EPF10K20TI144-4U - FLEX 10K FPGA, 20K Gates, 144-TQFP | Intel / Altera
N.º da peça: EPF10K20TI144-4U ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.2 | $1.920,00 |
| 500 | $15.4 | $7.700,00 |
| 1.000 | $12.85 | $12.850,00 |
EPF10K20TI144-4U Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing programmable logic blocks, interconnect, and I/O cells that the user configures after manufacture. Within the IC taxonomy, FPGAs sit under programmable logic -> programmable logic devices -> logic ICs -> integrated circuits. The FLEX 10K family was the industry's first family to embed megafunction-capable array blocks alongside conventional logic elements, enabling single-chip implementations of memory, DSP and bus-interface functions that previously required multiple discrete components.
Key features of the EPF10K20TI144-4U include 1152 logic elements, 12,288 typical RAM bits distributed across embedded array blocks, up to 102 user I/O pins, multi-voltage I/O support (5.0 V PCI-compliant and 3.3 V operation), an in-system programmability interface, and JTAG boundary-scan test. The 144-pin TQFP (1.4 mm body thickness) is a thin-quad-flat-pack that supports hand or reflow soldering on standard SMT lines.
Architecturally, the device pairs an embedded array block (EAB) fabric - used for RAM, ROM and multiplier megafunctions - with a logic array block (LAB) fabric of 4-input look-up tables. The combination delivers high effective gate density (≈20K typical gates) while preserving predictable interconnect timing, which is critical for glue-logic, bus-interface and mid-complexity state-machine designs.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, prototype ASIC replacement, motor-control and instrumentation front-ends, and embedded control in harsh-temperature environments where commercial-grade parts are unsuitable. Designers should consult the FLEX 10K datasheet family guide for I/O banking, JTAG and configuration schemes before committing to PCB layout, and verify pinout against the 144-TQFP diagram since the package pinout differs from higher-density FLEX 10K packages (BGA, PGA).
Alternativas drop-in para EPF10K20TI144-4U — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K20TI144-4U (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Typical Gates, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K20TI144-4N
✅ Drop-In✓ Em estoque
$19.95 / unidade
Ver ficha técnica →EPF10K20TI144-4
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF10K20TC144-4
✅ Drop-In✓ Em estoque
$18.95 / unidade
Ver ficha técnica →EPF10K20TC144-4N
✅ Drop-In✓ Em estoque
$52 / unidade
Ver ficha técnica →EPF10K20TC144-3
✅ Drop-In✓ Em estoque
$21.1 / unidade
Ver ficha técnica →EPF10K10TI144-4
✅ Drop-In✓ Em estoque
$2.95 / unidade
Ver ficha técnica →EPF10K20TI144-4U Classificações máximas e características elétricas
| Family | FLEX 10K |
| Series | FLEX-10K |
| Logic Elements | 1152 |
| Typical Gates | 20,000 gates |
| Embedded RAM Bits | 12,288 bits |
| User I/Os | 102 |
| Encapsulamento | 144-TQFP |
| Speed Grade | -4 |
| Process Technology | 0.42 µm CMOS |
| Tensão de alimentação | 5 V |
| Tipo de montagem | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires configuration device) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
Configuração de pinos do EPF10K20TI144-4U
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | VCCINT — Core supply voltage (5 V) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | I/O — User I/O (bank 1) |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | VCCIO — I/O bank 1 supply voltage |
| Pino 18 | I/O — User I/O (bank 1) |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | I/O — User I/O (bank 1) |
| Pino 22 | I/O — User I/O (bank 1) |
| Pino 23 | GND — Ground |
| Pino 24 | I/O — User I/O (bank 1) |
| Pino 25 | I/O — User I/O (bank 1) |
| Pino 26 | I/O — User I/O (bank 1) |
| Pino 27 | I/O — User I/O (bank 1) |
| Pino 28 | I/O — User I/O (bank 1) |
| Pino 29 | I/O — User I/O (bank 1) |
| Pino 30 | TDI — JTAG test data input |
| Pino 31 | TMS — JTAG test mode select |
| Pino 32 | TCK — JTAG test clock |
| Pino 33 | nCONFIG — Configuration control (active-low) |
