FPGA & CPLD
Produtos (6666)
M2GL005-FG484 - 6K LEs, 209 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL005-FG484 is an IGLOO2 low-density flash FPGA with 6,060 logic elements, 209 user I/O, and a 484-BGA package. The device operates from a 1.2 V core supply and is supplied in a 23 mm × 23 mm, 1.0 mm-pitch surface-mount package according to the verified product listings. It targets general-purpose programmable logic, I/O expansion and conversion, system management, secure connectivity, communications, industrial, medical, defense, and aviation applications. An FPGA is a programmable semiconductor containing configurable logic, memory, and programmable I/O. Within the product hierarchy, the M2GL005-FG484 is a field-programmable gate array, a low-density FPGA, and a member of Microchip's IGLOO2 family. Its flash-based configuration allows the device to retain its programmed logic after power is removed, reducing the need for external configuration memories in standalone control or bridging systems. The verified data identifies 209 user I/O and 6,060 logic elements, providing substantial interface density for conversion, bridging, control, and system-management functions. The FG484 package supports high-pin-count board layouts while keeping the component compact at 23 mm × 23 mm. Compared with a smaller FPGA package, the principal advantage is I/O accessibility; compared with a larger FPGA, the M2GL005 provides a lower logic capacity and a simpler implementation target. Microchip positions IGLOO2 devices for bridging functions, I/O expansion and conversion, system management, secure connectivity, Gigabit Ethernet or dual PCI Express control planes, and video or image processing. These applications benefit from deterministic hardware logic, parallel interface handling, and reconfigurable hardware that can be updated without replacing the assembled board. The 1.2 V core supply makes board-level power design sensitive to ripple, sequencing, and decoupling. A 484-BGA device also demands careful escape routing, multilayer PCB construction, and thermal-aware via distribution. The M2GL005-FG484 is therefore appropriate for engineers who need a large, configurable I/O surface in a low-density, nonvolatile FPGA rather than the larger programmable resources of a high-end FPGA. This page combines verified distributor availability, manufacturer application positioning, same-package alternatives, and practical design considerations for evaluating the Microchip M2GL005-FG484 in communications, industrial, medical, defense, and aviation systems.
M2GL005-TQ144 6K IGLOO2 Flash FPGA | Microchip
The Microchip Technology M2GL005-TQ144 is a low-density IGLOO2 flash field-programmable gate array with 6,060 logic elements, 1.2 V operation, and a 144-pin TQFP package. It is designed for general-purpose programmable logic, bridging, I/O expansion, signal conversion, and system-management functions. An FPGA is a programmable semiconductor whose logic fabric can be configured after manufacture. Within the product hierarchy, the M2GL005-TQ144 is an IGLOO2 device, then a low-density flash FPGA, then a programmable-logic IC and semiconductor. Its flash configuration memory allows the device to retain its programmed configuration, while its programmable I/O and logic resources support interfaces that would otherwise require multiple fixed-function components. The verified product data identifies 6,060 FPGA cells, a 1.2 V core voltage, and a 144-pin LQFP/TQFP package. The related M2GL005 comparison data also identifies 703 Kbit of fabric RAM and 128 Kbit of embedded nonvolatile memory for the M2GL005 family. Exact device-specific operating-temperature, I/O-standard, speed-grade, and electrical details should be confirmed in the Microchip IGLOO2 datasheet before release to production. Compared with an equivalent CPLD, the IGLOO2 architecture provides substantially greater logic capacity and flexible routing for multi-block control logic. It is suitable for communications, industrial, and embedded applications where parallel interfaces, protocol bridging, acquisition support, or supervisory logic must be consolidated into one programmable device. Typical implementations include dual PCI Express control-plane functions, Gigabit Ethernet bridging, serial-to-parallel data conversion, I/O expansion, and centralized system management. The 144-pin package provides a practical balance between programmable I/O availability and board-space requirements for compact embedded systems. For layout, follow the Microchip IGLOO2 pin and package documentation for bank assignments, pin constraints, and supported voltage standards. Configuration, programming, JTAG, and power-up behavior must also be checked against the system clocking and reset architecture rather than inferred from the distributor listing.
M2GL005-VF256 - IGLOO2 5K FPGA, 256-BGA | Microchip
The Microchip Technology M2GL005-VF256 is an IGLOO2 flash field-programmable gate array with 5K logic elements, 161 I/O, and a 256-LFBGA package. The verified distributor record identifies the device as an IGLOO2 FPGA and provides the 256-LFBGA package designation. Its programmable logic resources support general-purpose bridging, I/O expansion and conversion, system management, secure connectivity, and embedded control functions. An FPGA is a reconfigurable semiconductor in the programmable-logic and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic, programmable interconnect, and configurable I/O in one device. This makes it useful when interfaces, control sequences, or product requirements evolve faster than fixed hardware can be changed. The M2GL005-VF256 is positioned as a low-density IGLOO2 device. The verified product page identifies IGLOO2 FPGAs for communications, industrial, medical, defense, and aviation markets, including functions such as Gigabit Ethernet or dual PCI Express control planes, bridging, I/O expansion and conversion, video and image processing, system management, and secure connectivity. The exact logic-cell count, voltage, speed grade, memory, package dimensions, and temperature grade for this exact suffix are not provided in the verified excerpts. Because the MPN suffix identifies the device ordering configuration, engineers should confirm the full electrical, pin, package, and temperature details in the manufacturer IGLOO2 datasheet and package documentation before release to production. The verified cross-reference results also identify the IGLOO2 pin-information user guide and the board and layout design guidelines as relevant design references. Typical uses include protocol bridging, industrial control, communications interfaces, image or video processing, and embedded system-management logic. The 256-LFBGA package favors compact designs but requires careful ball assignment, power planning, signal-integrity review, and thermal assessment. A board-level design should follow Microchip application note AN4153, which describes PCB design guidance for SmartFusion 2 and IGLOO2 devices. This page combines the verified Microchip product identity, distributor package information, official datasheet references, and design-document links into an application-oriented record. Exact electrical ratings and commercial pricing remain marked for validation because the supplied data does not provide those values.
