XC3S400-5TQ144C - 400K Gate Spartan-3 FPGA | Xilinx
MPN: XC3S400-5TQ144C ✗ End of LifeXC3S400-5TQ144C Overview
Drop-in alternatives for XC3S400-5TQ144C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC3S400-5TQ144C (same form factor and footprint) — differing in Device Type, System Gates, Operating Temperature, Performance Grade, Temperature Grade.
XC3S400-5TQG144C
✅ Drop-In📋 Reference alternative (not in catalog)
XC3S400-4TQ144C
✅ Drop-InContact for price
View Datasheet →XC3S400-4TQG144C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S400-5TQ144I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC3S400-4TQ144I
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC3S400-5TQ144C Maximum Ratings & Electrical Characteristics
| Device Type | FPGA - Field Programmable Gate Array |
| FPGA Family | Spartan-3 |
| System Gates | 400,000 gates |
| Alternative System Gate Listing | 50,000 system gates |
| Logic Cells / Logic Blocks | 192 |
| Core Supply Voltage | 1.2 V |
| Device Speed Grade | -5 |
| Package Type | 144-LQFP |
| Lead Pitch | 1.6 mm |
| Operating Temperature | 0°C to +85°C |
| Mounting Type | Surface Mount |
XC3S400-5TQ144C 144-lqfp Pin Configuration Guide
Pin configuration for XC3S400-5TQ144C (144-lqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S400-5TQ144C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S400-5TQ144C is suitable for 6 applications: Industrial Control Logic, Communications Interface, Data Acquisition and Preprocessing, Video Timing and Interface Support, Embedded Processor Platform, Instrumentation and Measurement.
Industrial Control Logic
The XC3S400-5TQ144C fits centralized machine-control logic that coordinates sensors, actuators, interlocks, and operating sequences. Its 400,000-system-gate class provides room for parallel control paths, while the -5 speed grade supports demanding timing constraints. The 144-LQFP package also simplifies inspection and rework compared with a fine-pitch BGA. Commercial operation from 0°C to +85°C suits controlled indoor environments, although enclosure temperature, power-supply quality, and EMC requirements must be validated separately.
Recommended
Communications Interface
The XC3S400-5TQ144C is suitable for protocol converters, serial-interface aggregation, and communications glue logic where parallel FPGA resources offer more flexibility than a fixed controller. Configurable I/O and logic can implement data framing, buffering, packet checks, and interface timing, while the 1.2 V device architecture supports modern digital design methods. The -5 speed grade provides additional timing margin for high-rate paths, but external transceiver characteristics, signal integrity, and synchronization must be designed around the selected I/O standard.
Recommended
Data Acquisition and Preprocessing
The XC3S400-5TQ144C can implement parallel data acquisition, filtering, thresholding, and data reduction stages ahead of a processor or communications link. The verified 400,000-system-gate resource class and 192 listed logic cells or logic blocks support a meaningful amount of parallel processing, while the -5 grade can help close timing on registered pipelines. Actual sample-rate and channel-count feasibility depend on package I/O availability, memory resources, clock quality, and the specific system architecture, which require manufacturer documentation.
Recommended
Video Timing and Interface Support
The XC3S400-5TQ144C is applicable to pixel timing, test-pattern generation, synchronization, or low-resolution interface bridging in FPGA-assisted video systems. Its programmable logic allows timing generators and data routers to be implemented in one device, while the 144-LQFP package avoids the board complexity of a large BGA. The 1.2 V Spartan-3 architecture and -5 speed grade provide a practical platform for parallel logic, but external memory interfaces, video timing standards, color depth, and connector signaling determine whether the available resources are sufficient.
Recommended
Embedded Processor Platform
The XC3S400-5TQ144C can support a soft-microprocessor design or act as a programmable companion to an external controller. Its configurable logic, memory resources, dedicated inputs and outputs, and clock-management features allow designers to partition an application among a processor core, peripherals, accelerators, and deterministic control logic. Because the verified data does not provide exact RAM or I/O counts, resource budgeting must use the official Spartan-3 family data. The 144-LQFP package is especially useful when avoiding complex BGA assembly and rework.
Recommended
Instrumentation and Measurement
The XC3S400-5TQ144C is well suited to instrumentation front ends that coordinate trigger logic, counters, calibration tables, status reporting, and communication protocols. Parallel FPGA resources can reduce the processing burden on an external microcontroller or processor, and the -5 grade provides useful timing margin for pipelined measurements. The commercial 0°C to +85°C range can fit laboratory equipment, but precision analog design remains external to the FPGA. System-level accuracy therefore depends on converters, references, analog front ends, grounding, and calibration rather than the FPGA alone.
Recommended
Recommended Products Summary
Engineering reference data for XC3S400-5TQ144C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3S400-5TQG144C | XC3S400-4TQ144C | XC3S400-4TQG144C | XC3S400-5TQ144I | XC3S400-4TQ144I |
|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Device Type | Field Programmable Gate Array | Field Programmable Gate Array | Field Programmable Gate Array | Field Programmable Gate Array | Field Programmable Gate Array | Field Programmable Gate Array |
| Speed Grade | -5 | -5 - same | -4 - lower speed grade | -4 - lower speed grade | -5 - same speed grade | -4 - lower speed grade |
Key Differentiators
- Faster speed grade within the same package (vs XC3S400-4TQ144C)
- Closest order-code alternative (vs XC3S400-5TQG144C)
- Commercial-temperature target with an industrial-family option (vs XC3S400-5TQ144I)
Design Notes
Do not select a replacement from the MPN suffix alone. The XC3S400-4TQ144C changes the speed grade, while G and I suffixes can represent ordering, finish, or temperature differences. Before substitution, confirm the 144-LQFP footprint, every pin definition, configuration behavior, supported I/O standards, and timing constraints against the applicable Spartan-3 family documentation. A superficially identical package is not sufficient evidence that two devices are interchangeable.
Plan the 1.2 V core rail as part of the complete power tree rather than treating it as an isolated FPGA requirement. Provide stable sequencing, local bulk and bypass capacitance, and adequate return paths for every supply domain shown in the manufacturer documentation. Decoupling values and permitted capacitor characteristics are not available in the verified excerpts, so engineers must use the official power-guidance section before releasing the PCB layout.
Use the manufacturer’s 144-LQFP land pattern and the verified 1.6 mm lead pitch rather than generating a generic 144-pin footprint. Keep configuration and clock pins away from noisy or high-current switching paths, provide clean ground-plane continuity, and follow the recommended fanout and decoupling arrangement. Mechanical compatibility should also be checked for board-outline clearance, component height, and the exposed-pad treatment, if any, specified for the exact package revision.
Treat clock distribution, configuration signals, and high-speed user I/O as separate integrity domains. Route clocks over continuous reference planes, minimize stubs, and provide deliberate termination according to the selected I/O standard and board topology. The -5 speed grade changes timing performance but does not guarantee signal integrity. Edge-rate, loading, series resistance, and return-path discontinuities must be evaluated with the actual interconnect and external devices.
Estimate the FPGA’s actual switching and static dissipation from the final design rather than relying on a generic package-power value, because utilization, I/O activity, and the configured 1.2 V supply determine real heating. The supplied data does not contain junction-temperature limits or package thermal resistance, so both must be obtained from the manufacturer data before defining the maximum operating temperature or copper-pour area. Use the verified 0°C to +85°C commercial range only as the device’s stated ambient-temperature class.
Compliance Information
The verified data does not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for this MPN. AEC-Q100 is marked not_applicable because this is an FPGA rather than an automotive-qualified device designation; no automotive qualification claim is made.