| Pino 34 | VCCINT — Core supply voltage (5 V) |
| Pino 35 | MSEL0 — Configuration mode select 0 |
| Pino 36 | MSEL1 — Configuration mode select 1 |
| Pino 37 | GND — Ground |
| Pino 38 | nSTATUS — Configuration status (active-low) |
| Pino 39 | CONF_DONE — Configuration done indicator |
| Pino 40 | DCLK — Configuration clock |
| Pino 41 | DATA0 — Configuration data input 0 |
| Pino 42 | I/O — User I/O (bank 2) |
| Pino 43 | I/O — User I/O (bank 2) |
| Pino 44 | I/O — User I/O (bank 2) |
| Pino 45 | VCCIO — I/O bank 2 supply voltage |
| Pino 46 | I/O — User I/O (bank 2) |
| Pino 47 | I/O — User I/O (bank 2) |
| Pino 48 | I/O — User I/O (bank 2) |
| Pino 49 | I/O — User I/O (bank 2) |
| Pino 50 | I/O — User I/O (bank 2) |
| Pino 51 | GND — Ground |
| Pino 52 | I/O — User I/O (bank 2) |
| Pino 53 | I/O — User I/O (bank 2) |
| Pino 54 | I/O — User I/O (bank 2) |
| Pino 55 | I/O — User I/O (bank 2) |
| Pino 56 | I/O — User I/O (bank 2) |
| Pino 57 | I/O — User I/O (bank 2) |
| Pino 58 | VCCIO — I/O bank 2 supply voltage |
| Pino 59 | I/O — User I/O (bank 2) |
| Pino 60 | I/O — User I/O (bank 2) |
| Pino 61 | I/O — User I/O (bank 2) |
| Pino 62 | I/O — User I/O (bank 2) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O — User I/O (bank 2) |
| Pino 65 | I/O — User I/O (bank 2) |
| Pino 66 | I/O — User I/O (bank 2) |
| Pino 67 | I/O — User I/O (bank 2) |
| Pino 68 | I/O — User I/O (bank 2) |
| Pino 69 | I/O — User I/O (bank 2) |
| Pino 70 | VCCINT — Core supply voltage (5 V) |
| Pino 71 | I/O — User I/O (bank 3) |
| Pino 72 | I/O — User I/O (bank 3) |
| Pino 73 | I/O — User I/O (bank 3) |
| Pino 74 | I/O — User I/O (bank 3) |
| Pino 75 | I/O — User I/O (bank 3) |
| Pino 76 | VCCIO — I/O bank 3 supply voltage |
| Pino 77 | I/O — User I/O (bank 3) |
| Pino 78 | I/O — User I/O (bank 3) |
| Pino 79 | I/O — User I/O (bank 3) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O (bank 3) |
| Pino 82 | I/O — User I/O (bank 3) |
| Pino 83 | I/O — User I/O (bank 3) |
| Pino 84 | I/O — User I/O (bank 3) |
| Pino 85 | I/O — User I/O (bank 3) |
| Pino 86 | I/O — User I/O (bank 3) |
| Pino 87 | I/O — User I/O (bank 3) |
| Pino 88 | VCCIO — I/O bank 3 supply voltage |
| Pino 89 | I/O — User I/O (bank 3) |
| Pino 90 | I/O — User I/O (bank 3) |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | I/O — User I/O (bank 4) |
| Pino 95 | I/O — User I/O (bank 4) |
| Pino 96 | I/O — User I/O (bank 4) |
| Pino 97 | I/O — User I/O (bank 4) |
| Pino 98 | VCCINT — Core supply voltage (5 V) |
| Pino 99 | I/O — User I/O (bank 4) |
| Pino 100 | I/O — User I/O (bank 4) |
| Pino 101 | I/O — User I/O (bank 4) |
| Pino 102 | I/O — User I/O (bank 4) |
| Pino 103 | VCCIO — I/O bank 4 supply voltage |
| Pino 104 | I/O — User I/O (bank 4) |
| Pino 105 | I/O — User I/O (bank 4) |
| Pino 106 | GND — Ground |
| Pino 107 | I/O — User I/O (bank 4) |
| Pino 108 | I/O — User I/O (bank 4) |
| Pino 109 | I/O — User I/O (bank 4) |
| Pino 110 | I/O — User I/O (bank 4) |
| Pino 111 | I/O — User I/O (bank 4) |
| Pino 112 | TDO — JTAG test data output |
| Pino 113 | I/O — User I/O (bank 4) |
| Pino 114 | I/O — User I/O (bank 4) |
| Pino 115 | VCCINT — Core supply voltage (5 V) |
| Pino 116 | I/O — User I/O (bank 5) |
| Pino 117 | I/O — User I/O (bank 5) |
| Pino 118 | I/O — User I/O (bank 5) |
| Pino 119 | I/O — User I/O (bank 5) |
| Pino 120 | VCCIO — I/O bank 5 supply voltage |
| Pino 121 | I/O — User I/O (bank 5) |
| Pino 122 | I/O — User I/O (bank 5) |
| Pino 123 | I/O — User I/O (bank 5) |
| Pino 124 | I/O — User I/O (bank 5) |
| Pino 125 | GND — Ground |
| Pino 126 | I/O — User I/O (bank 5) |
| Pino 127 | I/O — User I/O (bank 5) |
| Pino 128 | I/O — User I/O (bank 5) |
| Pino 129 | I/O — User I/O (bank 5) |
| Pino 130 | I/O — User I/O (bank 5) |
| Pino 131 | I/O — User I/O (bank 5) |
| Pino 132 | VCCIO — I/O bank 5 supply voltage |
| Pino 133 | I/O — User I/O (bank 5) |
| Pino 134 | I/O — User I/O (bank 5) |
| Pino 135 | I/O — User I/O (bank 5) |
| Pino 136 | GND — Ground |
| Pino 137 | I/O — User I/O (bank 5) |
| Pino 138 | I/O — User I/O (bank 5) |
| Pino 139 | I/O — User I/O (bank 5) |
| Pino 140 | I/O — User I/O (bank 5) |
