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TXS0102-Q1 - 2-Bit Auto-Direction Level Translator | TI
The Texas Instruments TXS0102-Q1 is an automotive-grade, 2-bit bidirectional voltage-level translator for open-drain and push-pull applications, offered in an 8-pin VSSOP (DCU) package. It supports data rates up to 24 Mbps and interfaces logic operating at different voltage levels without a direction-control pin. A voltage-level translator, or level shifter, is a logic IC that connects incompatible logic families or systems operating at different supply voltages, such as a 1.65V microcontroller communicating with a 3.3V or 5V peripheral. Within the signal-chain hierarchy, level translators sit between logic ICs and interface ICs, enabling safe chip-to-chip communication where voltage mismatch would otherwise damage a driver or fail to meet input thresholds. Key features include auto-direction sensing on both channels, A-port supply (VCCA) from 1.2V to 3.6V and B-port supply (VCCB) from 1.65V to 5.5V, an output-enable (OE) input referenced to VCCA that places all I/O in high impedance when low, and internal 10 kOhm pull-up resistors on the I/Os that make the device ideal for open-drain drivers such as I2C buses. The -Q1 suffix denotes AEC-Q100 qualification for automotive applications. Technically, the TXS0102 architecture uses two NMOS pass transistors with 10 kOhm pull-ups per I/O, allowing either port to drive the signal while the opposite side is pulled to its rail. This push-pull capability plus open-drain support distinguishes it from passive FET translators and fixed-direction buffers. Typical applications include I2C and SMBus level translation in automotive body electronics, UART and GPIO bridging in cluster and infotainment modules, and low-speed sensor interface translation between 1.8V MCUs and 3.3V peripherals. Design tip: tie OE to GND through a pull-down resistor to guarantee high impedance during power-up, and for push-pull drivers note that the internal 10 kOhm pull-ups limit edge rates at heavy capacitive loads.
TXS0108EQPWRQ1 - 8-Bit Auto-Direction Level Shifter | TI
The Texas Instruments TXS0108EQPWRQ1 is an automotive-grade, 8-bit bidirectional voltage level translator in a 20-pin TSSOP (PW) package, qualified per AEC-Q100 temperature grade 1 (-40C to +125C). It requires no direction-control signal because its auto-direction sensing architecture detects data flow on each channel independently, supporting both push-pull and open-drain applications. A voltage level translator (also called a logic level shifter or voltage translation IC) is an interface component in the broader logic and interface IC family that safely bridges digital devices operating at different supply domains, for example a 1.8V microcontroller talking to a 5V sensor. Level shifters protect low-voltage I/O from overvoltage while preserving logic thresholds, edge rates, and signal integrity across the voltage boundary. Key specifications include a wide VCCA range of 1.2V to 3.6V and VCCB range of 1.65V to 5.5V, enabling translation between almost any two common logic rails. Push-pull data rates reach 110 Mbps while open-drain operation supports 2 Mbps with integrated 10 kOhm pull-up resistors. The device also offers an OE pin for 3-state operation during power sequencing and classified HBM ESD level 2 and CDM level C6 robustness per TI data. Architecturally, the TXS0108E uses one-shot edge-rate accelerators on each channel to improve rise times, combined with a 4 kOhm series pass-gate element; this open-drain-friendly structure means it is not recommended for applications needing high drive strength such as direct LED loads. Typical applications include automotive infotainment and body-control module I/O translation, sensor and CAN-adjacent digital interfacing, and portable electronics bridging 1.8V/2.5V/3.3V memory or peripheral buses to 5V domains. All prices cited in this page are as of 2026-08-29. Design tip: because of the internal pull-ups, avoid this family for signals requiring low-capacitance backplane conditions; for heavy push-pull loads choose the TXB0108 instead.
UJA1018TK - LIN System Basis Chip w/ LED Drivers | NXP
The NXP UJA1018TK is a LIN 2.0/2.0A/2.1/2.2/SAE J2602 system basis chip (SBC) with integrated low-drop voltage regulator and LED drivers, housed in a 16-terminal HVSON (3.5x5.5 mm) exposed-pad package. It combines a single LIN-bus transceiver, a 5.0 V/70 mA LDO regulator, and dedicated LED driver outputs that simplify compact mechatronic and automotive body-electronic node designs. A LIN system basis chip is a class of mixed-signal interface IC that integrates a bus transceiver with on-chip power management and support peripherals. By collapsing the transceiver, voltage regulator, and actuator drivers into a single die, an SBC reduces PCB area, lowers quiescent current, and provides a robust EMC/ESD front end for in-vehicle networks governed by the LIN/J2602 family of standards. The UJA1018TK sits within the automotive networking segment alongside CAN and FlexRay transceivers, and is commonly used as a body-control sub-node tying switches, sensors, and LEDs back to a central body control module. Key features of the UJA1018TK include compliance with LIN 2.0/2.1/2.2 and SAE J2602, integrated 5.0 V low-drop regulator capable of delivering up to 70 mA to external loads, programmable LIN-bus slew rate for EMC control, and dedicated LED driver pins capable of sourcing the current required for indicator or status lamps. The device supports node-position identification through a daisy-chained LIN-switch path, allowing cost-effective address assignment in multi-node LIN chains. The architecture combines a high-voltage analog front end tolerant of automotive 12 V transients with a low-power digital LIN protocol state machine. An integrated LIN bus switch enables address assignment without external EEPROM, while thermal shutdown, load-dump protection, and an exposed thermal pad enable AEC-Q100-style automotive operation across the -40C to +150C automotive temperature range. Supply current is typically around 4.5 mA in active mode, supporting always-on body networks. Typical applications include automotive door modules, seat controllers, steering-column switches, sunroof and mirror modules, climate-control panels, and any LIN-attached mechatronic node that also needs to drive LEDs. Its 5 V regulator rail can directly supply a small microcontroller and sensing front-end. When designing with the UJA1018TK, observe the recommended PCB layout for the HVSON exposed pad - a thermal land of at least 100 mm² of 1 oz copper is needed for sustained LED-driver currents. Decouple the regulator output with a 1 µF X7R ceramic placed within 3 mm of the VCC pin, and place the LIN bus termination and ESD protection within 10 mm of the LIN pin to meet IEC 61000-4-2 air-discharge ratings. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical PCB/EMC design notes not found in the manufacturer datasheet.
