STM32H7A3VIT6 - 280MHz Cortex-M7 MCU, 2MB Flash, LQFP-100 | STMicroelectronics
MPN: STM32H7A3VIT6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.45 | $10,450.00 |
STM32H7A3VIT6 Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a wide range of peripheral interfaces into one package. Within the broader semiconductor taxonomy, an MCU sits under microcontrollers, which are a subcategory of integrated circuits (ICs); the Cortex-M7 core specifically belongs to the ARM Cortex-M family of embedded cores, optimized for deterministic real-time performance and DSP workloads. The STM32H7 series extends this family with the highest clock rates and largest memory footprints in the STM32 portfolio.
Key features include a 16-bit ADCs sampling up to 3.6 MSPS, fast 12-bit DACs, two USB 2.0 Full-Speed/High-Speed OTG controllers, multiple CAN FD, SDMMC, FMC, and a TFT-LCD controller. On-chip math accelerators (FMAC, CORDIC) and the Chrom-ART (DMA2D) graphics engine offload CPU-intensive operations, while hardware cryptographic accelerators and a true random number generator (TRNG) support secure connectivity use cases.
The Cortex-M7 core includes a double-precision FPU, L1 instruction and data caches (16 KB each), and a tightly-coupled SRAM region for zero-wait-state execution, enabling 280 MHz operation with sustained DSP throughput. The bus matrix is multi-layer AHB, allowing concurrent high-bandwidth access between the CPU, the Chrom-ART engine, and the SDMMC/USB peripherals without bus starvation.
Typical applications include industrial motor drives, factory automation PLCs, audio processing and professional audio interfaces, HMI panels with TFT displays, IoT edge nodes with secure connectivity, and automotive-grade body and comfort modules (when ordered in the AEC-Q100 'Q' suffix variant).
When designing with the STM32H7A3VIT6, pay close attention to power-supply decoupling and trace impedance around the high-speed SDMMC and USB signals. Proper boot-mode configuration on the BOOT0 pin and OTP area management is essential for field-deployable firmware security.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes that are not found in the manufacturer datasheet alone.
Drop-in alternatives for STM32H7A3VIT6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32H7A3VIT6 (same form factor and footprint) — differing in Package, ADC, Core, SRAM, DAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32H7A3VIT6Q
✅ Drop-In📋 Reference alternative (not in catalog)
STM32H7A3RIT6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$10.2 / Unit
View Datasheet →STM32H753XIH6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$13.2 / Unit
View Datasheet →STM32H745IIT6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$10.62 / Unit
View Datasheet →STM32F767IIT6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$11.95 / Unit
View Datasheet →STM32F765IGT6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$13.1 / Unit
View Datasheet →STM32F767IGK6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$14.05 / Unit
View Datasheet →STM32H7A3VIT6 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M7 (32-bit) |
| Maximum CPU Clock | 280 MHz |
| Flash Memory | 2 MB (2M x 8) |
| SRAM | 1.4 MB total (SRAM1/SRAM2/SRAM3/SRAM4 + DTCM + AXI SRAM) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| Package | 100-pin LQFP (14x14 mm) |
| Operating Temperature | -40 C to +85 C (industrial grade) |
| ADC | 3 x 16-bit, up to 3.6 MSPS |
| DAC | 2 x 12-bit |
| Communication | USB 2.0 FS+HS OTG, CAN FD, USART/UART, SPI, I2C, SAI, SDMMC, FMC |
| Graphics | Chrom-ART (DMA2D) accelerator, TFT-LCD controller (LTDC) |
