TS7003ITD833 - 12-Bit 300ksps SAR ADC, 2.5V Ref, TDFN-8 | Silicon Labs
MPN: TS7003ITD833 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.92 | $192.00 |
| 500 | $1.68 | $840.00 |
| 1,000 | $1.49 | $1,490.00 |
TS7003ITD833 Overview
An ADC in this product category is a mixed-signal data converter that translates real-world analog voltages into discrete digital codes. The successive-approximation register (SAR) architecture family uses a binary-search algorithm with an internal track-and-hold front end, achieving a balance of speed, accuracy, and low power consumption suitable for embedded sensing, instrumentation, and process-control front-ends. This part sits within the broader hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor. Its integrated reference removes an external component and reduces board area, an important benefit for compact sensor-interface designs.
Key features include 12-bit resolution, 300 ksps throughput, a high-bandwidth input track-and-hold amplifier, and an internal +2.5V reference. The serial interface reduces pin count compared to parallel-output ADCs, simplifying routing and host-MCU connection. Low conversion-mode power consumption and an industrial temperature range support battery-aware and factory-floor deployments alike.
The TS7003ITD833 successive-approximation architecture implements a charge-redistribution DAC internally, capturing input samples on the T/H at the rising edge of CNVST and presenting results one frame later through the SPI-compatible serial port. The integrated reference and single-supply rail minimizes external component count, while the 8-pin TDFN EP package provides a low-impedance thermal/ground path that enhances noise immunity at full throughput.
Typical applications include industrial process-control analog front-ends, portable battery-powered data loggers, sensor-signal digitizers, weigh-scale and load-cell readouts, and microcontroller-based instrumentation. Use it where channel count is small, sampling rate is moderate, and PCB real estate is at a premium.
When designing with this ADC, place the decoupling capacitor directly between AVDD and GND, keep analog and digital ground returns separated until they join at the exposed pad, and respect the tACQ acquisition-time timing parameter when writing firmware. Driving the analog input from a low-impedance buffer maintains data-sheet linearity at high source resistances.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help procurement and design engineers evaluate the TS7003ITD833 for new designs and second-source risk mitigation.
Drop-in alternatives for TS7003ITD833 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TS7003ITD833 (same form factor and footprint) — differing in Package, Resolution, Sampling Rate, Architecture, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TS7003ITD833T
✅ Drop-In📋 Reference alternative (not in catalog)
TS7001ITD833
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MAX157BCPA
✅ Drop-In✓ In Stock
$3.1 / Unit
View Datasheet →MAX154BCWG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MAX150ACWP
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →TS7003ITD833 Maximum Ratings & Electrical Characteristics
| Resolution | 12 bit |
| Sampling Rate | 300 ksps |
| Number of Channels | 1 input |
| Architecture | SAR (successive approximation) |
| Supply Voltage (Analog/Digital) | 2.7 V to 3.6 V |
| Supply Current at 300 ksps | < 1 mA |
| Input Type | Single-ended (single channel) |
| Internal Reference | +2.5 V |
| Digital Interface | High-speed serial (SPI-compatible) |
| Data Output Format | Serial (12-bit) |
| Operating Temperature Range | Industrial (-40C to +85C) |
| Package | TDFN-EP8 (3 x 3 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Track-and-Hold Bandwidth | High bandwidth (per datasheet) |
| Conversion-Mode Power | Low (per datasheet) |
| RoHS Status | Compliant (per distributor listing) |
TS7003ITD833 Pin Configuration
| Pin 1 | AIN — Analog input; single-ended input to the SAR T/H |
| Pin 2 | GND — Analog ground return |
| Pin 3 | AVDD — +2.7V to +3.6V analog supply; decouple with 0.1 uF + 10 uF |
| Pin 4 | DVDD — +2.7V to +3.6V digital supply; decouple locally |
| Pin 5 | DOUT — Serial data output; SPI-compatible |
| Pin 6 | SCLK — Serial clock input for shifting out conversion results |
| Pin 7 | CNVST — Conversion start input; rising edge initiates T/H acquisition |
| Pin 8 | EOC/INT — End-of-conversion / interrupt output to host MCU |
Typical Applications
TS7003ITD833 is suitable for 6 applications: Industrial Process-Control Analog Front-End, Battery-Powered Portable Data Logger, Weigh-Scale and Load-Cell Readout, Microcontroller-Based Instrumentation Panel, Sensor Signal Digitizer Bridge, Audio/Video Control Surface ADC.
Industrial Process-Control Analog Front-End
The TS7003ITD833's 12-bit resolution, 300 ksps throughput, and industrial-grade temperature range fit 4-20 mA loop-powered process-control front-ends digitizing transducer outputs. Its less-than-1 mA supply current at full rate plus integrated +2.5V reference cuts BOM count by one external IC, easing the cold-junction compensation design of a thermocouple board while maintaining 12-bit absolute accuracy over the -40C to +85C industrial range per the manufacturer datasheet.
Recommended
Battery-Powered Portable Data Logger
At less than 1 mA supply current at 300 ksps and a 2.7V minimum supply, the TS7003ITD833 supports duty-cycled sensor sampling in a battery-powered data logger. The integrated +2.5V reference eliminates an external reference draw that can dominate 3.3V coin-cell runtime, and the serial output matches the SPI peripheral of low-power MCUs such as Silicon Labs EFM32 or STM32L, enabling sub-microamp sleep currents between acquisition bursts.
