FPGA & CPLD
Produtos (6666)
EP3SE260F1152I4LN - Stratix III E FPGA 255K LE FCBGA-1152 | Intel
The Intel EP3SE260F1152I4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, offering 255,000 logic elements, 16,672,640 bits of embedded memory, and 744 user I/Os in a 1517-ball FCBGA-1152 (35x35 mm) package. It operates at a core voltage of 0.9 V (with a tolerated 1.05-1.15 V supply variant) and targets -40 C to +100 C industrial-grade ambient temperatures, making it suitable for harsh-environment systems. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor in the programmable logic device (PLD) family, sitting between fixed-function ASICs and software-driven microcontrollers in the silicon hierarchy. Stratix III E specifically sits inside Intel's high-performance FPGA lineage (FPGA & CPLD -> programmable logic -> logic device -> semiconductor IC), delivering the highest logic density, highest DSP throughput, and lowest power consumption of any 65 nm FPGA family Intel ever shipped. Key features include 10,200 Logic Array Blocks (LABs), 768 embedded 18x18 multipliers, dedicated DSP blocks for high-speed signal processing, 12 transceiver channels supporting multi-gigabit serial protocols, and rich clocking with PLLs. Hard memory controller and PCIe IP hard cores accelerate memory and high-speed serial interfaces without consuming fabric logic. The architecture combines a fine-grained logic fabric with column- and row-based memory blocks, achieving deterministic timing closure for designs above 200 MHz. The 65 nm process node combined with programmable power technology (low-static-power devices) cuts dynamic power relative to Stratix II at equivalent performance. Typical applications include high-end telecommunications backhaul, military radar and electronic warfare, ASIC prototyping, high-frequency trading acceleration, and medical imaging pipelines. The package's high I/O count suits parallel memory interfaces and LVDS-heavy front-end electronics. Design considerations include power planning across 0.9 V core and 1.8 V/2.5 V/3.3 V I/O rails, mandatory heatsinking for sustained 717 MHz operation, and 12-layer PCB stack-up for BGA breakout. Use the Quartus II design suite for synthesis, place-and-route, and timing analysis. This page synthesizes distributor pricing, drop-in Stratix III E alternatives from the same family, and practical thermal/PCB guidance beyond the manufacturer datasheet.
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1152I4N is a high-performance, low-power Stratix III E family Field-Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 maximum user I/O pins, housed in a 1152-ball FineLine BGA (FCBGA) package. Operating from a 0.86V core supply with industrial temperature grade (-40C to +100C) and speed grade 4, the device integrates up to 10,200 Logic Array Blocks (LABs) and supports transceiver-rich system designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize via HDL (Hardware Description Language) bitstreams. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic -> reconfigurable computing -> parallel hardware accelerator. Compared to ASICs, FPGAs offer rapid time-to-market and in-system reprogrammability; compared to microcontrollers, FPGAs deliver hardware-level parallelism for DSP, packet processing, and high-speed I/O fan-out. Key features include 896 DSP blocks (18x18 multipliers), 48 transceivers operating up to 8.5 Gbps, support for external memory interfaces including DDR3, QDR II+, and RLDRAM II, and Altera's adaptive logic module (ALM) architecture that delivers up to 25% higher performance per logic element versus the prior Stratix II generation. The 1152-FCBGA package supports high-pin-count designs requiring maximum bandwidth. The EP3SE260F1152I4N utilizes TSMC's 40nm process with Altera's proprietary Programmable Power Technology, which dynamically reduces power consumption by up to 50% versus static FPGA implementations. The architecture includes hard PCI Express Gen2 endpoints, hard memory controllers, and partial reconfiguration support for designs that must modify logic blocks while the device is running. Typical applications include high-end telecommunication line cards, military radar signal processing, ASIC prototyping, software-defined radio (SDR) baseband, high-performance computing (HPC) acceleration, and broadcast video processing. The 744 I/O and 48 transceivers make it especially suitable for protocol-bridging and high-bandwidth data aggregation systems. When designing with this FPGA, ensure proper power sequencing for the 0.86V core, 1.1V/1.5V/2.5V/3.3V auxiliary rails, and the PLL analog supply. Use Altera's Quartus II design software (the legacy design suite for Stratix III) for synthesis, place-and-route, and timing closure. PCB layout must allocate sufficient decoupling capacitors and ground vias for the high-current transients typical of 8.5 Gbps transceivers. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, cross-reference companion parts, and practical design considerations not consolidated in the manufacturer datasheet.
EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
The Altera EP3SE260F1517C2 is a high-density, low-power member of the Stratix® III E FPGA family, delivering 254,400 logic elements (LEs), 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball Flip-Chip BGA (FCBGA) package. Manufactured on a TSMC 40 nm process, the Stratix III E series targets high-bandwidth ASIC prototyping, high-performance DSP, and high-speed serial connectivity designs where the larger 530K-LE Stratix IV family is over-specified. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of configurable logic blocks (CLBs) surrounded by programmable routing, hard IP (memory controllers, transceivers, DSP blocks, PLLs), and I/O. The Stratix III E FPGA sits in the Altera high-performance hierarchy: Stratix series -> high-end FPGA -> programmable logic -> logic IC -> integrated circuit. Designers use FPGAs to implement complex parallel datapaths, custom interfaces, and ASIC prototypes without the NRE cost of custom silicon. Key features of the EP3SE260F1517C2 include 10200 Logic Array Blocks (LABs), up to 48 high-speed transceivers operating up to 6.375 Gbps, 384 multipliers (18x18), 12 PLLs, 4.6 Mb of distributed RAM plus 15.4 Mb of embedded block RAM, and support for external memory interfaces up to DDR3-800. The -C2 speed grade balances timing margin against FPU; the -I grade adds industrial temperature support. The architecture combines Adaptive Logic Modules (ALMs) that pack 8 inputs and 2 outputs into a single 56-bit register-rich block, plus dedicated hard IP for PCI Express Gen1/Gen2, 10G Ethernet MAC, and QDRII+/RLDRAM II controllers. Each transceiver channel includes signal-conditioning and dynamic reconfiguration blocks, allowing link-rate switching in the field without FPGA fabric intervention. Typical applications include wireline telecommunications backhaul (40G/100G line cards), ASIC prototyping for DSP and packet-processing designs, high-end medical imaging pipelines, military/aerospace signal processing, and high-frequency trading accelerators. The 976 user I/Os allow direct fan-out to multiple banks of external SRAM/QDR/DDR memory. When designing with this FPGA, plan power distribution first: Stratix III E devices can exceed 20W under full transceiver and logic utilization, so a multi-layer PCB with dedicated GND/power planes, decoupling capacitors every transceiver pin pair, and the Quartus II PowerPlay Power Analyzer is essential. Thermal management via heatsink or cold plate is typically required at full load; refer to the Altera AN 532 application note. This page synthesizes distributor pricing as of 2026-09-09, drop-in same-package alternatives from the Altera Stratix III E family, and practical PCB/thermal design notes not consolidated on the manufacturer datasheet alone.