UJA1018TK,118 - LIN 2.x SBC with 5V LDO & LED Drivers | NXP
NXP UJA1018TK,118 is a LIN 2.0/2.1/2.2 and SAE J2602 compliant system-basis chip (SBC) integrating a LIN transceiver, a 5 V low-dropout (LDO) voltage regulator rated up to 70 mA, and two LED drivers, housed in a 16-pin HVSON (3.5 x 5.5 mm) exposed-pad package. A LIN System Basis Chip (SBC) is a mixed-signal IC that combines the physical-layer transceiver, an internal supply for the local microcontroller, and bus-switching or indicator-driving peripherals in a single die. It sits below the protocol layer (handled by software running on an external MCU) and above the physical LIN bus wire; the SBC therefore belongs to the broader class of in-vehicle networking (IVN) interface ICs in the automotive-power-tree hierarchy: SBC -> transceiver -> interface IC -> automotive semiconductor. Key features include LIN 2.0/2.1/2.2/SAE J2602 compliance, downward compatibility with LIN 1.3, an internal LIN slave termination resistor, Slave Node Position Detection (SNPD) for daisy-chain address assignment, integrated 5 V LDO capable of 70 mA, two programmable LED drivers, and a wide operating temperature range from -40 C to +150 C suited to under-hood automotive modules. The device is built on NXP's automotive-qualified mixed-signal BiCMOS process and uses an internal LIN slave termination that can be switched in/out to detect the node's position on the bus. This eliminates the need for an external termination resistor and simplifies ECU board layout where mechanical relay or electronic module LIN nodes are wired in series. Typical applications include automotive body-control modules, door/window/seat/mirror LIN slave nodes, HVAC control panels, steering-column switches, and ambient interior lighting nodes that require a regulated 5 V rail plus LIN connectivity in a small PCB footprint. When designing with this SBC, observe the maximum LIN bus load and slew-rate limits stated in the datasheet, and use the exposed pad as the primary thermal path - the LDO's 70 mA output and LED-driver current together define the package's power budget. A 100 nF decoupling capacitor placed within a few millimeters of the VCC pin is mandatory for stable LDO operation across the -40 C to +150 C range. This page synthesizes NXP distributor pricing, drop-in HVSON alternatives, and PCB-level design notes that go beyond the manufacturer datasheet's typical-application section.
UJA1023T - LIN 2.0 I/O Slave, 16-SO, NXP
The NXP UJA1023T is a stand-alone Local Interconnect Network (LIN) 2.0 compliant I/O slave integrated circuit, designed to replace discrete input and output handling components inside automotive electronic control units. The device integrates a LIN 2.0 controller, an integrated LIN transceiver (LIN 2.0 / SAE J2602 compliant, LIN 1.3 compatible), a 30 kΩ slave termination resistor, and eight general-purpose I/O lines, all packaged in a 16-pin Small Outline (SOT109-1 / 16-SO) surface-mount outline. A LIN transceiver IC is a category of in-vehicle networking transceivers that serves as the physical-layer interface between a microcontroller's UART and the single-wire LIN bus. In the broader system hierarchy, a LIN I/O follower sits below full system-basis chips and above discrete LIN bus drivers, providing a compact slave-node solution for distributed body-electronics applications such as door modules, mirror adjusters, and seat controllers. Key functional features of the UJA1023T include LIN 2.0 / SAE J2602 compliance for the physical layer, LIN 1.3 backwards compatibility, an integrated 30 kΩ bus termination resistor that eliminates an external component, eight configurable I/O lines that can act as digital inputs, digital outputs, or analog inputs, and a wide supply voltage range of 6.5 V to 27 V that directly accepts the automotive 12 V battery rail, including cranking transients. The IC operates with a maximum supply current of 1 mA and is qualified for automotive ambient temperatures. Architecturally, the UJA1023T pairs a hardware LIN protocol handler with parallel digital I/O registers, allowing the host microcontroller to service the bus autonomously and read or drive the I/O pins via a simple serial peripheral interface. Because the LIN protocol state machine is embedded, the host MCU only needs to handle application-level data, which reduces firmware complexity. Typical applications include automotive body-electronics slave nodes (door modules, mirror modules, seat controllers, steering-wheel switches, roof modules, and lighting clusters), HVAC flap and blower controls, and generic LIN-bus remote I/O expansion where host MCU pin count is limited but the application requires several additional digital or analog lines. When designing with the UJA1023T, ensure the local Vbat decoupling is sized for the cold-crank profile (down to 6.5 V) and that the LIN bus pin has the recommended reverse-battery and ESD protection network per the datasheet. Pins not used as I/O should be configured to a defined state in firmware to avoid parasitic current paths. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
UJA1023T/2R04/C,51 - LIN 2.0 I/O Slave | NXP Semiconductors
The NXP Semiconductors UJA1023T/2R04/C,51 is a stand-alone Local Interconnect Network (LIN) I/O follower (slave) that integrates a LIN 2.0 controller, a LIN 2.0/SAE J2602-compliant transceiver, a 30 kOhm LIN-slave termination resistor, and eight configurable I/O ports into a single 16-pin SOIC package supplied from 6.5 V to 27 V. It is designed to replace the discrete components commonly used in electronic control units (ECUs) for digital input capture, digital output driving, and LIN-bus communication. What is a LIN I/O follower? A LIN (Local Interconnect Network) I/O follower is a specialized node device in automotive LIN sub-bus networks. LIN is a low-cost single-wire serial protocol standardized by ISO 17987 (formerly LIN 1.3 / LIN 2.0 / SAE J2602) used for in-vehicle body-electronics communication (window lifters, seat controllers, mirror adjusters, ambient lighting). A LIN I/O follower replaces a small microcontroller + LIN transceiver + I/O expander combination with one IC that listens to LIN commands and drives/reads I/O lines directly, reducing BOM cost and PCB area in low-complexity slave nodes. Key features include LIN 2.0 protocol compliance with LIN 1.3 backward compatibility, SAE J2602 interoperability, integrated 30 kOhm bus termination (no external resistor required), eight software-configurable I/O ports routed via LIN, an SPI-compatible host interface for diagnostics and configuration, and built-in thermal protection. The /2R04 variant designation specifies the I/O mapping and firmware revision; /C,51 indicates the SOIC-16 tape-and-reel packaging and lead-finish code. Architecturally, the UJA1023 combines a LIN protocol handler, a physical-layer transceiver compliant with ISO 9141 / LIN 2.0 / SAE J2602, an internal 30 kOhm pull-up for slave nodes, and a multi-purpose I/O controller. The high integration eliminates the typical external microcontroller in simple LIN slaves, while the SPI host interface allows a higher-level ECU to log or override I/O states during diagnostics. Typical applications include automotive body-electronics modules (window lift, seat control, mirror adjust, ambient lighting, sunroof), HVAC auxiliary controls, door-handle and key-fob reader modules, and LIN-bus sensor actuators. The wide 6.5 V-27 V supply range tolerates automotive load-dump transients up to the absolute maximum ratings stated in the datasheet. Design considerations include adding a reverse-battery protection diode and adequate bulk decoupling on VBat, plus a 100 nF ceramic bypass capacitor close to the supply pin. The internal 30 kOhm termination is enabled in master-less slave configurations; in master or external-terminated nodes, the resistor is typically disabled via configuration. The /2R04 firmware revision must be matched against the OEM's LIN cluster description (LDF/NCF) to ensure correct I/O mapping. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
UJA1169ATK/3Z - Mini HS-CAN SBC, 3.3V/250mA, AEC-Q100 | NXP
The NXP UJA1169ATK/3Z is a mini high-speed CAN System Basis Chip (SBC) in the UJA1169ATK family, integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver that supports CAN FD up to 5 Mbit/s together with an on-board 3.3 V (V1) LDO regulator rated at 250 mA for the host microcontroller supply, all housed in a 20-pin HVSON package (3.5 x 5.5 mm). What is a CAN System Basis Chip (SBC)? An SBC is a highly integrated mixed-signal IC that combines a CAN (Controller Area Network) or CAN FD physical-layer transceiver with on-chip power management - typically one or more low-dropout (LDO) regulators - and optional watchdog, SPI control and wake-up logic. In the automotive ECU hierarchy, an SBC sits between the 12 V board net, the host microcontroller, and the CAN bus, replacing several discrete components: an HS-CAN transceiver, a 5 V or 3.3 V regulator for the MCU, reverse-battery protection and bus ESD protection. The wider taxonomy is: SBC -> CAN transceiver -> automotive networking IC -> power management IC -> semiconductor. Key features of the UJA1169ATK/3Z include 250 mA continuous V1 current to power a small MCU, support for CAN FD at 5 Mbit/s, integrated bus dominant clamping and very low-current standby modes with remote wake-up via the bus. The transceiver meets the stringent automotive EMC and ESD requirements of the ISO 11898-2:2016 standard and the SAE J2284-1 to J2284-5 specifications, while the integrated regulator and protection circuitry reduce external component count and PCB area in ECU designs. Architecturally, the part uses a high-voltage analog/mixed-signal process for the bus-side drivers and a low-voltage digital block for the SPI register set and V1 LDO. This dual-rail approach allows direct connection to a 12 V automotive supply while still powering the host MCU from the on-chip 3.3 V regulator in the /3Z variant. Typical applications include body control modules, gateway ECUs, CAN node power management in 12 V systems, ADAS sensor interface nodes and any automotive system that needs a single-chip CAN interface plus local MCU supply. Compared with discrete CAN transceivers plus external regulators, the UJA116ATK family shrinks the BOM and simplifies EMC compliance. When designing with the UJA1169ATK/3Z, ensure the 12 V supply is properly filtered, route the CANH/CANL lines as a 120 ohm twisted pair, and decouple V1 with the value recommended in the manufacturer datasheet. The /3Z variant is the 3.3 V V1, tape-and-reel orderable variant; the 5 V variant is the UJA1169ATK/F/3Z and the non-Z variants differ only in packing or V1 voltage. This page synthesizes real distributor pricing, drop-in alternatives from the same NXP UJA1169 family, comparison data and practical design notes not collated on the manufacturer product page alone.
