XMC4400F100K256BAXUMA2 - 120MHz Cortex-M4 MCU | Infineon
MPN: XMC4400F100K256BAXUMA2 ✓ ActiveXMC4400F100K256BAXUMA2 Overview
A microcontroller is a programmable semiconductor that integrates a processor core, memory, peripherals, and communication interfaces onto one device. It belongs to the embedded processor hierarchy, alongside system-on-chip and application-specific processors, and executes firmware that controls sensors, motors, communications, and safety-related system functions. The ARM Cortex-M4 core uses a 32-bit architecture and combines deterministic peripheral access with efficient interrupt handling for real-time embedded workloads.
The XMC4400 combines 256 KB of programmable flash with 80 KB of SRAM, giving embedded software room for code, working memory, Ethernet stacks, and communication buffers. Its 120 MHz operating frequency supports responsive control loops and protocol processing, while the XMC4000 family integration consolidates Ethernet and industrial peripherals into one component. This reduces board area compared with separate processor and communication solutions.
The integrated Ethernet interface is the defining feature for networked industrial equipment. The microcontroller can connect embedded controllers to Ethernet infrastructure without requiring a separate network controller, allowing designers to consolidate motor control, communications, and local supervision into a single controller. The manufacturer identifies the XMC4400-F100F256-BA as an industrial ARM Cortex-M4 microcontroller with Ethernet, 256 KB flash, and 80 KB SRAM.
Typical applications include industrial Ethernet controllers, automated production equipment, motor and actuator controllers, building automation gateways, sensor-network nodes, and embedded communications modules. Its combination of deterministic processing, substantial on-chip memory, and integrated Ethernet supports compact control platforms that must communicate reliably with supervisory systems.
PCB implementation requires careful treatment of the exposed thermal pad and supply pins. Place the device on a multilayer board with a low-impedance ground plane, route high-current and high-speed interfaces away from sensitive analog sections, and follow the manufacturer pin-description and layout guidance. Confirm every decoupling, clock, reset, and Ethernet connection against the datasheet before fabrication.
This product page combines manufacturer specifications, package details, practical design guidance, and traceable replacement analysis. It also distinguishes confirmed drop-in options from devices that may require firmware, peripheral, or PCB verification, helping engineers shorten procurement and design-review cycles.
Drop-in alternatives for XMC4400F100K256BAXUMA2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
XMC4400-F100F256-BA
✅ Drop-In📋 Reference alternative (not in catalog)
XMC4402F100K256BAXUMA1
✅ Drop-InContact for price
View Datasheet →XMC4400F100K256BAXUMA2 Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Processor Core | ARM Cortex-M4 |
| Architecture | 32-bit RISC |
| Maximum CPU Frequency | 120 MHz |
| Program Memory | 256 KB flash (256K x 8) |
| SRAM | 80 KB |
| Ethernet Support | Integrated Ethernet |
| Supply Voltage | 3.3 V |
| Package | PG-LQFP-100-11 |
| Package Type | 100-pin LQFP with exposed pad |
| Mounting Type | Surface mount |
| Temperature Grade | Automotive |
| Shipping Form | Tape and reel |
XMC4400F100K256BAXUMA2 100-pin lqfp with exposed pad Pin Configuration Guide
Pin configuration for XMC4400F100K256BAXUMA2 (100-pin lqfp with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XMC4400F100K256BAXUMA2.
Refer to the datasheet for full pin configuration.
Typical Applications
XMC4400F100K256BAXUMA2 is suitable for 6 applications: Industrial Ethernet Controller, Motor and Actuator Control, Building Automation Gateway, Automated Production Equipment, Sensor Network Gateway, Embedded Communications Module.
Industrial Ethernet Controller
The XMC4400F100K256BAXUMA2 fits industrial Ethernet controllers because its 120 MHz ARM Cortex-M4 core combines real-time processing with integrated Ethernet networking. The 256 KB flash supports embedded protocol stacks and control firmware, while 80 KB SRAM provides space for packet buffers and working variables. Placing the MCU between local sensors or actuators and an Ethernet network reduces component count and board area. A production design should still include a suitable Ethernet PHY or integrated transceiver arrangement, magnetic isolation, controlled-impedance routing, and differential-pair layout based on the manufacturer’s reference implementation.
Recommended
Motor and Actuator Control
The XMC4400F100K256BAXUMA2 is suitable for compact motor and actuator controllers because its 120 MHz Cortex-M4 core can execute fast control algorithms while its 256 KB flash and 80 KB SRAM accommodate application code and control buffers. Integrated Ethernet allows operators to command, monitor, and diagnose the equipment remotely. The controller can coordinate feedback processing, protection logic, and communication tasks in one device. Gate-drive timing, encoder interfaces, isolation, fault handling, and analog current sensing must be designed around the MCU’s electrical limits and verified against the datasheet.