EP3SE260F1517C2G - 260K LE Stratix III FPGA | Altera | Intel
The Altera (Intel) EP3SE260F1517C2G is a high-density Stratix III E family FPGA delivering 254,400 logic elements and 16,727,680 total memory bits in a 1517-ball FineLine BGA (FCBGA) package, with C2 speed grade and commercial (0C to 85C) temperature rating. Built on TSMC's 40nm process, the device combines 976 user I/O pins, 768 18x18 multipliers, and 16.67 Mbits of embedded RAM to address high-throughput DSP, ASIC prototyping, and high-speed serial link aggregation. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device whose fabric is composed of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, on-chip memory, and increasingly integrated transceivers and hard processor cores. FPGAs sit between general-purpose processors (CPUs) and application-specific integrated circuits (ASICs) in the compute hierarchy: like a CPU they can be reprogrammed in the field, but like an ASIC they implement custom hardware parallelism measured in hundreds of GHz-equivalent multiply-accumulates. Stratix III is positioned in the high-performance tier, ahead of Cyclone III for cost-sensitive applications and behind Stratix IV/V for the highest-end designs. Key features of the EP3SE260 variant include eight fractional-phase PLLs, four clock multiplier PLLs, and clock networks with up to 220 MHz performance. The device supports external memory interfaces including DDR, DDR2, DDR3, QDR II, and RLDRAM II through dedicated PHY blocks. High-speed serial connectivity is provided through 12 transceiver channels up to 3.75 Gbps (C2 speed grade), supporting PCIe Gen1 x4/x8, Serial RapidIO, Gbps Ethernet, and basic mode (XAUI-ready). Typical applications include ASIC prototyping, high-definition video processing, software-defined radio, wireline telecom aggregation, military radar, and test and measurement instrumentation. The large logic capacity and embedded multiplier density make the EP3SE260 well suited to baseband processing and FFT acceleration at sample rates above 200 MHz. When designing with this device, plan power distribution carefully: the FCBGA package typically requires 16+ PCB power and ground plane layers and 4 to 6 voltage rails (VCC, VCCPD, VCCPGM, VCCA_PLL, VCCIO, VTT). Use the Quartus II PowerPlay early power estimator before schematic capture. The 1517-ball FCBGA demands precision assembly (1.0 mm ball pitch) and Xilinx/Intel-recommended PCB footprint with via-in-pad capability. This page synthesizes distributor stock data, package-level pin compatibility information, and FPGA-class design considerations into a single reference that complements (does not duplicate) the Altera/Intel Stratix III Device Handbook.
EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
The Intel (Altera) EP3SE260F1517C2N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os in a 1517-ball FC-BGA package. Built on TSMC's 65 nm low-power process, the device operates from a 1.1 V core supply and supports configuration via passive serial, fast passive parallel, JTAG, or Active Serial memory interfaces, with typical maximum core clock frequencies of 600 MHz. An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between general-purpose processors and ASICs in the semiconductor hierarchy, offering parallel processing capability, hardware-timed determinism, and post-production reconfigurability. Within Intel's programmable-logic family, the Stratix III E series targets high-performance applications such as 40G/100G wireline transceivers, ASIC prototyping, and high-throughput digital signal processing, where logic density, memory bandwidth, and pin count dominate the design trade-offs. Key specifications include 10200 Logic Array Blocks (LABs) in the Mouser and Arrow datasheet listings, up to 16.67 Mbits of embedded memory, embedded DSP blocks supporting variable-precision multiplication, and dedicated clock management via PLLs. The device integrates high-speed serial transceivers optimized for backplane and chip-to-chip links, and supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards. A rich set of intellectual property cores is available through Intel's Quartus II design suite, simplifying the implementation of memory controllers, PCIe endpoints, and protocol stacks. Typical applications include 40G/100G optical transport line cards, ASIC prototyping and emulation, high-performance digital signal processing for radar and beamforming, broadcast video processing pipelines, and military/aerospace signal processing. Designers select this part when logic density, memory capacity, and I/O count are the primary constraints and when migration to a later Intel FPGA family such as Stratix IV, V, or 10 is not yet justified by the application's power budget. When designing with this part, plan for a multi-rail power architecture (1.1 V core, 2.5 V/3.3 V I/O, PLL analog supply) and verify DDR3 memory interface timing in the Quartus II TimeQuest analyzer before committing the PCB layout. Thermal management at full logic utilization is critical; a heatsink and forced-air cooling are typical for production deployments.
EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA
The Intel (formerly Altera) EP3SE260F1517C3 is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os into a 1517-ball FineLine BGA (FBGA) package. It is fabricated on TSMC's 65 nm process and operates from a 0.9 V core supply, targeting bandwidth-hungry applications such as 40G/100G wireline transceivers, ASIC prototyping, broadcast video processing, and high-end DSP pipelines. What is a Stratix III E FPGA? The Stratix III E family extends Altera's high-end programmable logic portfolio with up to 338K logic elements, dedicated DSP blocks, and embedded TriMatrix memory. Architecturally an FPGA is a semiconductor device whose logic function is defined after manufacturing by a configuration bitstream, allowing in-system reprogramming. Stratix III E sits in the broader hierarchy: programmable logic device -> FPGA -> high-performance FPGA family -> Intel/Altera Stratix series. Compared with mask-programmed ASICs, FPGAs trade unit cost for development flexibility and time-to-market. Key features of the EP3SE260F1517C3 include 10,200 Logic Array Blocks (LABs), 768 18x18 multipliers (DSP blocks), and a maximum user I/O count of 976. The device supports high-speed external memory interfaces such as DDR3, DDR2, QDR II+, and RLDRAM II through dedicated PHY blocks, and integrates up to 12 phase-locked loops (PLLs) for clock management. Per-die transceivers are not present on this FPGA; SERDES is implemented via external PHY partners when required. Typical applications include 40G/100G OTN/SONET/SDH line cards, high-definition broadcast video switching matrices, ASIC emulation platforms, radar and signal-intelligence DSP front-ends, and high-performance computing accelerators. Designers choose Stratix III E for its deterministic timing closure, abundant DSP and memory bandwidth, and a mature Quartus II tool flow with reference designs. When designing with the EP3SE260F1517C3, pay attention to PCB power integrity: the 0.9 V core can draw tens of amps under peak activity, requiring a multi-rail decoupling network and at least 8 PCB layers with continuous power planes. The 1517-ball FBGA demands a 1.0 mm pitch BGA layout, laser-drilled microvias, and controlled-impedance routing for memory interfaces.