| Pino 141 | I/O — User I/O (bank 5) |
| Pino 142 | I/O — User I/O (bank 5) |
| Pino 143 | VCCINT — Core supply voltage (5 V) |
| Pino 144 | I/O — User I/O (bank 5) |
Aplicações típicas
EPF10K20TI144-4U é adequado para 6 aplicaçãos: Industrial Control & PLC I/O Expansion, Telecom Line-Card Glue Logic, ASIC Replacement / Prototype Emulation, Motor Control & Drive Front-End, Test & Measurement Instrumentation, Legacy Retrofit & Industrial Modernization.
Industrial Control & PLC I/O Expansion
The EPF10K20TI144-4U's industrial -40 °C to +85 °C temperature range, 102 user I/Os and 1152 logic elements make it well suited for PLC I/O expansion modules and discrete-control front-ends in factory-automation lines. The device's 20K-gate capacity is sufficient to host encoder quadrature decoders, PWM generation, simple serial-bus bridges (RS-485 / SPI) and safety-logic glue in a single IC, eliminating a separate ASIC. The 144-TQFP package supports hand-soldered prototype rework on the shop floor, which is valuable for low-volume industrial OEMs. Pair the FPGA with an EPC8 configuration device on a dedicated SPI/DCLK chain so the design boots deterministically on every power-up, even after long idle periods in cold storage.
Recomendado
Telecom Line-Card Glue Logic
Telecommunications line cards frequently require mid-complexity glue logic to bridge parallel backplanes, deserialize high-speed serial links, and fan out clock-domain crossing signals - tasks well matched to the EPF10K20TI144-4U's 1152 logic elements and 12,288-bit embedded RAM. Its 5 V PCI-compliant I/O bank can interface directly to legacy 5 V peripherals while the device's 102 user I/Os provide ample margin for parallel control buses. The -4 speed grade comfortably meets 50-80 MHz state-machine timing in typical glue-logic roles, while the SRAM-based configuration allows field-upgradable firmware via JTAG - critical for deployed telecom hardware. Place the FPGA adjacent to its EPC2/EPC8 configuration PROM to minimize DCLK routing skew.
Recomendado
ASIC Replacement / Prototype Emulation
The EPF10K20TI144-4U is an ideal ASIC replacement during prototype and low-volume production phases, allowing designers to validate system architecture before committing to a masked ASIC. Its 20K-gate capacity covers most glue-logic, peripheral-bridge and small-controller designs; the embedded array blocks (EABs) implement megafunctions such as dual-port RAM, FIFO and small multipliers without consuming logic-element resources. Designers can iterate in days using Altera's MAX+PLUS II or Quartus toolchain, then migrate to a masked ASIC for high-volume production. The 144-TQFP package is hand-rework friendly, which speeds board bring-up cycles during prototype phases.
Recomendado
Motor Control & Drive Front-End
In motor-control and variable-frequency drive front-ends, the EPF10K20TI144-4U generates the PWM patterns, decodes encoder feedback and runs the speed/current control loops at the necessary update rates. Its 1152 logic elements and 12,288-bit embedded RAM comfortably host field-oriented control (FOC) state machines, SVPWM modulators and encoder quadrature decoders. The industrial temperature grade and 5 V tolerance suit inverter-stage electronics where nearby switching nodes introduce temperature swings and ground-bounce transients. Use the dedicated JTAG chain for in-system tuning of PWM dead-time and PI-controller coefficients during drive commissioning.
Recomendado
Test & Measurement Instrumentation
The EPF10K20TI144-4U's 12,288-bit embedded RAM, dual-clock logic-array blocks and 102 user I/Os make it suitable for digital-storage oscilloscope trigger engines, logic-analyzer pattern generators and bench-top protocol analyzers. Designers can implement high-speed state machines, custom trigger sequences and on-the-fly data-width conversion without external memory, while the SRAM-based configuration lets vendors ship field-upgradable trigger libraries via JTAG. The 5 V I/O tolerance simplifies interfacing with legacy bench equipment that uses 5 V CMOS levels, and the 144-TQFP package supports mixed-signal PCB layouts where thermal management matters.
