A3P1000-FGG256M ProASIC3 FPGA 256-LBGA | Microchip
MPN: A3P1000-FGG256M β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.12 | $45.12 |
| 10 | $39.85 | $398.50 |
| 100 | $34.5 | $3,450.00 |
| 500 | $30.2 | $15,100.00 |
| 1,000 | $27.85 | $27,850.00 |
Drop-in alternatives for A3P1000-FGG256M β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P1000-FG256M
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-2FGG256M
β Drop-Inβ In Stock
$25.8 / Unit
View Datasheet βA3P1000-1FG256T
β Drop-Inβ In Stock
$89.64 / Unit
View Datasheet βA3P1000-FGG256I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
M1AGL1000V5-FG256
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-FGG256M Maximum Ratings & Electrical Characteristics
| Series | ProASIC3 |
| Number of Logic Elements | 11KLEs |
| Number of I/O | 177 |
| RAM Bits | 147456 |
| Number of I/O Banks | 4 |
| Package / Case | 256-LBGA |
| Mounting Type | Surface Mount |
| Supplier Package | FBGA |
A3P1000-FGG256M fbga Pin Configuration Guide
Complete pinout information for A3P1000-FGG256M (fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000-FGG256M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000-FGG256M is suitable for 6 applications: Industrial Control and Automation, Communication Interface Bridging, Aerospace and Defense Electronics, Medical Device Monitoring, Test and Measurement Instrumentation, Embedded Vision Preprocessing.
Industrial Control and Automation
The A3P1000-FGG256M excels in industrial control as a configurable glue-logic hub. Its 11K logic elements implement UART/SPI bridging, motor-control state machines, and sensor conditioning logic. The 177 user I/O allow direct fan-out to industrial peripherals such as ADCs, op-amps, and high-side drivers. The flash-based architecture ensures instant-on operation without an external configuration memory, important in power-cycled factory equipment. With four I/O banks, engineers can mix 3.3V, 2.5V, and 1.8V logic on different banks, simplifying interface to legacy PLC modules and modern MCUs. The 256-LBGA package keeps the footprint compact for DIN-rail and embedded control boards. Unlike SRAM FPGAs, ProASIC3 retains its configuration in flash, reducing BOM cost and improving security in industrial networking equipment.
Recommended
Communication Interface Bridging
The A3P1000-FGG256M is well suited for communication interface bridging, where multiple serial protocols must be converted or routed. With 177 user I/O and 147456 bits of RAM, the device can buffer data streams while implementing UART, SPI, I2C, and parallel bus interfaces. The four I/O banks allow different voltage domains on each side of the bridge, simplifying connection between 3.3V peripherals and 1.8V core logic. The flash-based design starts up instantly, making it suitable for network switches, industrial gateways, and protocol converters that must be ready immediately after power application. The reprogrammability of ProASIC3 also supports in-field protocol updates, extending product life in communication equipment.
Recommended
Aerospace and Defense Electronics
The A3P1000-FGG256M is often selected for aerospace and defense electronics due to its flash-based non-volatile configuration, which provides secure instant-on operation. The 256-LBGA package supports dense circuit boards in avionics, unmanned systems, and secure communication modules. Its 11K logic elements and 147456 bits of RAM are sufficient for protocol processing, sensor fusion, and custom digital control. The four I/O banks can accommodate various I/O standards, enabling connection to radiation-tolerant transceivers and legacy avionics buses. The part supports reprogrammability, allowing field upgrades and customization for different mission profiles. Since the configuration is stored in flash, the device is less susceptible to bitstream loss compared with SRAM FPGAs, a significant advantage in harsh operational environments.
Recommended
Medical Device Monitoring
In medical monitoring equipment, the A3P1000-FGG256M provides reliable, low-latency digital logic for signal conditioning, data acquisition, and display control. The 147456 bits of RAM enable local buffering of physiological signals, while 177 I/O pins interface to sensors, ADCs, and graphical displays. The flash-based FPGA wakes almost instantly, which is desirable for battery-powered monitors that cycle power to save energy. The integrated four I/O banks simplify mixing 1.8V sensor I/O with 3.3V display logic. Designers can implement custom timing, filtering, and protocol handling without external controller overhead. The reprogrammability allows firmware-like algorithm updates, adapting the hardware to new monitoring modes without PCB changes.
