AMD

XC3S400-4TQ144I - 400K Gate Industrial Spartan-3 FPGA | AMD

MPN: XC3S400-4TQ144I ✗ End of Life
1.2 V Vdss 144-pin TQFP Package 630 MHz Speed
MOQ: 1 |

XC3S400-4TQ144I Overview

AMD XC3S400-4TQ144I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 bits of embedded RAM, and 97 user I/Os in a 144-pin TQFP package. It operates from a 1.2 V core supply and is manufactured using a 90 nm process. The -4 suffix identifies one of the Spartan-3 performance grades, while the I suffix identifies the industrial-temperature ordering option. The TQFP-144 package provides a surface-mount form factor for systems requiring moderate logic density, dedicated block RAM, and programmable digital interfaces without the cost or complexity of a larger FPGA.

A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O behavior are configured after fabrication. In the product hierarchy, an FPGA sits above programmable logic devices and provides parallel combinational logic, sequential logic, block RAM, programmable I/O, and clocking resources. The Spartan-3 architecture is intended for cost-sensitive embedded applications in which designers need configurable hardware without developing a custom ASIC.

Verified product data identifies 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 97 user I/Os for XC3S400-4TQ144I. The listed maximum operating frequency is 630 MHz, and the device uses 1.2 V core technology. These resources make it suitable for control logic, communications interfaces, industrial automation, test equipment, embedded signal processing, and general-purpose programmable system functions. The 144-pin package balances external connectivity against board-space requirements.

The -4 performance designation makes this device appropriate for designs that prioritize cost and power efficiency over the fastest available Spartan-3 grade. Its 8,064 logic cells and block RAM can support parallel datapaths, state machines, protocol handling, and control functions. Exact clock-rate, I/O-standard, and timing-budget conclusions should be based on the manufacturer datasheet and the selected I/O implementation rather than inferred solely from the maximum frequency listed by a distributor.

Typical applications include industrial controller logic, data-acquisition front ends, communications bridges, embedded test systems, and compact control platforms. In these systems, the FPGA can implement parallel interfaces and state machines while offloading deterministic tasks from a microcontroller. The 97 available user I/Os are particularly useful for legacy parallel buses, control signals, status indicators, and external memory or peripheral connections.

Designers should verify the exact bank supply voltages, supported I/O standards, configuration method, pinout, and timing constraints in the manufacturer datasheet before layout release. The TQFP package also requires attention to thermal dissipation and lead co-planarity. Configuration storage, clocking, decoupling, and JTAG access must be planned so that the device can be programmed and debugged in production without board rework.

This page combines verified distributor specifications, official-product search results, same-family replacement options, package-level comparison data, and practical design guidance. It distinguishes confirmed parameters from unavailable details instead of filling gaps with assumed values, helping engineers select, compare, source, and implement the XC3S400-4TQ144I with greater confidence.

Drop-in alternatives for XC3S400-4TQ144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with XC3S400-4TQ144I (same form factor and footprint) — differing in Device Type, System Gates, Operating Temperature, Performance Grade, Temperature Grade.

AMD
Device Type: Spartan-3 field-programmable gate array (FPGA)
Operating Temperature: 0 °C to 85 °C
Performance Grade: -4
Compare with XC3S400-4TQ144I →
Xilinx
Device Type: FPGA - Field Programmable Gate Array
System Gates: 400,000 gates
Operating Temperature: 0°C to +85°C
Compare with XC3S400-4TQ144I →

XC3S400-4TQG144I

✅ Drop-In
📦 TQFP-144
Same XC3S400 device, -4 speed grade, industrial suffix, 400,000 system gates, and TQFP-144 package; difference is the G terminal-finish or packaging ordering code rather than a quantified electrical difference.

📋 Reference alternative (not in catalog)

XC3S400-5TQ144C

✅ Drop-In
Xilinx
📦 TQFP-144
FPGA - Field Programmable Gate Array · Spartan-3 · 400,000 gates · 50,000 system gates · 192 · 1.2 V · -5 · 144-LQFP

Contact for price

View Datasheet →

XC3S400-5TQG144C

✅ Drop-In
📦 TQFP-144
Same XC3S400 device and TQFP-144 package; compared with the -4I target, it is one speed grade higher and uses commercial-temperature C ordering with the G finish code.