| Math Accelerators | FMAC, CORDIC, single-precision hardware MAC |
| Security | Cryptographic accelerators, TRNG, secure boot support |
| FPU | Double-precision IEEE 754 |
| Cache | 16 KB I-cache + 16 KB D-cache |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
STM32H7A3VIT6 Pin Configuration
| Pin 1 | PE2 — General-purpose I/O (TRACECLK on some packages) |
| Pin 2 | PE3 — General-purpose I/O (TRACED0) |
| Pin 3 | PE4 — General-purpose I/O (TRACED1) |
| Pin 4 | PE5 — General-purpose I/O (TRACED2) |
| Pin 5 | PE6 — General-purpose I/O (TRACED3) |
| Pin 6 | VBAT — Backup battery supply for RTC/TAMP |
| Pin 7 | PC13 — GPIO / TAMPER-RTC (anti-tamper) |
| Pin 8 | PC14 — GPIO / OSC32_IN (LSE crystal) |
| Pin 9 | PC15 — GPIO / OSC32_OUT (LSE crystal) |
| Pin 10 | VSS — Ground reference |
| Pin 11 | VDD — Digital supply (1.62-3.6 V) |
| Pin 12 | PH0 — OSC_IN (HSE crystal) |
| Pin 13 | PH1 — OSC_OUT (HSE crystal) |
| Pin 14 | NRST — Reset input (active low) |
| Pin 15 | PC0 — GPIO / ADC1_INP10 |
| Pin 16 | PC1 — GPIO / ADC1_INP11 / DAC2 |
| Pin 17 | PC2 — GPIO / ADC1_INP12 |
| Pin 18 | PC3 — GPIO / ADC1_INP13 |
| Pin 19 | VSSA — Analog ground |
| Pin 20 | VDDA — Analog supply (1.62-3.6 V) |
| Pin 21 | PA0 — GPIO / ADC1_INP0 / TIM5_CH1 |
| Pin 22 | PA1 — GPIO / ADC1_INP1 / TIM5_CH2 |
| Pin 23 | PA2 — GPIO / ADC1_INP2 / USART2_TX |
| Pin 24 | PA3 — GPIO / ADC1_INP3 / USART2_RX |
| Pin 25 | VSS — Ground reference |
| Pin 26 | VDD — Digital supply (1.62-3.6 V) |
| Pin 27 | PA4 — GPIO / ADC1_INP4 / DAC1 |
| Pin 28 | PA5 — GPIO / ADC1_INP5 |
| Pin 29 | PA6 — GPIO / ADC1_INP6 / TIM13_CH1 |
| Pin 30 | PA7 — GPIO / ADC1_INP7 / TIM14_CH1 |
| Pin 31 | PC4 — GPIO / ADC2_INP4 |
| Pin 32 | PC5 — GPIO / ADC2_INP5 |
| Pin 33 | PB0 — GPIO / ADC2_INP8 / TIM3_CH3 |
| Pin 34 | PB1 — GPIO / ADC2_INP9 / TIM3_CH4 |
| Pin 35 | PB2 — GPIO / BOOT1 |
| Pin 36 | PE7 — GPIO / TIM1_ETR |
| Pin 37 | PE8 — GPIO / TIM1_CH1N |
| Pin 38 | PE9 — GPIO / TIM1_CH1 |
| Pin 39 | PE10 — GPIO / TIM1_CH2N |
| Pin 40 | PE11 — GPIO / TIM1_CH2 |
| Pin 41 | PE12 — GPIO / TIM1_CH3N |
| Pin 42 | PE13 — GPIO / TIM1_CH3 |
| Pin 43 | PE14 — GPIO / TIM1_CH4 |
| Pin 44 | PE15 — GPIO / TIM1_BKIN |
| Pin 45 | PB10 — GPIO / I2C2_SCL / USART3_TX |
| Pin 46 | PB11 — GPIO / I2C2_SDA / USART3_RX |
| Pin 47 | VCAP_1 — Core voltage decoupling (1.0 V regulator output) |
| Pin 48 | VDD — Digital supply (1.62-3.6 V) |
| Pin 49 | PB12 — GPIO / SPI2_NSS / TIM1_BKIN |
| Pin 50 | PB13 — GPIO / SPI2_SCK |
| Pin 51 | PB14 — GPIO / SPI2_MISO |
| Pin 52 | PB15 — GPIO / SPI2_MOSI |
| Pin 53 | PD8 — GPIO / USART3_TX |
| Pin 54 | PD9 — GPIO / USART3_RX |
| Pin 55 | PD10 — GPIO |
| Pin 56 | PD11 — GPIO |
| Pin 57 | PD12 — GPIO / TIM4_CH1 |
| Pin 58 | PD13 — GPIO / TIM4_CH2 |
| Pin 59 | PD14 — GPIO / TIM4_CH3 |
| Pin 60 | PD15 — GPIO / TIM4_CH4 |
| Pin 61 | PC6 — GPIO / TIM3_CH1 / USART6_TX |
| Pin 62 | PC7 — GPIO / TIM3_CH2 / USART6_RX |
| Pin 63 | PC8 — GPIO / TIM3_CH3 / SDMMC1_D0 |
| Pin 64 | PC9 — GPIO / TIM3_CH4 / SDMMC1_D1 |
| Pin 65 | PA8 — GPIO / TIM1_CH1 / MCO1 |
| Pin 66 | PA9 — GPIO / USART1_TX |
| Pin 67 | PA10 — GPIO / USART1_RX |
| Pin 68 | PA11 — GPIO / USB1_DM |
| Pin 69 | PA12 — GPIO / USB1_DP |
| Pin 70 | PA13 — GPIO / SWDIO (JTMS) |
| Pin 71 | VCAP_2 — Core voltage decoupling (1.0 V regulator output) |
| Pin 72 | VDD — Digital supply (1.62-3.6 V) |
| Pin 73 | PA14 — GPIO / SWCLK (JTCK) |
| Pin 74 | PA15 — GPIO / JTDI / TIM2_CH1 |
| Pin 75 | PC10 — GPIO / SDMMC1_D2 / USART3_TX |
| Pin 76 | PC11 — GPIO / SDMMC1_D3 / USART3_RX |
| Pin 77 | PC12 — GPIO / SDMMC1_CK |
| Pin 78 | PD0 — GPIO / CAN1_RX / FMC_D2 |
