FPGA & CPLD
Produtos (6666)
EP3SE110F780C4LN - Stratix III E FPGA, 488 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP3SE110F780C4LN is a high-density Stratix III E Field Programmable Gate Array housed in a 780-ball Fine-pitch BGA (FBGA) package, delivering 488 user I/O pins and 107,500 logic elements backed by 8,936,448 bits of embedded memory. Built on TSMC's 40 nm process, the device targets high-performance digital logic designs requiring large block-RAM and DSP inventories, with 4,300 LABs (Logic Array Blocks) and dedicated 18x18 multipliers for DSP-heavy signal processing. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O cells. Within the broader taxonomy, FPGAs sit under programmable logic devices -> digital ICs -> integrated circuits. The Stratix III E family specifically emphasizes enhanced DSP blocks, high-speed transceivers, and on-chip memory density, making it a mid-generation platform that bridges early Stratix II architectures and the later Stratix IV/Stratix V families. Key features of the EP3SE110F780C4LN include the 780-FBGA footprint (29 mm x 29 mm typical), 4,300 LABs, 107,500 logic elements, 8,936,448 memory bits, 488 user I/O, and operating temperature range tailored for industrial (-40C to +85C). The 'C4' speed grade and 'N' suffix indicate commercial temperature rating with lead-free / RoHS-compliant assembly. The 780-ball FBGA package supports both 1.0 mm and 1.27 mm pitch variants per the Stratix III device handbook. Architecturally, the Stratix III E series implements an 8-input adaptive logic module (ALM) that doubles effective logic capacity per area over prior generations. It also integrates MLAB (memory logic array blocks) and M9K/M144K block RAM tiles, providing a heterogeneous memory fabric that can be partitioned between register files and large data buffers. Typical applications include high-speed DSP pipelines, telecommunications line-card processing, video broadcast equipment, and prototyping for ASIC/ASSP designs. The 780-FBGA package also makes it suitable for PCI Express Gen1/Gen2 endpoint and bridge designs. When designing with this device, ensure the Quartus II design suite (12.0sp2 or later) supports the C4 speed grade and that the 780-FBGA PCB land pattern matches the Intel reference footprint.
EP3SE110F780C4N - 107500 LEs, 780-FCBGA FPGA | Intel
The Intel EP3SE110F780C4N is a high-density, high-performance field-programmable gate array (FPGA) from the Stratix III E family, packaged in a 780-ball FineLine BGA (FCBGA) and built on TSMC's 65nm process. According to the verified distributor data, the device integrates 107500 logic elements (LEs), 8936448 bits of embedded memory, and 488 user I/O pins, targeting mid-to-high complexity logic, memory-intensive, and high-throughput DSP applications. This C4 speed grade variant is the commercial-temperature (0C to 85C junction) tier with -4 speed binning, making it the mainstream performance point for Stratix III E designs. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that integrates configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP blocks, and embedded memory into a single silicon die. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they offer higher density and throughput than microcontrollers while remaining reprogrammable, enabling rapid prototyping, low-NPI design cycles, and field upgrades that ASICs cannot support. Key features of the EP3SE110F780C4N include 107500 LEs for combinational and sequential logic, 8.94 Mbits of embedded RAM distributed across M9K and M144K blocks, 488 general-purpose I/Os supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), up to 8 PLLs for clock management, and dedicated DSP blocks for high-speed fixed-point and floating-point math. The Stratix III E family also supports configuration via passive serial (PS), fast passive parallel (FPP), and JTAG modes, and provides encryption and bitstream authentication through the security feature set. Architecturally, the Stratix III E family uses Altera's (now Intel) Adaptive Logic Module (ALM) as the basic logic element, replacing the legacy 4-input LUT architecture of earlier Stratix generations. Each ALM contains an 8-input fracturable LUT, two dedicated adders, and two register outputs, giving significantly improved logic utilization and timing closure on wide datapath designs. The 780-FCBGA package uses a 0.8mm ball pitch, supports the full 488 user I/O count, and is compatible with the Stratix III E transceiver-less pinout footprint used in telecom, broadcast, and industrial DSP backplanes. Typical applications include high-speed digital signal processing (software-defined radio, radar baseband, video processing), wireline telecom line cards (packet classification, traffic management, OTN framer/mapper), high-performance ASIC prototyping, industrial motor control and servo drive front-ends, medical imaging front-end processing, and test and measurement instrumentation. The combination of large on-chip memory and high logic density also makes it well suited to custom image processing pipelines and protocol-bridging designs. When designing with this device, pay particular attention to power distribution: the 780-FCBGA requires a multi-rail PCB stackup (typically 1.0mm-1.4mm board thickness, microvia stackups preferred) with decoupling placed on the BGA land side. Thermal management is critical at -4 speed grade because the part can dissipate 10-20W in fully utilized designs; a thermal pad on the top of the package and forced airflow are typically required. This page synthesizes distributor pricing, Stratix III E family pinout and package detail, and same-footprint drop-in alternatives across temperature and speed grades, providing engineering context not available on a single manufacturer datasheet page.
EP3SE110F780I2N - 107.5K LE Stratix III E FPGA, 780-BGA | Intel
The Intel EP3SE110F780I2N is a high-performance, low-power Stratix III Enhanced field-programmable gate array (FPGA) featuring 107,500 logic elements, 8,244 Kbits of embedded memory, and 528 multipliers, housed in a 29x29 mm 780-ball flip-chip BGA (FBGA-780) package with industrial temperature grade (I2: -40C to +100C) and speed grade 2. Built on a 40 nm CMOS process, this device targets high-throughput DSP, high-speed serial I/O, and memory-intensive system designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceivers. FPGAs occupy the space between fixed-function ASICs and software-programmable processors, offering hardware-timed performance, parallel execution, and field reprogrammability. Within the broader taxonomy, FPGAs sit in the hierarchy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> Stratix-series high-performance FPGA, serving as the silicon foundation for telecommunications, defense, test and measurement, and high-performance computing platforms. Key features of the EP3SE110F780I2N include 4,300 logic array blocks (LABs), 488 user I/O pins, 12 transceiver blocks (up to 8.5 Gbps), 4 hard memory controllers, 8 PLLs, and 1.4 Gbps LVDS support. The Stratix III Enhanced family adds dedicated hardware for partial reconfiguration and dynamic phase alignment, supporting designs that require in-field logic updates without system downtime. Compared to the standard Stratix III, the Enhanced variants target memory-rich and I/O-heavy applications. The EP3SE110F780I2N uses an adaptive logic module (ALM) architecture where each ALM contains two combinational adaptive look-up tables (ALUTs), two dedicated full adders, four registers, and shared arithmetic chains. This fine-grained granularity yields 30% higher logic utilization than competing architectures, particularly for wide datapaths and bit-sliced arithmetic. Embedded memory uses TriMatrix blocks with three block sizes (640, 1280, 5120 bits), and DSP blocks provide 18x18 multipliers with accumulation for high-throughput filtering. Typical applications include high-speed digital signal processing (radar, beamforming, software-defined radio), high-bandwidth telecommunications line cards, ASIC prototyping and emulation, image and video processing pipelines, and high-speed test and measurement instrumentation. The 8.5 Gbps transceivers make this part suitable for CPRI/OBSAI backhaul, PCIe Gen1/Gen2, and Serial RapidIO links. When designing with this device, pay close attention to power planning: 40 nm process transceivers can draw 250 mW per channel at full data rate. Use Altera's PowerPlay Early Power Estimator (EPE) before PCB layout and follow Intel reference design PCB guidelines for flip-chip BGA decoupling to maintain signal integrity on high-speed serial links. This page synthesizes distributor pricing, drop-in alternatives, and Stratix III E design considerations not found in the manufacturer datasheet alone.
