XC6SLX25-2FTG256I - 24K Cell Spartan-6 FPGA | AMD
MPN: XC6SLX25-2FTG256I ✓ ActiveXC6SLX25-2FTG256I Overview
A field-programmable gate array is a semiconductor whose digital logic, memory, interfaces, and signal paths are configured after manufacture. Within the product hierarchy, an FPGA sits above programmable logic devices and system-programmable semiconductor devices, combining configurable logic, block RAM, digital clock managers, and programmable I/O in one device. The Spartan-6 LX family targets cost-sensitive industrial, consumer, communications, and embedded-control systems requiring substantial parallel processing capability.
The XC6SLX25-2FTG256I provides 24,051 logic cells organized into 1,879 CLBs and 3,758 ALMs, along with 186 I/Os. Its integrated DCM and PLL resources support clock generation and phase-shifted clock distribution, while the core supply range is 1.14 V to 1.26 V. The 45 nm CMOS implementation and 256-ball package support dense board layouts without requiring a larger-footprint package.
The device is categorized as a Spartan-6 LX FPGA with 3,758 adaptive logic modules and 24,051 logic elements. A comparison listing identifies 1,879 CLBs and a 667 MHz figure for the broader device record, while another specification source describes the target -2 grade at 375 MHz. Designers should therefore use the AMD Spartan-6 family data sheet and the selected speed-grade tables when establishing timing constraints rather than treating aggregate comparison figures as interchangeable timing guarantees.
Typical uses include industrial control and factory automation, parallel sensor aggregation, communications infrastructure, display and video interfaces, embedded instrumentation, and compact control systems with many parallel I/O requirements. The 186 available I/Os make the device suitable for bridging external memory, capturing parallel sensor data, and coordinating multiple digital peripherals without requiring several discrete logic devices.
When laying out the PCB, follow AMD's FTG256 package pinout files, verify all bank power and ground connections, and decouple each supply rail close to its package pins. Because unused balls can differ across Spartan-6 device densities, use the package files for the exact XC6SLX25 variant and review no-connect assignments before finalizing the board design.
This product page combines the XC6SLX25-2FTG256I specifications, package and temperature details, speed-grade alternatives, practical design guidance, and application-specific engineering context to support faster component selection and PCB planning.
Drop-in alternatives for XC6SLX25-2FTG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX25-2FTG256I (same form factor and footprint) — differing in Package, Speed Grade, Logic Cells, Operating Temperature, Process Technology.
XC6SLX25-3FTG256I
✅ Drop-InContact for price
View Datasheet →XC6SLX25-1FTG256I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC6SLX25-1LFTG256I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC6SLX25-2FTG256C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX25-2FT256I
✅ Drop-InContact for price
View Datasheet →XC6SLX25-2FTG256I Maximum Ratings & Electrical Characteristics
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Logic Elements | 24,051 LE |
| Configurable Logic Blocks | 1,879 CLBs |
| Adaptive Logic Modules | 3,758 ALMs |
| User I/O Count | 186 I/Os |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Manufacturing Process | 45 nm CMOS |
| Speed Grade | -2 |
| Operating Temperature | 0°C to 85°C |
| Package Type | FTBGA-256 |
| Package Code | FTG256 |
| Package Dimensions | 15 mm × 15 mm |
| Ball Pitch | 0.80 mm |
| Total Package Pins | 324 pins |
| Mounting Style | Surface Mount |
| Lead-Free Construction | Lead Free |
| Integrated Clock Resources | DCM and PLL |
| RoHS Compliance | RoHS Compliant |
XC6SLX25-2FTG256I 324 pins Pin Configuration Guide
Pin configuration for XC6SLX25-2FTG256I (324 pins package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX25-2FTG256I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX25-2FTG256I is suitable for 6 applications: Industrial Machine Control, Parallel Sensor Aggregation, Communications Interface Bridging, Video and Display Control, Embedded Instrumentation, Automotive Infotainment and Bridging.
Industrial Machine Control
The XC6SLX25-2FTG256I fits industrial machine-control systems requiring deterministic parallel logic, extensive digital I/O, and operation across a listed 0°C to 85°C range. Its 24,051 logic cells, 1,879 CLBs, and 186 I/Os support motor sequencing, sensor acquisition, safety interlocks, and communication logic in one FPGA. Configure DCM and PLL resources to distribute clocks across control domains, but retain the exact Spartan-6 timing constraints for the -2 grade. PCB implementation should provide continuous bank-power distribution, local decoupling, and a thermal design based on actual switching activity.