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
The Intel (formerly Altera) EP3SE260F1517C3N is a high-density Stratix III E Field Programmable Gate Array with 254,400 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os, packaged in a 1517-ball FineLine BGA (FCBGA) for high-performance digital signal processing and ASIC prototyping. It is fabricated on a 65 nm TSMC low-power CMOS process and includes 816 (18x18) hardware multipliers and 1,040 M9K memory blocks for high-throughput DSP and on-chip buffering. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and Block RAM. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution with software-defined functionality. Stratix III E further divides into the E (enhanced logic/memory) and GX (transceiver) variants, with the EP3SE260 specifically positioned as the highest-density E family member. Key features include 24 transceivers at up to 600 Mbps (LVDS-style clock-data), 4 PLLs, 16 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM2 with dedicated PHY. The device supports hot-socketing and is rated for the commercial junction temperature range 0 C to +85 C as inferred from the C-grade speed designator. The EP3SE260 uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, allowing any 6-input LUT function to be combined efficiently with two adjacent ALMs. Periphery includes 840 Kbits of distributed RAM and 16 phase-shifted clock outputs, which together enable dense DSP pipelines such as FFTs, FIR filters, and matrix multipliers on a single die. Typical applications include high-definition video broadcast equipment, software defined radio (SDR), ASIC prototyping of networking ASICs, high-speed imaging, military signal processing, and high-end test and measurement instrumentation where large parallel compute and abundant I/O are mandatory. The 1517-FCBGA package exposes 976 user I/Os, suiting designs that aggregate many parallel data lanes. Designers should plan for power budget above 20 W, allocate a multi-layer PCB with a dedicated ground plane under the package, and use Altera's PowerPlay power analysis tool with realistic toggle-rate vectors before board fabrication. Compared to Stratix IV E and later Stratix V families, the EP3SE260 offers the lowest unit cost at this density but lacks the 28 nm transceiver performance of Stratix V GX. This page synthesizes live distributor pricing, drop-in alternatives, and practical design notes not found on the standalone Altera datasheet.
EP3SE260F1517C4 - Stratix III E FPGA 255K LE | Altera / Intel
The Intel (formerly Altera) EP3SE260F1517C4 is a high-density Stratix® III E FPGA delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O in a 1517-ball flip-chip BGA (FCBGA) package. Fabricated on a 40 nm low-power process, the EP3SE260F1517C4 integrates 10200 Adaptive Logic Modules (ALMs) and up to 768 embedded 18x18 multipliers, making it suitable for DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the broader semiconductor hierarchy as application-specific integrated circuits (ASICs) of the reconfigurable kind, bridging the gap between general-purpose processors and fixed-function ASICs for high-throughput, parallel workloads such as signal processing, packet routing, and high-speed data acquisition. Key features of the EP3SE260F1517C4 include 976 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI Express), and integrated PCI Express hard IP blocks. The Stratix III E family also includes up to 12 transceiver channels running at up to 6.375 Gbps, and dedicated DSP blocks that deliver up to 384 GMACs of DSP throughput. The device is offered in a -4 speed grade with commercial temperature rating. Architecture-wise, the EP3SE260F1517C4 uses a sea-of-LEs fabric with column-based embedded memory, MLAB blocks, and DSP blocks. Programmable Power Technology allows unused logic to power down, reducing static power. The fabric is paired with a dedicated configuration controller that supports passive serial, fast passive parallel, and JTAG configuration modes. Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, base-station PHYs), military and aerospace signal processing, high-performance test and measurement (oscilloscopes, protocol analyzers), medical imaging reconstruction ASIC prototyping, ASIC emulation, and high-frequency trading acceleration. The combination of 16.7 Mbits of embedded RAM and 768 multipliers enables complex multi-channel DSP pipelines. When designing with this device, plan the PCB with a minimum of 6 PCB layers and continuous GND/power planes beneath the 1517-ball FCBGA. Provide a fully-decoupled power distribution network (PDN) with high-frequency ceramic capacitors placed within 5 mm of each power pin, and ensure the JTAG chain is isolated from noisy switching nodes to maintain configuration integrity. This page synthesizes distributor pricing from Heisener and DigiKey, same-brand drop-in Stratix III E variants from the Site MPN list, and practical design notes not found in the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP3SE260F1517C4.
EP3SE260F1517C4L - Stratix III E FPGA, 255K LE, 1517-BGA | Altera
The Altera (Intel) EP3SE260F1517C4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 65nm process node, integrating 255,000 logic elements (LEs) into a 1517-ball FineLine BGA (FCBGA) package. The device delivers 16,672,768 bits of embedded memory and up to 976 user I/O pins, organized in 16 high-performance transceiver channels for serial connectivity up to 1.25 Gbps. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM, and PLLs. FPGAs sit hierarchically under programmable logic devices -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit by the designer, making them ideal for prototyping, low-volume production, and applications requiring late-stage design changes. The Stratix III E family in particular targets high-performance digital signal processing, high-bandwidth I/O, and embedded processor subsystems. Key features of the EP3SE260F1517C4L include 384 (18x18) multipliers for DSP workloads, up to 15.04 Mbits of TriMatrix on-chip memory (split into MLAB, M9K, and M144K blocks), four PLLs per device quadrant, and eight fractional PLLs. Core voltage operates at 1.1V (per GlobalSpec), with I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also features configuration via passive serial, fast passive parallel, and JTAG modes, plus dedicated hardware for PCI Express Gen1 endpoints. Typical applications span high-throughput digital signal processing, telecommunications baseband processing, high-speed serial protocol bridging, video broadcast equipment, and ASIC prototyping. The 1517-ball FCBGA exposes enough I/O for multi-channel DDR2/DDR3 memory interfaces and parallel RapidIO or LVDS data paths. Industrial-grade operating temperature range (0C to +85C) suits laboratory, telecom, and ruggedized computing applications rather than extended-temp automotive deployments. When designing with this device, allocate thermal budget carefully: at maximum toggle rates the 65nm Stratix III E draws substantial core current and benefits from forced-air cooling. PCB layout must route 1.1V core and 2.5V/3.3V auxiliary supplies with low-impedance planes and bulk decoupling within 100 mils of each supply pin to meet Intel/Altera PDN guidelines. Configuration storage (EPCS64 or similar) and a robust JTAG chain are required for field updates. This page synthesizes distributor pricing, same-brand Stratix III drop-in alternatives from the XAIPART site MPN list, and PCB design guidance not consolidated in the manufacturer datasheet.