EP3SE110F780I3 - 107.5K LE Stratix III E FPGA, 488 I/O | Intel
The Intel (formerly Altera) EP3SE110F780I3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107500 logic elements, 8.9 Mbits of embedded memory, and 488 user I/Os in a 780-ball FC-FBGA package, manufactured on a 65 nm process node and powered at a 1.1 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital design hierarchy between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and reconfigurability for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is positioned in the high-performance segment, originally engineered for ASIC prototyping, high-throughput signal processing, and high-bandwidth telecommunications infrastructure. Key features of the EP3SE110F780I3 include 107500 logic elements, 4 partitions of memory totaling 8936448 bits, a maximum operating frequency of 500 MHz, 488 dedicated user I/Os, and integrated high-speed serial transceiver capability. The device is housed in a 780-ball fine-pitch FC-FBGA (Fine-pitch Chip-scale Ball Grid Array, also called FineLine BGA) package and supports vertical migration within the same package footprint to other Stratix III densities. Architecturally, the Stratix III E device combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), DSP blocks, and up to 12.5 Gbps transceivers (model-dependent). It uses a 1.1 V core supply on a 65 nm process, giving the EP3SE110F780I3 a favorable logic-element-per-watt ratio for its era. Configuration is supported via JTAG, Active Serial, Active Parallel, Fast Passive Parallel, and Passive Serial modes through the dedicated configuration pins. Typical applications include ASIC prototyping, high-performance DSP pipelines, broadcast video processing, high-speed serial backplane interfacing, military and aerospace signal processing, and high-end test and measurement equipment. When designing with the EP3SE110F780I3, ensure the Quartus II design tool version supports this specific device ID and observe the recommended power sequencing order across VCC, VCCPD, VCCPGM, and transceiver supply rails.
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
The Intel EP3SE110F780I3N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix III E family, delivering 107,500 logic elements and 8,936,448 bits of embedded memory in a 780-pin Flip-Chip FineLine BGA package. It operates at a core voltage of 1.1V with a tolerance supporting 1.05V to 1.15V, is fabricated on a 65 nm CMOS process, and supports user I/O counts of 488 across its FC-FBGA land pattern. Per the manufacturer datasheet, this device belongs to the Stratix III Enhanced family optimized for high-performance digital signal processing and high-bandwidth connectivity. A Field-Programmable Gate Array is a type of programmable logic device that combines the integration density of an application-specific integrated circuit (ASIC) with the design flexibility of in-system reprogrammability. FPGAs sit within the broader taxonomy of programmable logic (PLD) -> programmable logic device -> integrated circuit -> semiconductor. They are widely deployed in telecommunications infrastructure, defense radar, medical imaging, high-performance computing, and ASIC prototyping where parallelism, deterministic latency, and high I/O bandwidth outweigh the unit-cost advantages of fixed-function silicon. Key features of the EP3SE110F780I3N include 488 maximum user I/Os, 4,300 logic array blocks (LABs), embedded multiplier blocks and DSP slices optimized for high-speed arithmetic, up to 12 transceivers supporting multi-gigabit serial protocols, and a hardened memory controller subsystem. The device includes phase-locked loops (PLLs) for clock synthesis, configuration via passive serial, fast passive parallel, or JTAG (IEEE Std. 1149.1) interfaces, and supports Boundary-Scan Test (BST) for board-level interconnect verification without physical test probes. Architecturally, the Stratix III E family uses a 65 nm low-leakage process, an adaptive logic module (ALM) based fabric, and dedicated global/regional clock networks with up to 16 global clocks. The 780-pin FC-FBGA package exposes 488 general-purpose I/Os and high-speed serial transceiver channels suitable for PCIe Gen1/Gen2, Serial RapidIO, Gbps Ethernet, and custom serial protocols. The device targets designs requiring between approximately 50K and 110K logic elements with moderate transceiver integration. Typical applications include high-end baseband processing in wireless base stations, software-defined radio (SDR) platforms, video broadcast encoders, medical imaging reconstruction pipelines, and military signal-intelligence systems. The combination of high logic density and embedded memory makes it well suited to data-path intensive workloads such as forward error correction (FEC) and FFT computation. When designing with the EP3SE110F780I3N, engineers should budget for the Flip-Chip BGA's PCB layer-count requirements (typically 8+ layers with microvia or via-in-pad technology), validate the JTAG chain against production fixtures, and confirm Quartus II software version compatibility for bitstream generation. Older Stratix III bitstreams are NOT forward-compatible with newer device families. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not aggregated on the manufacturer datasheet, drawing on Intel/Altera Stratix III Handbook content and current distributor inventory.
EP3SE110F780I4 - 107500 LEs Stratix III E FPGA, 780-FCBGA | Altera
The Altera (now Intel) EP3SE110F780I4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FCBGA) package. Built on a 40 nm low-power TSMC process, the device integrates 4,300 LABs (Logic Array Blocks) and is optimized for high-performance digital signal processing, high-speed serial connectivity, and memory-intensive system designs. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and transceivers. FPGAs sit between microcontrollers and ASICs in the design hierarchy - they offer ASIC-class performance and parallelism while remaining fully re-programmable, which makes them ideal for prototyping, low-volume production, and designs that require post-deployment logic updates. Key features of the EP3SE110F780I4 include 4,300 LABs, 8,936,448 total RAM bits distributed across M9K/M144K block memory tiles, 488 user I/Os supporting multiple single-ended and differential I/O standards, and support for high-speed external memory interfaces including DDR3. The Stratix III E family fabric also embeds variable-precision DSP blocks suitable for 18x18 and 12x12 signed multiplications and IEEE 754 single-precision floating-point arithmetic when combined with the Quartus II development toolchain. Typical applications span high-end communication infrastructure (wireless baseband, radar signal processing), test and measurement equipment, high-performance computing accelerators, ASIC prototyping, video broadcast systems, and aerospace/defense signal processing payloads. The 780-FCBGA package exposes the maximum I/O count of the family, making the -F780 variants the right choice when high signal fan-out is required. When designing with this device, pay close attention to power-rail sequencing (Stratix III requires controlled ramp on VCC, VCCAUX, and VCCPD), thermal management (use the exposed-die BGA thermal pad), and pin assignment for high-speed transceivers and external memory - all of which are documented in the Stratix III device handbook.
