XC7A100T-2FG484C - 101440-Cell Artix-7 FPGA | AMD
MPN: XC7A100T-2FG484C ✓ ActiveXC7A100T-2FG484C Overview
An FPGA is a reconfigurable digital integrated circuit used to implement control logic, signal processing, interface conversion, protocol handling, and data acquisition functions without changing the physical circuit board. Unlike a fixed-function application-specific integrated circuit, an Artix-7 FPGA can be reprogrammed during development or field updates to alter logic, add functions, or support design revisions. This makes the XC7A100T useful when algorithms and system interfaces evolve rapidly.
The Artix-7 family balances programmable logic capacity with power efficiency and cost. The XC7A100T provides 101,440 logic cells and 285 I/O, making it suitable for industrial controllers, embedded vision systems, communications equipment, instrumentation, and high-bandwidth signal-processing platforms. The -2 ordering designation identifies the specified performance grade, while the 484-ball package provides a substantial connection count for external memory and peripheral interfaces. Exact clock, memory, DSP, I/O-standard, and temperature details require confirmation in the manufacturer datasheet.
The device is appropriate for designs that require substantial programmable logic but do not need the resources of a larger FPGA family. It can implement parallel data paths, state machines, sensor fusion, industrial protocols, control loops, and test logic while keeping the design flexible. Its 28 nm process technology also places it within AMD's cost-sensitive, power-efficient Artix-7 positioning.
A valid package drawing, pinout data, power plan, configuration method, and board-level design must be treated as one system. Before schematic capture and PCB layout, engineers should obtain the exact AMD package pinout files, verify the accepted supply rails, and confirm which I/O standards and configuration pins are available for the selected board revision.
For a drop-in sourcing decision, package and pinout compatibility alone is insufficient. The replacement must also provide equivalent logic resources, memory interfaces, configuration behavior, speed grade, temperature grade, and power characteristics. This page distinguishes verified distributor information from parameters that still require confirmation from the official Artix-7 documentation.
This page combines the supplied distributor data, Artix-7 package references, and structured comparison information to support engineering selection. It also identifies uncertain fields explicitly instead of presenting unverified values as guaranteed specifications.
Drop-in alternatives for XC7A100T-2FG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC7A100T-2FG484C (same form factor and footprint) — differing in Package, Process Technology.
XC7A100T-2FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A100T-2FGG484I
✅ Drop-InContact for price
View Datasheet →XC7A100T-2FG484I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A100T-2FG484E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A100T-1FGG484C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XC7A100T-2FG484C Maximum Ratings & Electrical Characteristics
| Device Type | Artix-7 Field-Programmable Gate Array (FPGA) |
| Logic Cell Count | 101,440 cells |
| User I/O Count | 285 I/O |
| Package | 484-ball BGA |
| Process Technology | 28 nm CMOS |
| Configuration Supply | 1 V |
| Performance Grade | -2 grade |
| FPGA Family | Artix-7 |
| Programmability | User-programmable digital logic |
| Package Mounting Type | Surface-mount BGA |
| AEC-Q100 Qualification | not_applicable |
XC7A100T-2FG484C surface-mount bga Pin Configuration Guide
Pin configuration for XC7A100T-2FG484C (surface-mount bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7A100T-2FG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC7A100T-2FG484C is suitable for 6 applications: Industrial Automation and PLC Control, Embedded Vision and Image Processing, Communications and Signal Processing, Data Acquisition and Instrumentation, Medical and Diagnostic Monitoring, Aerospace and Flight-Control Prototyping.
Industrial Automation and PLC Control
The AMD XC7A100T-2FG484C fits industrial controllers that combine deterministic sequencing, peripheral interfacing, and configurable logic in one device. Its 101,440 logic cells provide capacity for state machines, interlocks, motion-command logic, and communication protocols, while 285 I/O support encoders, sensors, actuators, and field-bus transceivers. The -2 performance grade and 28 nm CMOS process are appropriate for a programmable platform aimed at balancing responsiveness with power efficiency. In a PLC or machine-control design, the FPGA can execute parallel control tasks beside a host processor while preserving deterministic behavior through fixed hardware pipelines. Design teams should still verify timing margins, supported I/O standards, configuration security, and the commercial or industrial temperature requirement against the official datasheet.
Recommended
Embedded Vision and Image Processing
The XC7A100T-2FG484C is suitable for embedded image-processing systems that need parallel pixel operations, configurable sensor interfaces, and flexible post-processing. Its 101,440 logic cells can implement filtering, thresholding, color conversion, and data-format conversion as fixed parallel pipelines, while 285 I/O offer substantial connectivity to image sensors, memory, and display or network interfaces. Compared with a processor-only implementation, the FPGA architecture can process multiple samples per clock and maintain predictable latency. Designers should use the official Artix-7 resources to confirm DSP and block-RAM capacity, supported memory interfaces, video I/O standards, achievable clock rates, and power consumption at the intended pixel throughput.
Recommended
Communications and Signal Processing
The AMD XC7A100T-2FG484C can implement high-throughput communications datapaths when protocol flexibility and parallel processing matter more than a fixed dedicated interface. The 101,440-cell fabric supports serializers, scramblers, filters, packet processing, and clock-domain logic, while 285 I/O permit broad connectivity to transceivers and memory. The -2 grade is intended for performance-oriented Artix-7 designs, but actual line rates depend on selected I/O standards, PLL resources, timing closure, and board-level signal integrity. A practical implementation should partition the design into clock domains, constrain interfaces with AMD timing tools, validate eye diagrams at the target rate, and confirm transmitter, receiver, and transceiver operating conditions independently.
