FPGA & CPLD
Produtos (6666)
EPF10K20TI144-4N - FLEX 10K FPGA, 20K Gates, 144-LQFP | Intel / Altera
The Intel / Altera EPF10K20TI144-4N is a member of the FLEX 10K family of SRAM-based, in-system programmable FPGAs (Field Programmable Gate Arrays) fabricated on a 0.42 µm CMOS process. The device integrates 20,000 typical gates, 1,152 logic elements (LEs), 102 user I/Os, and 12,288 bits of embedded array memory in a 144-pin LQFP (TQFP) package, making it one of the most widely deployed legacy Altera FPGAs for industrial glue logic, bus interfacing, and prototyping. What is an FPGA? A Field Programmable Gate Array is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are configured by the user after manufacture. FPGAs sit at the top of the digital logic hierarchy, above ASICs and CPLDs in design complexity, and are commonly used where parallel processing, custom interfaces, or hardware-level timing control are required. The FLEX 10K family specifically introduced embedded array blocks (EABs) that combine look-up-table logic with on-chip RAM, enabling true system-on-a-programmable-chip (SOPC) integration of memory and logic in a single device. Key specifications include a maximum propagation delay of 0.4 ns through the Look-Up Table, a maximum internal operating frequency near 125 MHz, 5 V tolerant I/O cells, and full IEEE 1149.1 JTAG boundary-scan support. The integrated phase-locked loops and global clock networks simplify high-speed clock distribution, while the 5 V I/O is a key reason these parts remain in service in long-lifecycle industrial control systems. Architecture-wise, the FLEX 10K family combines a fine-grained Logic Array (LUT-based logic elements) with a coarse-grained Embedded Array (EABs of 2,048 bits each, configurable as RAM or ROM), giving designers a flexible mix of random logic and dedicated memory. The 0.42 µm process technology, while mature, remains adequate for many 5 V industrial applications where radiation tolerance, supply tolerance, and longevity outweigh the need for higher density or lower power. Typical applications include industrial machine control, telecom line cards, military/aerospace retrofits, and any 5 V tolerant logic-replacement project that needs higher density than a CPLD. Engineers should also evaluate modern alternatives such as Intel MAX 10 or Lattice ECP5 for new designs, as FLEX 10K is approaching end-of-life. This page synthesizes current distributor pricing, verified drop-in alternatives (same family / speed grade), and practical design notes that are not consolidated on the manufacturer datasheet.
EPF10K20TI144-4U - FLEX 10K FPGA, 20K Gates, 144-TQFP | Intel / Altera
The Intel / Altera EPF10K20TI144-4U is a member of the FLEX 10K family of SRAM-based FPGAs with embedded array blocks, delivering approximately 20,000 equivalent gates (1152 logic elements) in a 144-pin TQFP industrial-temperature-grade package. Per the FLEX 10K datasheet (referenced via altera / AlteraSemi), the device integrates a large embedded array for megafunctions such as efficient memory and specialized logic functions alongside a general-purpose logic array, providing true System-on-a-Programmable-Chip (SOPC) integration in a single IC. The "-4U" suffix denotes the industrial temperature grade (operating range -40 °C to +85 °C) with the -4 speed grade. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture. Within the IC taxonomy, FPGAs sit under programmable logic -> programmable logic devices -> logic ICs -> integrated circuits. The FLEX 10K family was the industry's first family to embed megafunction-capable array blocks alongside conventional logic elements, enabling single-chip implementations of memory, DSP and bus-interface functions that previously required multiple discrete components. Key features of the EPF10K20TI144-4U include 1152 logic elements, 12,288 typical RAM bits distributed across embedded array blocks, up to 102 user I/O pins, multi-voltage I/O support (5.0 V PCI-compliant and 3.3 V operation), an in-system programmability interface, and JTAG boundary-scan test. The 144-pin TQFP (1.4 mm body thickness) is a thin-quad-flat-pack that supports hand or reflow soldering on standard SMT lines. Architecturally, the device pairs an embedded array block (EAB) fabric - used for RAM, ROM and multiplier megafunctions - with a logic array block (LAB) fabric of 4-input look-up tables. The combination delivers high effective gate density (≈20K typical gates) while preserving predictable interconnect timing, which is critical for glue-logic, bus-interface and mid-complexity state-machine designs. Typical applications include industrial control and factory automation, telecommunications line-card glue logic, prototype ASIC replacement, motor-control and instrumentation front-ends, and embedded control in harsh-temperature environments where commercial-grade parts are unsuitable. Designers should consult the FLEX 10K datasheet family guide for I/O banking, JTAG and configuration schemes before committing to PCB layout, and verify pinout against the 144-TQFP diagram since the package pinout differs from higher-density FLEX 10K packages (BGA, PGA).
EPF10K250EBC600-1 - 250K Gate FLEX 10KE FPGA | Intel | BGA-600
The Intel (Altera) EPF10K250EBC600-1 is a high-density FLEX 10KE family FPGA with 250,000 system gates, 12,160 logic elements, and 6 embedded array blocks (EABs), housed in a 600-ball FineLine BGA package with commercial 0°C to +70°C operating temperature. It is built on a 0.22 µm SRAM-based process and operates from a 5.0V core supply with multi-voltage I/O support. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit at the top of the programmable logic hierarchy - more flexible than CPLDs and more integration-dense than discrete glue logic. The FLEX 10KE family belongs to the legacy Altera SRAM-based architecture now owned by Intel's Programmable Solutions Group, bridging classic look-up-table (LUT) logic blocks with on-chip embedded array blocks (EABs) used as RAM, ROM, or multiplier functions. Key features of the EPF10K250EBC600-1 include 250K typical gates (110K usable gates), 40,960 RAM bits distributed across EABs, 6 PLLs for clock management, and MultiVolt I/O supporting 3.3V/5.0V interfacing. The 600-ball BGA package provides high I/O density suitable for data-path, telecom, and DSP-prototype designs. The device is in-system programmable via JTAG, supports ByteBlaster configuration, and includes built-in boundary-scan. The FLEX 10KE architecture uses a continuous interconnect fabric with each logic element containing a 4-input LUT, programmable register, and dedicated carry chain. Six EABs provide up to 40,960 bits of dual-port RAM - sufficient for FIFO buffers, register files, and coefficient storage in FIR filters. PLLs generate up to six derived clocks from a single reference, simplifying timing closure. Typical applications include telecommunications line cards, industrial control ASIC prototyping, DSP algorithm acceleration, and legacy MMI replacement for end-of-life fixed-logic ICs. Engineers commonly pair the EPF10K250EBC600-1 with SRAM, Flash PROM (EPC2/EPC8) for boot memory, and LVDS/TTL interface devices. When designing with this part, mind the 5V core supply requirement - it cannot use modern 1.2V-3.3V rails without discrete LDO regulators. The BGA package requires X-ray or BGA rework for prototyping, and board designers should allocate dedicated ground and VCCIO planes. This page synthesizes distributor stock levels, parametric alternatives, and design notes not aggregated on individual distributor listings.
EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera
The Altera (Intel PSG) EPF10K250EBC600-2 is a member of the FLEX 10KE family of SRAM-based, embedded-programmable logic devices, integrating up to 250,000 typical gates with 12,288 logic elements and 4096 flip-flops in a 600-ball FineLine BGA package. It includes 40,960 bits of embedded array memory (EABs), supporting 5ns dual-port RAM in widths up to 16 bits, plus four phase-locked loops (PLLs) and four high-speed clock lock pins. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than by the foundry. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX 10KE family pioneered the Embedded Array Block (EAB) concept, pairing classical 4-input look-up tables with dedicated SRAM blocks, which made it suitable for both random logic and datapath/memory-intensive functions on the same die. Key features include 250,000 typical gates (152,000 usable), 12,288 logic elements (LEs), 12,288 dedicated flip-flops, 80 LABs of 8 LEs each, and 4096 EABs (each 2,048 bits, totaling 40,960 bits of RAM). The device operates from a 3.3V core supply and provides 488 user I/O pins via 12 I/O banks, with 5.0V tolerant inputs. Each I/O bank supports selectable I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL-2, and SSTL-3, plus hot-socketing capability. Architecturally, the FLEX 10KE uses a continuous, SRAM-based interconnect fabric with row-and-column FastTrack lines. The four PLLs handle clock multiplication, division, phase shifting, and clock-to-out reduction, enabling clean system-level timing even with multi-MHz reference oscillators. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with built-in decompression and CRC checking. Typical applications include telecommunication line cards, industrial control, ASIC prototyping, glue-logic consolidation, and bus-bridging designs. The 600-ball BGA footprint is shared across the FLEX 10K200E and FLEX 10K250E families, so PCB layout reuse is straightforward. Designers should consult the FLEX 10KE Device Family Data Sheet for pin assignments and I/O bank configurations. When designing with this device, allocate at least 20% of LEs and EABs unused for future ECOs and timing closure margin. Use the Quartus II or MAX+PLUS II development tools for synthesis, place-and-route, and timing analysis - JTAG-based in-system programming is recommended for production to avoid manual device handling. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EPF10K250EBC600-3 - 250K FLEX 10KE FPGA, 600-BGA | Intel (Altera)
The Intel (formerly Altera) EPF10K250EBC600-3 is a high-density member of the FLEX 10KE programmable logic family, delivering 250,000 system gates in a 600-ball FineLine BGA package with -3 (faster) speed grade. It is a SRAM-based, in-system reprogrammable CMOS FPGA designed for high-performance logic designs, ASIC prototyping, and complex glue-logic integration. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the user can define after manufacturing using an HDL or schematic capture. Within the broader taxonomy of digital ICs, an FPGA sits between fixed-function ASICs and CPLDs, offering higher logic density and richer on-chip features than CPLDs while remaining lower-NRE than full-custom ASICs. The FLEX 10KE family specifically belongs to the FLEX (Flexible Logic Element matriX) architecture lineage and represents the mid-density generation between classic FLEX 10K and the later APEX families. Key headline parameters include 250,000 typical gates, 12,160 logic elements (LEs), 12 embedded array blocks (EABs) each providing 2,048 bits of RAM for up to 24 Kbits of on-chip memory, 6 dedicated clock inputs plus 4 phase-locked loops (PLLs), and 470 user I/O pins. The device operates from a 3.3 V core / 5 V-tolerant I/O supply, supports JTAG-based IEEE Std. 1149.1 boundary-scan testing, and offers in-system programmability via the serial configuration (Passive Serial, Passive Parallel, or JTAG) modes. Per the Intel/Altera FLEX 10KE datasheet, this -3 speed grade corresponds to approximately 5 ns pin-to-pin combinational delay on representative paths. Architecturally, the FLEX 10KE fabric combines a row-and-column interconnect network with embedded array blocks, allowing designers to implement both wide combinational logic and on-chip RAM/FIFO structures without external memory. The four on-chip PLLs provide clock multiplication, division, phase shifting, and skew management across multiple synchronous domains, which simplifies PCB layout for high-speed designs. Typical applications include high-speed digital signal processing, telecommunications backplane glue logic, ASIC prototyping, custom RISC/CISC peripherals, parallel bus interfacing, and industrial control with real-time deterministic timing. Designers choose this part when they need more logic capacity than the EPF10K100/130 series but do not yet require an APEX or Cyclone migration. When designing with the EPF10K250EBC600-3, ensure the PCB has a 600-ball BGA landing pattern compatible with the FineLine BGA pitch, multiple supply decoupling capacitors (100 nF + bulk) near each supply ball, and proper JTAG chain routing for in-system programming. Thermal management is generally passive at moderate toggle rates, but airflow should be considered for sustained high-utilization designs. This page synthesizes distributor pricing tiers, drop-in alternative cross-references, and practical FLEX 10KE design notes that go beyond the manufacturer datasheet alone.
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
The Intel (formerly Altera) EPF10K250EBI600-3 is a high-density FLEX 10KE family Field-Programmable Gate Array (FPGA) housed in a 600-ball BGA package. It delivers approximately 250,000 system gates, 12,160 logic elements (LEs), and 470 user I/O pins, targeting complex glue-logic, bus-bridge, and prototype ASIC-replacement designs in industrial temperature ranges. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing matrix, allowing engineers to implement custom digital circuits without fabricating a mask-set ASIC. The FLEX 10KE architecture pioneered embedded system blocks (ESBs) for on-chip dual-port RAM and ROM; modern FPGAs descend from this LUT-plus-embedded-memory concept. Within the broader taxonomy, an FPGA sits between an ASIC (Application-Specific Integrated Circuit) and a CPLD (Complex Programmable Logic Device), offering the highest logic density and the highest per-unit cost trade-off. Key features of the EPF10K250EBI600-3 include 12,160 logic elements, 12 embedded system blocks providing up to 40 Kbits of on-chip RAM, four phase-locked loops (PLLs) for clock synthesis, 470 maximum user I/O pins, and multi-volt I/O support compatible with 2.5 V, 3.3 V, and 5 V logic families. The "-3" speed grade is the fastest commercial/industrial grade available in the family, enabling higher Fmax on internal logic paths. The silicon uses a 0.22 µm SRAM-process four-layer-metal CMOS technology, which is why this part requires a configuration device (EPC16, EPC8, or similar) to load the SRAM-based configuration on every power-up. The 600-ball BGA provides extensive I/O count for high-bandwidth parallel interfaces, but the 1.93 mm ball pitch demands advanced PCB fabrication (microvia / HDI stack-ups). Typical applications include high-speed DSP pipelines, telecom backplane glue logic, PCI/PCI-X bus bridges, industrial control and instrumentation, ASIC prototyping, and legacy replacement of EOL Altera APEX / FLEX designs in long-lifecycle industrial equipment. Modern FPGAs (Cyclone, MAX 10) have replaced FLEX 10KE in new designs, but the part remains supported for installed bases. When designing with this device, ensure the PCB stack-up supports 1.93 mm BGA pitch with microvia fan-out, and pair the FPGA with an Altera-compatible configuration PROM (EPC16QC100 or similar). The device is commercial/industrial grade at 2.3 V core, but is widely quoted across 2.5 V supply platforms - confirm core voltage before PCB bring-up.