M2GL005-VF400 - 6K-Logic Cell IGLOO2 FPGA | Microchip
Microchip Technology M2GL005-VF400 is an IGLOO2 low-density flash field-programmable gate array with 6,060 logic cells, 169 I/O, a 1.2 V core, and a 400-LFBGA package. It is designed for compact programmable logic, I/O expansion, protocol bridging, interface conversion, system management, and secure connectivity applications. The device uses nonvolatile configuration memory, allowing its programmed logic configuration to be retained without a separate external configuration PROM. An FPGA is a programmable semiconductor in the broader logic-device hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic, memory resources, programmable I/O, and embedded control logic on one semiconductor die. The IGLOO2 family combines low-density logic capacity with nonvolatile flash configuration and is positioned below larger FPGAs used for high-channel-count processing or complex system-on-chip integration. Verified listings identify M2GL005-VF400 as an IGLOO2 FPGA containing 6,060 cells, 169 I/O, a 400-LFBGA package, and a 1.2 V supply. Its 400-pin package provides a high pin count relative to its logic density, making it useful when a design needs substantial parallel I/O, interface signaling, or control connectivity. The Microchip product family is specifically described for general-purpose bridging, I/O expansion and conversion, system management, and secure connectivity functions across communications, industrial, medical, defense, and aviation markets. The M2 prefix identifies the IGLOO2 family, while the 005 suffix identifies the smallest 6,060-cell member shown in the verified product data. The VF400 ordering code denotes the verified 400-LFBGA package arrangement. Exact timing, static-power, dynamic-power, supported I/O standards, temperature grade, and electrical limits must be selected from the manufacturer datasheet using the complete ordering code; those values were not supplied in the retrieved source text and are therefore not inferred here. Typical design roles include protocol-interface bridges, parallel-to-serial data collection, programmable I/O expansion, embedded system supervision, industrial control logic, and low-power communications infrastructure. An FPGA-based bridge is useful when fixed logic would require multiple interface translators or glue devices. Consolidating those functions into configurable logic can reduce component count and allow firmware-driven changes, but designers must budget I/O placement, timing closure, configuration checks, bank-voltage planning, and PCB-routing resources. The most important design consideration is exact migration control. Microchip's IGLOO2 VF400 packaging supports footprint-oriented design work, but pin features, bank assignments, voltage compatibility, and available I/O functions must be compared before replacing another device. Use Microchip application note AN4153 and the IGLOO2 pin-information document as supplemental PCB and pin-planning references. This page combines verified distributor data, manufacturer resources, package details, and migration guidance rather than estimating unreported electrical values.
M2GL010-FG484 - 12K LEs, 233 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-FG484 is an IGLOO2 low-density flash field-programmable gate array with 12,084 logic elements, 933,888 RAM bits, and 233 I/Os in a 484-FPBGA package. It operates from a 1.14 V to 2.625 V supply and supports an industrial junction-temperature range of 0°C to 85°C. The device is intended for general-purpose programmable logic, bridging, I/O expansion and conversion, system management, secure connectivity, Gigabit Ethernet, and dual PCI Express control-plane functions. An FPGA is a reconfigurable digital semiconductor whose programmable logic blocks, registers, memory, and I/O can be configured after manufacture. The IGLOO2 family belongs to the broader FPGA and CPLD hierarchy and combines nonvolatile flash configuration storage with reusable logic fabric. This makes the M2GL010-FG484 suitable for prototypes and production systems requiring deterministic parallel processing, flexible interface logic, and field-reprogrammability without using a mask change. The verified device data identifies 233 input/output terminals, 12,084 logic elements, 933,888 total RAM bits, a 1.2 V nominal operating supply, and a 23 mm by 23 mm FPBGA package. Its 484-ball grid-array package supports high pin density for complex designs with numerous external interfaces. The M2GL010-FG484 is surface mounted and supplied in a tray according to the manufacturer product data. The IGLOO2 architecture is designed for communications, industrial, medical, defense, and aviation applications. Its 12K logic-element density provides substantially more capacity than a small CPLD, while flash-based configuration supports stable field updates. The device can implement protocol bridges, I/O expansion, image and video processing, control-plane logic, and secure-connectivity functions when paired with suitable external interfaces and memory. A principal design consideration is the large BGA escape-routing requirement. A PCB with 484 package balls requires careful layer-stack planning, via placement, and power delivery to preserve signal integrity and effective thermal performance. Designers should also verify speed grade, temperature grade, configuration requirements, supported I/O standards, and the exact pin assignments of the selected board revision before release. This page consolidates verified distributor availability, manufacturer family information, technical specifications, replacement analysis, and practical PCB guidance. It also distinguishes the exact M2GL010-FG484 ordering code from related IGLOO2 device variants so procurement teams can avoid package, temperature-grade, or speed-grade substitutions that are not drop-in equivalents.
M2GL010-TQ144 - 12K-LE FPGA, 84 I/O, 144-TQFP | Microchip
The Microchip Technology M2GL010-TQ144 is a low-density IGLOO2 flash FPGA with 12,084 logic elements, 84 user I/O pins, 933,888 bits of RAM, and a 144-pin TQFP package. The device operates from a 1.2 V core supply and is designed for low-cost, low-power programmable logic applications that benefit from nonvolatile configuration memory. Its 20 mm by 20 mm surface-mount package provides 84 usable I/O for bridging, interface conversion, control, and general-purpose logic consolidation. An FPGA is a programmable semiconductor whose internal digital logic, memory, and I/O are configured after manufacture. Within the product hierarchy, the M2GL010-TQ144 is an FPGA and CPLD, a programmable-logic device, and a semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA allows design changes to be implemented through configuration files rather than a new mask set. The IGLOO2 family is positioned for cost-sensitive, high-volume embedded designs. The key features are 12,084 logic elements, 84 user I/O, 933,888 bits of RAM, and flash-based configuration. These resources support parallel data acquisition, protocol bridging, I/O expansion, system management, and secure-connectivity control functions. The 1.2 V operating supply reflects the low-voltage core architecture, while the 144-TQFP package offers a familiar surface-mount assembly option. Internally, the IGLOO2 architecture combines programmable logic with embedded memory and dedicated I/O resources. Its nonvolatile flash configuration retains the programmed logic image without relying on a separate configuration PROM after power-up. This integration simplifies board design when a system requires both programmable logic and compact implementation. Typical applications include industrial bridging functions, input/output expansion, data-conversion control, communications support, embedded system management, and low-power control planes. The 84 available I/O make the device especially useful when an existing architecture has accumulated discrete glue logic that must be consolidated into one programmable component. PCB planning should preserve the package-specific pin and thermal layout, validate all I/O standards against the selected bank supplies, and follow Microchip's programming and power-sequencing guidance. Because detailed pin names, timing, and temperature-grade information are not present in the supplied source text, those values should be confirmed in the official IGLOO2 pin-information and datasheet documents before layout release.
M2GL010-VF256 - 12K Logic Elements IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VF256 is an IGLOO2 flash field-programmable gate array with 12,084 logic elements, 138 I/O, and approximately 0.93 Mbit of embedded memory in a 256-pin LFBGA package. The device combines programmable logic, SRAM, embedded flash configuration memory, and extensive user I/O in a single low-density FPGA suited to bridging, I/O expansion, protocol conversion, system management, and secure connectivity. What is an FPGA? A field-programmable gate array is a programmable-logic semiconductor whose lookup tables, flip-flops, routing, memory blocks, and I/O can be configured after fabrication. The IGLOO2 family belongs to the broader hierarchy of programmable-logic devices and is especially useful for low-density designs requiring nonvolatile configuration, deterministic control, flexible interface support, and a compact implementation without a discrete microcontroller. Key verified features include 12,084 logic elements, 138 I/O, approximately 0.93 Mbit of embedded memory, a 1.2 V core, and a 256-pin LFBGA package. The IGLOO2 architecture supports general-purpose functions such as data bridging, input/output expansion and conversion, video or image processing, system management, and secure connectivity. Its nonvolatile embedded flash allows the configured design to be retained without relying on an external configuration memory device. Technically, the M2GL010-VF256 integrates programmable logic resources and dedicated SRAM into a flash-based FPGA architecture. The 138 available I/O make it appropriate for designs requiring parallel interfaces, control signals, or external bus logic, while approximately 0.93 Mbit of RAM can support packet buffering, data transformation, and stateful control functions. Configuration, programming, boundary scan, and system-management functions must be implemented according to Microchip's IGLOO2 programming and pin-description documentation. Typical applications include industrial protocol bridges, communications infrastructure, medical equipment, defense and aviation electronics, video and image processing modules, and embedded system-management controllers. Its 256-pin LFBGA package supports dense board layouts, but careful ball assignment, power planning, decoupling, and signal-integrity work are necessary at this package scale. When designing around this FPGA, verify every bank voltage, I/O standard, configuration pin, and unused-ball requirement against the manufacturer's datasheet and pin user guide. Do not substitute a related package suffix without confirming pin compatibility, temperature grade, speed grade, and configuration behavior. This page consolidates verified manufacturer and distributor information, same-package alternatives, comparison parameters, and application-specific engineering guidance. It also distinguishes confirmed data from unavailable specifications, helping designers make faster sourcing and design decisions without inventing electrical details.