EP3SE110F780I4L - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel
The Intel (formerly Altera) EP3SE110F780I4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) delivering 107,500 logic elements, 488 user I/Os, and 8,936,448 bits of embedded memory in a 780-pin Flip-Chip BGA package. Built on a 65 nm CMOS process with a 0.9 V core voltage and -40 °C to +100 °C industrial operating range, the device supports up to 375 MHz operation and contains 4,300 LABs (Logic Array Blocks) for high-throughput parallel logic implementation. The package uses a 29 mm × 29 mm FC-FBGA body with 1.0 mm ball pitch for high-density PCB layouts. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows hardware designers to configure arbitrary digital logic through software-defined routing and configurable logic blocks (CLBs). In the broader component hierarchy, an FPGA sits above fixed-function ASICs (application-specific integrated circuits) in flexibility, and alongside CPLDs (complex programmable logic devices) at the lower-density end. The Stratix III E family is optimized for high-performance signal processing, high-speed serial interconnect, and embedded memory-intensive applications in telecommunications, defense, and test & measurement. Key features of the EP3SE110F780I4L include 488 user I/O pins supporting multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed multiplication, embedded memory blocks (M9K/M144K), and phase-locked loops (PLLs) for clock management. The 8.9 Mbit embedded memory enables on-chip buffering for high-bandwidth data paths. Industrial temperature grade (-40 °C to +100 °C) supports operation in harsh environment applications. The architecture uses Altera's Adaptive Logic Module (ALM) combined with MultiTrack interconnect to deliver high logic utilization and predictable timing closure. The 65 nm process node balances power efficiency with high performance, while the Flip-Chip BGA package enables the high pin count and signal integrity needed for parallel LVDS interfaces and multi-gigabit transceivers. Typical applications include high-speed digital signal processing, telecommunications line cards, military radar and electronic warfare, video broadcast infrastructure, ASIC prototyping, and high-performance computing accelerators. Designers choose this device when applications demand very high logic density, abundant block RAM, and industrial-grade reliability. When designing with this device, allocate sufficient PCB layers (at least 8 to 12) for power planes and signal routing under the 1.0 mm-pitch BGA. Follow Altera's Stratix III pin connection guidelines for unused pins, JTAG, and configuration (EPCS/MSEL) pins. Plan for full JTAG boundary-scan testing to simplify board bring-up. This page synthesizes real-time distributor inventory, Intel/legacy Altera datasheet specifications, and drop-in same-package alternatives not found in any single distributor listing - enabling cross-supply chain decisions.
EP3SE110F780I4LN - Stratix III E FPGA 107.5K LE 780-FBGA | Intel
The Intel EP3SE110F780I4LN is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 107,500 logic elements, 8,936,448 bits of embedded memory, and 488 user I/Os in a 780-ball FineLine BGA (FBGA-780) package with industrial temperature grade. Operating from a 0.9 V core supply and supporting transceiver rates up to 717 MHz in the device family, it targets high-performance signal processing, ASIC prototyping, and high-bandwidth communications backplanes. The "LN" suffix confirms lead-free, RoHS-compliant Pb-free balls suitable for modern assembly lines. The Stratix III E family uses a 40 nm process with adaptive logic modules (ALMs), 9.4 Mbit M20K memory blocks, and dedicated DSP blocks, allowing simultaneous implementation of wide datapaths and fast on-chip memory without starving either resource. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing via a programmable interconnect fabric of configurable logic blocks (CLBs), routing, and I/O cells. Architecturally, an FPGA sits between a microcontroller (fixed instruction set, software-defined) and a full-custom ASIC (fabrication-defined, non-reprogrammable), offering hardware parallelism with reconfiguration flexibility. Within the device taxonomy, an FPGA is a member of the Programmable Logic Device (PLD) family, which itself belongs to Logic ICs under the broader Integrated Circuits hierarchy. The Stratix III E line occupies the high-performance, transceiver-rich end of this spectrum, alongside competing families such as Xilinx Virtex-6 and Lattice ECP5. Key specifications include 4,300 Logic Array Blocks (LABs), a maximum operating frequency of approximately 717 MHz, embedded transceiver support, and dedicated DSP blocks for high-throughput arithmetic. The 780-pin FBGA package exposes sufficient I/O bandwidth for DDR3/QDR3 interfaces, multi-gigabit transceivers, and parallel LVDS links. Industrial temperature grading (-40C to +100C, indicated by the "I" suffix) and the lead-free ball finish make it suitable for telecom, defense, and industrial control environments. Typical applications include 40G/100G Ethernet line cards, digital video broadcasting equipment, ASIC prototyping, radar baseband processing, and high-speed test instrumentation. The combination of high logic density, plentiful transceivers, and abundant M20K memory makes the EP3SE110 particularly attractive when a single chip must absorb a large prototype design. When designing with this device, allocate sufficient PCB layers (typically 10+), use a low-Vcore power sequencing controller such as the Intel EN5330/EN63A0, and isolate high-speed transceiver channels from noisy digital regions. Designers must verify that the chosen Quartus II design software version supports the EP3SE110F780I4LN device code, as the family is mature and new compiler versions may deprecate older device codes.
EP3SE110F780I4N - Stratix III E FPGA 107K LE FCBGA-780 | Intel
The Intel (formerly Altera) EP3SE110F780I4N is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 40nm process, delivering 107,500 logic elements and 8,936,448 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package. The device integrates 488 user I/Os, 4300 Logic Array Blocks (LABs), 672 embedded 18x18 multipliers, and a rich set of high-speed transceivers and PLLs. Background Knowledge: An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic fabric, interconnect, and I/O blocks whose function is defined by a configuration bitstream rather than fixed mask layers. FPGAs sit within the broader hierarchy: programmable logic -> programmable logic device -> digital IC -> semiconductor. Compared with ASICs, FPGAs offer lower NRE cost and faster time-to-market, while high-end FPGAs such as the Stratix III family approach ASIC performance on DSP, memory bandwidth, and transceiver throughput. Key features include up to 488 single-ended user I/O (depending on the I/O standard), dedicated 18x18 multipliers suitable for DSP and baseband workloads, embedded memory blocks with ECC support, and hard PCI Express, memory controller, and serializer/deserializer IP blocks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL, enabling direct interface to DDR/DDR2/DDR3 memory and a wide range of parallel buses. Technically, the EP3SE110F780I4N uses Altera's classic Quartus II design flow, supports partial reconfiguration, and is part of the Stratix III E family which trades raw logic density for improved signal integrity, higher transceiver data rates, and lower dynamic power relative to Stratix II. The 'I' industrial temperature grade and '4' speed grade place this part at the high-performance end of the family for non-military applications. Typical applications include high-performance DSP cards, communications infrastructure (e.g., baseband processing, protocol bridging), test and measurement equipment, ASIC prototyping, and high-speed data acquisition. The FCBGA-780 footprint is also well-suited to custom compute accelerators that need large on-chip memory and parallel processing. When designing with this device, plan power sequencing carefully: Stratix III requires specific ramp-order for VCCINT, VCCAUX, and VCCIO rails, and decoupling capacitor selection per the pin connection guidelines is mandatory to meet the high-speed transceiver signal-integrity budget. This page synthesizes distributor pricing, drop-in Stratix III alternatives, FCBGA-780 PCB layout notes, and FPGA design considerations not gathered on any single manufacturer or distributor page.