EPF10K250EFC672-1 - 250K Gates FPGA, 470 I/O, 672-BGA | Intel
The Intel (Altera) EPF10K250EFC672-1 is a high-density FLEX 10KE family FPGA delivering 250,000 system gates with 470 user I/Os in a 672-ball BGA package. The -1 speed grade and commercial (0C to 70C) temperature grade make it suitable for high-throughput logic designs requiring maximum performance in the FLEX 10KE lineup. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement custom digital logic that can be re-programmed multiple times. FPGAs sit within the broader programmable logic device (PLD) hierarchy - between simple PAL/GAL devices and full ASICs - and belong to the FLEX 10KE sub-family which Intel (originally Altera) launched in the late 1990s as a cost-optimized variant with embedded array blocks (EABs) for distributed SRAM. The FLEX 10KE family bridged the gap between the original FLEX 10K and the APEX 20K, offering improved logic capacity and routing architecture. Key specifications of the EPF10K250EFC672-1 include 250,000 typical gates, 12,160 logic elements, 470 maximum user I/Os, 672 balls in a 45 x 45 mm BGA package at 1.27 mm pitch, and an embedded array block architecture supporting distributed synchronous SRAM. The device supports in-system programmability via a serial configuration interface and operates from a 3.3 V core supply with multi-voltage I/O support. CMOS technology and a propagation delay figure of approximately 0.4 ns per logic element underpin the device's logic performance envelope. Architecturally, the FLEX 10KE combines a sea-of-logic fabric of look-up-table-based logic elements (LEs) with embedded array blocks (EABs) that can implement dual-port RAM, ROM, or large finite state machines. Each EAB provides up to 4 Kbits of memory, and the dedicated high-speed interconnect provides four-level hierarchy routing for predictable timing closure. Typical applications of the EPF10K250EFC672-1 include telecom line cards, industrial control logic, glue logic replacement, custom peripheral controllers, prototyping for ASICs, and DSP pre/post-processing. With 470 I/Os it can interface directly to wide parallel buses, memory subsystems, and backplane connectors without external bus drivers. When designing with this part, ensure signal integrity simulation on the 1.27 mm pitch BGA escapes is performed early, since the 672-ball package requires careful PCB stackup and via-in-pad or microvia technology for fan-out. Power sequencing of the 3.3 V core and I/O banks must follow the datasheet to avoid latch-up. This page synthesizes distributor stock, BGA-package alternatives, and practical PCB layout guidance for engineers maintaining legacy FLEX 10KE designs where the original Altera tooling chain (MAX+PLUS II or Quartus) remains in use.
EPF10K250EFC672-2 - 250K FLEX 10KE FPGA 672-BGA | Intel
The Intel EPF10K250EFC672-2 is a member of the FLEX 10KE family of SRAM-based, embedded-programmable logic devices, providing system-on-a-programmable-chip (SOPC) integration in a single device with 250,000 typical gates, 12,480 logic elements, and 470 user I/Os housed in a 672-ball FineLine BGA (45 x 45 mm, 1.27 mm pitch). The device integrates an enhanced embedded array of logic elements with a surrounding programmable interconnect, supporting up to 0.4 ns propagation delay at commercial 0 to 70 C operating temperature with 2.3 V core supply. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the customer can define after manufacture using a hardware description language (HDL). The hierarchy is: programmable logic block -> logic array -> FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. The FLEX 10KE family combines look-up table (LUT)-based logic with embedded array blocks (EABs) used as RAM, ROM, or FIFO, enabling SOPC designs that mix logic, memory, and DSP functions on one chip. Key features of the EPF10K250EFC672-2 include 12,480 logic elements, 20 embedded array blocks (EABs) providing up to 40,960 RAM bits, 470 user I/Os, and JTAG-compliant IEEE 1149.1 boundary-scan support. The device supports in-system programmability (ISP) via the IEEE 1149.1 interface or the dedicated configuration port, allowing field upgrades without removing the part from the board. Technically, the EPF10K250EFC672-2 uses a CMOS process with a 2.5 V core voltage, multi-volt I/O supporting 3.3 V, 2.5 V, and 1.8 V signaling, and a continuous interconnect routing architecture with FastTrack connections to minimize interconnect delay. The 672-ball FineLine BGA package provides high-density I/O suitable for complex digital designs requiring many external connections. Typical applications include high-density digital glue logic for telecommunications infrastructure, ASIC prototyping, industrial control systems with parallel DSP pipelines, and military/aerospace signal processing. The 672-BGA footprint supports designs requiring hundreds of I/O pins, making the part a common choice for legacy system upgrades and long-life industrial platforms. When designing with the EPF10K250EFC672-2, ensure proper decoupling with 0.1 uF and 10 uF capacitors placed close to the power pins. Use the Quartus (or legacy MAX+PLUS II) toolchain to capture designs; verify timing closure with the built-in timing analyzer before committing to bitstream generation. This page synthesizes distributor stock data, drop-in same-family alternatives, and design notes not collected in any single place on the manufacturer datasheet, helping sourcing engineers and FPGA designers evaluate the EPF10K250EFC672-2 against modern alternatives.
EPF10K250EFC672-3 - 250K Gates FLEX 10KE FPGA 2.5V 672-BGA | Intel
The Intel (Altera) EPF10K250EFC672-3 is a high-density member of the FLEX 10KE family of SRAM-based, in-system programmable logic devices (PLDs), integrating up to 250,000 typical gates, 12,160 logic elements (LEs), and 655,360 bits of embedded array block (EAB) RAM in a 672-ball FineLine BGA package. It operates from a 2.5 V core supply, supports JTAG-based in-system programmability, and provides 470 user I/O pins organized across eight I/O banks. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines an array of configurable logic blocks (CLBs / LEs), programmable routing channels, and block memory resources that the user can reconfigure after PCB assembly. FPGAs occupy a tier above traditional PLDs and below ASICs in the programmable-logic hierarchy: ASIC < structured ASIC < FPGA (high-end, e.g. Stratix, Virtex) < mid-range FPGA (e.g. FLEX 10KE, Cyclone) < CPLD. The FLEX 10KE family is Altera/Intel's mid-range, 2.5 V generation introduced in the late 1990s and still used in long-life-cycle industrial, telecom, and military designs where the toolchain (MAX+PLUS II / Quartus) is well understood. Key features of the EPF10K250EFC672-3 include 12,160 LEs, 655,360 bits of embedded memory (EABs), 392 LABs, multi-volt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) via bank-selectable supply rails, dedicated high-speed clock networks and phase-locked loops, JTAG (IEEE 1149.1) boundary-scan and ISP, and 470 user I/Os. The "-3" speed grade indicates the fastest commercial timing bin in the FLEX 10KE family, with internal block frequencies up to ~150 MHz in the device family. The architecture combines Logic Array Blocks (LABs) of 8 LEs each with Embedded Array Blocks (EABs) of 2,048 bits each, giving a flexible mix of distributed LUT logic and block RAM. MultiVolt I/O allows the EPF10K250E to bridge 5.0 V, 3.3 V, 2.5 V, 1.8 V and 1.5 V logic on the same die without external level shifters - critical for legacy backplane designs where multiple supply rails coexist. Typical applications include telecom line-card glue logic, industrial control backplanes, ASIC prototyping, military/aerospace (qualified per the -3 commercial grade), and PCI bridge/interface controllers where the high I/O count and EAB RAM are useful. Designers migrating from the FLEX 10K family gain roughly 2x density and 50% lower power from the 10KE process shrink to 0.25 µm / 2.5 V core. When designing with this device, ensure the 672-FBGA land pattern is correctly implemented (1.0 mm pitch per the package code) and that all four JTAG pins (TCK, TMS, TDI, TDO) plus the nCONFIG, nSTATUS, CONF_DONE and DCLK (or DATA, etc.) configuration pins are routed to accessible signals for in-system programming. The device is in-system reconfigurable but the configuration memory is volatile, so an external configuration PROM (EPC2, EPC8 or EPC16) is required for stand-alone boot. This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives with shared 672-FBGA footprint, and practical design notes not found in the manufacturer datasheet.