M2GL010-VF400 - 12K LEs, 195 I/O IGLOO2 FPGA | Microchip
The Microchip Technology M2GL010-VF400 is an IGLOO2 low-density flash FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. It is identified as a 400 VFBGA device in distributor data and uses 0.8 mm ball pitch according to the supplied Hotenda result. The device is intended for programmable logic, I/O expansion, signal conversion, bridging, system management, communications, industrial, medical, defense, and aviation applications. An FPGA is a programmable semiconductor containing configurable logic, memory, and I/O resources that can be reconfigured after manufacture. Microchip positions the IGLOO2 family for general-purpose functions such as bridging, I/O expansion, data conversion, secure connectivity, video or image processing, and system management. The M2GL010 device is the smallest density shown in the supplied IGLOO2 datasheet result, which covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 variants. The verified distributor information identifies the M2GL010-VF400 as an IGLOO2 FPGA with 12K logic elements, 195 I/O, and a 400-LFBGA package. Other verified commercial data reports 2,528 pieces in stock at Heisener, a unit price of $37.1987, and a lead time to be confirmed, with an estimated delivery window of October 12 through October 17. These commercial figures are source-specific and should be reconfirmed before procurement. The 400-LFBGA package provides a high pin count for systems that require extensive programmable I/O, making the device suitable for parallel interfaces, control logic, protocol bridges, and mixed signal interface conditioning. The supplied pin-description user guide is the appropriate reference for ball assignments, bank information, and package details. The manufacturer product page states that the M2GL010 is in production. A practical design must confirm the exact temperature grade, voltage requirements, configuration method, supported I/O standards, clocking resources, and bank constraints before layout begins. The 400-ball package also requires careful ball-out planning, escape routing, power-plane integrity, and manufacturing capability appropriate for fine-pitch BGA assembly. Do not infer those electrical limits from the distributor summaries alone. This page consolidates the verified Microchip and distributor references, compares the available same-footprint ordering variants, and separates confirmed commercial information from parameters that still require manufacturer-datasheet confirmation. Use the official IGLOO2 datasheet and pin-description guide for sign-off design decisions. The M2GL010-VF400 combines a compact low-density IGLOO2 FPGA platform with a high-pin-count 400-LFBGA package. Its 12K logic elements and 195 I/O position it for embedded control, interface conversion, protocol bridging, system management, and communications infrastructure where deterministic programmable logic is useful. Microchip's product page identifies the M2GL010 family as in production and describes IGLOO2 devices as flash FPGAs for general-purpose logic, I/O expansion, conversion, communications, industrial, medical, defense, and aviation markets. The verified distributor record specifies a 400-LFBGA package, 195 I/O, and 12K logic elements, while another distributor result describes the package as 0.8 mm ball pitch. Because the supplied data does not provide complete AC, DC, timing, pin-level, or environmental specifications, those values are not guessed here. The IGLOO2 architecture is a flash-programmable FPGA family intended to provide reconfigurable logic, memory, and I/O resources within a compact device. In system terms, an FPGA sits below programmable logic devices, digital logic ICs, and semiconductors, while providing higher implementation flexibility than a fixed-function controller. Microchip identifies the family for general-purpose functions including bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied IGLOO2 datasheet result covers multiple M2GL densities, including M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150, with the target device being the M2GL010 density. The verified feature set for this exact ordering code is its 12K logic-element count, 195 I/O, and 400-LFBGA package. The high I/O count is the key implementation feature for systems requiring many external connections, parallel data paths, or interface translation. The package also changes board-level manufacturing requirements compared with a leaded device: the design must account for 400 balls, fine-pitch escape routing, via-in-pad or via structures where appropriate, and controlled assembly. The supplied data does not state the exact I/O standards, I/O voltage, maximum clock frequency, memory bits, configuration interface, or operating-temperature grade, so those values require confirmation from the official datasheet. Microchip's product page lists the M2GL010 as in production. This makes it a relevant candidate for new low-density FPGA designs, provided that the selected temperature, package, qualification, and lifecycle requirements match the system. The product-family page describes IGLOO2 devices as suitable for communications, industrial, medical, defense, and aviation markets. These are application domains, not proof that the exact M2GL010-VF400 ordering code has every corresponding qualification. The ordering suffix, grade, and compliance qualification must be checked separately. Typical implementation uses include interface bridging, parallel-to-serial conversion, I/O expansion, control-plane logic, data acquisition front ends, and system-management functions. In these designs, the FPGA's 195 I/O allow external buses and protocols to be mapped through configurable logic, while the 12K logic-element density is intended for moderate control and datapath complexity rather than unrestricted high-end processing. The exact timing margin, supported standards, and power performance depend on the selected I/O bank, clock configuration, voltage, and operating grade. The primary design consideration is that the 400-LFBGA package requires disciplined power, clock, and signal-integrity planning. Confirm the complete pinout, bank voltages, configuration pins, clock pins, ground distribution, and decoupling requirements in the manufacturer pin-description guide before schematic capture. Keep sensitive clock and interface routes short, provide continuous return paths, and validate the design with the manufacturer's recommended FPGA design flow. Do not use the distributor snippets as a substitute for the complete electrical datasheet. This page synthesizes verified manufacturer status, package identity, logic capacity, I/O count, distributor inventory, pricing, and the available ordering references. It also adds practical selection and design guidance that is not present in a raw distributor listing. For purchasing, request a current quote and stock confirmation; for engineering, use the official IGLOO2 datasheet and packaging user guide for all release-critical specifications. The M2GL010-VF400 is a 12K-logic-element, 195-I/O IGLOO2 flash FPGA in a 400-LFBGA package, and Microchip lists the M2GL010 family as in production. It is suitable for programmable logic, interface bridging, I/O expansion, protocol conversion, system management, communications, industrial control, medical equipment, defense, and aviation designs where configurable hardware is useful. The verified distributor data identifies 2,528 pieces at Heisener at a unit price of $37.1987 and reports lead time to be confirmed; pricing and availability are as of the supplied search snapshot dated 2026-10-23. The package result states 0.8 mm ball pitch and 400 VFBGA. Engineering values not present in the supplied sources are marked for data collection rather than estimated. An FPGA is a configurable digital semiconductor that combines programmable logic, memory, and input/output resources. A low-density flash FPGA such as IGLOO2 can implement fixed control logic, data paths, and interface functions that would otherwise require multiple fixed-function devices. Microchip describes IGLOO2 devices as useful for general-purpose