XC6SLX25-2FTG256I - 24K Cell Spartan-6 FPGA | AMD
部品番号: XC6SLX25-2FTG256I ✓ 生産中XC6SLX25-2FTG256I 概要
A field-programmable gate array is a semiconductor whose digital logic, memory, interfaces, and signal paths are configured after manufacture. Within the product hierarchy, an FPGA sits above programmable logic devices and system-programmable semiconductor devices, combining configurable logic, block RAM, digital clock managers, and programmable I/O in one device. The Spartan-6 LX family targets cost-sensitive industrial, consumer, communications, and embedded-control systems requiring substantial parallel processing capability.
The XC6SLX25-2FTG256I provides 24,051 logic cells organized into 1,879 CLBs and 3,758 ALMs, along with 186 I/Os. Its integrated DCM and PLL resources support clock generation and phase-shifted clock distribution, while the core supply range is 1.14 V to 1.26 V. The 45 nm CMOS implementation and 256-ball package support dense board layouts without requiring a larger-footprint package.
The device is categorized as a Spartan-6 LX FPGA with 3,758 adaptive logic modules and 24,051 logic elements. A comparison listing identifies 1,879 CLBs and a 667 MHz figure for the broader device record, while another specification source describes the target -2 grade at 375 MHz. Designers should therefore use the AMD Spartan-6 family data sheet and the selected speed-grade tables when establishing timing constraints rather than treating aggregate comparison figures as interchangeable timing guarantees.
Typical uses include industrial control and factory automation, parallel sensor aggregation, communications infrastructure, display and video interfaces, embedded instrumentation, and compact control systems with many parallel I/O requirements. The 186 available I/Os make the device suitable for bridging external memory, capturing parallel sensor data, and coordinating multiple digital peripherals without requiring several discrete logic devices.
When laying out the PCB, follow AMD's FTG256 package pinout files, verify all bank power and ground connections, and decouple each supply rail close to its package pins. Because unused balls can differ across Spartan-6 device densities, use the package files for the exact XC6SLX25 variant and review no-connect assignments before finalizing the board design.
This product page combines the XC6SLX25-2FTG256I specifications, package and temperature details, speed-grade alternatives, practical design guidance, and application-specific engineering context to support faster component selection and PCB planning.
ドロップイン代替品: XC6SLX25-2FTG256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX25-2FTG256I （同一形状・フットプリント） — 相違点: Package, Speed Grade, Logic Cells, Operating Temperature, Process Technology.
XC6SLX25-3FTG256I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX25-1FTG256I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX25-1LFTG256I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX25-2FTG256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX25-2FT256I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX25-2FTG256I 最大定格＆電気的特性
| Device Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Logic Elements | 24,051 LE |
| Configurable Logic Blocks | 1,879 CLBs |
| Adaptive Logic Modules | 3,758 ALMs |
| User I/O Count | 186 I/Os |
| Internal Frequency | 500 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Manufacturing Process | 45 nm CMOS |
| Speed Grade | -2 |
| 動作温度 | 0°C to 85°C |
| Package Type | FTBGA-256 |
| Package Code | FTG256 |
| Package Dimensions | 15 mm × 15 mm |
| Ball Pitch | 0.80 mm |
| Total Package Pins | 324 pins |
| 実装スタイル | Surface Mount |
| Lead-Free Construction | Lead Free |
| Integrated Clock Resources | DCM and PLL |
| RoHS Compliance | RoHS Compliant |
XC6SLX25-2FTG256I 324 pins ピン配置ガイド
XC6SLX25-2FTG256I (324 pins パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX25-2FTG256I.
詳細は データシート をご参照ください。
主な用途
XC6SLX25-2FTG256I の用途: 6 件s: Industrial Machine Control, Parallel Sensor Aggregation, Communications Interface Bridging, Video and Display Control, Embedded Instrumentation, Automotive Infotainment and Bridging.
Industrial Machine Control
The XC6SLX25-2FTG256I fits industrial machine-control systems requiring deterministic parallel logic, extensive digital I/O, and operation across a listed 0°C to 85°C range. Its 24,051 logic cells, 1,879 CLBs, and 186 I/Os support motor sequencing, sensor acquisition, safety interlocks, and communication logic in one FPGA. Configure DCM and PLL resources to distribute clocks across control domains, but retain the exact Spartan-6 timing constraints for the -2 grade. PCB implementation should provide continuous bank-power distribution, local decoupling, and a thermal design based on actual switching activity.