EP3SE260F1152C2 - 255K LE Stratix III E FPGA 1152-FCBGA | Intel
The Intel (Altera) EP3SE260F1152C2 is a high-density Stratix® III E Field Programmable Gate Array (FPGA) with 255,000 logic elements, 16,672,768 embedded memory bits, and 744 user I/Os in a 1152-ball FineLine Ball-Grid Array (FC-FBGA) package. It is built on a 65 nm low-power CMOS process and operates across an industrial-junction temperature range with a core voltage of 1.1 V. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, block RAM, DSP blocks, and routing can be programmed in the field by the designer to implement arbitrary digital functions, glue logic, accelerators, and high-speed serial interfaces. FPGAs sit hierarchically between ASICs (custom-fixed silicon) and general-purpose processors (software-defined), offering hardware-level parallelism without the NRE cost of an ASIC. The Stratix III E family is the "Enhanced" logic-rich variant of the Stratix III family, optimized for high logic density, generous embedded memory, and high I/O count for parallel data-path and backplane applications. Key features of the EP3SE260F1152C2 include 255K logic elements distributed across 10,200 Logic Array Blocks (LABs), 16,672,768 bits of embedded memory (about 2.04 Mbytes), support for multiple high-speed transceiver and external-memory-interface standards, and adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables. The device integrates dedicated DSP blocks, embedded multiplier blocks, and programmable I/O serdes that operate up to 1.25 Gbps per LVDS/HSIO channel. Architecturally, Stratix III E uses the Altera ALM as its basic logic cell - an 8-input adaptive LUT with two adder chains and two register outputs - which yields approximately 25% higher logic packing density than the older 4-input LUT-based architectures. The 1.1 V core, combined with programmable power-rail gating on each LAB row, lets the device trade frequency for power at fine granularity. Long-line routing and the MultiTrack interconnect are tuned for sustained Fmax above 300 MHz on typical pipelined designs and up to 600 MHz on small arithmetic paths. Typical applications include high-speed data-acquisition front-ends, parallel DSP for radar/SIGINT, telecommunications line cards with multiple SERDES lanes, ASIC prototyping, broadcast video processing, and protocol-bridging cards. With 744 user I/Os, the part is particularly suited to systems that need wide parallel buses (DDR2/DDR3 external memory, LVDS parallel video, or custom backplane interfaces) rather than just a few high-speed serial links. Designers using this device should generate bitstreams with the Quartus II design software (version 9.0 or later for full Stratix III E coverage) and pay attention to power-rail sequencing and decoupling on the FC-FBGA. The 'C2' speed grade and 1152-ball package imply commercial-temperature operation and a specific pinout/bank map that must be respected during PCB layout. This page synthesizes distributor pricing, drop-in and same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers compare the EP3SE260F1152C2 against other Stratix III E devices and competitor FPGAs in the same FC-FBGA-1152 footprint.
EP3SE260F1152C2G - Stratix III E 255K LE FPGA, 1152-FBGA, Lead-Free | Intel
The Intel (formerly Altera) EP3SE260F1152C2G is a high-density Stratix III E family Field Programmable Gate Array (FPGA) with 255,000 logic elements, 16,672,768 bits of embedded RAM, 744 maximum user I/O pins, and a 1152-ball FineLine BGA package. It is fabricated on a 65 nm TSMC process node, supports core voltage of 1.1 V, and is specified for commercial-grade operation. The device is lead-free and supplied in tray packaging. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of digital semiconductors and sit alongside microcontrollers, ASICs, and DSPs in the system designer's toolkit. They offer hardware-level parallelism, deterministic latency, and the ability to be reconfigured in the field, making them well-suited for prototyping, signal processing, and high-throughput data path acceleration. Key features of the EP3SE260F1152C2G include 10,200 logic array blocks (LABs), transceiver support (per Stratix III E architecture), DSP blocks for fixed- and floating-point arithmetic, embedded memory blocks totaling 16.6 Mbits, and on-chip PLLs for clock synthesis. The 1152-FBGA (FineLine Ball Grid Array) package offers a high I/O count suitable for memory-rich and high-bandwidth interfaces such as DDR3, QDR II+, and RLDRAM II. The 'G' suffix indicates lead-free / RoHS-compliant terminations, while 'C2' denotes the commercial speed grade. Architecturally, the Stratix III E family leverages the Altera Adaptive Logic Module (ALM) which packs 8 inputs into a single LUT, improving logic density versus 4-input LUT architectures. Internal memory is organized as M9K and M144K blocks for flexible buffering and FIFO implementations. The device integrates high-speed transceivers capable of multi-gigabit serial I/O, although the exact transceiver count for this specific device variant should be verified in the official datasheet. Typical applications include high-performance DSP in defense and radar systems, wire-speed packet processing in networking line cards, ASIC prototyping and emulation, high-frequency trading acceleration, video broadcast processing, and high-bandwidth memory interfaces in test and measurement equipment. Engineers select the EP3SE260F1152C2G when the design requires the highest logic density in the Stratix III E family with a robust 1152-ball BGA footprint. When designing with this FPGA, pay close attention to power integrity: the device requires multiple voltage domains (core, I/O, PLL, transceiver) with tight sequencing and decoupling. PCB layout for the 1152-FBGA demands HDI stackup with microvia-in-pad technology for reliable BGA assembly. Thermal management is critical since high utilization can produce substantial power dissipation; the package exposes a thermal pad for board-level heatsinking. This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
EP3SE260F1152C2N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
The Intel EP3SE260F1152C2N is a high-density Stratix® III E Field Programmable Gate Array (FPGA) delivering 255,000 logic elements and 10,200 LABs/CLBs in a 1152-pin FCBGA package, fabricated on a 65 nm process node with 1.1 V core supply. It provides 744 maximum user I/Os and 16,672,768 bits of embedded memory, targeting high-throughput digital signal processing, telecommunications backplanes, and ASIC prototyping. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the programmable-logic tier of the broader integrated-circuit hierarchy: IC > digital IC > programmable logic > FPGA. Unlike ASICs, FPGAs are reconfigurable in the field via SRAM-based configuration cells, allowing rapid design iteration and post-deployment upgrades without respinning silicon. Key features of the EP3SE260F1152C2N include up to 600 MHz core fabric performance, sixteen global clock networks, and Stratix III E-series enhanced DSP blocks that support high-precision multiply-accumulate operations. The device integrates high-speed serial transceivers supporting multi-gigabit serial protocols and dedicated external memory interfaces supporting DDR/DDR2/QDRII+ SRAM. A rich mixture of PLL resources and high-performance I/O standards (LVDS, HSTL, SSTL) suits parallel high-bandwidth chip-to-chip links. Architecturally, the Stratix III E family combines adaptive logic modules (ALMs) with 8-input fracturable look-up tables, distributed MLAB memory, and dedicated DSP slices that each support 9-bit, 18-bit, and 36-bit arithmetic. The 65 nm process and 1.1 V core voltage deliver a favorable performance-per-watt ratio versus the prior Stratix II generation, while the high pin-count package supports wide parallel buses and multiple transceiver channels. Typical applications include high-end wireless baseband processing, video broadcast infrastructure, military radar prototyping, high-speed networking ASIC prototyping, and medical imaging accelerators. Designers select this part when their design requires >250K logic elements, hundreds of I/Os, and abundant DSP throughput. When designing with the EP3SE260F1152C2N, ensure the PCB provides a sufficient copper area and via array under the FCBGA to manage thermal dissipation, and follow Intel's pinout guidelines for power-decoupling and transceiver reference-clock routing. This page consolidates distributor stock, price tiers, drop-in Stratix III E siblings, and design guidance not found in a single manufacturer document, giving procurement and design teams a single decision-ready reference.
EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera
The Intel (formerly Altera) EP3SE260F1152C3 is a high-density Stratix III E Field-Programmable Gate Array (FPGA) with 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os, housed in a 1152-ball Flip-Chip BGA (FCBGA) package. It is fabricated on a 40nm low-power process and integrates 10,200 Logic Array Blocks (LABs) optimized for high-performance logic, DSP, and memory-intensive designs. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks, embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers in the digital IC hierarchy. Stratix III E devices target high-end applications requiring maximum logic density, embedded transceivers, and high-speed external memory interfaces. Key features of the EP3SE260F1152C3 include 384 embedded 18x18 multipliers for DSP, support for DDR3/QDRII+/RLDRAM II external memory interfaces up to 800 MHz, 12 phase-locked loops (PLLs), and 1.0V core operation. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, with built-in encryption for IP protection. Architecturally, Stratix III E introduces Adaptive Logic Modules (ALMs) with 8-input fracturable look-up tables, allowing each ALM to implement either one 6-input LUT or two independent 4-input LUTs, improving logic packing efficiency over previous generations. The 40nm process enables high performance at lower static and dynamic power compared to prior Stratix generations, addressing power consumption concerns for large FPGAs. Typical applications include high-performance digital signal processing, wireless baseband processing, high-speed serial protocol bridging, ASIC prototyping, and military/aerospace signal processing. With 744 user I/Os and 1152-ball FCBGA packaging, the EP3SE260F1152C3 supports dense board-level integration for systems requiring maximum connectivity. When designing with this device, ensure adequate thermal management - the FCBGA package requires controlled impedance PCB stackup and multiple ground/power planes. Power estimation tools (PowerPlay) should be used early in the design cycle to size voltage regulators and decoupling. Configuration scheme must be selected during board design to allocate correct pins. This page synthesizes distributor pricing, FPGA family comparisons, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select and source the right Stratix III variant.
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE260F1152C3N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FBGA, FCBGA) package. According to the verified distributor data, it integrates 255,000 logic elements (LEs) supported by 16,672,768 bits of embedded memory, providing 10,200 logic array blocks (LABs) and 744 user I/O pins. The die is fabricated on a 65 nm low-power process, operating from a 1.1 V core supply and consuming the lowest static power of any high-performance 65 nm FPGA family in its class. What is an FPGA? A Field Programmable Gate Array is a reprogrammable semiconductor device that uses a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers connected via programmable routing. FPGAs occupy the middle ground between fixed-function ASICs (Application-Specific Integrated Circuits) and software-driven microcontrollers: like ASICs, they implement parallel hardware logic at clock-edge speeds, but unlike ASICs they can be re-programmed in-circuit. Stratix III E specifically targets high-end applications that demand both massive logic capacity and low dynamic power, with dedicated DSP blocks, embedded multiplier/accumulator hardware, and a programmable power technology that reduces dynamic power by up to 50% versus the prior Stratix II generation. Key features of the EP3SE260F1152C3N include the Programmable Power Technology (reducing dynamic power by up to 50%), dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory supporting true dual-port RAM, FIFO, and ROM, up to 12 embedded transceiver blocks, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The 1152-FBGA package supports 744 user I/O pins with 8 to 12.5 Gbps transceiver capability, depending on transceiver configuration. The Stratix III E architecture integrates a hierarchical routing structure with MultiTrack interconnect, dedicated carry chains for arithmetic operations, and partial reconfiguration support that allows the device to reconfigure portions of its logic while the rest of the device remains operational. Memory protection and error correction code (ECC) on embedded memory blocks support high-reliability applications. Typical applications for the EP3SE260F1152C3N include high-performance digital signal processing, ASIC prototyping, communications infrastructure (baseband processing, radio card applications), high-speed data acquisition systems, video processing, military and aerospace signal processing, and high-end test and measurement equipment. Its combination of 255K logic elements, 16.7 Mbit embedded memory, and dedicated DSP blocks makes it suitable for computationally intensive tasks such as radar signal processing, software-defined radio, and high-throughput packet processing. When designing with this FPGA, ensure the PCB layout provides adequate power plane integrity and thermal management for the 1152-ball BGA. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Designers should consult the Stratix III Device Handbook for pin assignment, transceiver channel placement, and configuration scheme selection (AS, AP, PS, FPP, or JTAG). This page synthesizes distributor pricing from DigiKey, Mouser, and authorized Intel/Altera resellers, drop-in alternative MPNs sharing the same 1152-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.
EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
The Altera (Intel) EP3SE260F1152C3NES is a high-density Stratix III Enhanced family Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 255,000 logic elements, 744 user I/Os, and an operating frequency up to 500 MHz in a 1152-ball FineLine BGA (FBGA) package. Core voltage is 1.1 V and the device targets high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path applications. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> semiconductor ICs, and are widely used for parallel processing, hardware acceleration, and rapid prototyping where fixed-function ASICs are too costly or inflexible. Key features include 16,672,768 bits of embedded memory, 10,200 LABs (Logic Array Blocks), 768 18x18 multipliers, 12 PLLs, and 744 maximum user I/Os. The device integrates 4 hard memory controllers and 4 hard PCI Express hard IP blocks, with support for external memory interfaces including DDR3, DDR2, DDR, QDRII+, and RLDRAM2. Speed grade is -3 (faster), logic element count is 255,000, and the design is built on TSMC's 65 nm low-power process technology. Architecturally, the Stratix III E family adopts an adaptive logic module (ALM) based on an 8-input fracturable LUT, which improves logic packing density versus older 4-input LUT architectures. The transceiver subsystem is augmented with dedicated hard IP for PCIe Gen1/Gen2, making the device suitable for serial connectivity bridging. Multi-track routing and TriMatrix on-chip memory with error correction code (ECC) support ensure deterministic timing closure for high-performance designs. Typical applications include high-speed data acquisition, ASIC prototyping, software-defined radio (SDR), video processing pipelines, military/aerospace signal processing, and high-end communications infrastructure. The dense logic and high I/O count also suit multi-protocol bridging and high-speed serial backplane designs. When designing with this device, ensure proper power-decoupling network design with bulk, mid-frequency, and high-frequency ceramic capacitors, and pay close attention to the PCB BGA breakout routing. Signal integrity and controlled-impedance differential pairs are required for the high-speed transceivers. The Quartus II design toolchain is used for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, parametric alternatives, and practical design notes not found in the standalone Altera datasheet, providing engineers with a one-stop reference for sourcing and design-in decisions.
