M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
N.º da peça: M7AFS600-1FG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262 | $2.620,00 |
| 100 | $238 | $23.800,00 |
| 500 | $219 | $109.500,00 |
| 1.000 | $198 | $198.000,00 |
M7AFS600-1FG484I Visão geral
A Fusion FPGA is a Flash-based, nonvolatile field programmable gate array that integrates programmable logic, embedded flash configuration memory, and mixed-signal peripherals into a single chip. Within the power management hierarchy, the Fusion family occupies the system-on-chip tier below full ASSPs: FPGA fabric plus optional ARM CoreMP7 soft/hard processor support, making it a complete programmable system-on-chip (SoC) rather than a pure digital FPGA.
Key features include a nonvolatile Flash-based 130-nm, 7-layer-metal CMOS process that retains its configuration when powered off, and Live at Power-Up (LAPU) operation so the device is functional within microseconds of power application. Unlike SRAM FPGAs, no external boot flash or bitstream loading delay is required. The integrated analog peripherals (voltage/temperature monitoring ADC, user flash memory blocks) support complete single-chip system monitoring and control designs.
Technical depth: the M7AFS600 fabric provides roughly 110,592 logic elements organized into versatile logic blocks, supported by embedded SRAM and flash memory blocks. The ARM CoreMP7 processor option enables embedded control alongside the fabric. Supply is a nominal 1.5V core (CMOS logic family), with industrial (I) qualification covering -40C to +85C operation per distributor listings.
Typical applications include industrial automation and control, power supply and backplane monitoring, aerospace and defense control electronics, and single-chip embedded systems that previously required separate FPGA plus supervisor plus ADC components.
Design consideration: because this is a Flash-based FPGA with 1.5V core supply, verify power-rail sequencing and mixed-voltage I/O bank constraints early in the design; the 484 FBGA requires a carefully planned via-in-pad escape strategy on at least an 8-layer board.
This page synthesizes distributor pricing, drop-in alternatives within the M7 Fusion family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para M7AFS600-1FG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com M7AFS600-1FG484I (mesmo formato e footprint) — diferindo em Package, Family, Configuration Memory, Process Technology, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
M7AFS600-1FG484
✅ Drop-In✓ Em estoque
$181.3 / unidade
Ver ficha técnica →M7AFS600-FG484I
✅ Drop-In✓ Em estoque
$273.98 / unidade
Ver ficha técnica →M7AFS600-FGG484I
✅ Drop-In✓ Em estoque
$219.2 / unidade
Ver ficha técnica →M7AFS600-1FGG484I
✅ Drop-In✓ Em estoque
$228 / unidade
Ver ficha técnica →M7AFS600-2FGG484I
✅ Drop-In✓ Em estoque
$243.75 / unidade
Ver ficha técnica →M7AFS600-FGG484
✅ Drop-In✓ Em estoque
$232.9 / unidade
Ver ficha técnica →M7AFS600-1FG484I Classificações máximas e características elétricas
| System Gates | 600000 |
| Programmable Logic Tiles | 110592 |
| User I/O | 172 |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS |
| Configuration Memory | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | 1.5 V |
| Logic Family | CMOS |
| Speed Grade | 1 |
| Encapsulamento | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Ball Pitch | 1.0 mm |
| Temperatura de operação | Industrial, -40C to +85C |
| Tipo de montagem | Surface Mount |
| Embedded Processor Support | ARM CoreMP7 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do M7AFS600-1FG484I 484-ball fbga (fg484), 23 x 23 x 2.44 mm
Configuração de pinos para M7AFS600-1FG484I (pacote 484-ball fbga (fg484), 23 x 23 x 2.44 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para M7AFS600-1FG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
M7AFS600-1FG484I é adequado para 6 aplicaçãos: Industrial Automation and Control, Power Supply and Backplane Monitoring, Aerospace and Defense Control Electronics, Embedded System-on-Chip Designs, Test and Measurement Instrumentation, Medical Device Control Boards.
Industrial Automation and Control
The M7AFS600-1FG484I fits industrial control cards that need deterministic logic plus supervisory monitoring in one device: its 600K-gate fabric implements motor sequencing, interlocks, and communication glue logic, while Fusion's on-chip analog monitoring tracks rail voltages and board temperature without external supervisor ICs. With the industrial -40C to +85C rating and Live at Power-Up operation, the FPGA is active within microseconds, eliminating the boot window in which SRAM FPGAs leave safety outputs floating. Placed as the sole intelligence on an I/O card, the ARM CoreMP7 option runs protocol handling while fabric logic executes time-critical functions; the 1.5 V core keeps board-level power manageable in dense chassis.
Recomendado
Power Supply and Backplane Monitoring
Fusion's defining feature is integrated analog: on-chip voltage and temperature monitoring channels built on an ADC front end, plus user flash memory for threshold storage. The M7AFS600-1FG484I can therefore replace an FPGA-plus-supervisor-plus-ADC triple in backplane power management, watching multiple rails against programmable limits and asserting control GPIOs for hot-swap and sequencing. The 172 user I/Os interface to ORing controllers, LED indicators, and I2C/PMBus-style buses via fabric-implemented controllers. Because configuration is nonvolatile Flash, monitoring begins instantly at power-up - exactly the window in which SRAM-based alternatives are still loading a bitstream and cannot supervise the rails they will later use.