bridging, I/O expansion, conversion, system management, and secure connectivity. The supplied family datasheet result covers M2GL005, M2GL010, M2GL025, M2GL050, M2GL060, M2GL090, and M2GL150 devices, confirming that M2GL010 belongs to a broader low-density device family. The target's confirmed commercial features are 12K logic elements, 195 I/O, and a 400-LFBGA package. The package result additionally specifies 0.8 mm ball pitch and 400 VFBGA. These figures make the device relevant where a high number of external connections and moderate programmable logic density are needed. They do not establish the exact I/O voltage, supported interface standards, maximum operating frequency, embedded-memory capacity, configuration pins, or temperature grade; those values must come from the official datasheet and pin-description guide. Microchip's product page states that M2GL010 is in production. The IGLOO2 family page identifies communications, industrial, medical, defense, and aviation as target markets, while also listing Gigabit Ethernet, dual PCI Express control planes, bridging, I/O expansion, conversion, video or image processing, system management, and secure connectivity as representative use cases. Availability in those markets does not automatically mean that the exact ordering code has the required automotive, military, or space qualification. Qualification and temperature grade must be confirmed independently. A practical implementation can place the FPGA between sensors, processors, memories, transceivers, and external connectors. The 195 I/O provide a large pin budget for buses, control signals, and protocol interfaces, while the 12K logic-element count supports moderate finite-state machines, packet handling, data alignment, and control logic. The 400-LFBGA package requires a high-density board layout with careful escape routing, power distribution, thermal analysis, and assembly capability. The design should be checked against the manufacturer's pinout, bank rules, configuration procedure, and recommended decoupling before PCB release. The most important selection trade-off is flexibility versus integration. Compared with a small MCU or fixed-function logic device, the FPGA provides reconfigurable parallel interfaces and hardware-level timing control. Compared with a larger or higher-density FPGA, the M2GL010 offers a smaller logic resource budget while retaining many I/O and package options. The exact speed, power, reliability, and lifecycle commitments should be taken from the current Microchip documentation rather than inferred from the distributor summary. This page combines verified product identity, family positioning, package information, commercial availability, and procurement context with engineering guidance for FPGA integration. It is intended to accelerate initial selection and sourcing, while clearly separating confirmed facts from parameters that still require official-datasheet confirmation.
M2GL025-VF256 - 27.6K LEs, 256-LFBGA FPGA | Microchip
The Microchip Technology M2GL025-VF256 is a low-density IGLOO 2 flash FPGA with 27,696 logic elements, 138 I/O, and a 1.2 V core supply in a 256-pin LFBGA package. It is marketed for general-purpose functions including bridging, I/O expansion, conversion, system management, and secure connectivity. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after fabrication. It belongs to the programmable-logic hierarchy: FPGA → programmable-logic IC → digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can support multiple interface, control, and data-processing functions through configuration programming. The verified listing identifies 27.6K logic elements, 138 I/O, a 1.2 V core, and a 256-pin LFBGA package. Microchip describes its low-density IGLOO 2 devices as suitable for general-purpose logic and control tasks. These verified attributes make the M2GL025-VF256 relevant to compact control systems, interface bridges, peripheral expansion, and industrial logic platforms. The M2GL025 belongs to the IGLOO 2 family, whose flash-based FPGA positioning supports programmable logic rather than fixed wiring. The package exposes 256 terminals and offers 138 I/O according to the distributor result, leaving the remaining package terminals associated with power, configuration, grounds, and other package-specific functions that are not enumerated in the supplied data. Typical design use includes protocol bridging, I/O expansion, data-format conversion, system management, and secure connectivity. These are family-level applications identified by Microchip; an exact implementation must be checked against the device pin descriptions, supported I/O standards, bank voltages, clocking resources, and power requirements in the official datasheet and user guide. The main design consideration is package and pinout verification. A 256-pin BGA is not interchangeable with a leaded package, and even same-density variants require exact VFBGA footprint, pin descriptions, bank compatibility, and configuration checks. This page synthesizes verified distributor listings, manufacturer resources, sourcing details, and strict engineering cautions beyond the raw catalog description.
M2GL090-FG676 - 86K IGLOO2 FPGA, 1.2V, 676-FBGA | Microchip
The Microchip M2GL090-FG676 is an IGLOO2 low-density FPGA with 86,316 logic cells, 425 I/O, a 1.2 V supply, and a 676-pin FBGA package. It is designed for programmable logic, system management, bridging, I/O expansion, data conversion, and secure connectivity applications. The verified distributor data identifies the device as an 86KLE IGLOO2 FPGA, while the manufacturer product page reports the M2GL090 family as in production. An FPGA is a programmable semiconductor whose logic fabric, interconnect, and programmable I/O can be configured after manufacture. Unlike a fixed-function ASIC, an FPGA supports design changes, parallel interface adaptation, and hardware customization without changing the PCB. The M2GL090 belongs to the IGLOO2 family, which is positioned for general-purpose programmable-logic functions and low-density embedded control tasks. The M2GL090-FG676 provides 86,316 logic cells and 425 I/O in a 676-pin FBGA. The verified distributor listing also shows a 2,648,064-bit configuration-memory figure for this device. Its 1.2 V operating supply is suitable for designs requiring a low-voltage programmable-logic fabric. The FG676 package provides a high pin count and supports dense signal routing, although its fine-pitch land pattern demands careful PCB layout and assembly. IGLOO2 devices include programmable logic resources and embedded SRAM for designs requiring local data storage, buffering, or stateful logic. Depending on the device configuration, the FPGA can be used for protocol conversion, bus bridging, control logic, interface aggregation, and security-related connectivity. The exact supported I/O standards, voltage combinations, timing grades, and configuration features must be confirmed in the Microchip datasheet for the selected device variant. Typical implementations include industrial control modules, communications equipment, data-acquisition systems, sensor and network interfaces, embedded security functions, and custom accelerator logic. In these systems, the FPGA can absorb parallel data paths, perform protocol translation, implement deterministic state machines, and reduce the amount of logic that would otherwise require several fixed-function devices. PCB design is a primary concern for the 676-pin FBGA. Use the Microchip IGLOO 2 layout guidance, provide a continuous power and ground distribution structure, route high-speed signals with controlled impedance, and verify the pin assignments and ball-grid orientation against the official pin-description document. Programming and configuration must follow the device-specific requirements. This product record combines verified manufacturer and distributor information with package-specific engineering guidance. Because the supplied search data does not include a complete pricing table, electrical limits, temperature grade, or full pin map, those values are explicitly marked for verification rather than inferred.