📋 Reference alternative (not in catalog)

XC3S400-4TQ144I Maximum Ratings & Electrical Characteristics

Device Type Field Programmable Gate Array (FPGA)
FPGA Family Spartan-3
System Gates 400,000
Logic Cells 8,064
Embedded RAM 294,912 bits
User I/O Count 97
Maximum Operating Frequency 630 MHz
Core Supply Voltage 1.2 V
Process Technology 90 nm
Package 144-pin TQFP
Pin Count 144 pins
Mounting Type Surface Mount
Performance Grade -4 speed grade
Temperature Grade Industrial
Logic Array Blocks 896 LABs

XC3S400-4TQ144I 144-pin tqfp Pin Configuration Guide

Pin configuration for XC3S400-4TQ144I (144-pin tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

144-pin tqfp package pinout diagram for XC3S400-4TQ144I

No detailed pinout data available for XC3S400-4TQ144I.

Refer to the datasheet for full pin configuration.

Typical Applications

XC3S400-4TQ144I is suitable for 6 applications: Industrial Automation Controller, Data Acquisition Front End, Communications Protocol Bridge, Embedded Test and Measurement, Video Timing and Control, General-Purpose Programmable Control.

🏭

Industrial Automation Controller

XC3S400-4TQ144I fits industrial automation controllers that require deterministic parallel logic, local buffering, and programmable state machines. Its verified 8,064 logic cells can distribute among sequencers, interlocks, and data-processing functions, while 294,912 RAM bits support counters, trace buffers, or communication queues. The 97 user I/Os provide connections for sensors, actuators, and legacy field buses. Place the FPGA beside the controller circuitry and implement the timing-critical functions directly in fabric. The principal benefit is reduced microcontroller workload and deterministic response. Because the supplied records do not confirm every bank voltage or temperature limit, verify those requirements against the manufacturer datasheet before production release.

📺

Data Acquisition Front End

XC3S400-4TQ144I can implement the parallel control and buffering logic for a multi-channel data-acquisition front end. The FPGA's 8,064 logic cells support counters, channel multiplexing, timing generators, and interface state machines, while its 294,912 RAM bits can hold measured samples or intermediate results. With 97 user I/Os, a design can connect parallel converters, control lines, and status signals without relying entirely on a microcontroller. The listed 630 MHz maximum operating frequency provides substantial timing margin for parallel operations, although actual converter interface rates must be validated. Keep high-speed routing short and terminate unused inputs according to the manufacturer recommendations.

🌐

Communications Protocol Bridge

XC3S400-4TQ144I is appropriate for a communications bridge that converts between parallel and serial protocols using programmable logic and block RAM. Its 8,064 logic cells can accommodate framing, CRC processing, FIFO control, and interface adaptation, while 294,912 RAM bits provide packet buffering. The 97 user I/Os support parallel host connections, configuration signals, and multiple physical-layer interfaces. Compared with a fixed-function bridge, the FPGA permits protocol updates without changing the PCB. Timing closure must include the selected I/O standard and clocking arrangement, and configuration storage must be included so the communications function remains deterministic after power-up.

🔧

Embedded Test and Measurement

XC3S400-4TQ144I can implement compact test and measurement equipment that combines sequencing, pattern generation, response analysis, and data capture. The FPGA's programmable logic resources suit parallel instruments and timing-sensitive digital tests, while the embedded RAM can buffer vectors or captured results. Its 97 I/Os provide flexibility for legacy probes, trigger controls, status LEDs, and external interfaces. A practical design places the TQFP-144 device near short, controlled-length digital routes and uses a stable reference clock for deterministic results. Verify input thresholds, output drive capability, and timing margins from the manufacturer documentation because the supplied distributor summaries do not specify them.

📺

Video Timing and Control

XC3S400-4TQ144I can support timing, control, and interface logic in compact video-processing equipment. Its 8,064 logic cells are suitable for horizontal and vertical timing generation, coordinate processing, overlays, and synchronization, while the 294,912 RAM bits can serve small line buffers or control memories. The 97 I/Os allow connection to converters, memory interfaces, and control processors. Using the FPGA instead of a fixed timing generator makes product parameters easier to modify. The design must still comply with the selected interface's pixel-clock timing, voltage requirements, and impedance rules. External video memory bandwidth and synchronization constraints determine whether the available internal resources are sufficient.

🖥️

General-Purpose Programmable Control

XC3S400-4TQ144I is useful as the central programmable controller in an embedded subsystem that needs adaptable logic without a custom ASIC. A designer can allocate the 8,064 logic cells among control state machines, arithmetic pipelines, communication handlers, and fault logic, with 294,912 RAM bits available for local data. The 97 user I/Os support discrete controls and legacy buses, while the -4 speed classification offers a cost-oriented performance option for designs that close timing comfortably. A useful architecture places the FPGA between a host processor and peripheral devices, with a boot or flash configuration path and JTAG access for diagnostics. Firmware and bitstream version control remain essential for long-term maintenance.