おすすめ
Parallel Sensor Aggregation
XC6SLX25-2FTG256I is suitable for combining data from multiple sensors, counters, and high-speed digital inputs. The 186 available I/Os provide substantial parallel connectivity, while 24,051 logic cells can implement acquisition pipelines, filtering, thresholding, data packing, and interface control. Clocked logic should use the device's DCM or PLL resources for controlled clock generation, with timing analyzed for the selected -2 speed grade. Because unused package balls can vary across Spartan-6 densities, engineers should use the exact XC6SLX25 FTG256 pinout file before assigning sensor inputs or implementing PCB escape routing.
おすすめ
Communications Interface Bridging
The XC6SLX25-2FTG256I can bridge parallel and serial communications when a design requires protocol conversion, framing, buffering, or multiple interface instances. Its 3,758 adaptive logic modules and 24,051 logic cells provide substantial configurable resources, while 186 I/Os support parallel buses and device control signals. DCM and PLL blocks can generate the required clock relationships, but the design should use the manufacturer's recommended clocking topology to control jitter and skew. Validate pin assignments for the exact FTG256 package and verify all bank voltage requirements before routing high-speed interface signals.
おすすめ
Video and Display Control
XC6SLX25-2FTG256I is appropriate for display timing, pixel processing, control interfaces, and multi-stage logic pipelines that benefit from parallel FPGA implementation. The 186 I/Os can support component video, synchronization, control, and configuration links, while 24,051 logic cells provide capacity for timing generation, color processing, overlay, and memory-interface control. Use the integrated clock resources for stable pixel-clock generation and specify source-synchronous interfaces according to the manufacturer's bank and timing guidance. Board-level signal integrity depends on controlled impedance routing, proper reference planes, and correct output standards.
おすすめ
Embedded Instrumentation
XC6SLX25-2FTG256I can serve as the central control and acquisition engine in compact instrumentation with multiple sensors, counters, calibration tables, and communications ports. Its 24,051 logic cells support state machines, digital filtering, calibration, and protocol handling, while the 186 I/Os provide connections to converters, front ends, and service interfaces. The listed industrial temperature range supports controlled industrial environments when the completed assembly also satisfies its own thermal requirements. Plan configuration storage, startup behavior, clock distribution, and power sequencing early to achieve predictable operation after power restoration.
おすすめ
Automotive Infotainment and Bridging
The XC6SLX25-2FTG256I is architecturally suitable for infotainment and vehicle electronics requiring programmable display, networking, and control logic. A 45 nm Spartan-6 LX implementation provides 24,051 logic cells, 186 I/Os, and integrated clocking resources for protocol bridging and multimedia control. The I ordering option is specified for a 0°C to 85°C range, but that range alone does not establish AEC-Q100 qualification. Automotive production designs must obtain the current qualification documentation, validate all voltage and temperature corners, and satisfy supplier traceability requirements before deployment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX25-2FTG256I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX25-3FTG256I | XC6SLX25-1FTG256I | XC6SLX25-1LFTG256I | XC6SLX25-2FTG256C | XC6SLX25-2FT256I |
|---|---|---|---|---|---|---|
| Package | FTG256 | FTG256 | FTG256 | FTG256 | FTG256 | FT256 256-ball package family |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -3 | -1 | -1L | -2 | -2 |
主な差別化要因
- The -2 grade provides a different timing-power balance from the faster -3 option. （vs XC6SLX25-3FTG256I)
- The industrial-temperature ordering option covers a listed 0°C to 85°C range. （vs XC6SLX25-2FTG256C)
- The -1L option offers a distinct lower-power performance profile in the same footprint. （vs XC6SLX25-1LFTG256I)
設計ノート
Use the AMD Spartan-6 FTG256 package file for the exact XC6SLX25 device before assigning balls. The package is 15 mm by 15 mm with a 0.80 mm pitch, but no-connect and power assignments can differ across densities. Keep high-speed nets short, provide continuous reference planes, route clock outputs carefully, and match the land pattern to the manufacturer package drawing rather than relying only on the package name.
Plan separate routing for core and I/O supply requirements, following the AMD bank-power guidance. Place high-frequency decoupling capacitors close to the package supply and ground balls, and keep switching-current return paths short. The listed core voltage range is 1.14 V to 1.26 V, but allowable ripple, tolerance, sequencing, and I/O-bank limits must be taken from the manufacturer data sheet for the selected configuration.
Estimated thermal behavior should be calculated from actual design utilization, selected speed grade, I/O activity, supply voltage, and ambient temperature because those conditions affect FPGA power. Use a large uninterrupted ground structure and adequate copper beneath the BGA, then validate the assembly with thermal analysis or measurement. Do not assume that the package's lead-free construction eliminates the need for a thermal path from the exposed package structure.
コンプライアンス情報
The device is identified as RoHS compliant and lead free. REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not identified for the exact ordering code.