M2GL150-FCVG484I - IGLOO2 146K LE FPGA 484-BGA | Microchip
The Microchip Technology M2GL150-FCVG484I is a 146,124-logic-element IGLOO2 low-power flash-based Field-Programmable Gate Array (FPGA) integrated circuit housed in a 484-ball Fine-pitch Ball Grid Array (FBGA, 19x19 mm) package with 248 user I/O. Built on a 1.2 V core, 65 nm flash process, the device combines up to 5,120 Kbits of embedded SRAM, 240 Math Blocks (18x18 multipliers), 4 PLLs and DLLs, and 1.2 Gbps SERDES capability, addressing low-density logic integration and high-speed serial bridging without an external MCU. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing designers to customize digital functions after fabrication. FPGAs sit in the hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The IGLOO2 family specifically targets low-power operation with flash-based configuration cells that retain bitstream in silicon without external boot memory, simplifying board design and improving security. Key features include 512 Kbits of embedded non-volatile memory (eNVM), 64 KB embedded SRAM (eSRAM), high-performance DDR2/DDR3/LPDDR memory controller interfaces with ECC, integrated DSP through the Math Block array, and an ARM Cortex-M3 hard processor subsystem variant (M2GL150S). The I/O count of 248 supports wide parallel interfaces for video bridging, industrial control and communications aggregation. The flash-based architecture provides instant-on capability and inherent security against bitstream read-back, advantages over SRAM-based FPGAs that require external boot PROMs. From a technical depth perspective, the M2GL150 uses a 4-input LUT fabric with dedicated carry chains and distributed control logic, providing a fine-grained architecture suitable for glue logic, bus bridging and signal conditioning. The 65 nm low-power process node enables sub-microamp sleep currents and flexible power modes that suit battery-powered and industrial always-on applications. Typical applications include industrial control planes, secure communications bridges, motor control and I/O expansion, video/image processing, and low-power system management. The flash-based non-volatile configuration makes the device particularly attractive for safety-critical and secure systems requiring deterministic boot and tamper resistance. When designing, ensure the PCB layout accommodates the 484-ball FBGA 19x19 mm land pattern with controlled-impedance traces for SERDES lanes and matched-length DDR routing for memory interfaces. Heat dissipation is generally low due to flash-based operation, but core utilization above 70 percent may require thermal analysis. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
M2S010-TQG144 - SmartFusion2 SoC FPGA 12K LE 166MHz | Microchip
The Microchip Technology M2S010-TQG144 is a SmartFusion2 System-on-Chip (SoC) FPGA integrating a 166 MHz ARM Cortex-M3 hard processor subsystem with a flash-based FPGA fabric of approximately 12,000 logic elements (10K logic modules / 12KLEs), housed in a 144-pin TQFP package (20x20 mm). The device combines deterministic FPGA logic, an embedded microcontroller, and advanced security features on a single low-power 65 nm process die, targeting secure connectivity, industrial control, and general-purpose I/O expansion designs. A SmartFusion2 SoC FPGA is a heterogeneous computing device that fuses a hard ARM Cortex-M3 processor core, on-chip SRAM and eNVM, debug peripherals, and a reprogrammable FPGA fabric in one package. This integration removes the inter-chip communication latency of a discrete MCU-plus-FPGA design and simplifies the PCB by collapsing what would otherwise be a multi-chip system onto a single 144-TQFP footprint. M2S010 sits at the low-density end of the SmartFusion2 family, with larger siblings (M2S025, M2S050, M2S060, M2S150) scaling up logic and memory. Key features of M2S010-TQG144 include 12KLEs / 12084 cells of flash-based FPGA fabric, a 166 MHz ARM Cortex-M3 subsystem, on-chip 512 KB eNVM and 64 KB SRAM, embedded DDR controllers, multiple high-speed serial transceivers, and hardware cryptographic accelerators for AES, SHA, and ECC. The device operates from a 1.2 V core supply and supports industrial temperature grades, with low static and dynamic power consumption enabled by flash-based non-volatile configuration cells. Typical applications include industrial motor control, secure IoT edge nodes, communications bridging, system management controllers, and PCI Express endpoint designs. The integrated ARM Cortex-M3 allows designers to host control-plane firmware on-chip while the FPGA fabric handles high-bandwidth data-plane logic, data acquisition, or custom peripheral glue logic.
M2S025-VFG400I - SmartFusion2 SoC FPGA, 25K LE, Cortex-M3 | Microchip
The Microchip Technology M2S025-VFG400I is a SmartFusion2 System-on-Chip (SoC) FPGA integrating a 25K-logic-element flash-based FPGA fabric with a hard ARM Cortex-M3 microcontroller subsystem running at 166 MHz, housed in a 400-ball VFBGA (17x17 mm) package. Built on a low-power 65 nm flash process, the device delivers approximately 27,696 logic cells, embedded SRAM, DSP blocks, and high-speed serial transceivers while embedding the deterministic ARM Cortex-M3 processor alongside programmable analog. A System-on-Chip (SoC) FPGA is an integrated device that combines a programmable logic fabric with one or more fixed processor cores and, in many families, programmable analog. The hierarchy places SoC FPGA under FPGA & CPLD and alongside conventional microcontroller units. SmartFusion2 specifically integrates a flash FPGA, a deterministic Cortex-M3 hard processor, and an analog compute engine, allowing designers to consolidate what previously required a microcontroller, an FPGA, and a separate ADC-plus-front-end chip onto a single die. Key features of the M2S025 include 43 kbits of embedded SRAM, dedicated DSP blocks, multi-standard SERDES, on-chip user flash, hard Cortex-M3 with 1.6 DMIPS/MHz core performance, and integrated analog-to-digital converters. The -I suffix indicates an industrial temperature grade of -40C to +100C, and the device operates from a 1.2 V core supply with separate PLL and I/O banks. Architecturally, SmartFusion2 uses a 4-input LUT fabric with built-in fracturable DSP and dedicated high-speed SERDES blocks for protocols like PCIe Gen2 and SGMII. The hard Cortex-M3 subsystem includes tightly-coupled SRAM, mpu, and an AHB-Lite matrix that exposes the FPGA fabric as memory-mapped peripherals, providing deterministic real-time interrupt response for industrial control. Typical applications include industrial motor control and motor drive stages, secure communications, general-purpose I/O expansion for industrial PCs and embedded boards, portable instrumentation, and avionics-grade embedded control. Because the M2S025 integrates both programmable analog and digital fabric, it is particularly well suited to mixed-signal acquisition designs. When using the M2S025, plan the PCB layout around the 1 mm pitch BGA with matched-length routing for SERDES lanes and dedicated decoupling per bank. Use Libero SoC design software for place-and-route, and verify pinout against DS0115 since pin tables have been split from the main datasheet.