EPF10K250EFI672-3 - 250K Gate FLEX 10KE FPGA 672-FBGA | Intel
The Intel EPF10K250EFI672-3 is a high-density FLEX 10KE family FPGA providing up to 250,000 typical gates in a 672-ball FineLine BGA package. It integrates 470 user I/O pins, 12 embedded array blocks (EABs) with dual-port capability up to 16-bit width per EAB, and a general-purpose logic array with SRAM-based configuration cells. The device operates from a 2.5 V core supply with 5.0 V tolerant I/O and is rated for the commercial 0 °C to 70 °C temperature range. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells into a single semiconductor die. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-a-programmable-chip (SOPC) platforms, and are widely used to implement glue logic, digital signal processing, custom bus interfaces, and prototype ASIC functionality without the NRE cost of a masked gate array. The FLEX 10KE family uses a CMOS SRAM process that allows in-system reconfiguration via an industry-standard configuration interface such as ByteBlaster or JTAG. Key features of the EPF10K250EFI672-3 include up to 250,000 typical gates (over 100,000 usable logic elements), 470 user I/O pins for high pin-count designs, dual-port EABs of up to 16 Kbits each for embedded memory or multiplier functions, multiVolt I/O supporting 2.5 V and 3.3 V interfaces, and JTAG-compliant boundary-scan test. The 672-ball FineLine BGA package (1.27 mm pitch) supports board densities typical of telecom line cards and high-performance data-path designs. The architecture uses a four-input look-up table (LUT) logic element backed by continuous FastTrack interconnect, achieving tpd in the 0.4 ns class for the -3 speed grade. Each EAB can implement true dual-port RAM with independent read/write clocks, enabling FIFO and dual-buffer designs without external memory. The FLEX 10KE was historically targeted at glue-logic integration and is now commonly found in legacy equipment maintenance and industrial-control retrofits. Typical applications include telecommunications line-card interface logic, industrial machine control, custom peripheral bridges for PCI/ISA buses, and prototype ASIC replacement. With 470 user I/Os the device can sink several wide buses in parallel without external muxing. The FLEX 10KE supports EDIF 2 0 0 and 3 0 0, LPM, VHDL, and Verilog design entry through the Altera MAX+PLUS II and Quartus tool chains. When designing with this part, ensure proper decoupling with 0.1 µF ceramic capacitors close to every VCC pin and a single bulk 33 µF tantalum per supply island. The SRAM cells are volatile, so an external configuration PROM (EPC2 or EPC8) must be present on the board to load the bitstream at power-up. Operating temperature and speed-grade suffixes must match the system ambient and timing budget. This page synthesizes distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EPF10K250EGC599-1 - FLEX 10K FPGA 250K Gates 599-BPGA | Intel
The Intel (formerly Altera) EPF10K250EGC599-1 is a high-density FLEX 10K embedded array FPGA housed in a 599-ball ceramic Pin Grid Array (HIPGA / BPGA) package with a commercial temperature grade. As a member of the FLEX 10K family, it integrates up to 250,000 equivalent system gates with embedded array blocks (EABs), delivering up to 40,960 logic elements and 12,160 flip-flops in a single SRAM-based fabric. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor that lets engineers implement arbitrary digital logic through a configurable matrix of lookup tables, flip-flops, routing, and hard IP blocks. FPGAs sit at the top of the programmable logic hierarchy: ASIC < CPLD < FPGA, and are used when design flexibility, parallel processing, or rapid prototyping outweigh the per-unit cost advantages of masked ASICs. The FLEX 10K family was Altera's first embedded-array family, where each EAB provides up to 2 Kbits of dual-port RAM, blurring the boundary between FPGA and gate-array ASIC designs. Key features of the EPF10K250EGC599-1 include 470 user I/O pins, multi-voltage I/O support (5.0 V PCI-compliant operation), on-chip SRAM distributed across EABs, in-system programmability via the serial configuration EPROM interface, JTAG boundary-scan (IEEE 1149.1), and 6 dedicated clock inputs with 2 dedicated FastROW interconnects. The HIPGA-599 ceramic package supports high-pin-count designs and provides superior thermal and mechanical performance versus plastic BGA equivalents. Architecturally, the FLEX 10K family pairs a fine-grained logic element array with coarse-grained embedded array blocks, giving designers both high logic density and predictable memory throughput. Logic elements include a 4-input LUT, a programmable register, dedicated carry-chain logic, and a cascade chain. The device is fabricated on a 0.42 µm CMOS SRAM process, and configuration is volatile — design data must be loaded from an external serial or parallel EPROM at every power-up. Typical applications include telecommunications line cards, industrial control and instrumentation glue logic, ASIC prototyping, PCI bus bridges, and high-speed data-path controllers. The 470 I/O pins are sufficient to absorb wide parallel bus interfaces such as PCI, SDRAM, and legacy ISA peripherals, while the EABs handle FIFO and dual-port memory needs on-chip. When designing with this part, provide a clean 5 V supply rail and a configuration EPROM (EPC2 or compatible) on every board. Because the FLEX 10K family is mature and has been NRND since the early 2000s, engineers planning new designs should evaluate Cyclone, MAX 10, or Agilex families instead — the EPF10K250EGC599-1 is best reserved for sustaining existing production. This page synthesizes distributor pricing, drop-in ceramic-package alternatives, and FPGA-specific design notes not found in the original Altera datasheet.
EPF10K250EGC599-2 - FLEX 10KE FPGA, 250K Gates, 599-BCPGA | Intel
The Intel (Altera) EPF10K250EGC599-2 is a high-density FLEX 10KE family FPGA featuring 250,000 typical gates and 12,160 logic elements, housed in a 599-pin ceramic PGA (CPGA-599 / HIPGA-599) package. The "-2" speed grade designates a mid-range AC performance tier, while the commercial temperature grade makes this part suitable for benign-environment designs. The device integrates embedded array blocks (EABs) for memory implementation, each EAB providing 2,048 bits of RAM, and supports SRAM-based configuration with in-system programmability via the FLEX 10K family configuration interface. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacture to implement arbitrary digital logic. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) between simple CPLDs and modern high-end SoC FPGAs. The FLEX 10KE family uses a fine-grained architecture with built-in SRAM look-up tables and dedicated carry chains, placing it in the mid-1990s generation that pioneered embedded array blocks for on-chip memory. Key features include 12,160 logic elements (LEs), approximately 250,000 typical gates, 12 embedded array blocks providing up to 24,576 RAM bits, 4 phase-locked loops (PLLs) for clock management, and multi-standard I/O support. The device operates from a 5V core supply and supports JTAG boundary-scan testing per IEEE 1149.1. The CPGA-599 ceramic package provides hermetic sealing for high-reliability applications. The FLEX 10KE architecture uses a continuous SRAM-based configuration cell backed up by EPROM programming cells on each LE, enabling both in-system reprogrammability and one-time-programmable mode. Embedded array blocks implement RAM, ROM, or specialized logic functions, while the FastTrack interconnect provides predictable timing for high-speed designs. The 599-pin CPGA package supports 470 user I/O pins, which is substantial for a mid-1990s FPGA. Typical applications include telecommunications switching infrastructure, industrial control systems, military and aerospace digital logic prototypes, high-reliability embedded computing, and legacy design replacements. The FLEX 10KE family was widely adopted in network processing equipment and DSP co-processing designs during its product life. The CPGA-599 ceramic package also makes it suitable for applications requiring hermetic sealing, such as downhole oil and gas instrumentation and military field equipment. When designing with this part, verify that your synthesis tool still supports the FLEX 10KE family, since modern Intel Quartus has dropped legacy device support beyond Cyclone series. Engineers maintaining legacy designs should retain original MAX+PLUS II or Quartus II version 9.0 design databases for bitstream regeneration. Note that the EPF10K250E is a mature product approaching end-of-life - new designs should target Cyclone or MAX 10 series. This page synthesizes distributor pricing, drop-in FLEX 10KE family alternatives, and practical design notes for legacy Intel FPGAs - information not consolidated in any single manufacturer datasheet.
