SPC5602BK0VLL4 - 48MHz 256KB Flash 100-LQFP MCU | NXP
MPN: SPC5602BK0VLL4 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
SPC5602BK0VLL4 Overview
A microcontroller such as the SPC5602BK0VLL4 integrates a processor core, Flash program memory, peripherals, communication interfaces, interrupt handling, and timing resources into one embedded-control component. The e200z0h core provides the execution platform, while the MPC56xx family positioning targets embedded automotive and industrial systems where deterministic control, communication, and external peripherals are required. This SPC5602BK0VLL4 configuration combines a 48 MHz maximum frequency with 256K x 8 Flash organization for code storage.
Key verified features include the e200z0h 32-bit core, 48 MHz operation, 256 KB Flash, 100-LQFP packaging, 14 mm by 14 mm body size, and a -40°C to +105°C temperature range. The automotive-grade designation makes the part relevant to body-electronics designs, although the provided data does not enumerate the complete peripheral list, memory map, electrical limits, or qualification details. Those unverified parameters are intentionally not inferred here.
Typical implementation contexts include automotive body-control modules, industrial controllers, distributed control units, gateway electronics, and other embedded platforms where a 32-bit MCU and external communication peripherals are useful. The 100-LQFP package provides a high pin count for system integration, but designers should verify the exact pin multiplexing, alternate functions, and board-level requirements against the NXP datasheet before schematic capture.
A key design consideration is to confirm the exact device variant, temperature grade, supply-voltage configuration, package orientation, and programming requirements before layout release. The provided sources identify SPC5602BK0VLL4 as an active NXP product, but they do not provide a complete technical datasheet extract, detailed pinout, or verified lifecycle statement beyond the product-page status.
This product summary combines the verified distributor identity, core architecture, memory capacity, frequency, package, temperature range, and application positioning with source-linked engineering context. It is intended to support initial component selection and sourcing while directing final design decisions to the official NXP documentation.
Drop-in alternatives for SPC5602BK0VLL4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5602BK0VLL4R
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SPC5602BK0MLQ6
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SPC5602BK0MLH6R
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SPC5602BK0VLL6
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SPC5602BK0VLL4 Maximum Ratings & Electrical Characteristics
| Core Architecture | e200z0h Power Architecture 32-bit core |
| Maximum Core Frequency | 48 MHz |
| Flash Memory | 256 KB (256K x 8) |
| Series | MPC56xx Qorivva |
| Device Family | MPC560xB/C/D |
| Supply Voltage Class | 3.3 V or 5 V |
| Operating Temperature Range | -40°C to +105°C |
| Automotive Grade | Automotive grade |
| Package | 100-LQFP |
| Package Body Size | 14 mm x 14 mm |
| Terminal Count | 100 terminals |
| Mounting Type | Surface mount |
| Terminal Form | Gull wing |
| Package Shape | Square |
| Maximum Supply Voltage | 5.5 V |
| Product Status | Active |
| Application Domains | Automotive body electronics and industrial applications |
SPC5602BK0VLL4 square Pin Configuration Guide
Pin configuration for SPC5602BK0VLL4 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SPC5602BK0VLL4.
Refer to the datasheet for full pin configuration.
Typical Applications
SPC5602BK0VLL4 is suitable for 6 applications: Automotive Body Control, Industrial Embedded Controller, Distributed Control Unit, Communication Gateway, Motor and Actuator Control, Diagnostic and Service Module.
Automotive Body Control
The SPC5602BK0VLL4 fits automotive body-control concepts because it is identified as an automotive-grade 32-bit e200z0h MCU with a 48 MHz core and a -40°C to +105°C operating range. Its 256 KB of Flash provides storage for control software, while the 100-LQFP package offers a high pin count for integrating communication, sensing, and actuation interfaces. A body module can use the MCU as the central controller for switch inputs, lamp outputs, door or body-state logic, and diagnostic handling. The exact peripheral mapping, voltage limits, and qualification requirements must be verified in the NXP datasheet. The provided data supports the application class, but it does not enumerate the complete peripheral set or specific automotive qualification certification.
Recommended
Industrial Embedded Controller
The SPC5602BK0VLL4 is suitable as a candidate for industrial embedded control because the NXP product information positions the MPC560x family for industrial applications alongside automotive body electronics. Its 32-bit e200z0h core runs at up to 48 MHz and includes 256 KB of Flash for application code, configuration data, and boot logic. A controller could combine digital inputs, communication transceivers, sensor interfaces, and discrete outputs around this MCU. The 100-LQFP package provides a substantial pin budget, but industrial deployments must verify industrial-temperature requirements, EMC behavior, isolation, grounding, and long-term supply. The provided sources do not confirm a dedicated industrial certification, so qualification should be based on the exact system requirements and official NXP documentation.