Recommended
Test and Measurement Instrumentation
The A3P1000-FGG256M is used in test and measurement instrumentation for custom trigger logic, time-interval measurement, and data acquisition sequencing. Its 11K logic elements provide enough capacity to implement multi-channel digital filters and pattern generators. The 147456 bits of embedded RAM support waveform storage and acquisition buffers. With 177 I/O pins, the FPGA can interface to high-speed ADCs, DACs, and display drivers. The four I/O banks let designers match different voltage domains on the acquisition board and host interface. The flash architecture eliminates the need for a configuration PROM, reducing startup complexity in portable instruments. The device's instant-on nature ensures that measurement hardware is ready immediately after power-up, which is important in benchtop and field-deployable instruments.
Recommended
Embedded Vision Preprocessing
The A3P1000-FGG256M can perform real-time preprocessing in embedded vision systems, such as image cropping, pixel data formatting, and sensor timing control. The 11K logic elements are sufficient for simple image processing filters and parallel data paths, while 147456 bits of RAM act as line buffers. The 177 user I/O allow direct connection to CMOS image sensors, SDRAM, and display controllers. Because the FPGA is flash-based, it starts instantly when the camera module is powered, supporting trigger-synchronized capture. The four I/O banks enable interfacing between the low-voltage image sensor and the host processor's I/O voltage. For higher frame rates or more complex algorithms, designers may migrate to a larger ProASIC3 device while retaining the same design flow.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000-FGG256M β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-FG256M | A3P1000-2FGG256M | A3P1000-1FG256T | A3P1000-FGG256I | M1AGL1000V5-FG256 |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA (FG256) - same |
| Number of Logic Elements | 11KLEs | 11KLEs | 11KLEs | 11KLEs | 11KLEs | [DATA_NEEDED] |
| Number of I/O | 177 | 177 | 177 | 177 | 177 | [DATA_NEEDED] |
| RAM Bits | 147456 | 147456 | 147456 | 147456 | 147456 | [DATA_NEEDED] |
| Speed Grade | Standard | Standard | -2 | -1 | Standard | [DATA_NEEDED] |
| Package Finish | FGG (green) | FG (non-green) | FGG (green) | FG (non-green) | FGG (green) | [DATA_NEEDED] |
| Temperature Grade | M (per part number) | M (per part number) | M (per part number) | T (per part number) | I (per part number) | [DATA_NEEDED] |
Key Differentiators
- Green FGG package option with 177 user I/O in a compact 256-LBGA (vs A3P1000-FG256M)
- Standard speed grade offers higher timing performance than -1 speed grade (vs A3P1000-1FG256T)
- Flash-based single-chip with instant-on, no external configuration memory (vs M1AGL1000V5-FG256)
Design Notes
Provide a clean core supply to the A3P1000-FGG256M and separate I/O bank supplies. The ProASIC3 core typically runs at 1.5V, although the exact value must be verified from the official datasheet. Decouple each VCC and VCCIB ball with 0.1uF ceramic capacitors and add a bulk capacitor per bank. Estimated: a single 10uF bulk capacitor per bank plus 0.1uF per power pin provides a stable power delivery network for most designs. The flash-based FPGA does not require a separate configuration supply, which simplifies power budgeting.
The A3P1000-FGG256M has four I/O banks with dedicated VCCIB supplies. Route each bank's voltage supply separately so that banks can operate at different voltage standards. Ensure that only compatible I/O voltage standards are assigned to each bank, as stated in Microchip's migration guidance for A3P1000/A3P600/A3P400 devices. Place decoupling capacitors close to the BGA balls, and use a solid ground plane beneath the package to reduce noise. For 256-LBGA, the estimated recommended via pattern is a 0.8mm pitch BGA, so use microvias or a dogbone fanout depending on your PCB process.
Do not omit JTAG pull-ups. During normal operation, keep the TMS line pulled high to prevent unintended programming. The flash-based FPGA is programmed via JTAG; if the TMS pin is left floating, noise can cause accidental entry into programming mode. Also, check all VCCIB bank voltages before applying I/O signals to avoid latch-up. If migrating from a non-green FG variant to this FGG variant, confirm reflow profiles are compatible with RoHS assembly. Always follow the official datasheet programming and power-up sequencing requirements.
Compliance Information
Compliance data was not explicitly provided in the verified web snippets. The FGG package suffix typically indicates a green/RoHS-compliant package, but this should be confirmed from the official Microchip datasheet.
