STM32G473VET3 - 170MHz Cortex-M4 MCU 512KB LQFP-100 | STMicroelectronics
MPN: STM32G473VET3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.95 | $795.00 |
| 500 | $7.05 | $3,525.00 |
| 1,000 | $6.4 | $6,400.00 |
STM32G473VET3 Overview
A Cortex-M4 microcontroller is a 32-bit RISC processor core designed by Arm that includes a single-precision floating-point unit (FPU) and DSP extensions. The Cortex-M4 sits within the broader Cortex-M family and feeds into the wider STM32 portfolio, which scales from ultra-low-power Cortex-M0+ devices up to Cortex-M7 high-performance parts. Compared with Cortex-M3 parts, the M4 adds DSP SIMD instructions, single-cycle MAC, and an optional FPU, enabling higher-throughput signal processing and mathematical acceleration at modest clock speeds.
Key features of the STM32G473VET3 include up to 512 KB single-bank Flash with ECC and 128 KB SRAM with parity, a 12-channel DMA, two 16-bit advanced timers plus a 32-bit timer, four 16-bit general-purpose timers, two HRTIM masters, multiple USART/UART, SPI, I2C, FDCAN, USB 2.0 FS, and a real-time clock. The integrated Cordic accelerator (rotation, sine/cosine) and FMAC (filter math) offload DSP tasks, while the comparators, op-amps, and 12-bit DACs allow direct analog control loops on-chip. The 100-pin LQFP package exposes the full peripheral set, including the external memory bus and additional GPIO.
Typical applications span industrial motor drives (FOC for PMSM/BLDC), digital SMPS and power conversion, lighting controls, solar micro-inverters, factory automation, and sensor-rich IoT nodes. On-board comparators, op-amps, and high-resolution timers let the part close a current-mode control loop without external analog components, while the FPU and Cordic enable sensor fusion and field-oriented control without taxing the CPU. The LQFP-100 footprint also suits hand-prototyping and field-repair scenarios where rework is more practical than BGA.
When designing with this device, ensure the 1.8V/2.5V/3.3V rails are well-decoupled with 100nF + 4.7uF ceramic capacitors near each VDDA/VSS pair, and route the HSE 8-25 MHz crystal traces symmetrically to minimise jitter. Configure the math accelerator and DMA priorities in the CubeMX configuration to avoid conflicts, and consult the reference manual for Flash Option Byte programming to enable the desired read/write protection at production time.
This page synthesizes distributor stock and pricing data, drop-in compatible LQFP-100 STM32G4 family alternatives, and practical design notes drawn from the reference manual that are not aggregated on any single distributor page.
Drop-in alternatives for STM32G473VET3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32G473VET3 (same form factor and footprint) — differing in ADC, Communication Interfaces, Comparators, Core, DAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32G474VET3
✅ Drop-In✓ In Stock
$5 / Unit
View Datasheet →STM32G473VET6
✅ Drop-In📋 Reference alternative (not in catalog)
STM32G473VCT3
✅ Drop-In📋 Reference alternative (not in catalog)
STM32G473VEH6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
STM32G484VET3
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
STM32G473VET3 Maximum Ratings & Electrical Characteristics
| Core | Arm Cortex-M4 with FPU and DSP |
| Maximum Clock Frequency | 170 MHz |