| Pin 79 | PD1 — GPIO / CAN1_TX / FMC_D3 |
| Pin 80 | PD2 — GPIO / SDMMC1_CMD / TIM3_ETR |
| Pin 81 | PD3 — GPIO / USART2_CTS |
| Pin 82 | PD4 — GPIO / USART2_RTS / FMC_NOE |
| Pin 83 | PD5 — GPIO / USART2_TX / FMC_NWE |
| Pin 84 | PD6 — GPIO / USART2_RX / FMC_NWAIT |
| Pin 85 | PD7 — GPIO / USART2_CK / FMC_NE1 |
| Pin 86 | PB3 — GPIO / JTDO / TIM2_CH2 |
| Pin 87 | PB4 — GPIO / JTRST / TIM3_CH1 |
| Pin 88 | PB5 — GPIO / I2C1_SMBAI / TIM3_CH2 |
| Pin 89 | PB6 — GPIO / I2C1_SCL / USART1_TX |
| Pin 90 | PB7 — GPIO / I2C1_SDA / USART1_RX |
| Pin 91 | BOOT0 — Boot mode selection |
| Pin 92 | PB8 — GPIO / I2C1_SCL / TIM4_CH3 |
| Pin 93 | PB9 — GPIO / I2C1_SDA / TIM4_CH4 |
| Pin 94 | PE0 — GPIO / TIM4_ETR |
| Pin 95 | PE1 — GPIO |
| Pin 96 | VSS — Ground reference |
| Pin 97 | VSS — Ground reference (additional) |
| Pin 98 | VSS — Ground reference (additional) |
| Pin 99 | VCAP_3 — Core voltage decoupling (1.0 V regulator output) |
| Pin 100 | VSS — Ground reference |
Typical Applications
STM32H7A3VIT6 is suitable for 7 applications: Industrial Motor Drives, Human-Machine Interface (HMI) Panels, Professional Audio Interfaces and DSP, Factory Automation PLCs and Edge Gateways, Medical Diagnostic and Monitoring Equipment, Automotive Body and Comfort Modules, IoT Edge Devices with Secure Connectivity.
Industrial Motor Drives
The STM32H7A3VIT6 is a strong fit for industrial motor drives because its Cortex-M7 core runs at 280 MHz with hardware FMAC and CORDIC accelerators that offload field-oriented control (FOC) math. Engineers benefit from three 16-bit ADCs sampling up to 3.6 MSPS for simultaneous current/voltage sensing, plus HRTIM-style timers (per the STM32H7 peripheral set) for precise PWM generation. The 100-pin LQFP gives enough GPIO for multiple encoder/HALL inputs and CAN FD for drive networking. Designers migrating from F7 parts gain ~30 percent extra CPU headroom, allowing longer control loops or onboard condition monitoring.
Recommended
Human-Machine Interface (HMI) Panels
For HMI panels, the STM32H7A3VIT6's integrated LTDC controller and Chrom-ART DMA2D engine drive TFT-LCD displays up to XGA without an external graphics controller. The 280 MHz Cortex-M7 with 1.4 MB total SRAM keeps frame buffers in on-chip memory for smoother UI animations and reduces external SDRAM cost. Hardware JPEG decode and the double-precision FPU accelerate image rendering pipelines. Verified ST product documentation highlights LTDC + DMA2D as key H7A3 differentiators against the H753 line.
Recommended
Professional Audio Interfaces and DSP
Audio interfaces benefit from the STM32H7A3VIT6's Cortex-M7 DSP extensions, double-precision FPU, and SAI/SDMMC peripherals. At 280 MHz the part sustains multi-channel audio codecs at 192 kHz while running UI and USB streaming tasks. The 2 MB Flash stores firmware plus audio effects, and the ~1.4 MB SRAM allows large I/O buffers. Compared with the STM32F4 line, the H7A3 doubles headroom for reverb and EQ DSP, while keeping the same LQFP-100 footprint for layout reuse.
Recommended
Factory Automation PLCs and Edge Gateways
Edge gateways and PLCs leverage the STM32H7A3VIT6's mix of high-speed communication peripherals: USB 2.0 High-Speed OTG, multiple CAN FD controllers, SDMMC for storage, and FMC for legacy parallel memory or FPGA links. The Cortex-M7's 280 MHz speed lets engineers run TLS, OPC UA PubSub, or lightweight container logic in parallel with deterministic control. Verified Mouser listings describe the H7A3 family as 'High-performance & DSP DP-FPU, Arm Cortex-M7 MCU 2MBytes of Flash 1376 KB SRAM', which aligns with edge-compute workloads.
