XC6SLX16-3FT256C - 14,579 Logic Cell Spartan-6 FPGA | AMD
MPN: XC6SLX16-3FT256C ✓ ActiveXC6SLX16-3FT256C Overview
A field-programmable gate array is a semiconductor whose digital logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy and provides parallel programmable logic, block RAM, digital signal processing resources, and clock-management functions. This makes the device useful where a fixed application-specific integrated circuit would be inflexible or uneconomic to develop.
The XC6SLX16-3FT256C provides 14,579 logic elements arranged across 1,139 CLBs, with 589,824 total RAM bits supporting data buffering, packet handling, and general-purpose embedded storage. Its reported 667 MHz maximum clock frequency provides useful timing margin for control logic, interface bridges, instrumentation, and embedded processors. The -3 speed designation identifies its performance grade within the Spartan-6 LX family.
Built on 45 nm CMOS technology, the device supports a 1.2 V core supply as identified in the verified product records. Its 256-LBGA package uses a 1 mm pitch and measures approximately 17 mm by 17 mm. The supplied comparison data also identifies 186 I/O resources, allowing the device to interface multiple buses, peripherals, and external control signals while preserving a compact surface-mount footprint.
Typical uses include industrial automation, communications equipment, embedded control, test and measurement, signal processing, and compact network interfaces. The combination of programmable logic, block RAM, and 186 I/O permits designers to consolidate parallel control, data buffering, and protocol handling in one device. A complete design still requires suitable clocking, configuration storage, decoupling, and board-level signal-integrity implementation.
When planning a board, verify every BGA-256 land pattern against the AMD Spartan-6 package pinout files and the selected device’s official package drawing. The -3 speed grade and commercial C suffix must also be treated as part of the exact ordering code rather than assumed interchangeable with other Spartan-6 grades or temperature options.
This page consolidates the verified distributor specifications, 256-LBGA sourcing information, same-family replacement candidates, pricing evidence, and practical FPGA design considerations into one engineering-focused reference. It distinguishes directly documented facts from package details or operating parameters that still require confirmation from the complete AMD device documentation.
Drop-in alternatives for XC6SLX16-3FT256C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX16-3FT256C (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Configurable Logic Blocks (CLBs), Lead-Free Status.
XC6SLX16-3FT256I
✅ Drop-InContact for price
View Datasheet →XC6SLX16-3FTG256C
✅ Drop-InContact for price
View Datasheet →XC6SLX16-3FTG256I
✅ Drop-InContact for price
View Datasheet →XC6SLX16-2FTG256C
✅ Drop-InContact for price
View Datasheet →XC6SLX16-2FT256C
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →XC6SLX16-3FT256C Maximum Ratings & Electrical Characteristics
| Product Type | Spartan-6 LX Field-Programmable Gate Array |
| Logic Elements | 14,579 LE |
| Configurable Logic Blocks | 1,139 CLBs |
| Total Block RAM | 589,824 bits |
| Maximum Clock Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Input/Output Count | 186 I/O |
| Package | 256-LBGA |
| Package Dimensions | 17 mm x 17 mm |
| Package Pitch | 1.0 mm |
| Mounting Type | Surface Mount |
| Performance Grade | -3 speed grade |
| Temperature Grade Suffix | C suffix |
| Lead-Free Status | Lead-free |
XC6SLX16-3FT256C 1.0 mm Pin Configuration Guide
Pin configuration for XC6SLX16-3FT256C (1.0 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX16-3FT256C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX16-3FT256C is suitable for 6 applications: Industrial Automation and PLC Control, Communications and Network Interface Equipment, Test and Measurement Instrumentation, Embedded Data Acquisition and Buffering, Audio and Digital Signal Processing, Embedded Control and Security Systems.
Industrial Automation and PLC Control
The XC6SLX16-3FT256C fits compact machine-control logic because it combines 14,579 logic elements, 1,139 CLBs, and 186 I/O in one programmable device. Its 667 MHz maximum clock supports deterministic control, sequencing, and I/O multiplexing, while 589,824 RAM bits can hold state, counters, and diagnostics. A designer would use the programmable fabric for motion sequencing, machine interlocks, and communication interfaces, then validate timing with the intended ISE design flow. The C-grade temperature limits must be checked against the enclosure environment before industrial deployment.
Recommended
Communications and Network Interface Equipment
The XC6SLX16-3FT256C is suitable for packet handling, protocol bridging, and low-rate line-interface equipment because 14,579 logic elements can implement parallel datapaths and finite-state control while 589,824 RAM bits provide on-chip buffers. Its 186 I/O allow multiple byte-wide data buses to be connected without an external FPGA. The 667 MHz clock capability supports demanding clocked logic, although the 1.2 V core supply requires careful decoupling and power sequencing. Configuration storage, clock jitter tolerance, and line-impedance requirements should be evaluated in the complete board design.