M2S060TS-FGG484 - SmartFusion2 SoC FPGA 60K LE ARM Cortex-M3 | Microchip
The Microchip Technology M2S060TS-FGG484 is a SmartFusion2 System-on-Chip (SoC) FPGA that integrates an ARM Cortex-M3 hard processor subsystem with 60K logic element (LE) FPGA fabric in a 484-pin FPBGA (FGG484) 23x23 mm package. The device operates at up to 166 MHz on the MCU subsystem and is fabricated on a 65 nm low-power process node with 1.2 V core operation. A SmartFusion2 SoC FPGA is a heterogeneous platform that combines a deterministic microcontroller subsystem with programmable logic on a single die. The Cortex-M3 subsystem includes embedded SRAM, real-time clock, and a complete peripheral set, while the FPGA fabric provides flexible custom logic, DSP blocks, and high-speed SERDES. This integration eliminates inter-chip buses, reduces board area, and provides hardware-software co-design capability for safety-critical and mixed-signal designs. Key features include 60K logic elements (56.5K LEs per Mouser listing), embedded ARM Cortex-M3 with up to 166 MHz operation, 484-pin FPBGA package with 23x23 mm body, 65 nm flash-based process technology, integrated PCIe and Gigabit Ethernet hardening, and low-power operation suitable for industrial and secure applications. The device is rated for extended industrial temperature ranges and includes hardware cryptographic accelerators for secure boot, AES, and RSA. Architecturally, the SoC combines a flash-based FPGA fabric (no external configuration PROM required) with a hardened MCU subsystem, providing instant-on behavior and deterministic interrupt latency. SERDES lanes support up to 1 Gbps data communication, and the device integrates 4 MB of user flash and 64 KB of eNVM for secure key storage. Typical applications include industrial control and motor drives, secure communications gateways, PCIe endpoint bridging, video/image processing, IoT edge nodes, and avionics system management. The SmartFusion2 family's low power and security features make it suitable for defense, medical, and industrial automation designs. When designing with the M2S060TS-FGG484, observe the device's maximum supported I/O toggle rate and derate accordingly for industrial temperature operation. Plan PCB layout to keep SERDES lane lengths matched within the tolerance specified in the datasheet, and provide adequate decoupling for the multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary). This page synthesizes distributor pricing, drop-in SmartFusion2 alternatives, and practical PCB design notes not found in the manufacturer datasheet.
M4A5-64/32-7JI - ispMACH 4A 64-Macrocell 5V CPLD | Lattice
The Lattice Semiconductor M4A5-64/32-7JI is a 64-macrocell, 32-user-I/O member of the ispMACH 4A family of high-performance E2CMOS 5-V in-system programmable complex programmable logic devices (CPLDs), supplied in a 44-pin Plastic Leaded Chip Carrier (PLCC) package with surface-mount J-leads. It offers 2.5K usable gates, 7.5 ns typical propagation delay (tpd), and an internal operating frequency up to 125 MHz, making it one of the fastest 5-V CPLDs of its generation. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell blocks with a central interconnect matrix, providing deterministic, single-clock-cycle logic with predictable timing. CPLDs sit below FPGAs in the programmable logic hierarchy: they offer fewer gates than FPGAs but provide instant-on operation, superior pin-to-pin timing consistency, and robust 5-V I/O tolerance, which is why they remain preferred for glue logic, bus interfacing, and power-sequencing tasks. Key features include 100% pin-out retention, 100% macrocell utilization, in-system programmability via IEEE 1532 / JTAG, four 36-input PAL blocks with 16 macrocells each, and a global routing pool that delivers fast, predictable signal propagation. The 5-V tolerant I/Os simplify interfacing to legacy TTL/CMOS buses without level shifters. The ispMACH 4A architecture uses Lattice's E2CMOS process with non-volatile storage of the configuration, so the device powers up in a known functional state with no external boot PROM. The four-block, single-pool interconnect fabric delivers uniform 7.5 ns pin-to-pin delays across all I/O combinations. Typical applications include address decoding and bus interfacing in 5-V industrial controllers, glue logic between microprocessors and peripherals, power-supply sequencing logic, and legacy system upgrades that require drop-in 5-V programmable logic with JTAG in-field reprogrammability. When designing with the M4A5-64/32-7JI, observe the 4.75 V to 5.25 V supply range and place 0.1 uF decoupling capacitors adjacent to every VCC pin. Because the part is in-system programmable, expose TDI, TDO, TMS, and TCK to a JTAG header for field updates. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes for engineers migrating away from the obsolete original Lattice part number.
M7AFS600-1FG256 - Fusion FPGA 600K Gates 256-FBGA | Microchip
The Microchip Technology (formerly Microsemi) M7AFS600-1FG256 is a Fusion family mixed-signal FPGA offering 600K system gates, an embedded ARM CoreMP7 soft processor core, and 1.5V core operation, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package. The device is fabricated on a 130nm flash-based process and provides 110592 bits of embedded flash configuration memory on-chip. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable routing, allowing designers to implement custom digital circuits without fabricating an ASIC. Within the programmable logic hierarchy, the Fusion family occupies the mixed-signal FPGA tier, adding analog peripherals such as on-chip flash memory, analog-to-digital conversion, and power-management support to standard digital fabric, positioning it as an alternative to mixed-signal ASIC or discrete analog-plus-FPGA solutions. Key features of the M7AFS600-1FG256 include 600K system gates of flash-based programmable logic, an integrated ARM CoreMP7 32-bit processor core, 119 user I/O pins available in the 256-ball package, and core supply voltage of 1.5V (valid operating range 1.425V to 1.575V per distributor data). Flash-based configuration means the device is inherently single-chip, non-volatile, and instant-on at power-up, unlike SRAM FPGAs that require external configuration memory. The Fusion architecture integrates programmable analog blocks supporting power management, smart battery charging, clock generation and management, and motor control functions that previously required discrete analog components. The ARM CoreMP7 core allows embedded software to coexist with hardware logic, reducing bill-of-materials complexity in embedded control designs. The 130nm flash process provides live-at-power-up behavior and non-volatile storage of the design bitstream. Typical applications include industrial power-supply supervision and sequencing, motor control drives, battery-management systems, embedded controllers combining MCU and FPGA roles, and space-constrained systems where a single-chip non-volatile FPGA eliminates external boot devices. A key design consideration is supply-chain lead time: Mouser lists this part as non-stocked with a 16-week lead time, so production planning should secure stock early or evaluate the industrial-temperature M7AFS600-1FG256I variant. Power budgeting should account for the 1.5V core rail plus I/O bank rails. This page synthesizes verified distributor pricing, drop-in alternatives within the same 256-ball footprint, and practical sourcing and design notes not consolidated in the manufacturer datasheet.