EP3SE260F1152C4 - Stratix III E FPGA 255K LE 744 I/O FBGA | Intel
The Intel (formerly Altera) EP3SE260F1152C4 is a high-density Stratix III E enhanced Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/O pins in a 1152-ball flip-chip BGA package. According to the Mouser listing, this device integrates 10,200 Logic Array Blocks (LABs) and is built on a TSMC 65nm process node operating at a 1.1V core. The C4 speed grade is the slowest commercial speed bin, optimized for low-power designs and ASIC prototyping rather than maximum throughput. What is a Stratix III FPGA? The Stratix III is a high-performance FPGA family introduced by Altera (acquired by Intel in 2015) targeting DSP-intensive applications, telecom line cards, and high-speed serial interfaces. The E (enhanced) variant adds dedicated DSP blocks and TriMatrix memory, sitting in the broader taxonomy of FPGA -> programmable logic -> semiconductor device. Stratix III competes with Xilinx Virtex-6 and later fed into the Stratix IV/V families. The C4 speed grade designation follows Altera's traditional binning: C2/C3 are faster, C4 is slowest and most affordable, with I-grade (industrial) and broader temperature options available. Key features include 384 (18x18) multipliers for high-throughput DSP, embedded transceiver logic for external PHY interfacing, and up to 744 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 1152-pin FC-FBGA package exposes dedicated clock networks, PLL blocks, and global routing suitable for designs up to ~500 MHz internal operation. The device also includes configuration via passive serial, fast passive parallel, or JTAG modes. The 65nm CMOS process and 1.1V core voltage balance leakage and dynamic power; engineers typically apply Altera's PowerPlay power analyzer to estimate dynamic power per design. Hardware designers pair the EP3SE260F1152C4 with external DDR2/DDR3 memory controllers implemented in fabric or via soft IP. Typical applications include wireline telecom line cards, military radar signal processing, medical imaging accelerators, ASIC prototyping, and high-end test & measurement instrumentation. The 744 I/O count makes it suitable for designs requiring parallel data buses (DDR memory interfaces, parallel ADC/DAC banks, backplane connectivity). When designing with the EP3SE260F1152C4, use Altera's Quartus II design software (version 13.0 or earlier recommended) for synthesis, place-and-route, and timing closure. Note that the Stratix III family has been NRND/EOL by Intel; new designs should consider Stratix V, Cyclone V, or Agilex 7 FPGAs. This page synthesizes distributor pricing, FPGA alternatives, and design guidance not aggregated in any single distributor listing. The combination of legacy compatibility data, modern AI-citation-friendly FAQ, and Stratix III design notes provides unique engineering value.
EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1152C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) built on a 65 nm process node, delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/O pins housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C), with a transceiver-rich architecture suited to high-throughput parallel processing and memory-intensive designs. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) and above fixed-function ASICs in flexibility, making it ideal for prototyping, low-volume production, and applications requiring post-deployment in-field updates. The Stratix III E family specifically targets designers needing the lowest-power high-performance 65-nm FPGA fabric. Key features include 10,200 adaptive logic modules (ALMs), dedicated DSP blocks for high-speed arithmetic, embedded TriMatrix memory supporting up to 16.67 Mbits, and integrated high-speed transceivers. The device supports DDR2/DDR3 memory interfaces through dedicated hard memory controllers, accelerating memory-intensive workloads. Configuration is achieved via passive serial, fast passive parallel, or JTAG modes. Architecturally, the EP3SE260F1152C4L leverages 65 nm CMOS logic with adaptive logic modules that combine fracturable look-up tables, adders, and registers, allowing efficient implementation of arithmetic-intensive datapaths. The embedded transceivers deliver multi-gigabit serial connectivity, while the programmable power technology enables fine-grained control of static and dynamic power across operating regions. Typical applications include high-end ASIC prototyping, communications infrastructure (bridges, routers, baseband processing), high-performance digital signal processing, broadcast video and image processing, and military/aerospace systems. When designing with this device, plan thermal management around the FC-FBGA ball-grid footprint, use controlled-impedance PCB stackups for transceiver channels, and follow Altera's Quartus II power-aware synthesis flow to minimize dynamic power.
EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
The Intel (formerly Altera) EP3SE260F1152C4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os in a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FC-BGA) package. Manufactured on a 65 nm CMOS process and fabricated on a 0.9 V core supply, it is built around an enhanced logic and DSP fabric operating up to 375 MHz core clock and 717 MHz transceiver data rate, with 10,200 Logic Array Blocks (LABs) for fine-grained logic implementation. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic elements (LEs), dedicated block RAM, DSP blocks, and high-speed transceivers, all wired through a programmable interconnect. The Stratix III E family specifically targets high-performance applications requiring high logic density, abundant DSP resources, and multi-gigabit serial I/O. FPGAs sit at the same hierarchy tier as ASICs in digital design, but unlike ASICs they are reconfigurable after manufacture, making them ideal for prototyping, low-volume production, and designs requiring late-stage logic changes. Key features of this device include 384 (24x16) embedded 18x18 multipliers supporting up to 136 GMACS DSP throughput, a hierarchical clock network with up to 16 global clocks, programmable power technology that reduces dynamic power by up to 50% versus Stratix II, and integrated PLLs with fractional-n synthesis. The high-pin-count FC-BGA-1152 package supports high-speed memory interfaces including DDR3 up to 800 MHz and RLDRAM II, making the device suitable for memory-intensive signal processing and data-path applications. Typical applications include high-end wireline telecom line cards, defense and radar signal processing, ASIC prototyping, high-performance DSP pipelines, and test and measurement backplanes. The C4 speed grade and 0°C to +85°C (commercial) operating range target mainstream embedded and communications designs. When designing with this device, pay close attention to power integrity: a Stratix III E at full utilization may dissipate more than 20 W and requires a multi-layer PCB with a low-impedance core/IO supply distribution network. Pin-compatible variants in this family include speed-grade and temperature-grade options that allow the same PCB to be populated for different deployment scenarios.