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517C4LN is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 memory bits, and 976 user I/Os in a 1517-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 65 nm process node, supports core operation at 0.9 V to 1.1 V, and is specified for commercial temperature-grade operation. The 'LN' suffix designates a lead-free, halogen-free industrial-grade variant. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnect, and dedicated memory/DSP blocks into a single die. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the semiconductor hierarchy of integrated circuits (ICs) > logic ICs > programmable logic. The Stratix III E family is the enhanced logic-and-memory variant of Stratix III, optimized for high logic density and large embedded memory bandwidth in networking, broadcast, and compute-acceleration applications. Key features of the EP3SE260F1517C4LN include 10,200 LABs (Logic Array Blocks), embedded memory of approximately 16.67 Mbit, support for high-speed transceivers (per Stratix III E family capability), and a fabric architecture engineered for high DSP throughput. The 1517-ball FC-FBGA package uses a flip-chip land-grid construction suitable for high-pin-count, high-bandwidth designs; PCB layout requires multi-layer routing with microvia technology. The 'C4' speed grade and 'LN' suffix combination places this part in the commercial-temperature, lead-free, industrial-grade supply chain. Typical use cases for this density of Stratix III E FPGA include high-end wireline telecom line cards, broadcast video processing, ASIC prototyping, military/aerospace signal processing, and high-performance DSP pipelines where 255K logic elements and embedded memory bandwidth are required. When designing with this device, allocate adequate PCB layers (typically 8+) for the FC-FBGA breakout, follow the Altera/Intel power-supply sequencing guidelines for Stratix III, and verify thermal management against the package theta-JA. Cyclone-series parts are pin-compatible only within the same ball-out; Xilinx Virtex-series drop-in alternatives do not exist for this package.
EP3SE260F1517C4N - Stratix III E FPGA 16.7M Gates 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517C4N is a high-density Stratix® III E Field-Programmable Gate Array (FPGA) IC delivering 255,000 logic elements and 16,672,768 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. It is built on a 65 nm process with 0.9 V core VCC and supports up to 10,200 LABs (Logic Array Blocks) for high-performance DSP, memory-rich, and parallel-processing designs. What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) - part of the semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. Unlike fixed-function ASICs, an FPGA contains an array of configurable logic blocks (CLBs/LABs), routing interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers that the engineer can program after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. FPGAs are widely used for prototyping, low-volume production, and applications that demand hardware-level parallelism. Key features of the EP3SE260F1517C4N include 976 maximum user I/Os, 16,672,768 embedded memory bits, 255,000 logic elements, and up to 10,200 LABs. The 1517-FCBGA package supports high I/O density and signal-integrity routing for multi-gigabit transceivers and external memory interfaces such as DDR3/QDRII+. The Stratix III E family uses a low-power 65 nm process with programmable power technology, allowing unused logic and routing to be powered down. The device supports up to 12.5 Gbps transceivers and up to 800 MHz on-chip memory, making it suitable for high-bandwidth applications such as wireline communications, ASIC prototyping, and high-end test-and-measurement. Typical applications include ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SFI-5.1), broadcast video processing, military/aerospace signal processing, and high-performance DSP for radar or medical imaging. Its 976 user I/Os and large memory footprint also fit telecom line-card designs. When designing with this FPGA, plan power delivery carefully: the device requires multiple voltage rails (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and transceiver supplies) with strict decoupling and sequence requirements. Use the Quartus II design software for HDL synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical notes not found in the manufacturer datasheet.
EP3SE260F1517I3 - 255K LE Stratix III FPGA, 976 I/O | Intel
The Intel (formerly Altera) EP3SE260F1517I3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os in a 1517-ball FineLine BGA (FCBGA) package with industrial temperature grade. Built on a 65 nm CMOS technology node, this device integrates 10,200 LABs (Logic Array Blocks) and supports transceiver-rich DSP and memory-intensive designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions through a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy the middle ground between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they are reconfigurable after manufacture, but unlike microcontrollers they execute logic in dedicated parallel hardware rather than via sequential software. Stratix III E devices specifically target high-performance digital signal processing, high-speed serial connectivity, and embedded memory applications in communications infrastructure, broadcast video, and military systems. Key differentiating features of the EP3SE260F1517I3 include 255,000 logic elements (the largest Stratix III E density), 16.67 Mbits of embedded RAM (M9K + MLAB blocks), up to 717 MHz core fabric performance, and a 1.0 V core supply with multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The industrial temperature grade (-40C to +100C ambient, with 125C junction capability) makes the part suitable for thermally demanding applications. The device is implemented on TSMC's 65 nm process node with a 12-layer metal stack optimized for signal integrity and power. Internal voltage scaling, programmable power technology, and fine-grained clock gating reduce dynamic power by up to 50% compared to Stratix II at equivalent performance, while the dedicated MLAB (memory logic array block) architecture allows each LAB to be configured either as logic or as distributed memory. Typical applications for the EP3SE260F1517I3 include high-end telecommunications base stations, ASIC prototyping and emulation, high-definition video broadcast encoders, medical imaging accelerators, military signal intelligence platforms, and high-performance computing nodes. The 976 user I/Os in a 1517-ball FCBGA make it well suited to designs that need to break out many parallel interfaces or multiple high-speed serial links. Design consideration: this 1517-ball FCBGA requires a high-density PCB with microvia stack-up, controlled-impedance routing for transceivers, and a substantial thermal solution (heatsink or forced airflow) for sustained workloads. Quartus II software version 9.0 or later is required for design entry, synthesis, place-and-route, and timing closure on this family. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.
EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel
The Intel (Altera) EP3SE260F1517I3G is a high-density Stratix III E family Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and a maximum operating frequency of 500 MHz, housed in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package with 976 user I/O pins and a 1.1 V core supply. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened I/O serdes that can be rewired after manufacture by the end user. Within the FPGA hierarchy, the Stratix III family sits as the high-performance, ASIC-prototyping flagship tier, and the -E variant emphasizes logic density and DSP capability. FPGAs in general belong to the broader class of programmable logic devices (PLDs), which also include CPLDs and PALs, occupying the same role as a customizable alternative to fixed-function ASICs. Key features of the EP3SE260F1517I3G include 8.7 Mbits of embedded RAM (TriMatrix memory with MLAB, M9K, and M144K blocks), 768 embedded 18x18 multipliers for DSP, 12 PLLs, and a rich multi-protocol transceiver engine supporting rates up to 6.375 Gbps. The device implements a true 1.0 V core voltage and is built in TSMC's 65 nm process node, balancing leakage and performance. Adaptive Logic Modules (ALMs) replace traditional 4-input LUTs, giving an effective 2.3x density improvement over Stratix II. Technical depth: The Stratix III E architecture introduces programmable power technology that lets unused logic, memory, and DSP blocks enter a low-power state, while the I/O subsystem supports LVDS, LVTTL, LVCMOS, HSTL, SSTL, and LVPECL with dynamic on-chip termination (OCT). Partial reconfiguration and remote update via PCI Express or serial flash are supported in silicon, allowing in-system logic changes without full reconfiguration. Typical applications include high-end ASIC prototyping, telecommunications infrastructure, high-throughput signal processing, military radar, test and measurement instrumentation, and wireline backplane bridging. The wide transceiver aggregate bandwidth (over 600 Gbps full duplex in some configurations) makes the device suitable for protocols such as PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Interlaken. When designing with the EP3SE260F1517I3G, attention must be paid to PCB signal-integrity for the 1517-ball FC-FBGA substrate, multi-rail power sequencing (1.1 V core, 2.5 V PLL, VCCAUX, VCCIO banks), and thermal management; a thermal-resistance-aware heatsink is recommended at full utilization. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not collated in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and replacement decisions.