Recommended
Weigh-Scale and Load-Cell Readout
Weigh-scale designs use the TS7003ITD833's 12-bit resolution and integrated +2.5V reference to digitize a strain-gauge bridge directly. The 300 ksps throughput oversamples the slow-moving weigh signal, letting the host MCU apply digital averaging for 1-part-per-thousand noise rejection. The 8-pin TDFN-EP8 (3x3 mm) package suits the compact footprint of bench scales, while the exposed pad provides a low-impedance analog ground return critical for rejecting mains-noise pickup.
Recommended
Microcontroller-Based Instrumentation Panel
A panel-meter designer pairs the TS7003ITD833 with an MCU and a 4-digit LED/LCD display to read voltage, current, or RTD-derived temperature. The part's 12-bit resolution provides the 0.025% full-scale step the panel-meter market expects, while its serial output glues directly to the MCU without parallel-bus pin contention. The integrated +2.5V reference gives an absolute accuracy budget that does not drift between measurement gears, simplifying annual calibration.
Recommended
Sensor Signal Digitizer Bridge
Use the TS7003ITD833 at the analog side of any 0-2.5V or 0-3.6V sensor output that needs to be pushed into digital form at moderate speed, including temperature, humidity, pressure, and gas-sensor front-ends. The track-and-hold bandwidth and acquisition-time spec accommodate 4 kohm source-impedance sensors directly. The single-supply operation simplifies the 3.3V sensor board rail mapping and avoids dual-rail power trees that complicate handheld instrument designs.
Recommended
Audio/Video Control Surface ADC
The TS7003ITD833 fits cost-sensitive audio/video control surfaces such as potentiometer or fader-position digitizers on a mixing desk. The 12-bit code space gives roughly 4096 steps per travel span — adequate for LED-bar-level indication and MIDI-translated position updates. The SAR architecture avoids the latency of delta-sigma ADCs, making fader changes feel real-time to studio engineers without introducing audible zipper noise from sample timing.
Recommended
Recommended Products Summary
Engineering reference data for TS7003ITD833 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TS7003ITD833T | MAX157BCPA | MAX154BCWG | MAX150ACWP |
|---|---|---|---|---|---|
| Package | TDFN-EP8 (3x3 mm) | TDFN-EP8 (3x3 mm) - same | TDFN-EP8 class - same footprint | SOIC-WG (wide-body) - similar family footprint | SOIC-WP wide-body footprint |
| Brand | Silicon Labs | Silicon Labs | Analog Devices (formerly Maxim) | Analog Devices (formerly Maxim) | Analog Devices (formerly Maxim) |
| Resolution | 12 bit | 12 bit | 10 bit | 12 bit | 12 bit |
| Number of Channels | 1 (single-ended) | 1 (single-ended) | 1 (single-ended) | 8 (single-ended) | 1 (single-ended) |
| Architecture | SAR | SAR | SAR | SAR | SAR |
| Supply Voltage | 2.7V to 3.6V | 2.7V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V |
| Internal Reference | +2.5V | +2.5V | +2.5V | +2.5V | +2.5V |
| Data Interface | Serial (SPI-compatible) | Serial (SPI-compatible) | Serial (SPI-compatible) | Serial (SPI-compatible) | Serial (SPI-compatible) |
Key Differentiators
- Integrated +2.5V reference eliminates external ref-IC BOM (vs TS7003ITD833 vs externally-referenced 12-bit SAR ADCs)
- 300 ksps throughput at sub-1 mA supply current (vs TS7003ITD833 vs higher-throughput 1 MSPS SAR ADCs)
- TDFN-EP8 (3x3 mm) with exposed thermal/ground pad (vs TS7003ITD833 vs TSSOP/MSOP-8 12-bit SAR ADCs)
Design Notes
Place a 0.1 uF X7R ceramic capacitor within 2 mm of the AVDD pin and a 10 uF tantalum or ceramic bulk capacitor at the supply entry to the ADC island. The exposed thermal pad must be soldered to the board ground plane and stitch-via'd at 2 mm grid to provide a low-impedance analog ground return. Keep digital traces (SCLK, DOUT, CNVST) routed away from AIN to avoid coupling into the SAR decision comparator, which directly degrades INL/DNL at full 300 ksps throughput per the manufacturer datasheet.
Drive the AIN pin from a low-impedance op-amp buffer (output impedance under 50 ohm at the signal bandwidth) when sampling at full 300 ksps. Source impedances above 4 kohm extend the input settling beyond the tACQ acquisition window, adding harmonic distortion and degrading effective resolution. For high-impedance sensors such as weigh-scale bridges, place the front-end op-amp within 5 mm of the ADC AIN pin to minimize trace capacitance and ground-loop pickup at the sample edge.
Drive AVDD from a low-noise LDO regulator (such as a TPS7A4701 or equivalent) or ferrite-bead-isolated star topology from the main 3.3V rail. Avoid tying AVDD directly to a switching regulator output; switching ripple at the SAR sample moment couples into the conversion result. Keep digital and analog 3.3V returns joined at a single star ground near the exposed pad to prevent ground bounce from corrupting the conversion. Source: Silicon Labs datasheet layout recommendations as referenced in manufacturer documentation.
Compliance Information
RoHS and lead-free status inferred from distributor listing (Mouser / DigiKey / Octopart). Reach and halogen-free status are not explicitly stated in the verified web data and are marked unknown. Not AEC-Q100 qualified; the part is intended for industrial-grade sensor/instrumentation use cases rather than automotive under-hood. Refer to Silicon Labs manufacturer documentation for the authoritative compliance matrix before volume release.