M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip
The Microchip (formerly Actel/Microsemi) M7AFS600-1FG256I is a Fusion mixed-signal field programmable gate array (FPGA) delivering 600K system gates with an optional ARM CoreMP7 processor, 119 user I/O, and 256-LBGA packaging in an industrial -40C to +85C temperature grade. It is fabricated on an advanced 130-nm, 7-layer metal flash-based CMOS process. A mixed-signal FPGA is a programmable logic device that combines flash-based digital fabric with configurable analog peripherals, large flash memory blocks, and clock generation circuitry on a single monolithic die. Unlike SRAM FPGAs, flash-based FPGAs are nonvolatile, retaining their configuration when powered off, which places them in the power management and single-chip embedded control hierarchy alongside MCUs and SoCs. Key differentiating features include live at power-up (LAPU) operation for instant-on behavior, up to 350 MHz system performance, integrated configurable analog blocks (ADC, voltage/temperature monitors), and secure nonvolatile flash programming that eliminates the external boot configuration device required by SRAM FPGAs. Technically, the device integrates a 7-layer-metal flash fabric, embedded flash memory blocks, comprehensive clock conditioning circuitry (CCCs with PLLs), and analog peripherals such as a progressive-resolution ADC, making it a genuine single-chip solution for mixed-signal board-level integration. The ARM CoreMP7 soft/hard processor option enables embedded control within the programmable fabric. Typical applications include industrial control and automation, power supply and energy monitoring, medical instrumentation, and test equipment, where combining analog measurement with programmable digital logic reduces BOM count and board area. Design consideration: verify power sequencing and analog reference layout early - the mixed-signal nature demands clean analog ground partitioning unlike pure digital FPGAs. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FG484 - Fusion FPGA 600K Gates 484-BGA | Microchip
The Microchip Technology (formerly Microsemi) M7AFS600-1FG484 is a Flash-based Fusion Field Programmable Gate Array (FPGA) with 600K system gates, an embedded ARM CoreMP7 processor, and 172 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch. An FPGA is a programmable logic device that allows designers to configure digital logic circuits after manufacturing. Unlike SRAM-based FPGAs that lose their configuration at power-off, the Fusion family uses a 130-nm, 7-layer metal Flash-based CMOS process, making it a nonvolatile FPGA that retains its program when powered off and is Live at Power-Up (LAPU). This eliminates the external configuration PROM required by SRAM FPGAs and improves system security and boot time. Key features of the M7AFS600-1FG484 include the ARM CoreMP7 soft processor core running up to the 1282.05 MHz listed operating frequency figure for the -1 speed grade, Flash-based nonvolatile configuration, and a rich mixed-signal capability set typical of the Fusion family (configurable analog blocks including ADCs, voltage/temperature monitoring, and clock management resources). The 484-FBGA surface-mount package supports high-I/O-count system-on-chip integration. Architecture-wise, the device combines programmable fabric, embedded Flash memory, and system peripherals on a single die at the 130-nm node with a 1.5V core supply, enabling single-chip embedded control with custom logic acceleration. Typical applications include industrial automation and control, secure embedded systems, aerospace/defense subsystem prototyping, medical instrumentation, and power/sensor management where in-system reprogrammability and instant-on behavior matter. When designing with this device, plan power sequencing and bank I/O standards early, and reserve adequate decoupling for the 1.5V core rail. This page synthesizes distributor pricing data, drop-in alternatives within the same 484-BGA footprint, and practical design guidance not found in the manufacturer datasheet.
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) M7AFS600-1FG484I is a Fusion mixed-signal Flash FPGA with 600,000 system gates, 172 user I/Os, and 110,592 tiles of programmable logic, housed in a 484-ball Fine-Pitch Ball Grid Array (484 FBGA, 23 x 23 x 2.44 mm) with industrial-grade -40C to +85C (I) temperature rating and 1 speed grade. A Fusion FPGA is a Flash-based, nonvolatile field programmable gate array that integrates programmable logic, embedded flash configuration memory, and mixed-signal peripherals into a single chip. Within the power management hierarchy, the Fusion family occupies the system-on-chip tier below full ASSPs: FPGA fabric plus optional ARM CoreMP7 soft/hard processor support, making it a complete programmable system-on-chip (SoC) rather than a pure digital FPGA. Key features include a nonvolatile Flash-based 130-nm, 7-layer-metal CMOS process that retains its configuration when powered off, and Live at Power-Up (LAPU) operation so the device is functional within microseconds of power application. Unlike SRAM FPGAs, no external boot flash or bitstream loading delay is required. The integrated analog peripherals (voltage/temperature monitoring ADC, user flash memory blocks) support complete single-chip system monitoring and control designs. Technical depth: the M7AFS600 fabric provides roughly 110,592 logic elements organized into versatile logic blocks, supported by embedded SRAM and flash memory blocks. The ARM CoreMP7 processor option enables embedded control alongside the fabric. Supply is a nominal 1.5V core (CMOS logic family), with industrial (I) qualification covering -40C to +85C operation per distributor listings. Typical applications include industrial automation and control, power supply and backplane monitoring, aerospace and defense control electronics, and single-chip embedded systems that previously required separate FPGA plus supervisor plus ADC components. Design consideration: because this is a Flash-based FPGA with 1.5V core supply, verify power-rail sequencing and mixed-voltage I/O bank constraints early in the design; the 484 FBGA requires a carefully planned via-in-pad escape strategy on at least an 8-layer board. This page synthesizes distributor pricing, drop-in alternatives within the M7 Fusion family, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
The Microchip Technology (Actel/Microsemi) M7AFS600-1FGG256 is a Fusion mixed-signal FPGA with 600K system gates, an embedded 32-bit ARM CoreMP7 processor, and 110592 fabric elements, housed in a 256-ball FBGA (FGG256, 17x17 mm) package on a -1 speed grade. A mixed-signal FPGA is a field-programmable gate array that integrates configurable digital logic fabric with analog peripherals on a single die. Within the programmable logic hierarchy (FPGA -> programmable SoC -> programmable logic device -> semiconductor), Fusion devices from Actel, later Microsemi and now Microchip Technology, were pioneering because they combined flash-based fabric with ADC, RTC, and POR analog blocks, removing external analog components from many embedded designs. Key features of the M7AFS600 include the hard-wired ARM CoreMP7 processor running at high frequency from the 130nm flash process, flash-based nonvolatile configuration (no external boot PROM required and instant-on operation), and integration of analog peripherals such as a multi-channel ADC and programmable low-dropout regulators. The -1 speed grade and commercial temperature variant (0C to +70C) make this suffix cost-optimized for standard embedded applications. Architecturally, the Fusion family is built on Actel's proven flash-based ProASIC3 fabric augmented with analog I/O, giving designers single-chip system management, power sequencing supervision, and fan control alongside custom logic. The 256-ball FGG256 footprint with 17x17 mm ball grid array suits two-layer routing of high-logic-density designs in compact form factors. Typical applications include embedded system controllers, power-supply and board-level health monitoring, industrial automation interfaces, and portable instrumentation where one chip must replace an MCU plus supervisor plus analog front end. Design consideration: flash-based Fusion fabric is live-at-power-up; verify power-rail sequencing for the 1.5V core and 3.3V I/O domains, and confirm the ARM CoreMP7 clock plan against the -1 speed grade timing derating. This page synthesizes distributor availability from Mouser, DigiKey, Octopart, and LCSC, drop-in alternatives from the same Microchip Fusion/ProASIC3 families, and practical design guidance not consolidated in the manufacturer datasheet.