UJA1169ATK/F/3 - Mini HS-CAN SBC, 3.3V LDO, 20-HVSON | NXP
The NXP Semiconductors UJA1169ATK/F/3 is a mini high-speed CAN System Basis Chip (SBC) that integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver (supporting CAN FD up to 5 Mbit/s) together with a 3.3 V, 250 mA microcontroller supply and an internal 5 V regulator (V2) for the CAN transceiver. Housed in a 20-pin HVSON (3.5 x 5.5 mm) package, it provides partial networking with selective wake-up via CAN FD-passive capability. The /3 suffix designates the V1 regulator variant as 3.3 V rather than the 5 V used in the base UJA1169ATK, while the /F suffix enables the selective wake-up (partial networking) function. The device includes a watchdog, SPI control interface, and comprehensive protection features for automotive network nodes. A System Basis Chip (SBC) is an automotive-grade mixed-signal IC that consolidates a CAN/CAN FD transceiver with one or more voltage regulators, system protection, and optional wake-up logic into a single package. SBCs sit between the vehicle battery and the microcontroller, replacing several discrete components (transceiver, LDO, watchdog, reset generator) and reducing PCB area, BOM cost, and quiescent current in always-on networks. The UJA1169ATK family targets body-control modules, gateway ECUs, and zonal architectures in modern vehicles. Key features include a 3.3 V / 250 mA V1 regulator for the host MCU, a 5 V internal V2 regulator for the CAN transceiver, low quiescent current in standby and sleep modes with selective wake-up, an SPI interface for configuration and diagnosis, and integrated bus-failure management. The selective wake-up function allows ECUs to ignore CAN traffic not addressed to them, dramatically reducing network-wide quiescent current in CAN partial-networking architectures. The HVSON-20 package with exposed pad provides low thermal resistance for reliable operation in under-hood environments. The UJA1169ATK/F/3 is typically used in body and comfort ECUs, gateway modules, and any node that must wake selectively from CAN partial-networking traffic. It is particularly suited to OEM platforms targeting ISO 11898-2:2016 compliance with CAN FD-passive wake-up, where legacy nodes and FD-capable nodes coexist on the same bus. When designing with this SBC, ensure the HVSON exposed pad is soldered to a sufficient copper area for thermal dissipation, follow NXP's reference layout for the bus split termination, and configure the partial-networking filter mask in software to match the OEM-defined wake-up frame. All configuration is via SPI from the host MCU; no external programming is required. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes for the UJA1169ATK/F/3 that go beyond what the manufacturer datasheet alone provides.
UJA1169ATK/F/3Z - Mini HS-CAN SBC with 3.3V LDO | NXP
The NXP UJA1169ATK/F/3Z is a mini high-speed CAN System Basis Chip (SBC) that integrates an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver supporting CAN FD up to 5 Mbit/s, alongside an onboard 3.3 V microcontroller supply (V1) and a second 5 V onboard LDO (V2), both rated at 250 mA, in a 20-pin HVSON (3.5x5.5 mm) package with exposed thermal pad. An SBC is an integrated automotive network IC that combines a CAN (Controller Area Network) physical-layer transceiver with one or more voltage regulators and supporting features such as watchdog, wake-up management, and fail-safe output control. The SBC sits between the vehicle battery (VBAT) and the microcontroller, providing a regulated supply while the HS-CAN transceiver links the host MCU to the in-vehicle CAN bus. This class of device collapses what would otherwise be several discrete ICs into a single package, reducing PCB area, BOM cost, and quiescent-current budget in body, chassis, and powertrain ECUs. Key specifications of the UJA1169ATK/F/3Z include: 3.3 V V1 LDO with 250 mA current capability, 5 V V2 LDO at 250 mA for the internal transceiver and additional onboard hardware, CAN FD data rates up to 5 Mbit/s, very low VBAT quiescent current in standby modes, and integrated fail-safe behavior with a watchdog and SPI control. The /3 suffix on this variant fixes V1 at 3.3 V rather than the 5 V used in the UJA1169ATK, UJA1169ATK/F, UJA1169ATK/X, and UJA1169ATK/X/F members of the family. The /F suffix indicates the SPI-gated watchdog configuration; the trailing Z designates the 13-inch reel SBB packing format. Architecturally, the UJA1169ATK/F/3Z pairs a high-speed CAN physical layer with two linear regulators sharing a common thermal pad. The HVSON-20 exposed-pad package keeps thermal resistance low so both regulators can sustain full 250 mA loads simultaneously, while the integrated CAN transceiver implements the ISO 11898-2:2016 standard and supports the SAE J2284 series bit-timing benchmarks used by global automakers. The device supports selective wake-up and several low-power modes that allow an ECU to drop to microamp-level quiescent draw when the bus is idle. Typical automotive applications include body control modules, gateway ECUs, sensor cluster nodes, HVAC controllers, comfort and convenience modules, and small powertrain controllers. The 3.3 V LDO mapping of the /3 variant makes the device a direct fit for low-voltage host microcontrollers such as the NXP S32K1xx family that operate from a 3.3 V rail. When laying out the PCB, place decoupling capacitors directly at V1 and V2 with short, wide ground returns, and attach the exposed thermal pad to a copper plane sized for the worst-case dissipation. Use a 13-inch reel handling process consistent with the Z suffix to integrate this part into high-volume surface-mount lines. This page synthesizes distributor pricing, drop-in alternative selection, and practical SBC design notes not found in the manufacturer datasheet.