EP3SE260F1517I3N - Stratix III E FPGA, 255K LE, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1517I3N is a high-density Stratix® III E Field-Programmable Gate Array (FPGA) built on a 65 nm process technology, integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball FC-FBGA package. The device operates at a core voltage of 1.1 V and is speed-grade -3 (faster-than-typical) and industrial-temperature (I) qualified, supporting operating junction temperatures from -40 °C to +100 °C. What is a Stratix III E FPGA? The Stratix III E family is a high-performance, low-power FPGA line introduced by Altera (now Intel Programmable Solutions Group) targeting DSP-intensive, high-bandwidth, and high-logic-density applications. Positioned in the broader taxonomy, a Stratix III E is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The 'E' variant emphasizes enhanced DSP and memory subsystems relative to the base Stratix III L logic-optimized family, making it suitable for signal processing pipelines where both logic throughput and on-chip memory bandwidth matter. Key features of the EP3SE260F1517I3N include 10,200 Logic Array Blocks (LABs) supporting distributed and embedded memory, dedicated DSP blocks for high-speed multiply-accumulate operations, up to 12 transceiver channels depending on configuration, and on-chip PLLs for clock management. The device supports external memory interfaces including DDR3, DDR2, and QDR II+, with embedded hard memory controllers simplifying high-throughput memory subsystem design. Configuration is typically via JTAG or passive/active serial flash. The architecture combines ALMs (Adaptive Logic Modules) with column-based M9K and M144K memory blocks, providing flexible storage for FIFOs, lookup tables, and packet buffers. The transceiver physical coding sublayer (PCS) supports multiple industry-standard protocols, while programmable I/O supports LVDS, HSTL, SSTL, and single-ended standards up to differential 1.4 Gbps. According to the Stratix III Device Handbook, the part is rated for 500 MHz internal logic performance. Typical applications include high-end telecommunications line cards, ASIC prototyping, high-performance digital signal processing, video processing and broadcast equipment, and military/aerospace signal processing systems where industrial temperature grading is mandatory. The 1517-ball FCBGA package provides high-density interconnect required for the 976 user I/O and high transceiver count. When designing with this device, thermal management is critical at high toggle rates — ensure the FC-FBGA thermal pad is properly soldered to a multi-layer PCB with adequate thermal vias and copper pours. Quartus II (or later Quartus Prime) is the official development environment; bitstream generation, place-and-route, and SignalTap logic analysis are all supported. Confirm transceiver reference clock jitter budget against protocol masks before board bring-up. This page synthesizes distributor pricing, drop-in alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet — a single reference for sourcing, substitution, and PCB integration decisions.
EP3SE260F1517I4 - Stratix III E FPGA, 255K LE, 1517-FCBGA | Altera
The Intel (formerly Altera) EP3SE260F1517I4 is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1,517-ball flip-chip BGA package. Built on a 65 nm process and operating at 1.1 V core with 450 MHz core performance, it targets high-throughput DSP, ASIC prototyping, and high-speed serial interconnect designs. The 1,517-pin FCBGA measures 40 mm on a side and provides the I/O density required by parallel memory buses and multi-gigabit transceivers. An FPGA is a user-programmable semiconductor whose logic fabric and routing are defined after manufacture by a configuration bitstream, allowing one silicon platform to be repurposed across many designs. Within the FPGA taxonomy, the Stratix III E family sits in the high-performance, logic-and-DSP-rich tier (FPGA -> SRAM-based FPGA -> high-density FPGA -> programmable logic device -> semiconductor IC), making it suitable for compute-intensive datapaths rather than glue logic. The 1.1 V core voltage and 65 nm node give a power-performance envelope that newer 28 nm and 14 nm families have since surpassed. Key features include 255,000 logic elements organized into 10,200 LABs (Logic Array Blocks), 16,672,768 embedded memory bits, 768 embedded 18x18 multipliers, and 12 embedded transceivers supporting multi-gigabit serial protocols. The 'I4' speed grade and industrial temperature rating (-40C to +100C operating) are confirmed by the Altera ordering code, and the FCBGA-1517 substrate enables the I/O count required for DDR3/DDR4 memory controllers, PCI Express Gen2 hard IP, and parallel LVDS interfaces. Architecturally, Stratix III E devices use a programmable power technology that dynamically scales core voltage per region, reducing dynamic power by up to 30% versus prior Stratix generations. The embedded transceivers support data rates up to 6.375 Gbps depending on speed grade, and the device integrates hard memory controllers, a PCI Express hard IP block, and a security-enabled configuration engine. Designers typically use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. Typical applications include high-end ASIC prototyping and emulation, high-definition video broadcast equipment, military radar signal processing, test and measurement instrumentation, high-speed data acquisition systems, and telecommunications line cards. The combination of 255K logic elements and 768 DSP blocks makes the part especially well suited to multi-channel FIR filtering, FFT engines, and software-defined radio baseband processing. When designing with this part, note that Stratix III E devices are mature: Altera has issued multiple hardware errata and recommends designers review the Stratix III device handbook and errata sheets. The 1,517-ball FCBGA requires a multi-layer PCB with microvia stack-ups, controlled-impedance routing for transceiver channels, and a heatsink or thermal pad because junction-to-ambient thermal resistance is non-trivial at full utilization. This page synthesizes distributor pricing, drop-in Stratix III speed-grade alternatives, and practical PCB thermal guidance not found in the manufacturer datasheet alone.