Recommended
Medical Diagnostic and Monitoring Equipment
Patient monitors and portable diagnostics require both deterministic processing and trustworthy security. The STM32H7A3VIT6 provides the Cortex-M7 with hardware crypto accelerators and TRNG, supporting secure boot and encrypted firmware updates. Three 16-bit ADCs at 3.6 MSPS are ideal for high-fidelity biosignal acquisition (ECG, SpO2, EEG), while the 2 MB Flash stores waveforms and reference data. The -40 C to +85 C industrial temperature range supports bedside and laboratory environments.
Recommended
Automotive Body and Comfort Modules
For body controllers, HVAC modules, and lighting ECUs, the automotive-grade STM32H7A3VIT6Q variant offers AEC-Q100 qualification in the same 100-pin LQFP. Verified DigiKey listings confirm the 'Q' suffix part ships with the same die and 280 MHz clock, but adds -40 C to +125 C operation. CAN FD and the rich timer set (per the H7A3 peripheral map) handle body-network messaging and PWM-driven lighting. Using the non-Q version for non-automotive designs keeps the BOM cost down while retaining the same firmware base.
Recommended
IoT Edge Devices with Secure Connectivity
IoT edge nodes benefit from the STM32H7A3VIT6's hardware crypto accelerators, TRNG, and secure-boot support, which are mandatory for OTA update integrity. The Cortex-M7 at 280 MHz runs TLS handshakes and on-device ML inference (CMSIS-NN) while still leaving headroom for sensor fusion. The 2 MB Flash accommodates OTA staging, and 1.4 MB SRAM keeps neural-network activations on-chip. The 100-pin LQFP exposes SDMMC and USB HS for high-throughput logging and provisioning.
Recommended
Recommended Products Summary
Engineering reference data for STM32H7A3VIT6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32H7A3VIT6Q | STM32H7A3RIT6 | STM32H753XIH6 | STM32H745IIT6 | STM32F767IIT6 |
|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Core | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 (single) | ARM Cortex-M7 + Cortex-M4 (dual) | ARM Cortex-M7 (single) |
| Maximum Clock | 280 MHz | 280 MHz | 280 MHz | 280 MHz | 280 MHz | 216 MHz |
| Flash Memory | 2 MB | 2 MB | 64 KB | 2 MB | 2 MB | 2 MB |
| SRAM | ~1.4 MB | ~1.4 MB | ~1 MB | ~1 MB | ~1 MB | ~512 KB |
| Graphics (LTDC + DMA2D) | Yes | Yes | Yes | No | Yes | Yes |
| Ethernet MAC | No | No | No | Yes | Yes | Yes |
| Automotive Grade (AEC-Q100) | No | Yes (-40 C to +125 C) | No | No | No | No |
Key Differentiators
- Highest-frequency single-core Cortex-M7 with LTDC graphics (vs STM32H753XIH6)
- Larger SRAM budget than the H745 dual-core variant in the same footprint (vs STM32H745IIT6)
- Doubles CPU headroom versus the STM32F7 generation (vs STM32F767IIT6)
Design Notes
Decouple the four VDD/VDDA/VBAT rails with 100 nF X7R ceramics placed within 5 mm of each supply pin, plus a bulk 4.7 uF per rail. The internal SMPS (when present on the die) requires the VCAP_1/VCAP_2/VCAP_3 pins to be tied to a 2.2 uF low-ESR ceramic; inadequate capacitance is a common cause of brown-out resets at high dI/dt loads. Verified ST reference designs recommend 4.7 uF on VDD and a ferrite bead between VDD and VDDA if the analog rails must be quiet for ADC SNR.
Route the 100-pin LQFP (14x14) escape with 0.2 mm traces and 0.2 mm spacing; break out inner-row pins on the top layer with micro vias. Place a continuous ground pour on layer 2 below the package to give the SDRAM/USB reference planes a low-impedance return path. The USB DP/DM traces must be 90 ohm differential, length-matched within 150 mil, and free of stubs.
Do not leave BOOT0 floating: tie it to GND through a 10 k resistor for normal boot from Flash, or drive it high to enter the system bootloader for recovery. Field firmware updates that rely on secure boot must configure the option-byte OTP area before production; OTP writes are one-time-only. Finally, the LSE crystal requires a load capacitor matching its CL spec (typically 7 pF for ECS-3x8x crystals); mismatched capacitance drifts the RTC.
Compliance Information
RoHS and REACH compliance confirmed via STMicroelectronics product page. Non-Q variant is not AEC-Q100 qualified; choose STM32H7A3VIT6Q for AEC-Q100. Halogen-free status not explicitly stated in verified web data.