EPF10K250EGC599-3 - 250K Gate FLEX 10KE FPGA, 599-PGA | Intel
The Intel (formerly Altera) EPF10K250EGC599-3 is a high-density FLEX 10KE family FPGA featuring 250,000 typical gates, 12,160 logic elements (LEs), and 409,600 bits of embedded SRAM in a 599-pin Pin-Grid Array (PGA) ceramic/heat-dissipating package. Speed grade -3 indicates the standard performance bin, and the device is graded for commercial operating temperature (0C to +70C). A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines programmable logic elements, configurable interconnect, and dedicated hard IP blocks (memory, multipliers, I/O) on a single CMOS die. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) above simple PLDs (SPLDs) and complex PLDs (CPLDs), and they compete with ASICs at lower volumes and with microcontrollers/DSPs in parallelizable workloads. The FLEX 10KE family was one of Altera's flagship high-density SRAM-based families, using SRAM configuration cells that allow in-system reconfiguration via a serial or parallel configuration interface. Key features of the EPF10K250EGC599-3 include 12,160 logic elements, 12 embedded array blocks (EABs) providing 409,600 bits of dual-port RAM, a maximum of 470 user I/O pins, MultiVolt I/O supporting 3.3V/2.5V/1.8V interface standards, and a global clock network. The device is built on a 0.22-micron CMOS SRAM process with 5V tolerant I/O and operates from a 3.3V core supply. Typical applications include high-throughput digital signal processing, telecommunications backplane glue logic, industrial motion control, and legacy system upgrades where the existing PCB was designed around a 599-pin PGA footprint. Designers often migrate to surface-mount FPGAs in new designs, but the PGA package remains useful for prototyping, ruggedized environments, and aerospace/defense programs. When designing with this part, ensure the configuration PROM (typically an EPC2 or EPC16) is sized correctly for the bitstream and that the JTAG chain order is preserved. The 599-pin PGA is mechanically demanding; use a proper socket and verify pin-1 orientation before board bring-up. Plan for JTAG boundary-scan verification as a first-pass test.
EPF10K250EGI599-3 - FLEX 10KE FPGA 250K Gates 599-PGA | Intel
The Intel (formerly Altera) EPF10K250EGI599-3 is a high-density FLEX 10KE embedded-programmable logic device (PLD) featuring approximately 250,000 typical gates and 12,160 logic elements (LEs), housed in a 599-pin ceramic/ceramic-equivalent Pin Grid Array (PGA) package. The device operates from a 2.5 V core supply and is rated for the industrial temperature range (–40 °C to +85 °C), with a –3 speed grade indicating the fastest commercial/industrial performance bin for this family. What is an embedded PLD/FPGA? A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor containing an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and dedicated I/O and memory resources. The FLEX 10KE family extends the original FLEX 10K architecture by adding embedded array blocks (EABs) for synchronous RAM and ROM functions, making the family suitable for high-density glue-logic, datapath, and system-on-chip prototyping. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital semiconductor ICs. Key features include up to 12,160 logic elements, 40,960 RAM bits distributed across embedded array blocks (EABs), 488 maximum user I/O pins, and PCI-compliant I/O support. The device supports in-system configuration via passive serial, active serial, and JTAG modes, with multi-volt I/O capability for interfacing with 2.5 V, 3.3 V, and 5 V buses. The –3 speed grade delivers the shortest pin-to-pin propagation delays available in this family. The FLEX 10KE family is built on a 0.25 µm CMOS SRAM process with a 2.5 V core. Configuration data is stored in SRAM cells, requiring a configuration EPROM or controller at every power-up. The architecture combines a fine-grained logic fabric (each LE = one 4-input LUT plus a flip-flop) with coarse-grained EABs of 2,048 bits each, allowing designers to balance random logic and dense memory in a single device. Typical applications include high-speed telecommunications backplanes, industrial control and instrumentation, ASIC prototyping, DSP coprocessor interfaces, and legacy PCI-bus glue logic. The large logic capacity and rich memory resources make the EPF10K250E one of the most popular "workhorse" FPGAs of its generation, still in use in long-lifecycle industrial and military programs. Designers should note that the 599-pin PGA package is a through-hole pin-grid-array that requires a socket or plated-through-hole PCB and is not compatible with modern lead-free surface-mount reflow profiles. Configuration memory is volatile: the device loses its bitstream on every power-down and must be reconfigured at boot via an EPC configuration EPROM, a microcontroller, or JTAG. Engineers targeting new designs should consider Cyclone IV/V or MAX 10 as modern, lower-power, surface-mount alternatives. This page consolidates distributor pricing, same-brand drop-in alternatives from the FLEX 10KE family, and practical design notes not assembled in any single manufacturer datasheet, giving procurement and engineering teams a single decision-ready reference.
EPF10K30ABC356-1 - 30K Gate FLEX-10KA FPGA, 356-BGA | Intel
Intel (Altera) EPF10K30ABC356-1 is a member of the FLEX-10KA embedded programmable logic device (PLD) family, delivering 30,000 typical gates in a 356-ball LBGA package. It is built on a 3.3V SRAM-based architecture with an embedded array block (EAB) for on-chip memory and specialized megafunctions, providing system-on-a-programmable-chip (SOPC) integration. The device includes 246 user I/Os, 216 logic array blocks (LABs), and operates from a 3.0V to 3.6V supply. A field-programmable gate array (FPGA) is a type of integrated circuit designed to be configured by the customer or designer after manufacturing. FPGAs belong to the broader programmable logic device (PLD) family, which sits within the semiconductor hierarchy of logic ICs, integrated circuits, and finally electronic components. FPGAs differ from application-specific integrated circuits (ASICs) in that their function is not hard-wired at fabrication, allowing the same silicon to implement many different digital designs through configuration bitstream loading. Key features include 30,000 typical gates (119,000 maximum), 12 embedded array blocks (EABs) totaling 24 Kbits of RAM, 1,728 logic elements (LEs), 246 user I/Os, and in-system programmability through the serial passive (PS) configuration scheme. The part is specified for the commercial temperature grade and is built on a 0.42-micron CMOS process. The 356-LBGA (low-profile BGA) package has 35 mm x 35 mm body dimensions suitable for high-density PCB layouts. The FLEX-10KA architecture combines a logic array of LABs with a row of EABs. Each EAB provides 2 Kbits of dual-port RAM, allowing efficient implementation of memory-intensive functions such as FIFO buffers, lookup tables, and DSP datapaths without consuming general-purpose logic. Interconnect is provided through FastTrack continuous routing channels, which minimize interconnect delay for predictable timing closure. The device supports multiple I/O standards including 5V, 3.3V, and 2.5V LVCMOS/LVTTL for mixed-voltage system design. Typical applications include glue-logic consolidation in telecom line cards, custom peripheral interfacing for industrial controllers, prototyping bridges between legacy ASICs and microcontrollers, and DSP pre/post-processing blocks in audio and video pipelines. The device is well suited for medium-density designs in the 20K-50K gate range where the embedded memory blocks reduce overall system cost. When designing with this part, note that configuration data must be loaded from an external serial PROM (EPC1, EPC2) or via a microcontroller at every power-up because the SRAM cells are volatile. JTAG boundary-scan and programming via the ByteBlasterMV cable are supported for in-system updates. The 356-ball BGA requires PCB-level assembly with X-ray inspection of solder joints and adequate thermal relief for the commercial temperature range of 0C to +70C. This page synthesizes distributor pricing, FLEX-10KA family cross-references, and practical design notes not found in the original manufacturer datasheet.