UJA1169ATKZ - Mini HS-CAN SBC, 5V/3.3V LDO 250mA | NXP
The NXP UJA1169ATKZ is a mini high-speed CAN System Basis Chip (SBC) integrating an ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant HS-CAN transceiver with CAN FD support up to 5 Mbit/s, plus an integrated 5 V or 3.3 V, 250 mA voltage regulator (V1) for a host microcontroller or peripheral loads, all housed in a 20-pin HVSON (3.5 x 5.5 mm) exposed-pad package. It targets compact automotive body and network applications where PCB area, BOM count, and quiescent current are critical, and where a clean CAN bus interface plus a small, protected supply rail must coexist with a serial peripheral interface (SPI) control channel and independent watchdog. A System Basis Chip (SBC) is a category of automotive networking IC that combines a physical-layer transceiver with on-chip power, supervision, and diagnostic functions into a single die. Within the broader hierarchy, SBCs sit between standalone CAN transceivers (which provide only the bus interface) and full ECU power-management companions (PMICs), allowing one part to replace what traditionally required three or four discrete devices. The UJA1169 family achieves this by merging an HS-CAN physical layer with a low-drop linear regulator, a watchdog, an SPI configuration port, and a LIMP output for fail-safe system behavior. Key features include CAN FD support up to 5 Mbit/s for modern in-vehicle networking bandwidth, integrated 250 mA LDO selectable between 3.3 V and 5 V to host an MCU without an external regulator, very low quiescent current in standby modes for permanently connected nodes, integrated watchdog with window or timeout behavior, SPI for control and status, and a LIMP pin for graceful system degradation. The HVSON-20 exposed pad provides a low thermal resistance path suitable for harsh automotive environments. Architecturally, the device uses a mixed-signal BiCMOS process: the CAN transceiver meets ISO 11898-2:2016 (and the upcoming merged ISO 11898-2/5/6 standard for selective wake-up and CAN FD), while the regulator is implemented as a high-side series pass element with reverse-polarity and load-dump protection suitable for 12 V automotive battery rails. Battery/supply voltage can reach 28 V (with load-dump transient tolerance typical for 12 V systems). Typical applications include automotive body control modules (BCMs), gateway and CAN nodes requiring a regulated MCU rail, network sensors and actuators, HVAC controllers, seat/door/zone modules, and anywhere an HS-CAN node with integrated microcontroller power is needed to shrink the BOM. When designing with this part, derate the 250 mA regulator headroom against the V1 voltage tolerance, since a 12 V battery input powering a 5 V, 200 mA MCU load dissipates roughly 1.4 W in the package. Sufficient copper area on the exposed pad is recommended to keep the junction within the automotive temperature range. This page synthesizes NXP distributor pricing, qualified drop-in alternative cross-references, and practical automotive-node design notes that go beyond the manufacturer datasheet itself.
UM9921 - Microchip Technology | XAIPART
The Microchip Technology UM9921 is a component listed by Microchip Technology and distributed through authorized channels such as Arrow Electronics and indexed by Octopart, where it is categorized under the PIN (pin electronics / pin driver) product grouping. Publicly verified distributor records for the UM9921 confirm the manufacturer as Microchip Technology, but do not expose detailed electrical specifications in the retrieved web data, so engineers should consult the official Microchip documentation before design-in. A PIN-category device in the semiconductor hierarchy sits under interface ICs and signal-conditioning components: pin electronics are the circuits that drive and receive signals on the pins of a device under test, a role most commonly found in automated test equipment (ATE) and validation platforms. Within that hierarchy, the component family progresses from discrete drivers and comparators to integrated pin-electronics channels and, ultimately, complete ATE pin-card assemblies. Components in this class typically combine a high-speed driver, a comparator window, and active loads in a single channel. Because the retrieved verified web data for the UM9921 does not include published key parameters such as supply voltage, output current, package type, or operating temperature range, this page deliberately marks those values as data-pending rather than estimating them. This ensures that every number presented can be traced to a real source - in this case the Octopart index entry and the Arrow Electronics product page, both of which list the UM9921 under Microchip Technology. Typical use contexts for Microchip PIN-category parts include test and measurement systems, engineering validation fixtures, and production test equipment where per-pin drive and compare functions are required. The UM9921 should be selected only after confirming pinout, package, and electrical ratings from the manufacturer datasheet. Design consideration: before substituting or second-sourcing this part, verify pin-to-pin compatibility and package identity against the original, since cross-brand equivalents for specialized PIN-category components are rarely drop-in replaceable. This page synthesizes distributor listings, availability signals, and honest data-gap markers not found on aggregator sites, providing an accurate starting point for sourcing and qualification.
UPD72874GC-YEB-A - IEEE 1394a OHCI 1.1 PHY-Link Host Controller | Renesas
The Renesas UPD72874GC-YEB-A is a single-chip IEEE 1394a OHCI 1.1 compliant PHY-Link host controller integrating three 1394 ports (one cable port and two additional ports), the PHY analog front end, the link layer, and the OHCI host interface. According to the manufacturer datasheet, the device operates up to 400 Mbps (S400) and is housed in a plastic QFP package. It was originally developed by NEC Electronics and is now produced under the Renesas brand following the 2010 merger. An OHCI (Open Host Controller Interface) PHY-Link controller is a type of bridge IC that connects a host CPU (typically via PCI) to an IEEE 1394 (FireWire) serial bus. The PHY (Physical Layer) handles bus arbitration, signal encoding/decoding, and cable presence detection, while the Link Layer implements the transaction and DMA engines defined by the OHCI specification. By collapsing these two layers into one LSI, the part reduces board area, BOM cost, and design complexity relative to two-chip solutions. Key features include compliance with IEEE Std 1394a-2000 and the 1394 OHCI Specification 1.1, support for 100/200/400 Mbps transfer rates, bus-powered capability, integrated 1.5 kV cable-port ESD protection (typical for the family), 3.3 V core supply with 5 V tolerant I/O, and a power-management state machine for suspended and standby modes. The host bus interface conforms to PCI 2.1 with a 32-bit data path at up to 33 MHz. The device implements a deeply pipelined DMA engine with physical DMA, asynchronous transmit, asynchronous receive, isochronous transmit, isochronous receive, and self-ID receive DMA contexts. Internal PHY/link arbitration logic handles bus reset propagation, parent/child port selection, gap-count optimization, and cycle-master arbitration so that the host CPU only sees OHCI-compliant descriptors and interrupt events. Typical applications include desktop and notebook PC FireWire host add-in cards (PCI / mini-PCI), DV camcorder connection docks, external RAID and multi-disk enclosures, industrial machine-vision frame grabbers, and legacy PC-based audio interfaces for IEEE 1394 audio devices. Designers chose this part when they needed a single chip that already passed 1394a compliance testing rather than qualifying PHY and Link separately. When laying out the board, keep the 1394 cable-port differential traces (TPB/TPA pairs) matched to 110 ohm differential impedance and isolated from switching nodes. Decouple each VCC pin with a 0.1 uF ceramic cap placed within 3 mm of the lead, and provide a ferrite bead on the cable bus power rail to limit injected noise.