Recommended
Distributed Control Unit
The SPC5602BK0VLL4 can serve as the central processor in a distributed control unit when the design requires deterministic 32-bit execution and substantial I/O packaging. The verified 48 MHz e200z0h core supports embedded control logic, while 256 KB of Flash stores application code and configuration data. In a distributed architecture, the MCU may manage local sensors, communicate with remote modules, monitor system health, and coordinate actuators. The exact communication peripherals and memory organization are not included in the supplied source extract, so the designer should use the official datasheet to map interfaces and validate timing. The device is active according to NXP and is listed for shipment by a marketplace distributor, making it a reasonable platform candidate for new and existing embedded-control designs.
Recommended
Communication Gateway
The SPC5602BK0VLL4 is a potential communications-gateway controller because it combines a 32-bit Power Architecture core, 48 MHz operation, 256 KB of Flash, and a 100-LQFP package. A gateway can use the MCU to aggregate messages from multiple local interfaces, apply protocol routing, maintain state, and supervise communication links. The high pin count is useful when a design needs both digital control and external interface connections. However, the supplied data does not list CAN, Ethernet, serial, or other communication peripheral details, so gateway suitability cannot be finalized from the distributor summary alone. Engineers must verify the exact peripheral set, electrical interfaces, clock requirements, and software drivers in the NXP device documentation before selecting it.
Recommended
Motor and Actuator Control
The SPC5602BK0VLL4 can be evaluated for actuator and motor-control subsystems that require a 32-bit control loop and automotive-capable environmental positioning. Its e200z0h core operates at up to 48 MHz, and its 256 KB of Flash can hold control algorithms, state machines, and diagnostic routines. The MCU could coordinate input capture, timing, feedback processing, and output-control logic when paired with suitable power-stage drivers and sensors. The verified data does not state the exact PWM, capture, ADC, or motor-control peripherals, so those functions must be checked in the datasheet rather than assumed. The 100-LQFP package also creates a meaningful routing and assembly requirement. Validate signal timing, current limits, thermal conditions, and fault handling in the final power electronics design.
Recommended
Diagnostic and Service Module
The SPC5602BK0VLL4 is relevant to diagnostic and service-oriented modules because it provides a 32-bit automotive MCU core, 256 KB of Flash, and a 100-LQFP package for external signal and communication connections. A diagnostic controller can execute self-test routines, monitor digital and analog conditions supported by the device, manage fault indicators, and communicate service information to a higher-level controller. The verified sources identify automotive grade and a -40°C to +105°C range, but they do not provide the diagnostic protocol set or the complete peripheral inventory. Before implementation, confirm the required communication interfaces, diagnostic identifiers, watchdog behavior, memory constraints, and software support in the official NXP documentation. This positioning is useful for early architecture selection, not final compliance sign-off.
Recommended
Recommended Products Summary
Engineering reference data for SPC5602BK0VLL4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5602BK0VLL4R | SPC5602BK0MLQ6 | SPC5602BK0MLH6R | SPC5602BK0VLL6 |
|---|---|---|---|---|---|
| Package | 100-LQFP, 14 mm x 14 mm | 100-LQFP | 100-LQFP package details require confirmation | 100-LQFP package details require confirmation | 100-LQFP package details require confirmation |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
Key Differentiators
- Verified automotive-oriented positioning (vs SPC5602BK0MLQ6)
- Exact distributor-described core and memory configuration (vs SPC5602BK0MLH6R)
- Known active NXP product identity (vs SPC5602BK0VLL6)
- 100-LQFP package integration (vs STM32F030RCT6)
Design Notes
Before schematic capture, define every supply rail from the official SPC5602BK0VLL4 electrical table, including nominal voltage, tolerance, current limit, decoupling requirements, reset behavior, and sequencing. Distributor data identifies a 3.3 V or 5 V class and reports a maximum supply voltage of 5.5 V, but those figures are not a substitute for the complete operating limits. Place required bulk and bypass capacitors at the package pins and validate startup behavior with the chosen regulator.
Use the exact 100-LQFP footprint and pin numbering from the official package drawing, then preserve pin 1 orientation, exposed thermal or thermal-pad requirements, and manufacturer land-pattern tolerances. The verified source confirms a 14 mm by 14 mm gull-wing package but not the pin table. Do not substitute a generic 100-pin footprint until the NXP mechanical drawing, pin list, solder mask, and paste recommendations have been checked.
Do not treat a distributor comparison as proof that a similarly named SPC5602 MCU is drop-in compatible. Compare the complete datasheet pinout, alternate-function multiplexing, supply pins, clock architecture, memory map, reset pins, watchdog behavior, peripherals, and software device identifier. In particular, suffix changes can indicate ordering, packaging, temperature, or qualification differences that affect procurement and board assembly.
For a 48 MHz embedded-control design, route clock-sensitive signals with short return paths and provide clean local decoupling around the MCU supply pins. The supplied data does not list the internal clock tree or communication-interface pin locations, so review the official pin multiplexing and application guidance before assigning high-rate external signals. Keep programming, debug, and reset nets accessible for production test and validate signal integrity with the intended peripheral configuration.
Compliance Information
The supplied data identifies the part as automotive grade but does not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Compliance must be confirmed from the current NXP product documentation or manufacturer declarations.