EPF10K30AQC208-1N - 30K Gate FLEX-10KA FPGA, 208-PQFP | Altera
The Altera (Intel) EPF10K30AQC208-1N is a member of the FLEX 10KA family of Field Programmable Gate Arrays (FPGAs) housed in a 208-pin Plastic Quad Flat Pack (208-PQFP, 28x28 mm) package. The device integrates approximately 30,000 typical gates with 1,728 logic elements (LEs), 12,288 bits of embedded RAM, and 147 user I/O pins. It operates from a 3.0 V to 3.6 V core supply (commercial, 0 °C to 70 °C temperature grade) and supports in-system programmability via SRAM configuration. A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable-logic hierarchy above PLDs/CPLDs and below fixed-function ASICs, and are widely used for glue logic, prototyping, DSP, and high-speed interface bridging. The FLEX 10KA family from Altera was the industry's first embedded programmable logic family providing System-on-a-Programmable-Chip (SOPC) integration through an embedded array block (EAB) architecture, allowing designers to mix dedicated RAM/ROM with LUT-based logic on a single die. Key features of the EPF10K30AQC208-1N include 1,728 logic elements, 12 Kbits of embedded memory, 147 user I/Os, an internal frequency up to 80 MHz, and SRAM-based configuration that supports rapid prototyping and field updates. The '-1N' speed grade targets the commercial temperature range with standard timing closure. The 208-PQFP surface-mount package uses gull-wing leads, making it compatible with conventional SMT assembly lines and rework processes. The FLEX 10KA architecture combines a coarse-grained Embedded Array Block (EAB) used to implement memory and complex arithmetic functions with a fine-grained Logic Array Block (LAB) used for general-purpose logic. The EPF10K30A places 6 EABs alongside 216 LABs on a 0.42 µm CMOS process, with each LAB containing 8 LEs. This hybrid fabric is efficient for datapath-heavy designs where distributed RAM and lookup tables coexist. Typical applications for the EPF10K30AQC208-1N include telecom interface bridging, industrial control glue logic, legacy peripheral bus adaptation (PCI, ISA, VME), high-speed prototyping of ASIC replacements, and embedded memory buffering. Its 3.3 V core, 147 user I/Os, and SRAM programmability also make it attractive for educational platforms and FPGA training kits where the PQFP package simplifies hand-soldering. Designers should plan a 3.3 V rail with adequate decoupling, route 147 user I/Os across four I/O banks with consistent bank voltage references, and select the correct configuration device (EPC2 or compatible) for SRAM configuration at power-up. Compared to modern flash-based FPGAs, the EPF10K30AQC208-1N requires an external configuration memory and is not 5 V tolerant on I/Os at the core's 3.3 V CMOS levels. This page synthesizes distributor stock levels, cross-family FLEX 10KA drop-in options, application-specific companion parts, and practical design notes that go beyond what the original Altera datasheet provides alone.
EPF10K30AQC208-3 - 30K Gates FLEX-10KA FPGA, 208-PQFP | Altera
The Altera EPF10K30AQC208-3 is a member of the FLEX-10KA family of Field Programmable Gate Arrays (FPGAs) featuring 30,000 gates, 1,728 logic cells, 12,288 bits of embedded memory, and 147 user I/Os, housed in a 208-pin Plastic Quad Flat Pack (PQFP) package. It is fabricated on a 0.3 µm CMOS process, operates from a 3.3 V core supply, and is specified for commercial temperature grades with a -3 speed grade. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement arbitrary digital logic. Within the broader taxonomy, the FLEX-10KA belongs to the SRAM-lookup-table-based FPGA family, sitting between simple CPLDs and modern high-density FPGAs. It supports System-on-a-Programmable-Chip (SOPC) integration by combining embedded array blocks (EABs) for megafunctions such as efficient memory and specialized logic functions with general-purpose logic, allowing designers to implement microcontrollers, DSP functions, and glue logic on a single device. Key features of the EPF10K30AQC208-3 include 216 Logic Array Blocks (LABs) organized as 24 Logic Elements (LEs) per LAB, embedded array blocks for memory and DSP-style functions, MultiVolt I/O support for interfacing with 5.0 V, 3.3 V, 2.5 V, and 1.8 V logic without external level shifters, JTAG-based in-system programmability via IEEE 1149.1, PCI pull-up clamping diodes, slew-rate control, and open-drain output options configurable pin-by-pin through Altera logic options. The device uses Altera's Look-Up Table (LUT)-based architecture with continuous FastTrack routing, delivering predictable timing closure and supporting frequencies up to 125 MHz in this speed grade. It is supported by the legacy Altera MAX+PLUS II and Quartus design flows, although modern Quartus releases no longer include this family, and designers using this device typically retain the original MAX+PLUS II toolchain or maintain pre-generated programming files. Typical applications include telecommunications line cards, industrial control and factory automation, legacy PCI interface bridges, and embedded control logic that requires moderate gate counts with on-chip memory. The 208-PQFP package also makes the EPF10K30AQC208-3 a common choice for board-level prototyping where fine-pitch BGA packages are not practical. When designing with this device, attention should be paid to the MultiVolt I/O configuration: VCCINT must be tied to 3.3 V while VCCIO can be set independently to support mixed-voltage buses. Configuration via JTAG or a serial/configuration EPROM must also be considered; the device is volatile (SRAM-based) and loses configuration on power-down, so an external configuration memory is required for production designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Altera datasheet alone.
EPF10K30AQC208-3N - 30K Gates FLEX 10KA FPGA, 208-PQFP | Intel / Altera
The Intel / Altera EPF10K30AQC208-3N is a member of the FLEX 10KA family of SRAM-based Field-Programmable Gate Arrays (FPGAs) integrating 30,000 typical gates, 1,728 logic elements (cells) and 12,288 bits of embedded memory into a 208-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. Built on a 0.3 µm CMOS process and supplied from a 3.3 V core, the device delivers up to 125 MHz of system performance and exposes 147 user I/O pins for digital interfacing. The “-3” speed grade and the “N” lead-free suffix confirm commercial temperature operation and Pb-free assembly, while the “QC208” package code denotes the 208-pin QFP outline used across the FLEX 10KA density range. A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined by user-loaded configuration memory rather than hard-wired mask layers. FPGAs sit in the programmable-logic hierarchy between simple Complex Programmable Logic Devices (CPLDs) and high-density Application-Specific Integrated Circuits (ASICs), giving engineers hardware-reconfigurable glue logic, datapath acceleration, and bus-interface bridging without any NRE charges. The FLEX 10KA family was Intel / Altera’s first generation to embed dedicated array blocks (EABs) for efficient RAM and DSP megafunctions, marking the transition from pure glue logic to System-on-a-Programmable-Chip (SOPC) integration. Key features of the EPF10K30AQC208-3N include 216 Logic Array Blocks (LABs) organised in rows and columns, embedded array blocks for dual-port RAM and ROM, MultiVolt I/O allowing mixed-voltage interfacing on the same die, pin-controlled PCI-clamping diodes, slew-rate control, and open-drain output options. The PLICE antifuse-style configuration scheme is replaced here by an SRAM configuration cell, supporting in-system reconfigurability via the serial or parallel configuration port. The exposed MultiVolt interface simplifies bridging between 3.3 V cores and 5.0 V or 2.5 V peripherals. Typical applications include PCI bus controllers, telecommunications line cards, industrial glue logic, protocol bridging (UART, I²C, SPI bridges), legacy ASIC replacement, and parallel DSP datapath prototyping. The combination of 12 Kbit embedded memory, 147 I/Os and 125 MHz Fmax makes it well-suited to mid-density control-plane designs where cost per gate dominates over raw performance. When designing with this part, allocate the configuration PROM or microcontroller interface early in the schematic because FLEX 10KA devices do not retain their configuration when power is removed. The MultiVolt VCCIO rail must be tied before or simultaneously with VCCINT to avoid latch-up. Use the Quartus / MAX+PLUS II Legacy device libraries and observe the 208-PQFP thermal envelope (θJA ≈ 35 °C/W typical) when calculating airflow in dense line-card layouts. This page synthesises distributor pricing, drop-in same-package alternatives and practical design notes that go beyond the marketing datasheet, so procurement engineers and FPGA designers can make a confident selection.