Recommended Products Summary

XC3S400-4TQG144I Same-family industrial-ordering alternative for controller designs Used in: Industrial Automation Controller, Data Acquisition Front End, Embedded Test and Measurement XC3S400-5TQ144C Xilinx Used in: Communications Protocol Bridge, Video Timing and Control XC3S400-5TQG144C Same-package alternative for configurations requiring additional speed margin Used in: General-Purpose Programmable Control
What are the key specifications of XC3S400-4TQ144I that engineers should know?
The XC3S400-4TQ144I provides 400,000 system gates, 8,064 logic cells, 294,912 bits of RAM, and 97 user I/Os in a 144-pin TQFP package. According to the manufacturer datasheet and verified distributor records, it uses a 90 nm process and a 1.2 V core supply, with a listed maximum operating frequency of 630 MHz. These figures place the device in the middle of the Spartan-3 family in terms of logic and memory capacity, making it suitable for embedded control, communications, data acquisition, and test systems that require programmable logic without a large ASIC development effort.
Where can I download the XC3S400-4TQ144I datasheet PDF?
The XC3S400-4TQ144I datasheet can be accessed through the Octopart document page or through the manufacturer’s Spartan-3 documentation. The verified datasheet URL is https://octopart.com/datasheet/xilinx/XC3S400-4TQ144I, while the indexed Xilinx document page is https://www.datasheets.com/go?p=XC3S400-4TQ144I. Before schematic or PCB release, consult the complete manufacturer document for pin names, I/O bank requirements, configuration pins, timing constraints, and absolute-maximum ratings rather than relying on a distributor summary.
Where can I find the XC3S400-4TQ144I pinout and package drawing?
The XC3S400-4TQ144I pinout and package drawing must be taken from the manufacturer datasheet because the supplied search results do not expose the complete 144-pin pin table. The verified device is packaged in a 144-pin TQFP, and the compatible package key used on this page is TQFP-144. Verify every pin, including power, ground, configuration, clock, and user I/O assignments, against the official package drawing before fabrication. An incorrect TQFP footprint or swapped orientation can make an otherwise electrically sound design unusable.
What is the price of XC3S400-4TQ144I?
The verified listed price for XC3S400-4TQ144I is $67.8114 per unit as of 2026-10-28. That value comes from the LCSC product result, while DigiKey and Mouser results confirm that the part is listed for quotation, pricing, and availability comparison. The supplied data does not establish separate volume breakpoints, so the quantity tiers use the same verified starting price rather than inventing discounts. Request a current quotation before budgeting a production build because legacy FPGA inventory and market pricing can change rapidly.
Is XC3S400-4TQ144I in stock and what is its lead time?
XC3S400-4TQ144I is listed as in stock by LCSC as of 2026-10-28, and DigiKey’s result states that the component ships today. The provided evidence does not state a numerical manufacturer lead time or guarantee inventory at every authorized distributor. LCSC identifies a starting price of $67.8114 per unit as of 2026-10-28. For production planning, confirm the exact quantity, date code, packaging condition, and traceability requirements with the selected supplier because distributor stock is not the same as an unrestricted factory allocation.
Where can I buy XC3S400-4TQ144I online?
XC3S400-4TQ144I can be ordered through verified distributor listings from DigiKey, Mouser, LCSC, and Octopart’s distributor comparison network as of 2026-10-28. DigiKey lists the part as shipping today, LCSC reports it in stock, and Octopart references 27 distributors for pricing and availability comparison. XAIPART also provides a sourcing channel for the MPN. Buyers should compare authorized-channel traceability, date codes, condition, and the manufacturer’s lifecycle position before placing an order, especially for new production rather than maintenance.
What is XC3S400-4TQ144I and what is an FPGA used for?
XC3S400-4TQ144I is an AMD Spartan-3 FPGA with 400,000 system gates, 8,064 logic cells, 294,912 bits of RAM, and 97 user I/Os. According to the manufacturer datasheet and verified distributor data, an FPGA is a reprogrammable semiconductor used to implement digital logic, sequential control, memory functions, and programmable interfaces after fabrication. The Spartan-3 device is positioned between simpler programmable logic devices and larger FPGAs, making it useful for industrial control, communications, instrumentation, and embedded systems that need flexible hardware behavior.
Is XC3S400-4TQ144I suitable for industrial control applications?
The XC3S400-4TQ144I is suitable for industrial-control designs that fit within its 8,064 logic cells, 294,912 RAM bits, and 97 I/Os. The verified product information identifies it as the industrial-grade -4 option and describes it as a Spartan-3 FPGA targeting industrial applications. Its programmable logic can implement state machines, control sequencing, communications protocols, and parallel interfaces. The exact temperature limits and long-term availability are not specified in the supplied records, so qualification should rely on the manufacturer datasheet and an authorized supply commitment.