Recommended
Parallel Sensor Aggregation
XC6SLX25-2FTG256I is suitable for combining data from multiple sensors, counters, and high-speed digital inputs. The 186 available I/Os provide substantial parallel connectivity, while 24,051 logic cells can implement acquisition pipelines, filtering, thresholding, data packing, and interface control. Clocked logic should use the device's DCM or PLL resources for controlled clock generation, with timing analyzed for the selected -2 speed grade. Because unused package balls can vary across Spartan-6 densities, engineers should use the exact XC6SLX25 FTG256 pinout file before assigning sensor inputs or implementing PCB escape routing.
Recommended
Communications Interface Bridging
The XC6SLX25-2FTG256I can bridge parallel and serial communications when a design requires protocol conversion, framing, buffering, or multiple interface instances. Its 3,758 adaptive logic modules and 24,051 logic cells provide substantial configurable resources, while 186 I/Os support parallel buses and device control signals. DCM and PLL blocks can generate the required clock relationships, but the design should use the manufacturer's recommended clocking topology to control jitter and skew. Validate pin assignments for the exact FTG256 package and verify all bank voltage requirements before routing high-speed interface signals.
Recommended
Video and Display Control
XC6SLX25-2FTG256I is appropriate for display timing, pixel processing, control interfaces, and multi-stage logic pipelines that benefit from parallel FPGA implementation. The 186 I/Os can support component video, synchronization, control, and configuration links, while 24,051 logic cells provide capacity for timing generation, color processing, overlay, and memory-interface control. Use the integrated clock resources for stable pixel-clock generation and specify source-synchronous interfaces according to the manufacturer's bank and timing guidance. Board-level signal integrity depends on controlled impedance routing, proper reference planes, and correct output standards.
Recommended
Embedded Instrumentation
XC6SLX25-2FTG256I can serve as the central control and acquisition engine in compact instrumentation with multiple sensors, counters, calibration tables, and communications ports. Its 24,051 logic cells support state machines, digital filtering, calibration, and protocol handling, while the 186 I/Os provide connections to converters, front ends, and service interfaces. The listed industrial temperature range supports controlled industrial environments when the completed assembly also satisfies its own thermal requirements. Plan configuration storage, startup behavior, clock distribution, and power sequencing early to achieve predictable operation after power restoration.
Recommended
Automotive Infotainment and Bridging
The XC6SLX25-2FTG256I is architecturally suitable for infotainment and vehicle electronics requiring programmable display, networking, and control logic. A 45 nm Spartan-6 LX implementation provides 24,051 logic cells, 186 I/Os, and integrated clocking resources for protocol bridging and multimedia control. The I ordering option is specified for a 0°C to 85°C range, but that range alone does not establish AEC-Q100 qualification. Automotive production designs must obtain the current qualification documentation, validate all voltage and temperature corners, and satisfy supplier traceability requirements before deployment.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX25-2FTG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX25-3FTG256I | XC6SLX25-1FTG256I | XC6SLX25-1LFTG256I | XC6SLX25-2FTG256C | XC6SLX25-2FT256I |
|---|---|---|---|---|---|---|
| Package | FTG256 | FTG256 | FTG256 | FTG256 | FTG256 | FT256 256-ball package family |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -3 | -1 | -1L | -2 | -2 |
Key Differentiators
- The -2 grade provides a different timing-power balance from the faster -3 option. (vs XC6SLX25-3FTG256I)
- The industrial-temperature ordering option covers a listed 0°C to 85°C range. (vs XC6SLX25-2FTG256C)
- The -1L option offers a distinct lower-power performance profile in the same footprint. (vs XC6SLX25-1LFTG256I)
Design Notes
Use the AMD Spartan-6 FTG256 package file for the exact XC6SLX25 device before assigning balls. The package is 15 mm by 15 mm with a 0.80 mm pitch, but no-connect and power assignments can differ across densities. Keep high-speed nets short, provide continuous reference planes, route clock outputs carefully, and match the land pattern to the manufacturer package drawing rather than relying only on the package name.
Plan separate routing for core and I/O supply requirements, following the AMD bank-power guidance. Place high-frequency decoupling capacitors close to the package supply and ground balls, and keep switching-current return paths short. The listed core voltage range is 1.14 V to 1.26 V, but allowable ripple, tolerance, sequencing, and I/O-bank limits must be taken from the manufacturer data sheet for the selected configuration.
Estimated thermal behavior should be calculated from actual design utilization, selected speed grade, I/O activity, supply voltage, and ambient temperature because those conditions affect FPGA power. Use a large uninterrupted ground structure and adequate copper beneath the BGA, then validate the assembly with thermal analysis or measurement. Do not assume that the package's lead-free construction eliminates the need for a thermal path from the exposed package structure.
Compliance Information
The device is identified as RoHS compliant and lead free. REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not identified for the exact ordering code.