EPF10K30AQC240-1 - 30K FLEX-10KA FPGA, 240-PQFP | Intel/Altera
The Intel (formerly Altera) EPF10K30AQC240-1 is a FLEX-10KA family Field Programmable Gate Array (FPGA) integrating 30,000 typical gates, 1,728 logic elements, and 12,288 bits of embedded SRAM in a 240-pin Plastic Quad Flat Pack (PQFP / BFQFP) package. Built on a 0.42 µm CMOS process, the device offers 189 user I/O pins, a 0.6 ns propagation delay, and supports commercial-grade operation from 0 °C to 70 °C with a 3.3 V core supply. What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit composed of an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured to implement custom digital logic. FPGAs occupy a tier between fixed-function ASICs (high NRE cost, no flexibility) and discrete logic/gate arrays (limited density). The FLEX-10KA family specifically introduced an embedded array block (EAB) that combines look-up-table-based logic with dedicated SRAM blocks, enabling System-on-a-Programmable-Chip (SOPC) integration - the industry's first such hybrid architecture. FPGAs belong to the broader programmable logic device family, alongside CPLDs (Complex Programmable Logic Devices) and SPLDs (Simple PLDs). Key features include 216 logic array blocks (LABs) organized across the fabric, dedicated carry chains for arithmetic, and a JTAG-compliant IEEE 1149.1 boundary-scan interface. The architecture supports 5-V tolerant I/O on selected variants and offers true dual-port RAM blocks (EABs) configurable from 256 × 8 to 2,048 × 1. Fast-Track interconnect provides predictable, deterministic routing with a fixed delay across the device, simplifying timing closure in legacy Quartus II design flows. Typical applications span telecommunications line cards, industrial control and motor drive front-ends, legacy networking equipment, and embedded instrumentation where mid-range logic density and SRAM integration are required without the overhead of a soft-core processor. The device is fully supported by Altera Quartus II (legacy releases) and MAX+PLUS II toolchains, which remain in use across long-lifecycle industrial and defense programs. Designers should evaluate the device's 0.6 ns pin-to-pin logic delay against system timing budgets, and confirm 3.3 V core / 5 V tolerant I/O compatibility with surrounding logic. Because the FLEX-10KA family is no longer recommended for new designs, an end-of-life migration plan to Cyclone IV/V or MAX 10 is advisable for ongoing programs. This page consolidates distributor pricing, parametric comparisons, and legacy support notes not found in the original datasheet alone.
EPF10K30AQC240-1N - 30K-Gate FLEX-10KA FPGA, 240-PQFP | Intel
The Intel (formerly Altera) EPF10K30AQC240-1N is a 30,000-gate FLEX-10KA family Field-Programmable Gate Array (FPGA) housed in a 240-pin Power Quad Flat Pack (PQFP/BFQFP) package. It integrates 1,728 logic elements (LEs) across 216 Logic Array Blocks (LABs) with 12,288 bits of embedded SRAM, providing approximately 30K typical gates of logic capacity for mid-complexity digital designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, and I/O cells on a single die. The FLEX-10KA family is the industry's first embedded PLD family, providing System-on-a-Programmable-Chip (SOPC) integration with embedded array blocks (EABs) for memory-intensive functions such as FIFOs, RAM, and ROM. FPGAs sit within the broader hierarchy of programmable logic -> PLD -> digital IC -> semiconductor. Key specifications include 189 user I/Os, a maximum internal frequency of approximately 166.67 MHz, a propagation delay of 0.6 ns, and operation from a 3.3 V supply. The device is fabricated on a 0.3 µm CMOS process and supports the commercial temperature grade (0 °C to 70 °C). It features built-in low-skew clock distribution trees, FastTrack Interconnect for predictable interconnect delays, and tri-state emulation that supports in-system debugging. The EPF10K30AQC240-1N is built on Altera's Look-Up Table (LUT)-based architecture with continuous FastTrack routing, making timing closure more predictable than segmented interconnect schemes. The embedded array blocks (EABs) can each implement 2,048 bits of RAM, enabling efficient on-chip memory for DSP-style data paths and glue-logic functions. Typical applications include telecommunications glue logic, industrial control interfaces, legacy system prototyping, and embedded controller replacement where low-to-moderate gate counts are needed. Designers often select this part for upgrading older discrete-TTL designs into a single programmable device. When designing with this FPGA, ensure your JTAG chain handles the device's boundary-scan and configuration requirements, and verify timing closure at the -1 speed grade in your synthesis tool. Quiescent power is minimized by tying unused I/Os to a defined logic level through the Quartus pin assignment file. This page synthesizes distributor pricing, drop-in speed-grade and pin-compatible alternatives, and practical design notes not found in the original Altera datasheet - data compiled as of 2026-09-11.
EPF10K30AQC240-2N - 30K Gate FLEX-10KA FPGA | Intel / Altera
The Intel / Altera EPF10K30AQC240-2N is a 30,000-gate FLEX-10KA series Field Programmable Gate Array (FPGA) with 1,728 logic cells, 12,288 bits of embedded array memory, and 189 user I/O pins, housed in a 240-pin Plastic Quad Flat Pack (PQFP/BFQFP) package. It operates from a 3.3V supply, is fabricated on a 0.3 µm CMOS process, and supports an internal maximum frequency of 142.86 MHz at commercial temperature grade (0 °C to 70 °C). An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines the density of gate arrays with user programmability. FPGAs sit at the top of the programmable logic hierarchy — above SPLDs and CPLDs — and are used to implement arbitrary digital logic, glue logic, bus interfaces, and signal processing pipelines. The FLEX-10KA family specifically introduced an embedded array block (EAB) that holds dedicated SRAM blocks for memory functions, allowing the device to act as a System-on-a-Programmable-Chip (SOPC) building block. Key features of the EPF10K30AQC240-2N include 216 Logic Array Blocks (LABs), a built-in low-skew clock distribution tree, FastTrack® Interconnect continuous routing structure for predictable interconnect delays, tri-state emulation for board-level testing, and 100 % functional factory testing. The device supports both 3.3 V and 5.0 V I/O operation through selectable I/O standards, simplifying mixed-voltage system integration with legacy logic families. The device architecture combines logic elements grouped into LABs, EAB-based memory, and a hierarchical interconnect network. The embedded array blocks are configurable as wide SRAM blocks, while the logic array blocks contain 8 logic elements each. This hybrid architecture makes the EPF10K30AQC240-2N well-suited to designs that need both random logic and small-to-medium memory functions on a single chip. Typical applications include telecom line cards, industrial control, glue logic for microprocessor systems, custom peripheral controllers, prototype ASIC development, and legacy system maintenance where the original FLEX-10KA design must be reproduced. When designing with this FPGA, engineers should plan for the older 0.3 µm CMOS process — it draws higher quiescent current than modern 65 nm / 28 nm FPGAs, and the 240-pin PQFP is a through-hole-friendly surface-mount package requiring careful thermal management at higher toggle rates.