What can replace XC3S400-4TQ144I on the same PCB footprint?
The closest verified same-family drop-in candidate is the AMD XC3S400-4TQG144I, which retains the XC3S400 device, -4 speed grade, industrial suffix, and 144-pin TQFP package. The G ordering code changes the device’s terminal-finish or packaging treatment, so PCB land-pattern compatibility does not by itself authorize substitution without checking the official ordering table. Cross-brand alternatives cannot be presented as drop-in replacements without matching I/O, configuration, voltage, timing, and software compatibility. A replacement should therefore be validated against the manufacturer migration documentation.
Can XC3S400-4TQG144I replace XC3S400-4TQ144I?
XC3S400-4TQG144I is the closest same-family option for XC3S400-4TQ144I and uses the same TQFP-144 package organization. Its key difference is the G ordering suffix, which identifies a different terminal-finish or packaging treatment rather than a different logic density or speed grade. Before treating it as a drop-in replacement, verify the manufacturer ordering guide, board finish, moisture-sensitivity handling, soldering process, and exact exposed or connected pin assignments. Board-level footprint similarity alone does not guarantee production interchangeability.
XC3S400-4TQ144I vs XC3S400-5TQ144C - which is better for an industrial design?
XC3S400-4TQ144I is generally the closer choice for an industrial design because its verified ordering information identifies the industrial-temperature option, while XC3S400-5TQ144C is a one-step-higher speed grade with the commercial C suffix. The -5 part may provide additional timing margin, but it changes both the speed and temperature classifications. According to the verified product pages, both use the Spartan-3 400K device and 144-pin TQFP package. Select based on the complete timing and environmental requirements rather than frequency alone.
What is the best Lattice equivalent for XC3S400-4TQ144I?
The verified cross-reference results identify LCMXO2-4000HC-4TG144I as a TQFP-144 alternative, but it is not established as a true drop-in replacement for XC3S400-4TQ144I. The cited alternative provides 4,320 logic cells and 115 I/Os, whereas the AMD device provides 8,064 logic cells and 97 I/Os. Those resource and pin-count differences exceed the required drop-in proximity and can alter PCB routing, configuration, and design software. Treat it only as a migration candidate requiring complete architectural verification, not a production substitute.
When should I choose XC3S400-4TQ144I over a faster Spartan-3 variant?
Choose XC3S400-4TQ144I when the design meets its timing at the -4 speed grade and cost, power, or thermal margin matters more than maximum performance. Verified data identifies 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, 97 I/Os, and a listed 630 MHz maximum operating frequency. A -5 variant may help a timing-constrained design but uses a different speed classification and possibly a different temperature suffix. Timing closure should be repeated with the exact replacement because pin-compatible does not mean timing-equivalent.
Is XC3S400-4TQ144I suitable for data acquisition and communications equipment?
XC3S400-4TQ144I is suitable for data-acquisition and communications equipment when the required logic, RAM, and interface count fit within its verified resources. Its 8,064 logic cells can support parallel datapaths and protocol state machines, while 294,912 RAM bits provide configurable on-chip storage. The 97 user I/Os are useful for parallel buses, control signals, converters, and peripheral interfaces. Exact interface speeds and voltage levels must be checked against the datasheet, particularly where legacy logic and newer mixed-signal interfaces share a board.
What design considerations matter when using XC3S400-4TQ144I?
The most important design checks are the 144-pin TQFP land pattern, power and ground distribution, I/O-bank voltage compatibility, configuration interface, and timing closure. Verified distributor data confirms a 1.2 V core supply, 90 nm process, and TQFP-144 package, but it does not provide every bank voltage or decoupling value. Follow the manufacturer datasheet and configuration guide for supply sequencing, bypass capacitors, clock routing, JTAG access, and startup behavior. Confirm the final pin assignments and power pins in the schematic review to avoid a respin.
How should engineers plan supply for an obsolete XC3S400-4TQ144I design?
Engineers should plan supply for XC3S400-4TQ144I by securing verified authorized-channel inventory, documenting date codes and condition, and qualifying any alternate ordering code before production release. The verified LCSC listing shows the part in stock and gives a starting price of $67.8114 as of 2026-10-28, while DigiKey and Octopart also provide active purchasing references. Because the product is a mature Spartan-3 device and the current lifecycle position is treated as obsolete, maintaining sufficient safety stock and reviewing a longer-term migration plan are prudent.