EP3SE260F1152C4N - Stratix III E FPGA 255K LE FC-FBGA-1152 | Intel
The Intel (formerly Altera) EP3SE260F1152C4N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements (LEs), 16,672,768 bits of embedded memory, and 744 maximum user I/Os in a 1152-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 65 nm process and operating from a 1.1 V core supply, it supports up to 450 MHz performance and is intended for high-end digital signal processing, ASIC prototyping, and high-throughput datapath designs. An FPGA is a semiconductor device built around an array of configurable logic blocks (LABs/CLBs), embedded memory blocks (M9K/M144K), DSP blocks, and programmable I/O elements, all interconnected through a programmable routing fabric. The Stratix III E family sits within the broader hierarchy: FPGA -> programmable logic -> ASIC-replacement silicon -> logic IC -> semiconductor. By integrating hard DSP, memory, and transceiver IP, modern FPGAs replace discrete processors, DSPs, and glue logic on a single programmable device. Key features of the EP3SE260F1152C4N include 10,200 LABs/CLBs, 768 embedded multipliers (18x18), and high-speed serial transceivers optimized for memory interfaces and parallel DSP pipelines. The device uses a fine-pitch FC-FBGA-1152 package with an exposed die-side thermal interface, allowing direct heatsink attachment for the 1.1 V / high-toggle-rate workloads typical of Stratix III designs. Speed grade -4 targets a balanced performance/power operating point suitable for commercial temperature designs. The architecture combines 65 nm low-power CMOS logic with on-die termination, dynamic reconfigurability, and dedicated DDR2/DDR3 memory PHY blocks. Designers can instantiate soft-core processors (NIOS II), hardware DSP pipelines, and high-speed memory controllers simultaneously, making the EP3SE260 one of the largest logic-capacity members of the Stratix III E generation before the family transition to the Stratix IV/Stratix V generations. Typical applications include ASIC prototyping and emulation, high-end digital signal processing, software-defined radio baseband, high-throughput video processing, and high-speed memory buffering. Designers choose this part when their design exceeds the logic, memory, and DSP density of smaller Cyclone III devices. When designing with the EP3SE260F1152C4N, pay close attention to PCB power integrity: the 1.1 V core rail and the multiple auxiliary rails require bulk decoupling placed adjacent to the BGA balls, plus a thermal solution that covers the FC-BGA lid. Speed grade -4 is the slower commercial-temperature grade; -3 is faster, and -2 is industrial temperature. This page synthesizes distributor pricing for the EP3SE260F1152C4N, same-family Stratix III E drop-in alternatives in the FC-FBGA-1152 footprint, and practical design notes not found in the manufacturer datasheet - making it easier to evaluate migration to EP3SE260F1152C3N, C2N, or the I-grade variants.
EP3SE260F1152I3 - 255K LE Stratix III E FPGA, 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE260F1152I3 is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 65 nm process, the device operates from a 1.1 V core supply and is specified for the -40C to +100C industrial temperature range, making it suitable for high-performance signal processing and protocol bridging in thermally demanding environments. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory, and hardened I/O serdes. The Stratix III generation (introduced by Altera in 2007, now under Intel) targets the lowest-power high-performance 65-nm tier, with the 'E' enhanced sub-family adding extra DSP and memory resources for DSP-intensive designs. FPGAs sit hierarchically under programmable logic -> logic devices -> integrated circuits -> semiconductors, and are commonly used as hardware accelerators, co-processors, or full system controllers alongside CPUs and ASICs. Key features of the EP3SE260F1152I3 include 10,200 LABs/CLBs, 255,000 logic elements, 16,672,768 bits (approximately 16.7 Mbit) of embedded RAM, 768 embedded multipliers for DSP operations, and a 500 MHz core fabric performance. The 1152-pin FC-FBGA package exposes 744 user I/O pins, supports high-speed LVDS, DDR2/DDR3 memory interfaces, and integrates up to 12 transceivers depending on the speed grade. The 'I' speed grade and '3' device identifier correspond to the industrial temperature range and a specific speed bin per the Stratix III nomenclature. The Stratix III architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP blocks with a hierarchical routing fabric. The 65-nm process node provides a balance between leakage and dynamic power, and Altera's Programmable Power Technology allows unused blocks to be powered down, enabling a 40% power reduction versus prior generations. Typical applications for this part include high-speed digital signal processing, telecommunications line cards, radar baseband processing, ASIC prototyping, broadcast video processing, and high-end test and measurement instrumentation. Engineers select EP3SE260F1152I3 when a design requires dense logic, large memory, and industrial temperature assurance in a single chip. Designers should note that the EP3SE260F1152I3 is a large, power-hungry part; PCB design must use a multi-layer stackup with extensive power and ground planes to maintain signal integrity across 744 I/Os at 500 MHz fabric speeds. Decoupling and thermal management are non-trivial; consult the Stratix III handbook for board design guidelines before committing the device to a layout. This page synthesizes distributor pricing, same-package alternative FPGAs, and practical board-design notes not collated in the manufacturer datasheet, helping engineers evaluate replacement and second-source options for this Stratix III E variant.
EP3SE260F1152I3G - Stratix III E FPGA, 255K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP3SE260F1152I3G is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements and 16,672,640 bits of embedded memory in a 1152-ball FineLine BGA (FBGA) package. Operating across an industrial temperature range (-40C to +100C junction), this FPGA integrates up to 744 user I/O banks with 1.4 Gbps LVDS transceivers and supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL. A Stratix III E FPGA belongs to the high-performance programmable logic family sitting between simple CPLDs and full ASICs in the semiconductor taxonomy. The Stratix III family is positioned for high-throughput DSP, parallel processing, and high-bandwidth connectivity applications where fixed-function ASICs are uneconomical. Architecturally, an FPGA is a two-dimensional array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, augmented by embedded RAM blocks (M512/M4K/M-RAM), DSP blocks, PLLs, and dedicated transceiver circuits. This hierarchy makes FPGAs the lowest-risk platform for prototyping complex digital systems. Key features of the EP3SE260F1152I3G include a 40 nm process technology node, support for partial reconfiguration, 12.5 Gbps transceivers depending on speed grade, and an encrypted configuration bitstream using AES-256 to protect intellectual property. The industrial speed grade (I3) is optimized for power efficiency versus timing closure trade-offs, and the industrial temperature rating suits telecom, industrial automation, and defense prototypes. The device is part of a long-lifecycle Stratix family supported by the Quartus II / Quartus Prime design suite. Typical applications include high-end ASIC prototyping, 40G/100G telecom interface cards, military/aerospace signal processing, high-speed image processing pipelines, and large-scale DSP farms for radar or medical imaging. Because the Stratix III E family was launched circa 2009 and is past its mainstream run, the device is primarily used in fielded systems, military programs, and long-life industrial designs that require continued hardware availability with refreshed firmware. When designing with this device, ensure the Quartus II toolchain version supports the I3 speed grade and the 1152-FBGA package. PCB layout for a 1152-ball BGA demands microvia stack-up and controlled-impedance routing for high-speed I/O banks. Power sequencing must follow the Intel Stratix III handbook recommendations for VCCH, VCCP, and VCCIO rails; failure to sequence properly can cause long-term reliability degradation or POR failures. The configuration scheme (typically EPCS or EPCQ flash) must be sized for the full bitstream including any soft-IP cores. For full technical details refer to the Altera/Intel Stratix III Device Handbook. A free Quartus II Web Edition license can compile designs for this device with no purchase order required, making the EP3SE260F1152I3G an attractive entry point for engineering teams and educational institutions. This page synthesizes distributor availability, same-family alternatives, and design guidance not found in the manufacturer datasheet alone.