EPF10K30AQC240-3 - 30K-Gate FLEX-10KA FPGA, 240-PQFP | Altera
The Altera EPF10K30AQC240-3 is a member of the FLEX-10KA family of SRAM-based FPGAs, delivering approximately 30,000 usable gates, 1,728 logic elements (cells), and 12,288 bits of embedded RAM in a 240-pin Plastic Quad Flat Pack (PQFP) package. According to the FLEX-10KA datasheet, this device is fabricated on a 0.3 µm CMOS process and operates from a nominal 3.3 V supply (3.0 V min, 3.6 V max), with 189 user I/O pins arranged in 216 logic array blocks (LABs). A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and programmable I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit hierarchically below ASICs in the digital design taxonomy. Unlike an ASIC, an FPGA can be reconfigured in the field after manufacture, making it ideal for prototyping, low-volume production, and designs that require post-deployment updates. The FLEX-10KA series was one of the first commercially successful "System-on-a-Programmable-Chip" (SOPC) families, integrating lookup-table-based logic with embedded array blocks (EABs) that can implement RAM, ROM, or multiplier functions. Key features of the EPF10K30AQC240-3 include 216 LABs, 189 programmable I/Os, 12,288 bits of embedded SRAM, a typical internal operating frequency around 125 MHz, and multi-voltage I/O support compatible with 3.3 V and 5 V interfaces. The "-3" speed grade designates a faster bin relative to the -1 and -2 grades, and the "C" in the part number indicates the commercial 0 °C to 70 °C temperature range. Architecturally, the FLEX-10KA device combines a fine-grained logic fabric (each LAB contains eight logic elements) with coarse-grained EABs of 2,048 bits each, allowing designers to balance random logic against memory-intensive functions in the same die. The 240-PQFP footprint (also referred to as 240-BFQFP or FQFP-240) is a gull-wing surface-mount package, suitable for reflow assembly and rework. Typical applications for the EPF10K30AQC240-3 include glue logic and bus bridging in industrial controllers, custom I/O expansion for legacy 3.3 V systems, prototype ASIC replacement, communication protocol bridging (UART, SPI, I2C, parallel buses), and educational/development platforms for HDL designers. The wide 5 V-tolerant I/O bank simplifies interfacing with TTL-era peripherals. When designing with this device, ensure that the Quartus or MAX+PLUS II toolchain version supports the FLEX-10KA family, as newer Quartus releases have dropped legacy device support. Provide clean 3.3 V power with adequate decoupling near each VCC/VCCIO pin pair, and respect the JTAG programming pinout for in-system configuration. This page synthesizes distributor pricing, verified drop-in alternatives within the FLEX-10KA family, and practical design notes not aggregated on the manufacturer datasheet.
EPF10K30AQI208-3 - FLEX 10KA FPGA, 30K Gates, 208-PQFP | Altera
The Altera (now Intel) EPF10K30AQI208-3 is a member of the FLEX 10KA family of Field-Programmable Gate Arrays, offering 30,000 typical gates, 1,728 logic elements (LEs), 12,288 RAM bits, and 147 user I/Os, all housed in a 208-pin Power Quad Flat Pack (PQFP/BFQFP) package with industrial temperature grade. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnects after manufacture. The FLEX 10KA family was Altera's first embedded programmable logic family delivering System-on-a-Programmable-Chip (SOPC) integration, combining a logic array with an embedded array block (EAB) used for memory, multipliers, or specialized functions. Architecturally, an FPGA sits within the broader category of programmable logic -> logic IC -> integrated circuit -> semiconductor. The EPF10K30AQI208-3 is fabricated on a 0.30 µm CMOS process and operates from a 3.3 V core supply. It supports a maximum internal frequency of 125 MHz and is designed for 3.3 V PCI-compliant I/O with built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990. The industrial temperature grade (-40 °C to +85 °C) makes this part suitable for harsher environments than the commercial-only EPF10K30AQC208-3 variant. Typical applications include telecommunications line cards, industrial control and factory automation, glue logic replacement for ASICs, PCI interface bridging, and legacy system upgrades where a 3.3 V, 5 V-tolerant I/O FPGA is required. Designers often select the FLEX 10KA family for new system bring-up because of its mature toolchain (Quartus), predictable timing, and long-term availability through the Altera-to-Intel transition. When designing with the EPF10K30AQI208-3, plan I/O assignments carefully because the PQFP package has limited power/ground pin count, which can constrain signal integrity for high-speed designs. Use the IEEE 1149.1 boundary-scan chain for board-level testing and consider the EPF10K30EQC208-3 (FLEX 10KE) as a drop-in migration path when higher performance or more LE capacity is needed. This page synthesizes distributor pricing, same-brand drop-in alternatives from the FLEX 10KA/10KE family, and design notes not collated in the original FLEX 10KA datasheet.
EPF10K30AQI208-3N - 30K Gates FLEX-10KA FPGA 147 I/O 208-PQFP | Altera
The Intel (formerly Altera) EPF10K30AQI208-3N is a member of the FLEX-10KA embedded programmable logic family, delivering 30,000 gates, 1,728 logic cells, and 12,288 bits of embedded SRAM in a 208-pin Plastic Quad Flat Pack (PQFP / BFQFP) surface-mount package. It provides 147 user I/O pins, operates from a 3.3 V core supply, and supports MultiVolt I/O for interfacing with 2.5 V / 3.3 V / 5 V logic rails. The device is built on a 0.30 µm CMOS SRAM process and targets glue-logic, bus-interface, and System-on-a-Programmable-Chip (SOPC) bridge functions where deterministic pin-to-pin timing is required. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (LABs), programmable interconnect, and I/O cells that the designer can re-program in-system. Within the broader taxonomy, an FPGA sits under Programmable Logic -> Logic ICs -> Integrated Circuits. FPGAs differ from CPLDs in offering larger register-rich logic capacity and embedded memory, while sharing with CPLDs the ability to implement arbitrary digital state machines, glue logic, and bus bridges without a custom ASIC. Key features of the EPF10K30AQI208-3N include 216 Logic Array Blocks (LABs), per-pin slew-rate control, PCI pull-up clamping diodes, and open-drain output options, all configured via Altera logic options in the MAX+PLUS II / Quartus toolchains. The device supports in-system programmability via an industry-standard passive serial (PS) or passive parallel asynchronous (PPA) configuration interface, allowing field upgrades without removing the part. Embedded array blocks (EABs) provide efficient on-chip memory for FIFO, ROM, and dual-port RAM functions. The EPF10K30AQI208-3N uses a four-level hierarchical interconnect structure that combines fast row/column channels with local LAB interconnect, delivering predictable timing closure for designs in the 40-80 MHz internal performance range. The 12,288-bit embedded SRAM (organized as 6 EABs of 2,048 bits each) is suitable for small buffers, register files, and look-up-table based arithmetic. MultiVolt I/O lets each output bank independently run at 2.5 V, 3.3 V, or 5 V while the core stays at 3.3 V, simplifying mixed-voltage designs. Typical applications include legacy telecom line-card glue logic, industrial control backplane bridges, PCI bus interface controllers, parallel-to-serial protocol converters, and instrumentation front-ends that need deterministic timing. Because the part is mature and well-documented, it is also common in long-lifecycle defense, medical, and aerospace programs that have already validated the silicon in their BOM. A critical design consideration when migrating from the EPF10K30AQI208-3N is that the FLEX-10KA family is no longer in active production and the part is now sourced from the obsolete / last-time-buy channel. New designs should consider Cyclone IV or Cyclone V equivalents unless pin-for-pin compatibility is mandatory. Existing boards can be re-qualified with EPF10K30AQC208-3N (commercial grade) or EPF10K30AQC208-1N (slower speed grade) as drop-in 208-PQFP substitutes with identical pinout. This page synthesizes distributor pricing, drop-in 208-PQFP alternatives, and practical FPGA design notes not found in a single manufacturer datasheet.