Recomendado
Legacy Retrofit & Industrial Modernization
For legacy equipment modernization programs, the EPF10K20TI144-4U serves as a drop-in replacement for older FLEX 10K, MAX 7000 and APEX 20K devices that are no longer repairable, while preserving the original PCB land pattern and JTAG test infrastructure. Its pin-compatibility with EPF10K20TC144-4N, EPF10K10TI144-4 and other 144-TQFP FLEX 10K variants (per Site MPN list) means retrofit boards can be re-qualified without respinning the layout. The SRAM-based configuration and Altera JTAG chain also allow modern diagnostic firmware to be loaded onto existing boards, extending equipment service life by years.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K20TI144-4U — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K20TI144-4N | EPF10K20TC144-4 | EPF10K20TC144-3 | EPF10K10TI144-4 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-TQFP | 144-TQFP | 144-TQFP | 144-TQFP | 144-TQFP |
| Logic Elements | 1152 | 1152 | 1152 | 1152 | 720 (10K gates) |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 | 10,000 |
| Embedded RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 6,144 |
| Speed Grade | -4 | -4 | -4 | -3 (slower) | -4 |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Commercial (0 °C to +70 °C) | Industrial (-40 °C to +85 °C) |
| User I/Os | 102 | 102 | 102 | 102 | 102 |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Principais diferenciais
- Industrial temperature grade (U suffix) (vs EPF10K20TI144-4N)
- Same-die -4 speed grade for timing-critical designs (vs EPF10K20TC144-3)
- 20K-gate capacity in 144-TQFP industrial grade (vs EPF10K10TI144-4)
Notas de projeto
The EPF10K20TI144-4U requires a stable 5.0 V core supply (VCCINT) and a separately decoupled VCCIO rail per I/O bank. Per the FLEX 10K datasheet, each VCCINT pin should be bypassed with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, plus a 10 µF tantalum bulk capacitor near the package. The I/O banks (VCCIO) can each be powered at 3.3 V or 5.0 V independently to support mixed-voltage interfacing; bypass each VCCIO pin identically. Sequence the supplies so VCCINT is established before VCCIO if 5 V I/O is used with a 3.3 V core logic family in adjacent banks, to prevent back-powering through I/O clamping diodes.
Place the EPC8 or EPC2 configuration PROM as close as physically possible to the DCLK, nCONFIG, nSTATUS, CONF_DONE and DATA0 pins of the EPF10K20TI144-4U. Routing these traces over 25 mm introduces timing skew that can cause configuration failures at cold temperature. Per Altera's FLEX 10K hardware reference, keep the JTAG chain (TDI/TDO/TMS/TCK) under 150 mm total and add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on JTAG TMS per IEEE 1149.1. Maintain a continuous ground plane under the TQFP-144 paddle area for thermal dissipation; the device can dissipate up to 1.5 W at 100 % logic utilization.
Do not assume that the EPF10K20TI144-4U is electrically compatible with later Cyclone devices on the same TQFP-144 footprint - the JTAG, configuration and power schemes differ fundamentally. Per the FLEX 10K datasheet, configuration data is loaded synchronously from an external PROM using DCLK; Cyclone IV/10 LP devices use active serial (AS) mode with EPCQ PROMs, which is NOT compatible with EPC8/EPC2 timing. Also note that the FLEX 10K device is volatile (SRAM-based), so the configuration must reload on every power-up; a missing or improperly programmed EPC8 will leave the device unconfigured with all I/Os tri-stated.
When driving long PCB traces or external cables, configure EPF10K20TI144-4U outputs with the slowest slew-rate setting in the Quartus / MAX+PLUS II assignment editor to limit ground bounce and EMI. Per the FLEX 10K datasheet, the device supports 2.5-3.3-5.0 V I/O standards with PCI-compliant drive strength; use PCI drive only on signals that require it, since high-strength outputs inject switching noise into adjacent analog sections. Add 22-33 Ω series-termination resistors on clock outputs and high-speed (>50 MHz) control signals to dampen reflections on traces longer than 50 mm.
Informações de conformidade
RoHS and lead-free status not consistently documented across distributor listings for the EPF10K20TI144-4U; Altera's FLEX 10K family predates widespread RoHS adoption. Request lot-specific material declaration from the supplier before integration into a RoHS-mandated product. AEC-Q100 is not applicable as the device is not marketed as automotive-qualified.