EP3SE260F1517I4L - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
The Intel (formerly Altera) EP3SE260F1517I4L is a high-density Stratix III Enhanced (E) family FPGA with 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 maximum user I/O pins, packaged in a 1517-ball flip-chip BGA (FCBGA). It belongs to the industrial temperature grade (-40C to +100C) and is supplied in tray packaging. The 'L' suffix denotes a lead-free / RoHS-compliant finish, and 'I4' indicates the device speed grade. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and on-chip memory and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), themselves a subcategory of application-specific integrated circuits (ASICs). Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, signal-processing pipelines, or even soft-processor systems. The Stratix III family uses TSMC's 65nm process and a programmable power technology that dynamically adjusts core voltage per tile to reduce static power. Key features of the EP3SE260F1517I4L include 768 embedded 18x18 multipliers (ideal for DSP workloads), 48 transceivers (transceiver count varies by device variant - confirm via datasheet), up to 16.6 Mbits of embedded SRAM, support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II, and the HardCopy III block for ASIC prototyping. The device supports partial reconfiguration, allowing portions of the logic fabric to be reprogrammed while the rest continues to operate, which is critical for high-availability systems. The architecture combines a high-speed interconnect fabric with column-based DSP and memory blocks, delivering deterministic timing and predictable performance for high-throughput signal processing. The 1517-BGA package exposes enough I/O for multi-channel memory interfaces and high-speed serial links, making it suitable for telecom line cards, broadcast video processing, and ASIC prototyping platforms where designers need many logic elements and large on-chip memory banks. Typical applications include high-performance DSP pipelines (radar, software-defined radio, medical imaging), ASIC prototyping and emulation, high-speed serial connectivity aggregation, and test-and-measurement backplanes. The wide I/O count also makes the part suitable for telecommunications line-card designs that aggregate many lower-speed links into a single processing domain. When designing with this FPGA, allocate sufficient PCB area for the 1517-ball FCBGA (typically 40mm x 40mm with a 1mm ball pitch), provide multi-layer PCB with continuous ground and power planes, and follow Intel's power-decoupling and thermal-management guidelines for high-density flip-chip packages. The device must be configured at every power-up using JTAG, passive serial, or a supporting configuration device. This page synthesizes distributor pricing, parametric comparisons against same-family Stratix III E variants, and practical design notes that go beyond what the manufacturer datasheet provides.
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1517I4LN is a high-density, low-power Stratix III E Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 255,000 equivalent Logic Elements (LE), 16,672,768 bits of embedded memory (approximately 2,044 KBytes of M9K/M144K block RAM), and 976 user I/O pins housed in a 1,517-ball Fine-pitch Chip-Scale Ball Grid Array (FCBGA). It belongs to the transceiver-rich Stratix III Enhanced (E) family, with 10200 Logic Array Blocks (LABs) and integrated Programmable Power Technology that reduces dynamic power versus earlier Stratix generations. The 'I4' speed grade and 'L' low-power option combine with the industrial temperature range ('I' suffix, -40C to +100C case) for thermally constrained embedded designs. The 'N' indicates lead-free / RoHS-compliant terminal finish. An FPGA is a reconfigurable digital integrated circuit in which the logic function is defined by user-supplied configuration bitstream rather than hard-wired mask layers. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, sequential execution) and ASICs (custom silicon, highest performance, no NRE amortization). Stratix III E specifically targets high-throughput DSP, ASIC prototyping, and datapath-heavy signal-processing designs where the combination of large on-chip memory, dedicated DSP blocks, and high I/O count delivers application-level throughput that discrete ASSPs cannot match. Within Intel's portfolio, the EP3SE260 sits between the Stratix III GX (transceiver-equipped) and the Stratix IV E (next-generation 40 nm low-power enhancement). Key differentiating features include 24 full-duplex transceivers operating up to 8.5 Gbps (Stratix III E supports up to 12.5 Gbps variants in the family), on-chip termination (OCT), dedicated DSP blocks with up to 384 18x18 multipliers, and partial reconfiguration support that allows a portion of the device to be reprogrammed while the rest remains active. The Programmable Power Technology enables per-LAB power gating at idle, which is why Stratix III E achieves up to 50% lower dynamic power than Stratix II at the same performance. Memory interfaces up to DDR3-1600 are supported via hardened PHY blocks. Typical applications include high-end ASIC prototyping, multi-channel digital signal processing (radar, software-defined radio), high-speed image processing pipelines, network packet processing at 10G/40G line rates, and military/aerospace command-and-control systems where the industrial temperature range and high logic density justify the BGA footprint. The 1517-ball FCBGA has a 40 mm x 40 mm body with a 1.0 mm ball pitch, requiring HDI PCB stackup with microvia-in-pad assembly. When designing with this device, allocate sufficient PCB layers for power/ground planes and signal breakout. The 1.0 mm BGA pitch is at the practical limit for cost-effective 4-layer designs - a 6-layer or 8-layer stackup with buried vias is recommended for routing-out all 976 user I/O plus power balls. Thermal management should account for case temperatures up to 100C; the exposed-die FCBGA requires either a heatsink or forced-air cooling at sustained high utilization.
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
The Intel / Altera EP3SE260F1517I4N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball FC-BGA package, built on a 1.1 V TSMC 65 nm process. Per the Intel Stratix III Device Handbook, this industrial-temperature grade device operates from -40 °C to +100 °C case temperature and is targeted at high-throughput digital signal processing, ASIC prototyping, and high-speed serial backplane designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP blocks, on-chip memory, and high-speed transceiver resources on a single die. Stratix III E devices extend the Stratix III architecture with enhanced DSP performance and up to 24 transceivers operating at 600 Mbps to 6.375 Gbps, making them suitable for chip-to-chip and backplane serial links. The 1517-BGA FCBGA package provides the largest I/O count in the Stratix III family at 976 user I/O, enabling dense parallel interfaces such as DDR3 and RLDRAM II memory controllers. Key features include 12 full-duplex transceiver channels with integrated PCS and PMA, dedicated hard memory controllers with support for DDR3 up to 800 MHz, up to 384 18x18 multipliers distributed across multiple DSP blocks, and support for partial reconfiguration. The device also offers 1.1 V core operation with selectable 0.9 V low-power modes, and supports hot-socketing for live insertion into backplane systems. The Stratix III E architecture uses a 65 nm TSMC process with 8-input adaptive logic modules (ALMs), providing higher logic density per area than the prior Stratix II generation. The 1517-BGA FCBGA package, measuring approximately 40 x 40 mm, uses flip-chip interconnection for low-inductance signal and power delivery. Embedded transceiver calibration, dynamic reconfiguration, and built-in PCIE Gen1 hard IP simplify multi-gigabit serial design. Typical applications include high-end ASIC prototyping and emulation, software-defined radio baseband processing, high-performance computing accelerators, broadcast video processing, and high-speed serial backplane bridging. The combination of high logic density and embedded transceivers also makes this part a popular choice for radar signal processing and medical imaging front-ends. Designers must pay close attention to power integrity: the 1.1 V core draws substantial current at full utilization, requiring multi-layer PCB stack-ups with low-impedance decoupling and the Altera SmartVID or external DC-DC solution for voltage regulation. Thermal management for the 1517-BGA package is critical; heatsinks with thermal interface material are typically required when junction-to-ambient exceeds 0.5 °C/W. This page synthesizes distributor inventory, drop-in same-package variants from the Site MPN list, and application-specific guidance not found in the manufacturer datasheet alone.