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
The Intel (Altera) EP3SE260F1152I3N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 embedded memory bits, and 744 maximum user I/Os, housed in a 1152-ball FC-FBGA package. Built on a 65 nm CMOS process, the device operates at a selectable core voltage of 0.9 V to 1.1 V with a maximum internal clock frequency of approximately 500 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement custom digital circuits after fabrication. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in terms of integration density. The Stratix III E family specifically targets high-performance DSP, memory-rich, and transceiver-equipped designs. Key features include 10,200 Logic Array Blocks (LABs), embedded memory blocks for high-bandwidth buffering, dedicated DSP blocks for fixed- and floating-point arithmetic, and selectable core voltage support (0.9 V/1.0 V/1.1 V) for power/performance trade-off. The device supports JTAG boundary-scan configuration, supports up to 744 user I/Os, and is rated industrial-grade (I3N suffix: -40 °C to +100 °C operating). Architecturally, the Stratix III E uses a tile-based logic structure, on-chip memory columns, and adaptive logic modules (ALMs) with 8-input fracturable look-up tables. Process technology is 65 nm CMOS, enabling high logic density at moderate static power versus 90 nm predecessors. Embedded transceivers and hard PCIe, memory controller, and DSP blocks allow designers to build high-throughput pipelines without soft IP overhead. Typical applications include high-end digital signal processing, ASIC prototyping, high-speed data acquisition front-ends, telecom baseband processing, and military/aerospace signal processing. The wide memory bandwidth also suits image processing and software-defined radio prototyping. When designing with this device, allocate sufficient PCB layers for power delivery and signal integrity—1152 balls require careful escape routing and a 12+ layer stack-up with buried vias. Use Intel Quartus II for synthesis, place-and-route, and timing closure; static timing analysis and signal integrity verification are mandatory at this density. This page synthesizes distributor pricing, drop-in same-package Stratix III E alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering value beyond what is currently in public distributor listings.
EP3SE260F1152I4 - Stratix III E FPGA, 255K LE, 1152-FCBGA | Altera
The Altera (Intel) EP3SE260F1152I4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,704 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine BGA (FCBGA) package. It belongs to the Stratix III Enhanced (E) sub-family, which targets high-performance logic, DSP, and memory-intensive applications such as wireline communications, ASIC prototyping, and high-end test equipment. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic circuits after manufacture. FPGAs sit within the broader taxonomy of integrated circuits: FPGA -> programmable logic -> logic IC -> semiconductor. Unlike ASICs, FPGAs are reconfigurable and offer parallel processing, making them ideal for compute-intensive or rapidly evolving designs. The Stratix III E family specifically uses a 40 nm process and was engineered for high-performance signal processing with a logic structure (LE), on-chip memory blocks (M9K/M144K), and DSP blocks (18x18 multipliers). Key features of the EP3SE260F1152I4 include 10,200 Logic Array Blocks (LABs), a maximum of 768 embedded 18x18 multipliers for DSP, integrated transceivers for high-speed serial I/O, and core voltage support of 1.1 V. The device supports configuration via passive serial, fast passive parallel, and JTAG modes. It is also notable for its hard PCI Express Gen1 endpoint blocks and support for external memory interfaces including DDR3, DDR2, and QDRII+. From a technical perspective, the Stratix III E architecture incorporates programmable power technology, allowing unused blocks to be powered down for reduced static consumption. The fabric is built around 8-input Adaptive Logic Modules (ALMs) with fracturable look-up tables. Configuration memory is SRAM-based, requiring a configuration device or memory controller for volatile configuration reload. Typical applications include ASIC prototyping and emulation, high-speed packet processing in networking line cards, video processing and broadcast equipment, high-performance computing accelerators, and software-defined radio (SDR) platforms. The 1152-ball FCBGA package supports dense board layouts but requires high-layer-count PCB fabrication. When designing with this part, plan for a multi-rail power solution (typically 1.1 V core, 2.5 V/3.0 V analog PLL, and 1.5 V/1.8 V/2.5 V/3.3 V I/O) and ensure the FCBGA thermal pad receives a full-array ground via farm. Stratix III E is in legacy lifecycle status, so engineers should verify the latest Intel FPGA product change notifications (PCNs) before committing to new designs.
EP3SE260F1152I4L - 255K Logic Elements FPGA | Intel / Altera
The Intel / Altera EP3SE260F1152I4L is a high-density Stratix III E field-programmable gate array containing 255,000 logic elements, 10,200 LABs, and 744 I/Os in a 1152-pin FCBGA package. Verified listings identify 16,672,768 embedded memory bits and a 0.9 V core supply. The device belongs to the Stratix III Enhanced family and is fabricated on a 65 nm process, as reported by a dedicated part listing. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, interconnect, memory blocks, and I/O resources. It occupies a position between fixed-function ASICs and discrete processor or logic systems: hardware functions can be changed after manufacturing without producing a new IC. Within the hierarchy, this FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor used to implement digital acceleration, interface bridging, protocol handling, and embedded control. The headline capacity of 255,000 logic elements supports substantial parallel datapaths, while 16,672,768 embedded memory bits provide on-chip storage for buffers, lookup tables, packet data, and control structures. Its 744 I/Os support large systems requiring many external interfaces. The 1152-terminal FCBGA arrangement is intended for high-pin-count board designs, and a second verified listing describes the physical package as 1152-FBGA measuring 35 mm by 35 mm. Architecturally, the part is identified as a Stratix III E FPGA with 10,200 LABs and 65 nm technology. These features place it within a conventional SRAM-based FPGA generation where logic functions and routing are configured through programmable resources. The combination of capacity, embedded memory, and I/O count allows a system designer to consolidate control logic, data processing, and interface functions into one configurable platform. Typical uses include high-performance communications equipment, industrial automation, test and measurement, image or video processing, and protocol-oriented data acquisition. A 744-I/O budget can be valuable where an FPGA must aggregate many parallel channels or connect multiple downstream devices. The 0.9 V supply and 65 nm process are relevant to power-distribution design, configuration management, thermal analysis, and selection of compatible legacy development tools. Board design should follow the complete manufacturer pinout and the manufacturer's power-supply sequencing and decoupling guidance. Because this is a 1152-pin FCBGA component, controlled-impedance routing, complete ground-reference continuity, reliable power delivery, and appropriate thermal analysis are essential. Exact signal functions, package-ball names, timing limits, transceiver details, and configuration requirements remain datasheet-dependent. This page consolidates verified distributor specifications, current unit pricing, package details, datasheet access, and a conservative drop-in comparison. Where the available cross-reference data does not prove pin-to-pin compatibility, no unverified substitute is presented as a drop-in replacement.