| DMIPS | 213 DMIPS |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Operating Voltage | 1.8V / 2.5V / 3.3V |
| Package | 100-pin LQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| ADC | 5x 12-bit SAR, up to 36 channels |
| DAC | 4x 12-bit (2 buffered + 2 unbuffered) |
| Operational Amplifiers | On-chip (multiple) |
| Comparators | On-chip ultra-fast comparators |
| Math Accelerator | Cordic + FMAC |
| DMA Channels | 12 |
| Advanced Timers | 2x 16-bit + 1x 32-bit |
| High-Resolution Timer | 2x HRTIM masters |
| Communication Interfaces | USART/UART, SPI, I2C, FDCAN, USB 2.0 FS |
| Operating Temperature Range | -40C to +125C (industrial) |
| RoHS Status | Compliant |
STM32G473VET3 Pin Configuration
| Pin 1 | PE2 — General-purpose I/O, TRACECLK |
| Pin 2 | PE3 — General-purpose I/O, TRACED0 |
| Pin 3 | PE4 — General-purpose I/O, TRACED1 |
| Pin 4 | PE5 — General-purpose I/O, TRACED2 |
| Pin 5 | PE6 — General-purpose I/O, TRACED3 |
| Pin 6 | VBAT — Battery domain supply for RTC |
| Pin 7 | PC13 — GPIO, TAMPER-RTC |
| Pin 8 | PC14 — GPIO, OSC32_IN |
| Pin 9 | PC15 — GPIO, OSC32_OUT |
| Pin 10 | VSS — Digital ground |
| Pin 11 | VDD — Digital supply (1.8V/2.5V/3.3V) |
| Pin 12 | OSC_IN — HSE crystal oscillator input |
| Pin 13 | OSC_OUT — HSE crystal oscillator output |
| Pin 14 | NRST — Reset input, active low |
| Pin 15 | PC0 — GPIO, ADC12_IN6 |
| Pin 16 | PC1 — GPIO, ADC12_IN7 |
| Pin 17 | PC2 — GPIO, ADC12_IN8 |
| Pin 18 | PC3 — GPIO, ADC12_IN9 |
| Pin 19 | VREF+ — ADC reference voltage positive |
| Pin 20 | VDDA — Analog supply |
| Pin 21 | VSSA — Analog ground |
| Pin 22 | PA0 — GPIO, ADC12_IN1, TIM2_CH1 |
| Pin 23 | PA1 — GPIO, ADC12_IN2, TIM2_CH2 |
| Pin 24 | PA2 — GPIO, USART2_TX, ADC1_IN3 |
| Pin 25 | PA3 — GPIO, USART2_RX, ADC1_IN4 |
| Pin 26 | VSS — Digital ground |
| Pin 27 | VDD — Digital supply |
| Pin 28 | PA4 — GPIO, SPI1_NSS, DAC1_OUT1 |
| Pin 29 | PA5 — GPIO, SPI1_SCK, DAC1_OUT2 |
| Pin 30 | PA6 — GPIO, SPI1_MISO, ADC12_IN3 |
| Pin 31 | PA7 — GPIO, SPI1_MOSI, ADC12_IN4 |
| Pin 32 | PB0 — GPIO, ADC12_IN5, TIM3_CH3 |
| Pin 33 | PB1 — GPIO, ADC12_IN6, TIM3_CH4 |
| Pin 34 | PB2 — GPIO, BOOT1 |
| Pin 35 | PE7 — GPIO, TIM1_ETR |
| Pin 36 | PE8 — GPIO, TIM1_CH1N |
| Pin 37 | PE9 — GPIO, TIM1_CH1 |
| Pin 38 | PE10 — GPIO, TIM1_CH2N |
| Pin 39 | PE11 — GPIO, TIM1_CH2 |
| Pin 40 | PE12 — GPIO, TIM1_CH3N |
| Pin 41 | PE13 — GPIO, TIM1_CH3 |
| Pin 42 | PE14 — GPIO, TIM1_CH4 |
| Pin 43 | PE15 — GPIO, TIM1_BKIN |
| Pin 44 | PB10 — GPIO, I2C2_SCL, USART3_TX |
| Pin 45 | PB11 — GPIO, I2C2_SDA, USART3_RX |
| Pin 46 | VSS — Digital ground |
| Pin 47 | VDD — Digital supply |
| Pin 48 | PB12 — GPIO, SPI2_NSS, TIM1_BKIN |
| Pin 49 | PB13 — GPIO, SPI2_SCK, USART3_CTS |
| Pin 50 | PB14 — GPIO, SPI2_MISO, TIM15_CH1 |
| Pin 51 | PB15 — GPIO, SPI2_MOSI, TIM15_CH2 |
| Pin 52 | PD8 — GPIO, USART3_TX |
| Pin 53 | PD9 — GPIO, USART3_RX |
| Pin 54 | PD10 — GPIO, USART3_CK |
| Pin 55 | PD11 — GPIO, USART3_CTS |
| Pin 56 | PD12 — GPIO, TIM4_CH1 |
| Pin 57 | PD13 — GPIO, TIM4_CH2 |
| Pin 58 | PD14 — GPIO, TIM4_CH3 |
| Pin 59 | PD15 — GPIO, TIM4_CH4 |
| Pin 60 | PC6 — GPIO, TIM3_CH1, USART6_TX |
| Pin 61 | PC7 — GPIO, TIM3_CH2, USART6_RX |
| Pin 62 | PC8 — GPIO, TIM3_CH3, SDMMC_D0 |
| Pin 63 | PC9 — GPIO, TIM3_CH4, SDMMC_D1 |
| Pin 64 | PA8 — GPIO, TIM1_CH1, USART1_CK |