USB2512B-I/M2 - 2-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip USB2512B-I/M2 is a 2-port USB 2.0 Hi-Speed hub controller housed in a 36-pin SQFN (6x6 mm) package, designed for consumer, mobile, and embedded applications where low power and small footprint are critical. It operates across a 3.0 V to 3.6 V supply range, supports USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps) downstream signaling, and integrates Microchip's MultiTRAK™ (multi-transaction translator) technology with one transaction translator per downstream port for parallel traffic handling. A USB hub controller is a USB class-compliant device that expands one upstream USB port into multiple downstream ports while managing power negotiation, bus enumeration, and split-transaction routing. The hub sits in the broader USB controller hierarchy (USB 2.0 interface IC → USB hub → USB compound device) and is the standard building block for adding USB Type-A downstream ports to laptops, docking stations, monitors, automotive head units, and embedded SBCs. Key features include integrated upstream and downstream termination resistors (saving external component count), configurable port-mapping via pin strap or SMBus, per-port power-switch control with over-current sensing, and individual port ganging. The device supports battery-charging detection (BC 1.2) on downstream ports when paired with an external charger emulator, and offers an optional JTAG boundary-scan interface for board-level test. MultiTRAK™ technology dedicates a transaction translator to each downstream port, allowing concurrent traffic on ports operating at different speeds (e.g., a Full-Speed keyboard plus a Hi-Speed storage drive). Compared to single-TT hubs that serialize all downstream transactions, this dramatically improves throughput in mixed-speed, detachable-device scenarios typical of consumer and embedded designs. Typical applications include laptop docking stations, USB Type-A expansion on monitors and TVs, automotive infotainment rear-seat charging hubs, industrial panel PCs, and consumer electronics such as set-top boxes and printers requiring USB port expansion. The 36-SQFN 6x6 mm footprint also enables compact mobile and IoT designs. When designing with this part, ensure the upstream port's VBUS detection is routed correctly and that downstream over-current sensing resistors match the chosen power switch FETs. The /PRTPWR and /OCS pins require careful PCB layout to avoid false-trip events during hot-plug events. This page synthesizes current distributor pricing, drop-in same-family alternatives (USB2512B-AEZG, USB2512BT-I/M2), and practical design notes not duplicated in the manufacturer datasheet.
USB2512BI-AEZG - 2-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip Technology USB2512BI-AEZG is a 2-port USB 2.0 high-speed, low-power hub controller IC housed in a 36-pin QFN (6x6 mm) package. The device operates from a single 3.3 V supply and supports Low-Speed, Full-Speed, and Hi-Speed USB upstream and downstream traffic through a 2-port downstream configuration. It targets embedded USB port expansion for consumer, mobile, and industrial products. A USB hub controller is an interface IC that manages multiple downstream USB device connections from a single upstream USB host port, handling transaction translation, power management, and protocol negotiation across USB 1.1 (Low/Full Speed) and USB 2.0 (Hi-Speed) links. The USB2512BI-AEZG belongs to the USB 2.0 hub controller family within the broader interface IC category, sitting between the physical USB connectors and the system processor. Key features include Microchip's MultiTRAK™ high-performance transaction translator, per-port battery-charging support, an I²C/SMBus management interface for configuration, and integrated upstream-port power detection. The industrial temperature grade (-40°C to +85°C) plus 3.3 V single-supply operation simplifies power-tree design versus discrete hub implementations. The 36-pin QFN-EP package with exposed thermal pad offers good thermal dissipation for bus-powered and self-powered applications. Internally, the device uses a USB 2.0 UTMI/UTMI+ compatible PHY, an embedded hub repeater, and dedicated transaction translators per downstream port. MultiTRAK™ allows concurrent traffic on multiple downstream ports at mixed speeds, eliminating the throughput loss common to single-TT architectures. An external 24 MHz crystal provides the reference clock, and an optional EEPROM or SMBus master configures VID/PID and string descriptors. Typical applications include docking stations, monitors with built-in USB ports, laptop port replicators, embedded industrial PCs, automotive infotainment head units, and any consumer device that must expand a single USB host port into multiple ports while preserving Hi-Speed (480 Mbps) throughput. When designing with this IC, place the 24 MHz crystal within 5 mm of the XI/XO pins, route the USB DP/DM differential pairs as 90 Ω impedance matched traces, and connect the exposed pad to a continuous ground plane to meet USB-IF compliance and EMI targets. This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
USB2513B-AEZC-TR - 3-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip USB2513B-AEZC-TR is a 3-port USB 2.0 Hi-Speed hub controller IC in a 36-pin QFN (6x6 mm) package with exposed pad, engineered for embedded USB port expansion in cost- and power-sensitive designs. It integrates a Hi-Speed upstream port and three downstream ports, supports USB 2.0 Link Power Management, and operates from a single 3.3 V supply. MultiTRAK technology delivers one transaction translator per downstream port, improving throughput in mixed-speed environments versus single-TT hubs. A USB hub controller is a USB Interface IC that aggregates one upstream USB connection into multiple downstream ports, allowing many devices to share a single host root port. Within the broader taxonomy, a USB hub belongs to USB Interface ICs, which sit under Interface ICs and ultimately under Integrated Circuits. The USB2513B-AEZC-TR implements the hub repeater and transaction-translator functions defined by the USB 2.0 specification, while adding vendor-specific features such as per-port battery-charging detection and configurable port mapping. This makes it the lowest-level "smart" intermediary between a USB host and peripherals. Key features include a 36-pin QFN-EP package with low thermal resistance, an SMBus/I2C management interface for configuration and GPIO control, integrated upstream and downstream termination resistors, and per-port enable and over-current sense inputs. The device supports self- and bus-powered operation, individual port switching, and optional FlexConnect technology for role reversal between upstream and downstream ports. Technically, the USB2513B uses MultiTRAK, which assigns a dedicated transaction translator to each downstream port. This avoids the head-of-line blocking seen in single-TT hubs when a full-speed device is connected alongside Hi-Speed traffic, sustaining throughput on all three ports simultaneously. Internal charge-pump regulation supplies the high-side drive for the downstream D+/D- lines without external 5 V short-circuit protection FETs when paired correctly. Typical applications include USB port expansion in set-top boxes, docking stations, automotive head units, monitors with USB hubs, and industrial HMI panels. Designers select this part when three downstream ports, low standby current, and a small QFN footprint are simultaneously required. When designing with this hub, the exposed pad must be soldered to a continuous ground plane for thermal dissipation and signal return. Place the 3.3 V decoupling capacitors within 2 mm of the respective supply pins and observe the 90-ohm differential impedance requirement for USB DP/DM traces. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, helping procurement and embedded design teams shorten the bill-of-material selection cycle.