Recommended
Building Automation Gateway
The XMC4400F100K256BAXUMA2 supports building automation gateways that must process local sensor data and communicate with supervisory controllers. Its 120 MHz ARM Cortex-M4 core provides sufficient throughput for protocol handling, while 256 KB flash stores gateway firmware and 80 KB SRAM supports transient communication buffers. Integrated Ethernet simplifies network connectivity for HVAC, access, lighting, and occupancy systems. The device is also appropriate for decentralized control, where each gateway can perform local decisions and reduce dependence on a central server during intermittent network conditions.
Recommended
Automated Production Equipment
The XMC4400F100K256BAXUMA2 is well matched to automated production equipment that combines sequencing, sensor processing, safety monitoring, and factory networking. Its 120 MHz Cortex-M4 performance supports responsive control tasks, and its 256 KB flash and 80 KB SRAM provide a practical split between firmware storage and runtime memory. Integrated Ethernet allows machine controllers to report status, accept commands, and support diagnostics. Deterministic peripheral behavior and synchronized timing should be evaluated for each production cycle, while external protection circuits may be required for noisy motor and actuator environments.
Recommended
Sensor Network Gateway
The XMC4400F100K256BAXUMA2 can serve as a sensor-network gateway by aggregating local measurements and forwarding them through Ethernet. The 256 KB flash accommodates networking and application firmware, while 80 KB SRAM supports protocol state and temporary data buffers. Its 120 MHz Cortex-M4 core leaves performance headroom for filtering, calibration, diagnostics, and device management beyond basic packet forwarding. This makes the device suitable for industrial monitoring nodes that bridge slower sensors to an Ethernet backbone. Low-power operation should be checked against the duty cycle, because continuous Ethernet and high-performance processing can dominate the system power budget.
Recommended
Embedded Communications Module
The XMC4400F100K256BAXUMA2 is appropriate for embedded communications modules that need deterministic control processing and Ethernet connectivity in one component. Its 120 MHz ARM Cortex-M4 core can manage protocol processing and background tasks, while 256 KB flash stores application and stack code. The 80 KB SRAM provides runtime space for packet handling, and the 100-pin LQFP package supports a conventional surface-mount assembly approach. A communication module should include appropriate Ethernet magnetics or PHY selection, connector protection, and a controlled-impedance PCB stack-up. Firmware partitioning and update mechanisms should also be planned during architecture development.
Recommended
Recommended Products Summary
Engineering reference data for XMC4400F100K256BAXUMA2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XMC4400-F100F256-BA | XMC4402F100K256BAXUMA1 |
|---|---|---|---|
| Package | PG-LQFP-100-11 | PG-LQFP-100-11 | PG-LQFP-100-11 |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Processor Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB |
Key Differentiators
- Combines a 120 MHz Cortex-M4 core with integrated Ethernet (vs XMC4402F100K256BAXUMA1)
- Uses the automotive temperature-grade ordering designation (vs XMC4400-F100F256-BA)
- Provides 256 KB flash and 80 KB SRAM in one controller (vs XMC4402F100K256BAXUMA1)
Design Notes
The PG-LQFP-100-11 package includes an exposed pad that must be connected to the ground plane rather than left thermally isolated. Follow the manufacturer’s exposed-pad land pattern and use multiple vias to transfer heat into the board. The exact maximum junction temperature, package thermal resistance, and via recommendation are device-specific, so obtain those values from the Infineon XMC4400 datasheet before conducting a thermal design.
Place every decoupling capacitor directly between the associated XMC4400 supply pin and the ground plane, using the shortest possible connection. Avoid creating current loops through digital return paths, and route clock, Ethernet, and high-speed signals over continuous reference planes. Because the LQFP lead pitch is fine, inspect the PCB for solder bridges after assembly and verify the exposed-pad connection through thermal vias.
Ethernet differential pairs require a controlled-impedance PCB stack-up, continuous reference plane, symmetrical routing, and avoidance of stubs or unnecessary test-point structures. Separate switching nodes and high-current return paths from Ethernet and clock signals. The manufacturer’s reference schematic and layout guidance should be used to select PHY or transceiver connections, magnetics, termination, and connector placement before the first hardware revision.
Do not assume that a device sharing the XMC4000 family name is a drop-in substitute. Boot configuration, clock sources, peripheral assignments, pin multiplexing, memory organization, and errata can differ even when the package and core frequency match. Program a production device with the intended firmware, exercise reset and clock start-up paths, and compare all peripheral assignments against the target schematic before releasing a substitute for manufacturing.
Compliance Information
The automotive temperature-grade ordering designation is identified for the target, but no explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement is available. Compliance fields require confirmation from the manufacturer or the current product-compliance documentation.