| Pin 65 | PA9 — GPIO, USART1_TX, TIM1_CH2 |
| Pin 66 | PA10 — GPIO, USART1_RX, TIM1_CH3 |
| Pin 67 | PA11 — GPIO, USB_DM, CAN1_RX |
| Pin 68 | PA12 — GPIO, USB_DP, CAN1_TX |
| Pin 69 | PA13 — GPIO, SWDIO |
| Pin 70 | VSS — Digital ground |
| Pin 71 | VDD — Digital supply |
| Pin 72 | PA14 — GPIO, SWCLK |
| Pin 73 | PA15 — GPIO, SPI3_NSS, TIM2_CH1 |
| Pin 74 | PC10 — GPIO, UART4_TX, SDMMC_D2 |
| Pin 75 | PC11 — GPIO, UART4_RX, SDMMC_D3 |
| Pin 76 | PC12 — GPIO, UART5_TX, SDMMC_CK |
| Pin 77 | PD0 — GPIO, CAN1_RX |
| Pin 78 | PD1 — GPIO, CAN1_TX |
| Pin 79 | PD2 — GPIO, UART5_RX, SDMMC_CMD |
| Pin 80 | PD3 — GPIO, USART2_CTS |
| Pin 81 | PD4 — GPIO, USART2_RTS |
| Pin 82 | PD5 — GPIO, USART2_TX |
| Pin 83 | PD6 — GPIO, USART2_RX |
| Pin 84 | PD7 — GPIO, USART2_CK |
| Pin 85 | PB3 — GPIO, SPI3_SCK, SWO |
| Pin 86 | PB4 — GPIO, SPI3_MISO |
| Pin 87 | PB5 — GPIO, SPI3_MOSI, TIM3_CH2 |
| Pin 88 | PB6 — GPIO, I2C1_SCL, USART1_TX |
| Pin 89 | PB7 — GPIO, I2C1_SDA, USART1_RX |
| Pin 90 | PB8 — GPIO, I2C1_SCL, TIM4_CH3 |
| Pin 91 | PB9 — GPIO, I2C1_SDA, TIM4_CH4 |
| Pin 92 | PE0 — GPIO, TIM4_ETR |
| Pin 93 | PE1 — GPIO, TIM1_CH2N |
| Pin 94 | VSS — Digital ground |
| Pin 95 | VDD — Digital supply |
| Pin 96 | PE2 — GPIO |
| Pin 97 | PE3 — GPIO |
| Pin 98 | PE4 — GPIO |
| Pin 99 | PE5 — GPIO |
| Pin 100 | PE6 — GPIO |
Typical Applications
STM32G473VET3 is suitable for 6 applications: Industrial Motor Drives (FOC), Digital SMPS and Power Conversion, Lighting and LED Drivers, Solar Micro-Inverters and MPPT, Factory Automation and Sensor Fusion, Medical and Diagnostic Devices.
Industrial Motor Drives (FOC)
The STM32G473VET3 fits three-phase PMSM and BLDC field-oriented control because it combines a 170 MHz Cortex-M4 with FPU, Cordic/FMAC trigonometric offload, three synchronized 12-bit ADCs timed for current sensing, and 1.7 ns advanced timers with complementary PWM and dead-time insertion. The on-chip comparators can trigger emergency shut-down directly without an external analog IC. Compared with Cortex-M0 solutions, the FPU and DSP extensions double current-loop bandwidth at the same clock. The LQFP-100 footprint exposes the full peripheral set including the SD card interface for parameter logging.
Recommended
Digital SMPS and Power Conversion
The STM32G473VET3 supports digital power topologies up to ~200 kHz switching frequency using its advanced timers with complementary outputs, on-chip comparators for peak-current mode control, four 12-bit DACs for slope compensation, and the Cordic accelerator for trigonometric math. For higher switching frequency above 200 kHz where sub-nanosecond timing resolution matters, the STM32G474VET3 in the same LQFP-100 footprint adds an HRTIM. The 100-pin LQFP package allows hand-reworkable prototypes during power supply design validation.
Recommended
Lighting and LED Drivers
The STM32G473VET3 drives multi-channel LED lighting including DALI, DMX, and tunable-white systems by leveraging 12-bit DACs for smooth dimming, HRTIM-style timer resolution on the advanced timers, and up to 87 GPIO for large LED matrix multiplexing. The integrated op-amps close current-sense loops without external components, reducing BOM cost. The Cortex-M4 with FPU computes CIE-1931 color correction and gamma curves faster than Cortex-M3 at the same clock, simplifying high-channel-count LED fixtures.
