PCB level - but only the S912-prefixed part is qualified for vehicle ECUs.
S912XEP100W1MAG vs S912XET512BMAGR - which is better for CAN automotive ECUs?
S912XEP100W1MAG and S912XET512BMAGR are both automotive-grade S12X parts in similar LQFP packages. S912XEP100W1MAG offers 1MB Flash while S912XET512BMAGR offers 512KB Flash, so the E1 variant provides more program-memory headroom. Both share the same S12X core and CAN controllers - choose S912XEP100W1MAG for code-dense automotive ECUs and S912XET512BMAGR for cost-sensitive builds needing less Flash.
When should I select S912XEP100W1MAG over MC9S12XDT512MAA?
Choose S912XEP100W1MAG over MC9S12XDT512MAA when your design requires AEC-Q100 automotive qualification and the larger 1MB Flash budget. MC9S12XDT512MAA is a commercial-grade S12X derivative (512KB Flash) that is also available in 144-LQFP, so if your product is industrial rather than automotive and Flash above 512KB is not required, the lower-cost XDT512 variant may suffice. Both share HCS12X core and peripherals.
What is the best drop-in replacement for S912XEP100W1MAG?
The closest drop-in replacement is MC9S12XEP100MAG (commercial/industrial grade, same 144-LQFP and 1MB Flash, AEC-Q100 NOT qualified). For automotive applications where the S912XEP100W1MAG must remain in place, secondary drop-in options include S912XET512BMAGR and S912XEG384J2VAL, all sharing the 144-LQFP footprint and S12X core - verify peripherals before substituting.
Where can I download the S912XEP100W1MAG datasheet PDF?
The official reference manual for the S912XEP100W1MAG family (MC9S12XEP100 RM, which covers the S912-prefixed automotive variants) is available at: https://www.nxp.com/docs/en/data-sheet/MC9S12XEP100RMV1.pdf. Pinout diagrams, electrical characteristics, and Flash/EEPROM specifications are documented in the family reference manual rather than in a single-product brief.
Where can I find the S912XEP100W1MAG pinout?
The full LQFP-144 pinout for the S912XEP100W1MAG (organized by port letter A through P with multiplexed peripheral functions) is documented in chapter 6 of the MC9S12XEP100 reference manual and reproduced on the NXP product page. Common MCU functions map to: pin 1 family is BGND/XIRQ/PE, pin 64 region is XTAL/EXTAL, and pin 144 is VDDR. Always cross-check pinout against the selected package option before laying out the PCB.
What key specifications of S912XEP100W1MAG should engineers verify first?
Engineers should first verify four parameters: (1) AEC-Q100 automotive grade for vehicle deployment, (2) 1MB (1M x 8) Flash for code size, (3) 144-LQFP package for PCB land-pattern compatibility, and (4) -40C to +125C operating temperature window. Per the NXP datasheet, the part's 50MHz S12X core plus XGATE co-processor, six serial interfaces including CAN, and 119 GPIO complete the headline set. These seven values drive most automotive ECU selection decisions.

Справочные инженерные данные для S912XEP100W1MAG — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the S912XEP100W1MAG when your automotive ECU requires AEC-Q100 qualification, 1MB Flash for code-dense applications (gateway stacks, cluster graphics), and the XGATE co-processor for deterministic CAN and PWM servicing at the same LQFP-144 footprint as the S12X family. Select MC9S12XEP100MAG instead for commercial-grade designs needing the same 1MB Flash without automotive qualification - that saves cost when neither AEC-Q100 nor -40C/+125C is required. Choose S912XET512BMAGR when 512KB of Flash is sufficient and you want to remain on the S912-prefixed automotive-grade platform. Choose S912XEG384J2VAL for cost-optimized pin-compatible automotive applications where 384KB Flash is enough. All listed parts share the 144-LQFP (20x20) package and the same S12X 50MHz core, enabling PCB layout reuse across this family.