Recomendado
Aerospace and Defense Control Electronics
Flash-based FPGAs are preferred in defense electronics because the configuration bitstream cannot be read back from SRAM and is highly resistant to configuration upsets. The M7AFS600-1FG484I provides 600K gates for sensor interface, bus bridging (MIL-STD-style protocol stitching in fabric), and telemetry formatting, with 172 I/Os supporting mixed-voltage board interfaces. The industrial I grade and Microchip's legacy Actel pedigree make the part a common choice in avionics subsystems and ground-based defense platforms. Nonvolatile Live at Power-Up behavior matters in systems where outputs must be valid immediately after aircraft or vehicle power-on, and the single-chip integration of analog monitoring reduces part count and associated reliability analysis.
Recomendado
Embedded System-on-Chip Designs
With ARM CoreMP7 support, the M7AFS600-1FG484I serves as a single-chip SoC: the processor handles application firmware while the 110,592-tile fabric implements peripherals, accelerators, and custom interfaces. Fusion's embedded user flash memory stores parameters and the on-chip ADC monitors system health, removing the external supervisor and configuration flash a discrete MCU-plus-FPGA stack would require. This suits cost-sensitive intelligent sensors, test instruments, and protocol converters where BOM consolidation is valuable. Designers work in Microchip Libero SoC, and the nonvolatile Flash configuration means the product powers up running instantly - a meaningful differentiator versus SRAM SoC FPGAs that spend boot time loading from external memory.
Recomendado
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M7AFS600-1FG484I's combination of timing-precise fabric logic and integrated analog monitoring. The 600K-gate fabric implements counters, trigger engines, and bus interfaces (USB/UART-style stitching via fabric peripherals), while Fusion's ADC-based monitors watch internal instrument rails and enclosure temperature, feeding calibration data into user flash. The 172 I/Os address front-end multiplexers, relay drivers, and display interfaces directly. Live at Power-Up ensures front-panel logic is alive the instant mains is applied, and the 484 FBGA's 1.0 mm pitch allows fan-out on a standard 8-layer instrument main board. Grade selection (1 vs 2) sets the maximum internal clock for counter resolution.
Recomendado
Medical Device Control Boards
Portable and benchtop medical equipment uses the M7AFS600-1FG484I where deterministic turn-on, secure nonvolatile configuration, and integrated health monitoring are valued: infusion and diagnostic station control boards use the fabric for actuator sequencing and interlock logic while Fusion's on-chip voltage/temperature monitors support the board-level self-test routines required by quality systems. The industrial -40C to +85C range comfortably covers clinical environments, and the ARM CoreMP7 option hosts the application layer. Flash configuration resists corruption during noisy electrosurgical environments, and the single-chip approach shortens the fault-analysis documentation path versus discrete FPGA-plus-monitor stacks. Power budget is dominated by fabric utilization; enable clock-gating in Libero to cut dynamic current.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para M7AFS600-1FG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | M7AFS600-1FG484 | M7AFS600-FG484I | M7AFS600-FGG484I | M7AFS600-1FGG484I | M7AFS600-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484), 23x23 mm | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FGG484) - same footprint, lead-free finish | 484-ball FBGA (FGG484) - same footprint, lead-free finish | 484-ball FBGA (FGG484) - same footprint, lead-free finish |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 172 | 172 | 172 | 172 | 172 | 172 |
| Speed Grade | 1 | 1 | Standard | Standard | 1 | 2 (faster) |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Configuration Memory | Nonvolatile Flash, LAPU | Nonvolatile Flash, LAPU | Nonvolatile Flash, LAPU | Nonvolatile Flash, LAPU | Nonvolatile Flash, LAPU | Nonvolatile Flash, LAPU |
| Embedded Processor Support | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
Principais diferenciais
- Nonvolatile Flash with Live at Power-Up (vs M7AFS600-FGG484I)
- Industrial temperature grade (vs M7AFS600-1FG484)
- Faster timing than standard grade at lower cost than grade 2 (vs M7AFS600-2FGG484I)
Notas de projeto
The 484-ball FBGA uses a 1.0 mm ball pitch in a 23 x 23 mm body. Escape the innermost ball rows with filled-and-capped via-in-pad or dog-bone fan-out; a 6- to 8-layer stackup is typical when using the full 172 I/Os. Dedicate a solid plane to the 1.5 V core supply and follow Microchip Fusion package guidelines for separating analog ground of the on-chip monitoring peripherals from digital return. Confirm the ball map for your exact order code (FG vs FGG) before finalizing the footprint, as suffix variants share geometry but should be verified against the datasheet package table.
The Fusion fabric runs from a nominal 1.5 V core with separate I/O bank supplies. Estimated: dynamic core current scales with clock frequency and fabric utilization - a design at 50% utilization and 50 MHz can draw appreciably more than an idle configuration, so size the 1.5 V rail from Libero power-analysis output rather than the idle figure. Because the device is nonvolatile and Live at Power-Up, I/O activity can begin the instant 1.5 V and I/O rails are valid; implement supervisor-controlled reset or output-enable gating if downstream circuitry must not see early signals during rail ramp.
Do not substitute commercial-temperature M7AFS600-1FG484 into designs specified for the industrial I grade; the screening range differs (-40C to +85C vs 0C to +70C). Re-run Libero timing sign-off whenever changing speed grades - the FG/FGG standard-grade parts have relaxed timing versus grade 1 and grade 2, so a design closed on 2FGG484I may fail on FGG484I. Finally, since Flash configuration cannot be updated over PCIe-style reconfiguration flows, plan field-update strategy around JTAG/FlashPro access or fabric-implemented flash reprogramming early in the architecture.
Informações de conformidade
Newark lists the M7AFS600 family (484 PBGA, TRAY) as RoHS Compliant: Yes for FGG variants; RoHS/lead-free status of the standard FG484I finish should be confirmed on the Microchip environmental datasheet for this exact order code.