Recommended
Solar Micro-Inverters and MPPT
The STM32G473VET3 hosts perturb-and-observe / incremental-conductance MPPT algorithms using its FPU for fast floating-point math, on-chip 12-bit ADCs for panel voltage and current sensing, and FDCAN for grid-side communication. The Cordic engine accelerates the trigonometric math needed for PLL grid synchronization. With 512 KB Flash it can run a complete grid-tie control stack including anti-islanding protection in a single chip, eliminating the need for an external DSP. The LQFP-100 footprint allows field retrofits on micro-inverter PCBs.
Recommended
Factory Automation and Sensor Fusion
The STM32G473VET3 acts as a sensor-fusion hub in industrial PLC and IO-Link master designs by combining FPU-accelerated quaternion math, up to 5 SAR ADCs for analog sensor channels, multiple UART/SPI/FDCAN peripherals for fieldbus connectivity, and 512 KB Flash for protocol stacks. The Cordic/FMAC accelerators offload the trigonometric inner loop typical of IMU fusion, freeing CPU for PLC cycle work. The 100-pin LQFP exposes the full peripheral count needed for multi-protocol IO-Link masters.
Recommended
Medical and Diagnostic Devices
The STM32G473VET3 fits low-end medical and diagnostic instrumentation such as blood-pressure monitors, infusion pumps, and patient monitors requiring deterministic real-time response. The Cortex-M4 with FPU executes DSP filter chains (FIR, IIR) for ECG and pulse-oximetry signal conditioning, while on-chip op-amps condition analog front-end signals without external analog ICs. The 100-pin LQFP footprint supports prototypes that need FDA/IEC 62304 design history, and the LQFP package simplifies verification and re-spin during design validation.
Recommended
Recommended Products Summary
Engineering reference data for STM32G473VET3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32G474VET3 | STM32G473VET6 | STM32G473VCT3 | STM32G484VET3 |
|---|---|---|---|---|---|
| Package | LQFP-100 | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same | LQFP-100 - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core / Max Clock | Cortex-M4F / 170 MHz | Cortex-M4F / 170 MHz | Cortex-M4F / 170 MHz | Cortex-M4F / 170 MHz | Cortex-M4F / 170 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| High-Resolution Timer (HRTIM) | No | Yes (added) | No | No | No |
| Crypto / Hash Accelerator | No | No | No | No | Yes (added) |
| Temperature Grade | -40C to +125C (industrial) | -40C to +125C (industrial) | -40C to +85C (extended industrial) | -40C to +125C (industrial) | -40C to +125C (industrial) |
Key Differentiators
- Same LQFP-100 footprint as G474 with full peripheral set retained (vs STM32G474VET3)
- Cordic + FMAC hardware math accelerators on-chip (vs STM32G473VCT3)
- Mainstream Cortex-M4 with FPU and DSP at 170 MHz (vs STM32G484VET3)
Design Notes
The STM32G473VET3 requires separate analog (VDDA/VSSA) and digital (VDD/VSS) supplies. Place a 100 nF X7R ceramic capacitor on each VDD pin plus a bulk 4.7 uF within 10 mm, and a ferrite bead between VDD and VDDA to suppress digital switching noise on the ADC reference. VBAT must be tied to VDD when no battery backup is used, otherwise RTC and backup registers will lose state. The on-chip voltage regulator requires an external 1 uF + 100 nF on VCAP pins.
Layout: route the HSE 8-25 MHz crystal traces symmetrically and keep them within 5 mm of OSC_IN/OSC_OUT with a ground guard ring. The LQFP-100 power pad (if exposed) should be soldered to a copper pour of at least 50 mm^2 for thermal relief. Avoid routing high-current PWM traces adjacent to ADC input traces; insert a ground trace between them. SDRAM and parallel bus pins should be length-matched within 1 mm for reliable operation above 80 MHz.
Common pitfalls: (1) the BOOT0 pin state at reset selects the boot source - leave it tied to GND through a 10 k resistor for normal Flash boot. (2) The HSE bypass capacitors must be sized per crystal load capacitance; wrong values cause oscillator start-up failure. (3) When using USB FS, the DP/DM traces must be 90 ohm differential with length matching to 1 mm. (4) The math accelerator (Cordic/FMAC) requires interrupt priority lower than the DMA to avoid pipeline stalls.
Compliance Information
RoHS compliant per STMicroelectronics product page. Industrial temperature grade -40C to +125C. Not AEC-Q100 qualified - choose AEC-Q100 grade variant for automotive.