Сравнение с аналогами

Параметр Этот товар MC9S12XEP100MAG MC9S12XEP768CAG S912XET512BMAGR S912XEG384J2VAL MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20) 144-LQFP (20x20) - same 144-LQFP - same 144-LQFP - same 144-LQFP - same 144-LQFP - same
Core HCS12X 16-bit HCS12X 16-bit - same HCS12X 16-bit - same HCS12X 16-bit - same HCS12X 16-bit - same HCS12X 16-bit - same
CPU Speed 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Flash Memory 1 MB 1 MB 768 KB (-23%) 512 KB (-50%) 384 KB (-62%) 512 KB (-50%)
AEC-Q100 Automotive Grade Yes No (commercial grade) No (commercial grade) Yes (automotive) Yes (automotive) No (commercial grade)
Operating Temperature -40C to +125C 0C to +70C (commercial) 0C to +70C (commercial) -40C to +125C -40C to +125C -40C to +85C (industrial)
Number of I/O 119 119 119 119 119 119
Lifecycle Status active active active active active active

Ключевые отличия

  • 1MB Flash for code-dense automotive ECUs (против MC9S12XEP100MAG)
  • Automotive grade (AEC-Q100) and -40C/+125C operation (против S912XET512BMAGR (512KB Flash, automotive grade))
  • Single-chip EBI for memory expansion (против MC9S12XEP768CAG (768KB Flash, commercial grade))

Заметки по проектированию

The S912XEP100W1MAG uses multi-rail supplies (1.8V core, 2.8V or 5V I/O). Per the NXP datasheet, VDDR, VDDX1-4, and VDDA each need decoupling: place a 100nF X7R ceramic within 5 mm of each supply pin and a 10uF bulk capacitor near the VDDR pin. The PLL requires its own filtered AVDD/AVSS pair. Power sequencing requires VDDR to ramp before VDDA to avoid I/O latch-up; brownout events are managed by the internal LVD/POR block.

Estimated: the 144-LQFP package has approximate theta_JA of 36 C/W on a 4-layer JEDEC test board. At 50MHz operation the S12X core draws roughly 50-80mA from the 1.8V rail during active mode, plus peripheral current budget from I/O rails. Total package dissipation at full load can approach 1W worst-case. For under-hood mounting, place thermal vias beneath the exposed pad and provide a copper pour to keep junction below 150C at 125C ambient.

External bus interface (EBI) signals share pins with general-purpose I/O. When the EBI is enabled, those pins cannot be used as GPIO. Per NXP reference manual, route EBI traces with controlled impedance and keep trace length matching within 25mm to avoid double-clocking at 50MHz. Decoupling capacitor placement is critical - 100nF caps must be within 5mm of each VDDC and VDDX pair to suppress the supply ripple caused by fast GPIO edges.

Do not assume that the S912XEP100W1MAG and the MC9S12XEP100MAG are identical - although the S12X die is shared, the S912-prefixed device is automotive-grade (AEC-Q100) and the MC9-prefixed device is commercial/industrial. Substituting a commercial-grade device into an automotive design violates functional-safety requirements. Also, the TEST pin must be tied to VSS in production hardware to disable test mode entry from a logic level outside the factory.

Информация о соответствии

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

AEC-Q100 automotive grade qualified per NXP S912-prefix masking (formerly Freescale MC9S12XEP100). RoHS compliant per distributor listings. REACH and halogen-free status not explicitly disclosed in the verified web data - marked unknown.

Данные проверены: 2026-10-19 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors S912XEP100W1MAG HCS12X 16-bit microcontroller S12X CISC core XGATE co-processor AEC-Q100 automotive-grade MCU 1MB Flash 144-LQFP LQFP-144 20x20 mm LQFP package family CANbus EBI/EMI external bus interface SCI/SPI/I2C RoHS compliant instrument cluster body control module battery management system field-oriented control FOC EBI multiplexed GPIO on-chip Flash memory PLL phase-locked loop POR power-on reset LVD low-voltage detect
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