Recommended
Data Acquisition and Instrumentation
The XC7A100T-2FG484C fits modular data-acquisition and instrumentation systems requiring simultaneous sampling control, digital filtering, calibration, and data packaging. Its 101,440 logic cells can organize multiple ADC channels into parallel acquisition paths and execute real-time filtering, while 285 I/O supports converters, clocks, triggers, and memory. An FPGA-based acquisition path can provide deterministic channel sequencing and configurable sample rates without relying entirely on host software. Engineers must confirm the number and speed of selectable I/O, supported voltage standards, clock-management resources, block RAM, and DSP allocation. Board validation should also cover analog isolation, grounding, input bandwidth, trigger timing, and synchronization with the test-and-measurement front end.
Recommended
Medical and Diagnostic Monitoring
The XC7A100T-2FG484C can support configurable diagnostic, monitoring, and patient-data acquisition equipment when a product needs programmable logic and a stable hardware upgrade path. The 101,440 logic cells allow parallel sensor conditioning, filtering, feature extraction, and control functions, while 285 I/O connects sensors, converters, and communications hardware. Programmable hardware can implement stable acquisition timing and adapt to different operating modes without redesigning the analog front end. Medical use nevertheless requires a separate quality and regulatory assessment, including risk management, electrical-safety requirements, software validation, and confirmation that the selected commercial or industrial grade fits the deployment environment. The verified source data does not establish medical or AEC-Q100 qualification.
Recommended
Aerospace and Flight-Control Prototyping
The XC7A100T-2FG484C may be evaluated for aerospace, UAV, and flight-control prototypes that benefit from parallel logic, configurable I/O, and programmable real-time behavior. Its 101,440 logic cells can support redundant control paths, sensor fusion, navigation filtering, and telemetry formatting, while 285 I/O connects field buses, sensors, and actuators. The -2 grade provides a defined performance class within the Artix-7 family, but it does not by itself establish aerospace qualification. Actual deployment requires the appropriate AMD device grade, radiation and environmental assessment, traceability, configuration security, and compliance with the system-level safety process. Engineers should use the official package, timing, power, and lifecycle documents before treating this device as flight hardware.
Recommended
Recommended Products Summary
Engineering reference data for XC7A100T-2FG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A100T-2FGG484C | XC7A100T-2FGG484I | XC7A100T-2FG484I | XC7A100T-2FG484E | XC7A100T-1FGG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) |
| Performance Grade | -2 grade | -2 grade | -2 grade | -2 grade | -2 grade | -1 grade |
| Temperature Grade | Commercial-grade suffix C | Commercial-grade suffix C | Industrial-grade suffix I | Industrial-grade suffix I | Extended-grade suffix E | Commercial-grade suffix C |
Key Differentiators
- High logic and I/O density in a 484-ball package (vs XC7A100T-1FGG484C)
- Commercial-temperature ordering option (vs XC7A100T-2FGG484I)
- Same-family sourcing path with verified package compatibility (vs XC7A100T-2FGG484C)
- Broader environmental option for industrial sourcing (vs XC7A100T-2FGG484C)
Design Notes
Do not begin the footprint from the abbreviated ordering code alone. AMD's Artix-7 package pinout resources provide the authoritative ball map and package information, and the supplied sources distinguish 484-BBGA and FCBGA-484 descriptions. Download the files for the exact device and package, verify every power, ground, configuration, clock, and user-I/O ball, and cross-check them against the board's netlist. The incorrect FG versus FGG ordering-code distinction can otherwise lead procurement or assembly errors even when the mechanical family appears similar.
Separate core, configuration, and I/O supply planning, then verify rail sequencing against the official Artix-7 power guide. The verified source identifies a 1 V configuration supply but does not provide complete current limits, tolerance, sequencing, or decoupling tables. Place required bulk and high-frequency decoupling at the relevant package balls, control power-up behavior, and test each rail under worst-case I/O activity. A power estimate based only on the 28 nm process node would be incomplete because utilization and I/O slew determine real power.
Treat package compatibility, device equivalence, and software compatibility as separate checks. A replacement using the same 484-ball footprint can still differ in speed grade, temperature suffix, configuration scheme, supply requirements, or supported I/O standards. Before substituting a part, compare the full ordering code, AMD device support files, bitstream configuration, timing constraints, and board test results. For the C, I, and E suffixes, confirm the actual junction-temperature range rather than inferring it from the letter alone.
Build high-speed interface constraints from the selected I/O standard, package ball, clocking architecture, and target data rate. Account for package-loss variation, board skew, series termination, impedance continuity, and adjacent high-current switching paths. The supplied data confirms 285 I/O and a 484-ball package but does not identify supported I/O standards or maximum pin rates, so those values must be obtained from the official device documentation. Validate critical interfaces with scope measurements and eye-diagram or compliance testing after layout.
Estimate junction temperature from total device power and the actual PCB thermal path rather than from logic utilization alone. Include core, I/O, configuration, and auxiliary power, and evaluate both static operation and bursts that raise activity. Use the official power estimator and package thermal data, preserve the recommended exposed-pad and via arrangement, and avoid relying on a nominal copper area without considering enclosure temperature, airflow, neighboring heat sources, and board stack-up.
Compliance Information
The supplied data does not contain material-compliance declarations for the exact MPN. AEC-Q100 is marked not applicable because this is an FPGA; this field is not an automotive-qualification claim.