Engineering reference data for XC3S400-4TQ144I — comparison, design guidance, and compliance information.

Selection Guide

Choose XC3S400-4TQ144I for an industrial or general-purpose design that fits within 8,064 logic cells, 294,912 RAM bits, and 97 I/Os while meeting timing at the -4 speed grade. Select XC3S400-4TQG144I when the ordering-code change is approved by the manufacturer and the required terminal finish or packaging treatment is acceptable. Consider XC3S400-5TQ144C or XC3S400-5TQG144C only after confirming that one higher speed grade is necessary and that their commercial-temperature classification meets the environmental requirement. Do not use LCMXO2-4000HC-4TG144I as a production drop-in substitute because its verified logic-cell and I/O counts differ materially. For any migration, preserve configuration access, recreate timing constraints, verify bank voltages, and complete hardware testing on the revised board.

Comparison with Alternatives

Parameter This Product XC3S400-4TQG144I XC3S400-5TQ144C XC3S400-5TQG144C
Package TQFP-144 TQFP-144 - same package TQFP-144 - same package TQFP-144 - same package
Brand AMD AMD AMD AMD
FPGA Family Spartan-3 Spartan-3 Spartan-3 Spartan-3
System Gates 400,000 400,000 400,000 400,000
Logic Cells 8,064 8,064 8,064 8,064
Embedded RAM 294,912 bits 294,912 bits 294,912 bits 294,912 bits
User I/O Count 97 97 97 97
Speed Grade -4 -4 - same speed grade -5 - one speed grade higher -5 - one speed grade higher
Temperature Classification Industrial Industrial - same classification Commercial Commercial
Core Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • Closest ordering-code alternative preserves the target's electrical classification (vs XC3S400-4TQG144I)
  • Higher speed classification offers additional timing margin for constrained designs (vs XC3S400-5TQ144C)
  • Target retains industrial classification for temperature-sensitive industrial designs (vs XC3S400-5TQG144C)

Design Notes

Use the official 144-pin TQFP land pattern and verify pin 1 orientation against the manufacturer package drawing. Keep configuration pins, clock inputs, and ground connections consistent with the datasheet recommendations. Because the supplied search data does not include the full pin table, do not release the PCB from a distributor summary alone. Cross-check every power pin against the schematic and use the manufacturer reference schematic as the authority for bypass placement and pin connectivity.

Design the 1.2 V core rail and all I/O-bank supplies separately, following the manufacturer power-supply topology and decoupling guidance. The verified data does not provide bank voltage values, current limits, or capacitor quantities, so those details must come from the manufacturer datasheet. Check total core and I/O current against the selected speed grade and temperature class. Sequence supplies and configuration behavior as specified rather than assuming that all rails can be energized in any order.

Do not treat a same-package FPGA as an automatically interchangeable device. The XC3S400-4TQG144I is close to the target but differs in ordering treatment, while the -5 options change speed and temperature classification. Re-run timing analysis, verify configuration compatibility, review pin-level voltage constraints, and confirm tooling and bitstream support before substitution. For LCMXO2-4000HC-4TG144I, do not attempt a production drop-in change because its verified 4,320 logic cells and 115 I/Os differ materially from the target's 8,064 cells and 97 I/Os.

Route clock and high-speed interface signals according to the selected I/O standard, with attention to trace length, reference planes, impedance, and return paths. The listed 630 MHz maximum operating frequency is not a guarantee for every I/O or pin arrangement. Use the manufacturer's timing and I/O guidance to evaluate each interface, and avoid relying on general FPGA assumptions when migrating between speed grades. JTAG and configuration routing should also be checked for reliable programming and production test access.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

The supplied product results do not provide verifiable compliance statements for RoHS, REACH, AEC-Q100, lead-free status, halogen-free status, or conflict minerals. The G suffix in XC3S400-4TQG144I should not be interpreted as verified RoHS or lead-free compliance without the manufacturer ordering information. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified device, and no automotive qualification claim appears in the supplied data.

Related Searches

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Related Components & Terms

AMD Xilinx XC3S400-4TQ144I XC3S400-4TQG144I XC3S400-5TQ144C XC3S400-5TQG144C LCMXO2-4000HC-4TG144I Spartan-3 FPGA field-programmable gate array programmable logic device semiconductor system gates logic cells embedded block RAM user I/O TQFP-144 TQFP package family surface-mount package SMD 90 nm process technology 1.2 V core supply 630 MHz industrial temperature grade configuration memory
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