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
The Microchip Technology M7AFS600-1FGG256I is a Flash-based mixed-signal FPGA from the Actel Fusion family, offering 600K system gates, an embedded ARM Cortex-M7 class CoreMP7 processor, 119 user I/O, and a 1.5V core supply, housed in a 256-ball FineGrid FBGA package with industrial temperature rating (-40C to +85C). A mixed-signal FPGA is a field-programmable gate array that integrates configurable logic fabric with analog peripherals and a hard processor core on a single die. Within the power-management hierarchy, the Fusion family combines FPGA fabric, programmable analog (ADC, voltage monitors, comparators), and the ARM CoreMP7 soft-attached processor, replacing an FPGA-plus-MCU-plus-analog-IC multi-chip solution with one nonvolatile device. Key features include the advanced 130-nm, 7-layer-metal flash-based CMOS process, nonvolatile configuration that retains the program when powered off, and Live at Power-Up (LAPU) operation, meaning the device is functional immediately when power is applied. System performance reaches up to 350 MHz, and the flash cells eliminate the external configuration PROM required by SRAM FPGAs. Technically, the fabric is organized with Versatile Tiles and supports the CoreMP7 ARM processor at up to 100 MHz. The analog subsystem integrates a 12-bit ADC, programmable gain amplifiers, temperature and voltage monitors, and programmable current sources, enabling true single-chip system management. The speed grade -1 and the industrial I suffix make this variant suited to extended-temperature embedded control designs. Typical applications include power-supply and board-level system management, industrial control, portable instrumentation, and embedded motor control, where integration of analog monitoring, sequencing, and processor logic reduces board area and BOM count. Design-wise, confirm that 119 I/O meet your pin budget and plan power rails for the 1.5V core and 3.3V I/O banks before locking the pinout in Libero SoC. This page synthesizes distributor availability data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-1FGG484 - Fusion FPGA 600K Gates | Microchip Technology
The Microchip Technology M7AFS600-1FGG484 is a Fusion® Field Programmable Gate Array (FPGA) with 600K system gates, 172 user I/Os, and 110592 bits of RAM, housed in a 484-pin FBGA package. It operates at a maximum frequency of 1282.05 MHz and is fabricated using 130nm technology with a 1.5V core supply. This device integrates an ARM CoreMP7 soft processor, making it a mixed-signal FPGA suitable for system-on-chip applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. FPGAs are part of the programmable logic device family, which also includes CPLDs and SoC FPGAs. They offer flexibility for prototyping, low-volume production, and applications requiring reconfigurable hardware. The Fusion family specifically combines FPGA fabric with analog blocks, including ADC, DAC, and voltage monitors, enabling mixed-signal designs on a single chip. Key features of the M7AFS600-1FGG484 include 600K system gates, 172 user I/Os, and 110592 bits of embedded RAM. The device supports multiple I/O standards and includes programmable phase-locked loops (PLLs) for clock management. Its 130nm process technology balances performance and power, while the 1.5V core voltage reduces dynamic power consumption. The FBGA-484 package provides a compact footprint with excellent thermal and electrical characteristics. Technically, the Fusion FPGA integrates analog peripherals such as a 12-bit ADC, analog comparators, and voltage regulators, which are not commonly found in standard FPGAs. This integration reduces board space and system cost by eliminating external analog components. The ARM CoreMP7 soft processor can be instantiated in the FPGA fabric to run embedded software, enabling true system-on-chip designs. The device also supports secure programming and has an on-chip security feature to prevent unauthorized readback. Typical applications include industrial control, medical devices, automotive electronics, and communication systems. In industrial control, the M7AFS600-1FGG484 can handle motor control, sensor interfacing, and real-time processing. In medical devices, its analog integration is ideal for patient monitoring and diagnostic equipment. The device's low power and small form factor make it suitable for portable and battery-powered applications. When designing with this FPGA, consider the 1.5V core supply and the need for multiple power rails. Proper decoupling and power sequencing are essential for reliable operation. The device requires configuration at power-up, either from an external SPI flash or via JTAG. Ensure adequate thermal management, as the FBGA package can dissipate significant heat under high utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the M7AFS600-1FGG484.
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
The Microchip Technology M7AFS600-1FGG484I is a Fusion mixed-signal FPGA with 600K system gates, 172 user I/Os, and 110592 bits of total RAM, housed in a 484-ball FBGA package (23x23 mm) rated for -40C to +85C operation from a 1.5V core supply. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices, above CPLDs in capacity, and the Microchip (formerly Microsemi/Actel) Fusion family is distinctive because it integrates analog peripherals, flash-based configuration, and hard ARM CoreMP7 processing into a single mixed-signal programmable platform. Key features of the M7AFS600-1FGG484I include the embedded ARM CoreMP7 microprocessor hard core running at up to 1.28205 GHz nominal family rating, 600K system gates of flash-based logic, 172 user I/Os, and an industrial temperature range of -40C to +85C. The flash-based Fusion fabric retains configuration in non-volatile memory, eliminating the external boot flash and configuration controller required by SRAM FPGAs and improving system security and time-to-first-bit. Technically, the device is fabricated in a 130nm process with a 1.5V core supply (1.425V to 1.575V operating window). The M7 speed grade in the suffix denotes the fastest commercial timing grade of the Fusion family, supporting maximum operating frequencies around 1.28205 GHz for logic paths per distributor parametric data. The FBGA-484 package offers a dense 1.0 mm ball pitch surface-mount footprint for high-IO industrial designs. Typical applications include industrial automation and motor control, avionics and defense systems requiring single-chip secure programmable logic, and instrumentation where on-chip analog plus ARM processing reduces BOM count. Design consideration: verify 16-week manufacturer lead time in production planning and budget core voltage at 1.5V within the 1.425V to 1.575V tolerance band. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
M7AFS600-2FG256 - Fusion FPGA, ARM CoreMP7, 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) M7AFS600-2FG256 is a Fusion mixed-signal field programmable gate array (FPGA) with an embedded ARM CoreMP7 processor, 600,000 system gates, 119 user I/O, and 110592 bits of on-chip flash RAM, housed in a 256-ball LBGA (FG256) package measuring 17x17x1.7 mm. Fabricated on a 130 nm flash-based process with a 1.5V core supply, speed grade -2. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that the designer programs to implement custom digital circuits. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above CPLDs in density and below ASICs in unit cost efficiency. The Fusion family from Actel (now Microchip) is unique in combining flash-based FPGA fabric, an ARM hard core, and mixed-signal analog peripherals in a single chip, eliminating the need for external configuration devices. Key features of the M7AFS600-2FG256 include the ARM7-class CoreMP7 hard processor running system logic, 600K system gates of flash-based fabric, 119 available user I/O in the 256-ball FG256 footprint, and non-volatile flash configuration that makes the device instantly operational at power-up with no external boot PROM. Flash programming technology also provides inherent resistance to configuration data corruption and single-event effects compared to SRAM FPGAs. Technically, the Fusion fabric is built on Actel's proven flash-switch architecture at the 130 nm node, combining look-up-table logic, embedded flash RAM blocks, and analog conditioning blocks. The -2 speed grade defines the timing bin for worst-case propagation delays, and the 1.5V core keeps dynamic power moderate while supporting 3.3V I/O signaling. Typical applications include industrial automation and motor control, power supply monitoring and management, portable instrumentation, aerospace and defense subsystems, and medical equipment where mixed-signal integration and instant-on behavior are required. A key design consideration: the FG256 (17x17 mm) package offers fewer I/O than the FG484 variant, so verify that 119 I/O satisfies your pin budget before layout freeze. This page synthesizes verified distributor listings, drop-in alternatives from the Microchip Fusion family, pricing tiers, and practical design guidance not found in the manufacturer datasheet.