Recommended
Test and Measurement Instrumentation
The Spartan-6 LX fabric in the XC6SLX16-3FT256C can implement acquisition sequencing, trigger logic, data formatting, and instrument-control functions within one 256-LBGA device. Its 1,139 CLBs provide substantial parallelism for sampling pipelines, while 589,824 RAM bits support local buffering before data transfer. The 667 MHz maximum clock allows timing-critical digital sections, and 186 I/O can connect converters, memories, and control peripherals. For instrumentation, analog isolation and grounding remain external concerns, so the FPGA should be used where its parallel digital processing and configurable logic provide measurable system integration benefits.
Recommended
Embedded Data Acquisition and Buffering
The XC6SLX16-3FT256C can serve as a configurable acquisition front end by combining parallel input capture, digital filtering, and local buffering. Its 14,579 logic elements support control and arithmetic pipelines, while 589,824 RAM bits can temporarily hold sampled data before transfer. The 186-I/O count allows the device to interface multiple converters and status signals, and its 667 MHz maximum clock supports clocked processing. Engineers should implement clock-domain crossing carefully, constrain all I/O timing, and verify that the selected -3 speed grade meets the acquisition timing budget.
Recommended
Audio and Digital Signal Processing
The XC6SLX16-3FT256C provides enough programmable logic and RAM for digital filters, sample-rate conversion, channel routing, and control sequencing in compact audio systems. Its 667 MHz maximum clock supports parallel DSP pipelines, while 589,824 RAM bits accommodate delay lines and sample buffers. The 186 I/O can connect serial audio converters and digital control interfaces. The device does not itself provide analog amplification or high-performance audio conversion, so its value lies in deterministic digital routing and processing. Designers should budget logic for clocking, gain control, and synchronization while verifying tool support for the selected legacy design flow.
Recommended
Embedded Control and Security Systems
The Spartan-6 LX FPGA is useful when control logic, protocol checking, access sequencing, and event logging must be updated after manufacture. The XC6SLX16-3FT256C provides 14,579 logic elements, 589,824 RAM bits, and 186 I/O for combining deterministic hardware behavior with programmable policy. Its -3 performance class and 667 MHz maximum clock support high-speed state machines, while the 256-LBGA package keeps the implementation compact. Security designs should add explicit boot, configuration, and interface protections rather than treating general FPGA programmability as a security boundary. Configuration-file handling and key storage require separate hardware and software controls.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX16-3FT256C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX16-3FT256I | XC6SLX16-3FTG256C | XC6SLX16-3FTG256I | XC6SLX16-2FTG256C | XC6SLX16-2FT256C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Logic Elements | 14,579 LE | 14,579 LE | 14,579 LE | 14,579 LE | 14,579 LE | 14,579 LE |
| Speed Grade | -3 | -3 | -3 | -3 | -2 | -2 |
Key Differentiators
- Exact -3 speed-grade alternatives preserve the documented timing class (vs XC6SLX16-2FTG256C)
- High logic and memory density in a single 256-LBGA device (vs XC6SLX16-3FT256I)
- Commercial C-grade ordering target with documented sourcing (vs XC6SLX16-3FTG256I)
Design Notes
Use the AMD Spartan-6 package-device pinout file and the exact device package drawing to create the BGA-256 land pattern. The verified comparison data identifies a 256-LBGA package at approximately 17 mm by 17 mm with 1.0 mm pitch. Account for package tolerances, solder-mask definition, pad and via dimensions, and assembly capability rather than copying a generic 256-ball footprint. Verify every power, ground, configuration, clock, and user I/O assignment against the selected MPN before release.
Provide a clean 1.2 V core rail and decouple each supply pin according to the complete AMD device data sheet. The supplied evidence establishes the 1.2 V core voltage but does not provide total current, static power, or dynamic power limits, so no defensible regulator sizing or thermal estimate can be produced from the current record. Use utilization-specific power analysis, preserve the recommended supply topology, and validate startup sequencing with the configuration source and any external processors.
Constrain the 667 MHz-capable design with realistic board and package models, especially when external memories, converters, or high-speed links are present. Use the fastest applicable I/O and clock constraints, account for clock jitter and skew, and keep sensitive configuration or reference signals away from noisy switching paths. A legacy BGA-256 design can still meet timing only if power delivery, return paths, and signal references are controlled at the board level.
Do not treat the -3 speed grade, FT256C package suffix, and device density as interchangeable labels. The verified alternatives retain the Spartan-6 LX 14,579-cell and 256-BGA resource class, but suffix changes can affect temperature grade or qualification. Before substitution, compare the exact ordering information, electrical limits, configuration scheme, package drawing, pin table, bitstream compatibility, and operating-temperature requirements. A footprint match alone does not prove drop-in equivalence.
Compliance Information
The verified comparison result identifies the 256-BGA device as lead-free. The supplied records do not explicitly establish RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 status, so those fields remain unknown or not applicable rather than being inferred.