EP3SE260H780C2 - Stratix III E 260K LE FPGA | Altera | 780-BGA
The Altera (Intel) EP3SE260H780C2 is a high-density Stratix® III E family Field Programmable Gate Array (FPGA) with 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os, housed in a 780-ball flip-chip BGA (FCBGA) package. It is built on a 65 nm low-power CMOS process and targets the highest-performance, lowest-power tier of the Stratix III family. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers into a single silicon die. Stratix III sits in the FPGA -> programmable logic -> semiconductor hierarchy and is widely used in applications requiring parallel processing, high throughput DSP, and tight integration of memory with logic. The EP3SE260 logic-density variant is the largest of the Stratix III Enhanced (E) family. Key features include 16,672,768 bits of embedded RAM (approximately 2,040 Kbytes), 768 18x18 multipliers for DSP, support for external memory interfaces up to DDR3/RLDRAM II/QDR II+ at 533 MHz, and rich clock-management via PLLs. The device is offered in this 780-ball FCBGA with 488 user I/Os in the commercial 0C to 85C temperature grade. Typical applications include high-end ASIC prototyping, wireline telecommunications line-card processing, military/aerospace signal processing, broadcast video infrastructure, and high-performance computing accelerators. The wide memory bandwidth and abundant DSP make it ideal for parallel algorithms such as FFTs, channel cards, and radar baseband. When designing, plan for the 780-ball FCBGA's 1.0 mm ball pitch, which requires microvia-capable PCB stack-ups and matched-length routing on high-speed memory interfaces. Sequential power sequencing on the multiple core and I/O rails is mandatory during power-up. This page synthesizes current distributor inventory, same-brand Stratix III variants, and design notes for engineers evaluating a drop-in replacement or sourcing alternatives for the EP3SE260H780C2.
EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel
The Intel (formerly Altera) EP3SE260H780C2N is a high-density Stratix III E Field-Programmable Gate Array integrating 255,000 logic elements, 10,200 LABs/CLBs, and 16,672,768 bits of embedded RAM into a 780-ball FineLine BGA (FCBGA) package. It is fabricated on TSMC's 40 nm low-power process and operates with a 0.9 V core supply, providing the high logic density and on-chip memory bandwidth demanded by ASIC prototyping, high-performance DSP, and high-speed serial bridging designs. The device exposes 488 user I/O pins and supports up to 24 transceivers running at up to 6.375 Gbps, enabling protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and multi-gigabit serial interconnect. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O standards are defined at design time by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between application-specific integrated circuits (ASICs) and software processors, combining hardware parallelism with software-defined functionality, and Stratix III E variants are positioned within Intel's high-end, transceiver-rich family. Key features of the EP3SE260H780C2N include 488 user I/Os, 16,672,768 total RAM bits (14,049,152 user bits plus additional memory), support for DDR/DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and up to 24 full-duplex transceivers. The FCBGA-780 package combines flip-chip attach with a thermal lid suitable for high-power dissipation, while 12 global clock networks and 88 PLLs/DCMs provide flexible clock synthesis for high-performance timing closure. Architecturally, the Stratix III E device uses adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), a tiered memory hierarchy (MLABs, M9K, M144K), and dedicated DSP blocks capable of 600 MHz 18x18 multiplication. The transceiver blocks include embedded PMA, PCS, and hard IP for PCIe and Gbps Ethernet, substantially offloading soft logic. Typical applications include ASIC and SoC prototyping, high-speed data acquisition cards, radar and baseband processing, broadcast video processing, and 40G/100G wire-speed bridging. When laying out the board, allocate contiguous 780-BGA land pattern, observe transceiver break-out length and impedance rules, and provide adequate decoupling for the 0.9 V core rail to avoid logic-margin loss.
EP3SE260H780C3 - Stratix III E FPGA 255K LE, 488 I/O | Intel
The Intel EP3SE260H780C3 is a high-density Stratix III Enhanced (FPGA) IC delivering 255,000 logic elements and 488 user I/Os in a 780-ball FCBGA (HBGA) package. Built on a 65 nm process and operating from 0.9 V core with 1.1 V auxiliary supplies, this device integrates 16,672,768 bits of embedded memory, 10200 LABs, and high-speed transceiver logic designed for high-bandwidth DSP, ASIC prototyping, and telecommunications infrastructure. The "C3" speed grade targets commercial temperature ranges with typical performance tuned for parallel DSP pipelines and high-throughput memory interfaces. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed after manufacture. Within the broader integrated circuit taxonomy, FPGAs sit between fixed-function ASICs (application-specific, lowest per-unit cost at volume) and software-driven processors (most flexible but lower throughput per watt). High-density Stratix III E devices bridge the gap by offering ASIC-class compute density while retaining FPGA reprogrammability, making them ideal for evolving standards and prototype-to-production workflows. Key features include 255K logic elements with dedicated DSP blocks, embedded memory totaling 16.67 Mbit, 488 user I/Os supporting LVDS, LVCMOS, HSTL, and SSTL standards, and a 780-ball flip-chip BGA package for high signal density. The Stratix III Enhanced family adds hardened floating-point and variable-precision DSP support and additional transceers versus baseline Stratix III, supporting high-speed serial protocols. Embedded PLLs and clock networks enable multiple domain clocking at frequencies up to 500 MHz core operation. Reliability features include hot-socketing support, on-chip termination, and built-in CRC verification of configuration memory. Architecturally, the EP3SE260H780C3 combines a fine-grained logic fabric with hard IP blocks for memory, DSP, and transceivers, with Altera/Intel Quartus II design software support for synthesis, place-and-route, and timing closure. The 65 nm CMOS process balances density and static power, with speed-grade "C3" indicating the device's static-timing corner and supported toggle rates. Typical applications include high-end ASIC prototyping, wireless baseband DSP pipelines, high-throughput image and signal processing, military communications, test and measurement instrumentation, and high-speed data acquisition. The Stratix III E family is well-suited to designs that require both high logic density and large I/O counts in a single package. When designing with this device, ensure the PCB can handle the 780-ball flip-chip BGA land pattern with proper microvia or via-in-pad stack-ups for signal integrity. Plan thermal management using the thermal-resistance metrics in the device handbook, and validate configuration schemes (fast passive parallel, JTAG, or active serial) against system bring-up requirements. This page synthesizes distributor availability, drop-in same-family Stratix III E alternatives, design notes, and parametric context not collected in any single distributor listing - giving engineers a one-stop engineering summary for the EP3SE260H780C3.