USB2514B-AEZC - 4-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip Technology USB2514B-AEZC is a 4-port USB 2.0 Hi-Speed hub controller housed in a 36-pin QFN (6x6 mm) package with exposed pad. It operates from a 3.0V to 3.6V single supply, supports Low/Full/Hi-Speed USB signaling (480 Mbps), and integrates Microchip's MultiTRAK™ technology for industry-leading throughput in mixed-speed USB environments. The device provides four downstream ports with per-port battery-charging detection and is well suited for consumer, mobile, and embedded computing platforms. What is a USB hub controller? A USB hub controller is an interface IC that expands a single upstream USB port into multiple downstream ports, handling the USB protocol, transaction translation, and port power management. It belongs to the broader family of interface ICs (USB controllers → interface ICs → digital ICs → semiconductors) and sits between the host controller and end devices, isolating traffic per port and enumerating attached peripherals. Key features include USB 2.0 Hi-Speed compliance, integrated 1.5 kΩ upstream pull-up, automatic Hi-Speed termination, port-status indicators, ganged or individual port power switching, and optional battery charging support on downstream VBUS. The internal architecture pairs a serial interface engine (SIE), hub repeater, and transaction translator, allowing full- and low-speed devices to operate behind a Hi-Speed hub without throughput penalty. The USB2514B-AEZC also exposes I2C/SMBus configuration, GPIO for LED indicators, and PRTPWR power-control outputs per port. Its compact 36-QFN footprint and low standby current make it a common choice for space-constrained designs such as docking stations, monitors, automotive head units, and embedded motherboards. Typical applications include USB port expansion on docking stations, automotive infotainment hubs, monitors with built-in USB, all-in-one PCs, set-top boxes, and embedded industrial PCs. The 4-port density matches the most common desktop-peripheral expansion scenarios without external port-multiplier silicon. When designing with this part, observe the datasheet's recommended decoupling (1 µF + 0.1 µF near VBAT and VDD33) and provide a stable 3.3V rail. The exposed thermal pad must be soldered to a grounded copper pour to meet the QFN-36 thermal performance spec. PRTPWR drive strength is limited; pair with an external power switch (such as Microchip's MIC2026) for VBUS control. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
USB2517I-JZX-TR - 7-Port USB 2.0 Hub | Microchip
The Microchip Technology USB2517I-JZX-TR is a USB 2.0 seven-port hub controller with seven downstream ports, USB 2.0 compliance, and a 64-pin QFN package measuring 9 mm by 9 mm. It is designed for embedded USB systems requiring low-power, configurable hub expansion. The controller supports Low-Speed, Full-Speed, and Hi-Speed downstream devices when operating as a Hi-Speed hub, while its upstream attachment can operate as a Full-Speed or Full-/Hi-Speed hub. A USB hub controller is an interface semiconductor that manages traffic between one upstream USB host and multiple downstream devices. It belongs to the USB interface controller, interface IC, and connectivity semiconductor hierarchy. The USB2517 family uses MultiTRAK technology to support mixed-speed USB environments while helping embedded designs consolidate multiple peripheral connections behind one upstream host interface. The USB2517I is identified in the verified data as the industrial-temperature-rated member of the USB2517 family. Its 64-QFN 9 x 9 mm package supports compact embedded implementations, while the integrated hub function reduces the need for discrete USB routing and control components. The device is described by Microchip as low power and OEM configurable, making it suitable for system-level USB port expansion where firmware, hub configuration, and downstream-port requirements are controlled by the OEM. Typical embedded uses include industrial equipment, test systems, printers, storage appliances, communications equipment, and other products that need more USB connections than a host controller provides directly. Because USB2517I is a hub rather than a host controller, the system still requires an upstream USB host or host-capable controller. The hub’s downstream devices can include low-speed, full-speed, and hi-speed USB peripherals, subject to the operating mode and system configuration. Designers should verify the complete pinout, power requirements, crystal or clock implementation, port-enable behavior, and configuration requirements against the manufacturer datasheet before layout. The 64-QFN package also requires careful exposed-pad thermal and assembly planning. This page combines verified manufacturer, distributor, and datasheet information with practical design context; unsupported electrical details remain marked for data completion rather than inferred.
USB2660I-JZX-03 - USB 2.0 Hub & Multi-Format Flash Controller | Microchip
The Microchip Technology USB2660I-JZX-03 is a USB 2.0 Hi-Speed hub controller combined with a multi-format flash media reader/writer and dual Secure Digital (SD) interfaces, integrated in a single chip. Per the Microchip USB2660/USB2660i datasheet (DS00001931B), this combo device delivers up to 480 Mbps Hi-Speed USB performance, two downstream USB 2.0 ports, and multi-format flash card support including SD, MMC, Memory Stick, and xD-Picture Card. The device is housed in a 64-pin QFN (JZX) 9x9 mm package with exposed thermal pad, designed for surface mount desktop and notebook PC applications. The industrial temperature grade (-40C to +85C) makes the USB2660I variant suitable for non-consumer embedded use cases where the commercial-grade USB2660 is insufficient. A USB 2.0 Hi-Speed hub controller is a category of USB peripheral that aggregates multiple downstream ports and card-reader functions behind a single upstream port, while a flash media controller is a class of storage interface IC that bridges a host processor to removable flash memory cards using standardized protocols such as SD, MMC, and MSPro. The USB2660I sits at the intersection of these two product types, forming part of the broader USB interface IC hierarchy: USB peripheral controller -> USB hub controller -> combo hub + media reader -> Microchip USB264x/2660 family. This combination reduces PCB area, BOM count, and design complexity for system integrators that would otherwise need a separate hub chip and card-reader chip. Key features of the USB2660I-JZX-03 include 2 downstream USB 2.0 Hi-Speed ports, an internal transaction translator for mixed-speed USB environments, multi-format flash card support with dual SD interfaces, integrated card power FETs, on-board 24 MHz crystal driver, and USB-IF certified hub silicon. The chip is USB 2.0 compliant and supports Suspend and low-power modes per the USB specification. Programmable through an external I2C EEPROM, the device enables custom vendor/product IDs, string descriptors, and manufacturer-specific behavior. Internally the USB2660I uses Microchip's proven UTMI+ compliant physical layer and a hardened Hi-Speed USB 2.0 hub topology that delivers industry-leading data throughput in mixed-speed environments where some downstream devices run at Full-Speed (12 Mbps) and others at Hi-Speed (480 Mbps). The integrated media controller supports USB Mass Storage class and SDIO bridging, enabling SDIO peripherals to enumerate over USB with custom firmware. Typical applications include desktop and notebook PCs, multi-function printers with card reader slots, docking stations, set-top boxes, and industrial panel PCs that expose SD card slots and multiple USB ports to end users. Designers use the USB2660I-JZX-03 to consolidate USB expansion and media reading onto a single 9x9 mm QFN. When designing with the USB2660I-JZX-03, allocate at least four PCB layers for clean USB signal routing, route the differential DP/DM pair as a 90-ohm impedance-matched pair, and provide a local 0.1 uF decoupling cap adjacent to every power pin. The exposed thermal pad must be soldered to a contiguous ground pour to meet USB-IF Hub Certification thermal-rise limits.
USB3320C-EZK - Hi-Speed USB 2.0 ULPI Transceiver | Microchip
The Microchip USB3320C-EZK is a highly integrated full-featured Hi-Speed USB 2.0 transceiver built on the proven ULPI (UTMI+ Low Pin Interface) standard, housed in a 32-pin QFN (5x5 mm) package. It supports 480 Mbps High-Speed and 12 Mbps Full-Speed USB signaling, operates from a single 3.3 V supply with on-chip 1.8 V LDO regulator, and provides up to +30 V VBUS ESD protection on the USB connector side. A USB 2.0 transceiver (also called a PHY) is the physical-layer analog block that sits between a digital SoC's ULPI/UTMI link and the differential DP/DM lines of a USB connector. It handles HS chirp, packet detection, serializer/deserializer, and clock recovery, while leaving link-layer protocol to the host controller. Within the system hierarchy, the USB3320C-EZK is a peripheral controller companion IC: SoC (application processor) -> ULPI link -> USB3320 PHY -> DP/DM -> USB connector. This split architecture lets designers pair an inexpensive PHY with any SoC that exposes ULPI pins (NXP i.MX, ST STM32, Xilinx Zynq, TI Sitara). Key electrical characteristics include 480 Mbps Hi-Speed data rate, internal 1.8 V regulator eliminating external LDO, integrated 45 ohm HS termination resistors (no external Rs needed), 8-bit single-data-rate ULPI interface with 60 MHz reference clock, and integrated USB charger-detection hardware. The device is USB 2.0 specification compliant, USB Battery Charging v1.2 capable, and OTG-ready via the ID pin. The architecture uses a 60 MHz reference clock input (REFCLK) generated by the SoC, an internal PLL multiplies to 480 MHz for HS operations. A digital state machine handles UTMI/ULPI command interpretation, while the analog block performs line termination, current-mode driver bias, and disconnect detection. The chip supports both host and peripheral roles. Typical applications include USB 2.0 device/host ports on single-board computers, OTG ports on industrial tablets, automotive infotainment USB interfaces, medical device USB ports, and 5G/LTE modem modules with USB 2.0 diagnostic channels. Designers favor the USB3320C-EZK over UTMI-only PHYs because ULPI slashes pin count to 12 versus UTMI's 30+. When designing with this device, maintain 90-ohm differential impedance on DP/DM traces to the connector, place decoupling capacitors on VDD33/VDD18/VBAT as close as possible to the IC, and ensure the REFCLK signal has less than 50 ps jitter to pass USB compliance. Do not omit the ID pin pull-up for OTG or charger-detection operation.
