XC7A100T-2FGG484I - Artix-7 FPGA, 285 I/O | AMD
MPN: XC7A100T-2FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $63.38 | $63.38 |
| 10 | $58.5 | $585.00 |
| 100 | $52 | $5,200.00 |
| 500 | $47.5 | $23,750.00 |
| 1,000 | $43 | $43,000.00 |
Drop-in alternatives for XC7A100T-2FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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XC7A100T-1FGG484I
β Drop-Inβ In Stock
$17.5 / Unit
View Datasheet βXA7A100T-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC7A100T-2FG484I
β Drop-Inπ Reference alternative (not in catalog)
XC7A100T-2FGG484I Maximum Ratings & Electrical Characteristics
| Number of Logic Cells | 101440 |
| Number of LABs/CLBs | 7925 |
| Number of Block RAM | 4976640 bits |
| Number of DSP Slices | 240 |
| Number of CMTs | 10 |
| Number of I/Os | 285 |
| Maximum Operating Frequency | 628 MHz |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Operating Temperature Range | -40Β°C to +100Β°C |
| Package Type | 484-BBGA (FBGA-484) |
| Package Dimensions | 23 mm x 23 mm |
| Mounting Type | Surface Mount |
| Technology | 28nm |
| RoHS Status | Compliant |
| Series | Artix-7 |
XC7A100T-2FGG484I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCINT β Core logic supply voltage (1.0V) |
| Pin C2 | GND β Ground |
| Pin D1 | VCCAUX β Auxiliary supply voltage (1.8V) |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | IO_L4P_T0 β User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0 β User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A100T-2FGG484I is suitable for 6 applications: Motor Control, Industrial Networking, Medical Imaging, Software-Defined Radio, Video Processing, Aerospace & Defense.
Motor Control
The XC7A100T-2FGG484I excels in motor control applications due to its 240 DSP slices for FOC algorithms and 285 I/Os for encoder interfaces. Its 628 MHz fabric handles high-speed PWM generation, while the industrial temperature range ensures reliable operation in factory environments. The FPGA's parallel processing capability enables multi-axis control with deterministic timing, outperforming MCU-based solutions.
Recommended
Industrial Networking
With 285 I/Os supporting various voltage standards, the XC7A100T-2FGG484I is ideal for industrial Ethernet switches and protocol converters. Its 4,976,640 bits of block RAM buffer packets efficiently, while the 28nm process keeps power low for 24/7 operation. The FPGA can implement EtherCAT, PROFINET, or Modbus TCP stacks with hardware acceleration, reducing latency compared to software implementations.
Recommended
Medical Imaging
The XC7A100T-2FGG484I's 240 DSP slices and 628 MHz fabric enable real-time image processing for ultrasound and X-ray systems. Its block RAM supports frame buffering, while the AMS block with 12-bit ADC monitors system health. The industrial temperature range and high reliability make it suitable for medical devices requiring long operational life.
Recommended
Software-Defined Radio
The XC7A100T-2FGG484I is well-suited for SDR applications, with 240 DSP slices handling digital down-conversion and filtering. Its 285 I/Os interface with high-speed ADCs and DACs, while the 628 MHz fabric supports complex modulation schemes. The FPGA's reconfigurability allows over-the-air updates for new waveforms, making it ideal for defense and amateur radio systems.
Recommended
Video Processing
With 101,440 logic cells and 240 DSP slices, the XC7A100T-2FGG484I handles real-time video scaling, color space conversion, and frame rate conversion. Its block RAM supports line buffering for video pipelines, while 285 I/Os connect to HDMI, LVDS, or MIPI interfaces. The 628 MHz fabric ensures smooth 1080p60 processing with low latency.
Recommended
Aerospace & Defense
The XC7A100T-2FGG484I's industrial temperature range and high reliability make it suitable for aerospace applications like flight control and radar processing. Its 240 DSP slices handle beamforming algorithms, while the AMS block monitors power integrity. The FPGA's reconfigurability enables in-field updates for evolving mission requirements, and the 28nm process balances performance with power efficiency for airborne systems.
Recommended
Recommended Products Summary
Engineering reference data for XC7A100T-2FGG484I β comparison, design guidance, and compliance information.
Comparison with Alternatives
| Parameter | This Product | XC7A100T-1FGG484I | XA7A100T-2FGG484I | XC7A100T-2FG484I |
|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -1 | -2 | -2 |
| Number of Logic Cells | 101440 | 101440 | 101440 | 101440 |
| Number of I/Os | 285 | 285 | 285 | 285 |
| Operating Temperature | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +125Β°C | -40Β°C to +100Β°C |
| Automotive Grade | No | No | Yes (AEC-Q100) | No |
| RoHS Compliant | Yes | Yes | Yes | No |
Key Differentiators
- Higher speed grade than XC7A100T-1FGG484I (vs XC7A100T-1FGG484I)
- Industrial temperature range (vs XC7A100T-2FG484I)
- RoHS compliant package (vs XC7A100T-2FG484I)
Design Notes
The XC7A100T-2FGG484I requires multiple supply rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (bank-specific, typically 1.5V-3.3V). Use dedicated power regulators with proper sequencing - VCCINT must ramp before VCCAUX. Refer to AMD's power management application note for recommended regulator topologies and decoupling capacitor values.
For the 484-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Place 0.1uF and 1uF decoupling capacitors close to each power pin. Follow AMD's PCB design guidelines (UG475) for via placement and trace routing. Ensure the thermal pad is properly connected to the ground plane for heat dissipation.
Do not exceed the maximum core voltage of 1.05V. Ensure proper configuration clock (CCLK) termination and use AMD's recommended configuration mode (e.g., SPI flash). For industrial applications, implement watchdog timers and CRC checking on configuration data to detect bitstream corruption. Verify all I/O standards match the connected devices to avoid damage.