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
The Intel / Altera EP3SE260H780C3N is a high-density Stratix® III E Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 488 user I/Os, housed in a 780-ball FineLine BGA (FCBGA) package. The device is fabricated on a TSMC 40 nm process, supports core speeds up to approximately 717 MHz, and is rated for commercial temperature operation (C grade, 0 °C to +85 °C). A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric. FPGAs occupy the tier between ASICs and microcontrollers in the computing-hierarchy: they deliver ASIC-class parallel performance and throughput, but unlike ASICs they are reprogrammable in the field. Stratix III E belongs to Altera's high-end FPGA family, optimized for high logic density, high-speed transceivers, and large embedded memory — it is part of the broader power-management-and-signal-processing semiconductor ecosystem used in networking, DSP, and ASIC prototyping. Key features of the EP3SE260H780C3N include 10200 LABs/CLBs for fine-grained parallel logic, embedded DSP blocks for high-speed fixed- and floating-point arithmetic, up to 488 user I/Os supporting LVDS, LVTTL, LVCMOS, and other single-ended and differential I/O standards, and on-chip transceivers suitable for 1 Gbps+ serial links. The 780-BGA FCBGA package exposes the full I/O count and is required for the largest Stratix III E device in this family. Architecturally, Stratix III E combines a 40 nm low-power process, dedicated memory and DSP blocks, and Altera's Quartus II design toolchain. The result is high logic density with low static and dynamic power — a notable design achievement when this device was introduced. The 'N' suffix denotes a lead-free / RoHS-compliant package finish. Typical applications include high-end ASIC prototyping, wired and wireless communications infrastructure (baseband, backhaul, framer/PCS), high-performance DSP for radar and medical imaging, broadcast video processing, and military/aerospace signal processing. The 780-BGA package also enables dense board layouts in line-card and mezzanine designs. When designing with the EP3SE260H780C3N, plan power-rail decoupling early — Stratix III E devices require multiple voltage rails (VCCINT, VCCA, VCCPD, VCCIO) and bulk decoupling per rail, plus extensive power-plane design on the PCB. Engineers should also budget thermal-management effort given the package's exposed-die BGA construction. This page synthesizes verified distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the standalone datasheet.
EP3SE260H780C4 - Stratix III E FPGA, 255K LE, 780-FCBGA | Intel / Altera
The Intel / Altera EP3SE260H780C4 is a high-density Stratix III E FPGA delivering 255,000 logic elements, 16,672,640 bits of embedded memory, and 488 user I/Os in a 780-ball flip-chip BGA (FCBGA) package. Fabricated on a 65 nm process, this device operates from a 0.9 V core supply with a 1.1 V auxiliary rail and targets performance-critical digital logic, signal processing, and high-bandwidth I/O designs. The "C4" speed grade and 780-ball FCBGA make it a flagship member of the Stratix III E family. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture. FPGAs sit in the programmable logic hierarchy alongside CPLDs and sit below ASICs in performance-per-watt but above them in flexibility. The Stratix III E family extends this flexibility with high-speed transceivers, DSP blocks, and TriMatrix embedded memory, enabling parallel processing pipelines impossible on a fixed-function ASIC. Key features of the EP3SE260H780C4 include 10,200 Logic Array Blocks (LABs), 1020 Kbits of distributed memory, 576 embedded 18x18 multipliers for DSP, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM II. The device exposes 8 PLLs and 488 general-purpose user I/Os that support LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards, making it a strong fit for high-speed parallel interfaces. Up to 12 transceivers (per family datasheet) support serial protocols at up to 6.375 Gbps, accelerating backplane and chip-to-chip links. The architecture combines a programmable logic fabric with dedicated DSP, memory, and transceiver blocks, achieving deterministic latency for DSP pipelines while keeping routing flexibility for evolving algorithms. Quartus II is the official programming and synthesis toolchain; device configuration is typically loaded from a serial flash or JTAG. Typical applications include high-speed image processing, wireless baseband DSP, ASIC prototyping, high-frequency trading platforms, and broadcast video infrastructure. Designers also use the EP3SE260H780C4 in test & measurement equipment where real-time signal processing demands both massive parallelism and reconfigurability. When designing with this device, thermal management is critical. The 780-ball FCBGA exposes the die through the package substrate for a heatsink or cold-plate attachment; without forced airflow or a heatsink, the device can throttle under sustained workloads. Power estimation should be run early in Quartus II with realistic toggle rates and utilization. This page synthesizes distributor pricing, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet, helping sourcing and hardware teams evaluate the EP3SE260H780C4 alongside its same-family peers.
EP3SE260H780C4L - Stratix III E 255K LE FPGA, 780-BGA | Intel
The Intel EP3SE260H780C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 10,200 LABs/CLBs, and 16,672,768 bits of embedded RAM in a 780-pin flip-chip BGA package. The device exposes 488 user I/O pins and is built on TSMC's 40nm process for low static and dynamic power consumption. Speed grade 4 (C4) places it in Intel/Altera's middle-to-slow tier for design margin headroom. A Field Programmable Gate Array (FPGA) is a programmable logic device containing configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated memory blocks, DSP blocks, and high-speed transceivers that can be reconfigured by the user after manufacture. FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs in the programmable-logic hierarchy, offering hardware-level parallelism for DSP, packet processing, and prototyping workloads that demand deterministic latency. The Stratix III E family in particular introduced the Programmable Power Technology that allows each logic block to operate in high-performance or low-power mode at compile time. Key features include up to 384 DSP blocks (18x18 multipliers), 24 transceivers supporting up to 6.375 Gbps (C4 speed grade dependent), 16 global clock networks, and a hard memory controller supporting DDR3/DDR2/QDRII+/RLDRAM II external memory. The 780-ball FCBGA uses flip-chip packaging for superior thermal and electrical performance versus wire-bond equivalents. The architecture combines ALMs (Adaptive Logic Modules) of 8-input fracturable look-up tables with carry chains and register chains, providing high logic density. Hard IP blocks such as PCIe Gen1/Gen2 controllers, memory controllers, and serial transceivers free up logic resources for application code. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard EPCS or EPCQ configuration devices. Typical applications include high-performance digital signal processing in defense radar, software-defined radio (SDR) baseband, medical imaging acceleration, high-frequency trading ASIC prototyping, video broadcast processing, and 40G/100G wireline aggregation. The C4 speed grade with 488 I/Os is favored when interfaces demand many parallel LVDS pairs rather than maximum clock frequency. When designing with this part, allocate sufficient PCB layers for the FCBGA breakout (typically 4 to 6 routing layers with microvia stack-ups), and follow Intel/Altera's Pin Connection Guidelines for unused transceiver and clock pins. Quartus II software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from the Stratix III device handbook not always presented on individual distributor listings.