USB3803 - 3-Port USB 2.0 Hi-Speed Hub Controller | Microchip
The Microchip USB3803 is a three-port USB 2.0 Hi-Speed hub controller optimized for portable, battery-powered embedded systems, integrating BC 1.1 charger detection, flexible internal power regulators, and a 25-ball WLCSP package. It connects to an upstream port as a Full-Speed or Hi-Speed hub and supports Low, Full, and Hi-Speed downstream devices on all enabled ports. The device targets tablets, smartphones, and other mobile platforms where small footprint, low standby current, and minimal BOM are critical design constraints. A USB hub controller is a dedicated interface IC that aggregates multiple downstream USB ports behind a single upstream port, handling transaction translation, port power control, and suspend/resume signaling. In the broader USB-IF taxonomy, hubs sit between hosts (root hubs inside PC chipsets) and peripherals, implementing Chapter 11 of the USB 2.0 specification. The USB3803 belongs to the "embedded hub" sub-category, optimized for integration into battery-powered devices rather than stand-alone retail hubs. Key features include 480 Mbps Hi-Speed upstream support, integrated USB-IF Battery Charging 1.1 detection on the upstream port, integrated 5V-to-3.3V and 1.8V regulators, a serial slave (I2C) interface for status/configuration, and ultra-low standby and bypass current modes. The WLCSP-25 package measures only 2.0 x 2.0 mm, enabling placement on space-constrained mobile mainboards. Microchip's Bypass mode (USB3803C variants) reduces quiescent current to single-digit microamperes when the host is off, directly extending battery life. Architecturally, the USB3803 integrates a Hi-Speed UTMI/ULPI-less PHY, a serial interface engine (SIE), per-port transaction translators, and the charger-detection analog block. The on-chip regulators remove the need for external LDO components when powered from a single 5V VBAT rail, further shrinking BOM count. The I2C serial slave interface exposes charger-status and configuration registers, allowing the application processor to query attach type, port power status, and override default settings. Typical applications include tablets and 2-in-1 laptops requiring one USB-A expansion port, smartphone accessories with OTG-to-host bridging, portable medical devices, and embedded infotainment head units. The charger-detection block also enables the device to act as a charger-sensing front-end, reporting Standard Downstream Port (SDP), Charging Downstream Port (CDP), or Dedicated Charging Port (DCP) classification back to the application processor over I2C. When designing with this part, allocate adequate PCB area under the WLCSP for the exposed die pad and route the 90-ohm differential USB pairs with controlled impedance. Microchip's USBCheck online design review service is available free of charge to qualified customers using the USB3803 in production designs. This page synthesizes distributor stock, application-grade alternatives, and practical layout notes not found in the manufacturer datasheet, giving embedded engineers a single decision-ready reference.
USB5742/2G - 2-Port SS/HS USB 3.1 SmartHub Controller | Microchip
The Microchip USB5742/2G is a 2-port, low-power SuperSpeed/Hi-Speed USB 3.1 Gen 1 SmartHub hub feature controller with 2 downstream ports, housed in a 56-pin VQFN (7x7 mm) package with exposed thermal pad. It supports USB 3.1 SuperSpeed (5 Gbps), USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps) downstream traffic, and includes SPI/SMBus configuration interfaces for OEM-flexible firmware customization. A SmartHub is a USB hub controller IC with integrated bridge logic and configurable firmware that adds value features beyond the basic USB hub function defined by the USB-IF. As a category, SmartHub belongs to the USB Interface IC family (a subset of Interface ICs > Integrated Circuits), sitting between root hosts and downstream USB peripherals and providing functions such as port-power switching, per-port enable, programmable GPIO, and flexible upstream port mapping. The USB5742 specifically implements Microchip's fifth-generation USB 2.0 hub feature controller operating in parallel with a SuperSpeed transaction translator, decoupling 5 Gbps SuperSpeed signalling from legacy 480 Mbps traffic and removing the legacy FS/LS signalling bottleneck of older USB-IF transaction translator rules. Key features include full USB Battery Charging v1.2 support including CDP/DCP modes, integrated 5 V VBUS switch drivers with per-port overcurrent protection, USB Link Power Management (LPM) Addendum compliance for U1/U2/U3 low-power states, role-swapping for reversible Type-C wiring, and Microchip's proprietary Multi-Transaction Translator (Multi-TT) for full 480 Mbps bandwidth on all downstream ports simultaneously. The device operates from a single 3.3 V supply, integrates a 5 V to 3.3 V regulator for internal logic, and the -40C to +85C industrial temperature grade supports embedded OEM use. Typical applications include two-port docking stations, embedded USB expansion for industrial PCs, automotive rear-seat USB chargers, USB Type-A wall chargers with smart-charging, and head-unit infotainment connectivity modules. The SPI host interface allows an external MCU to enumerate attached devices, customize charging profiles, and read port events. When designing with the USB5742/2G, ensure the 56-VQFN exposed pad is properly soldered to a contiguous ground plane of at least 1 square inch to meet the 90 mA unconfigured VBUS-current budget. Bypass the 3.3 V rail with 10 uF + 100 nF ceramic capacitors placed within 5 mm of the supply pin, and follow USB-IF HS/SS routing rules (90-ohm differential impedance, intra-pair skew under 15 ps). This page synthesizes distributor pricing, drop-in equivalent SmartHub alternatives, and practical layout guidance not found in the standalone manufacturer datasheet.
USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip
The Microchip USB5807C-I/KD is a 7-port, SuperSpeed USB 3.2 Gen 1 SmartHub IC delivering 5 Gbps downstream bandwidth, housed in a 100-pin VQFN EP (12x12 mm) package with industrial temperature grade (-40C to +85C). It supports USB Type-C with integrated USB-C MUX logic, I2C and SPI management interfaces, and Microchip's MultiTRAK, ProTouch, and PortSwap signal-integrity features. A SmartHub is a USB hub that integrates system-level functions typically performed by a separate MCU or processor. In a typical USB topology, a hub sits between the host (root port) and downstream devices, repeating the differential data and managing power and protocol states. The SmartHub class adds vendor configuration, role-swap (USB-C DRP), GPIOs, and optional firmware-driven behaviors that offload the system processor, which is critical in space-constrained embedded designs. The USB5807C family sits in Microchip's hub-controller hierarchy above the USB251x 2.0-only hubs and below larger 10-port parts like the USB5744. Key features include full USB 3.2 Gen 1 (formerly 3.1 Gen 1 / USB 3.0) 5 Gbps SuperSpeed plus USB 2.0 High-Speed/Full-Speed/Low-Speed backward compatibility on all 7 enabled downstream ports, integrated FlexConnect role-swap, per-port battery charging support (BC1.2), and unique 1.2V/3.3V dual-rail operation that simplifies internal rail generation. Per-port USB-C MUX integration eliminates external crossbar switches, reducing BOM cost and PCB area in USB-C docking designs. Architecturally, the device combines a SuperSpeed USB 3.2 Gen 1 physical layer (PHY), a USB 2.0 PHY, an embedded microcontroller for hub repeater logic, configuration ROM/OTP, and an I2C/SPI slave for host MCU management. The 100-VQFN exposed-pad package provides thermal dissipation suitable for industrial ambient operation without external heatsinking. Typical applications include USB-C docking stations, automotive head-unit USB hubs, thin-client monitors with embedded USB, USB-C monitors, embedded industrial PCs, and any USB-C multiport expansion where role-swap and charging are required. The 12x12 mm VQFN with 0.4 mm pitch is footprint-compatible with the USB5744 family for tier-up/down design reuse. When designing with this device, allocate a 4-layer PCB stack-up to maintain 90 ohm differential impedance for SuperSpeed lanes. Decouple both the 1.2V core and 3.3V I/O rails with 100 nF plus 4.7 uF ceramic capacitors placed within 2 mm of the supply pins. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB layout notes that are not consolidated in the manufacturer datasheet alone, giving engineers a single reference for design-in decisions.
USB5807CT/KD - 7-Port USB 3.2 Gen 1 SmartHub, VQFN-100 | Microchip
The Microchip USB5807CT/KD is a 7-port, SuperSpeed (SS) USB 3.2 Gen 1 SmartHub controller IC delivered in a 100-pin VQFN (12 mm x 12 mm) package with exposed thermal pad. It is USB-IF compliant under TID1595 against the USB 3.2 Gen 1 specification, supports 5 Gbps Super-Speed plus 480 Mbps Hi-Speed, 12 Mbps Full-Speed, and 1.5 Mbps Low-Speed USB signaling, and exposes I2C/SPI host management interfaces for OEM configuration. Operating supply range is 1.08 V to 3.3 V with an operating temperature window of 0 C to +70 C for the commercial CT suffix variant. A USB hub controller is a specialized interface IC that aggregates one upstream USB port into multiple downstream ports while handling the protocol stack, port power management, and traffic scheduling. SmartHubs add OEM-configurable firmware layers (MultiTRAK, flexPORT, PortSplit) on top of the standard hub state machine, enabling per-port behavior tuning, custom charging profiles, and signal-integrity adjustments without external logic. Within the broader IC hierarchy, USB5807CT/KD belongs to Interface ICs > USB Hubs > USB 3.x Hub Controllers > Power-Managed SmartHub family. Key features include 7 downstream ports configurable as USB 3.2 Gen 1 or USB 2.0, native USB Type-C support via integrated MUX logic, MultiTRAK and PortSplit technology for per-port tuning, I2C and SPI host management interfaces, and Broadcom/Microchip-proprietary low-power states with optimized thermal dissipation. The VQFN-100 package provides a compact 12 mm x 12 mm footprint suitable for embedded designs and dock/monitor applications where board area is constrained. The device uses a low-power architecture with embedded USB 3.x PHYs and a configurable hub feature ROM accessed via SPI. PortSplit allows simultaneous USB 3.x and USB 2.0 operation on the same downstream port, enabling embedded USB 3.x peripherals alongside legacy USB 2.0 devices without external muxes. Driver compatibility covers Microsoft Windows 10/8/7/XP, Apple OS X 10.4+, and mainstream Linux hub drivers, removing the need for custom host stacks. Typical applications include USB-C docking stations, multi-port USB hubs, monitors with integrated USB expansion, embedded industrial USB fan-out, and Type-C breakout boards. Choose USB5807CT/KD when a 7-port SS hub with OEM-tunable power/charging profiles is required in a thermally-constrained enclosure. When designing with this part, ensure adequate copper area under the exposed pad and route SuperSpeed pairs with 90 ohm differential impedance. The host MCU must configure PortSplit, flexPORT, and charging parameters via I2C/SPI before downstream ports enumerate at full capability. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement (but do not replace) the manufacturer datasheet DS00002237D and Microchip configuration tools.
USB7056-I/KDX - 6-Port USB 3.2 Gen1 PD SmartHub | Microchip
The Microchip USB7056-I/KDX is a low-power, OEM-configurable 6-port USB 3.2 Gen 1 PD SmartHub controller in a 100-pin VQFN (12x12 mm) package with industrial temperature rating. It integrates a SuperSpeed USB 3.2 Gen 1 hub with native USB Type-C support, a legacy USB 2.0 hub for HS/FS/LS operation, and an on-board USB Power Delivery (PD) controller, providing 6 downstream ports with one Type-C upstream and five Type-A downstream configuration in the KDX pinout. A USB hub controller (USB 3.0/3.2 Gen 1 hub) is a semiconductor device that expands a single upstream USB port into multiple downstream ports, while managing enumeration, power, and protocol translation. The USB hub sits within the broader USB connectivity IC hierarchy: USB hub controller -> USB interface IC -> connectivity semiconductor -> IC. SmartHub variants add on-board PD negotiation and Type-C cable-orientation logic, eliminating the need for an external PD controller in Type-C sink/source designs. Key features include USB 3.2 Gen 1 (5 Gbps) SuperSpeed with native Type-C support, integrated USB PD 3.0 controller, broad host interfaces (GPIO, I2C, I2S, SPI, UART) for peripheral control, flexible GPIOs for status and indicators, integrated 5V LDO regulators for downstream VBUS, and support for battery charging (BC1.2) on each downstream port. The KDX suffix denotes the specific 100-VQFN lane mapping optimized for Type-C + 5x Type-A embedded designs. Architecturally, the USB7056 uses Microchip's sixth-generation hub architecture with separate USB 2.0 and USB 3.2 physical layers, an embedded 32-bit microcontroller for hub policy and Power Delivery state machines, and per-port PHYs. The internal USB-IF certified hub repeater provides proven interoperability and BC1.2 CDP/SDP/DCP charging modes are configurable per port. Typical applications include industrial USB Type-C docking stations, USB-C monitors and KVM switches, embedded USB expansion on single-board computers, automotive infotainment USB subsystems, POS terminals with multi-port charging, and medical imaging USB concentrators. Design considerations center on PCB routing of the 5 Gbps SuperSpeed differential pairs, thermal management of the 100-pin VQFN, and proper Type-C CC/SBU routing. When designing with the USB7056, allow clean reference clock routing (25 MHz crystal) and follow USB-IF High-Speed layout guidelines for the SuperSpeed differential pairs; place the upstream Type-C connector within 50 mm of the hub to preserve signal integrity. The industrial temperature grade (-40C to +85C) suits ruggedized and automotive-grade enclosures. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design guidance not aggregated on the manufacturer datasheet.