PMIC Especializado
Produtos (6)
L9679P - Automotive Airbag IC, 100-TQFP | STMicroelectronics
The STMicroelectronics L9679P is an automotive-grade airbag system-on-chip IC designed for mid/high-end airbag modules and integrated safety markets, housed in a 100-pin TQFP (14x14 mm) package. The device integrates a power-management section, multiple squib drivers, sensor interfaces, and a SPI communication port, providing the core analog and digital functions required by a single-point or distributed airbag ECU. An automotive airbag IC is a specialized mixed-signal interface and power-management IC that combines high-voltage safing logic, low-impedance squib drivers, arming switches, and diagnostic loops in one die, allowing a single ASIC to replace several discrete blocks traditionally wired together in airbag electronic control units (ECUs). The L9679P belongs to the broader category of safety ASICs / specialized PMICs, sitting hierarchically under PMIC > specialized power management IC > safety ASIC > airbag IC > semiconductor. Key features include 4-channel squib drivers with integrated high-side and low-side switches, configurable deployment loops, programmable SPI-controlled thresholds, on-chip watchdog and diagnostic functions, and support for both 12V and 24V vehicle battery systems. The chip is qualified to AEC-Q100 stress-test standards required for in-vehicle safety electronics. The TQFP-100 (14x14 mm) package has a typical theta-JA around 45 C/W, suitable for thermally-constrained ECU boxes when paired with copper pour. Architecturally the L9679P uses ST's BCD (Bipolar-CMOS-DMOS) process, which allows 60 V-tolerant DMOS drivers, 5 V CMOS logic, precision bandgap references, and bipolar analog blocks to coexist on one die. This integration reduces ECU board area by roughly 30-40 percent compared with discrete airbag ASIC solutions and supports ISO 26262 functional-safety design methodologies. Typical applications include driver airbag modules, passenger airbag modules, side and curtain airbag modules, knee airbag modules, and seatbelt pretensioner interfaces. It can also serve integrated safety applications such as cut-off battery systems and pyrotechnic battery-disconnect units, where the high-side switch and diagnostic loops provide the same protections as in a squib channel. When designing with this device, place the SPI lines away from the high-current squib loop traces and add a low-ESR decoupling capacitor of at least 10 microfarad close to the battery pin to handle deployment transients. The pinout is dense at 0.5 mm pitch, so a 4-layer PCB with internal ground plane is recommended to meet automotive EMI/EMC and ESD requirements.
LTC1923EUH - TEC Cooler/Heater PWM Controller | Analog Devices
The Analog Devices LTC1923EUH is a high-efficiency thermoelectric cooler (TEC) pulse-width modulation controller housed in a 32-pin QFN (5x5 mm) exposed-pad package. It integrates two sets of complementary output drivers to drive a full H-bridge, providing bidirectional current control of a TEC element from a single 2.7 V to 5.5 V supply. The device is a specialized power management IC aimed at temperature-stabilized laser modules, photonic subsystems, and laboratory instrumentation. A thermoelectric cooler controller is a specialized PWM power-management IC that drives Peltier-effect modules used for precise heating and cooling. Unlike a general-purpose DC-DC controller, the LTC1923EUH integrates the bidirectional H-bridge drivers, soft-start, current limiting, and thermal feedback loops in one IC. It belongs to the broader hierarchy: TEC controller -> specialized PMIC -> power management IC -> semiconductor. This category converts electrical energy into a controlled thermal gradient with high efficiency, enabling sub-degree temperature set-point stability in optoelectronic and biomedical systems. Key features of the LTC1923EUH include a 225 kHz switching frequency for compact magnetics, integrated synchronous MOSFET gate drivers capable of several amps of bridge current, and an accurate temperature feedback loop using an external thermistor or RTD. It supports both unidirectional and bidirectional TEC operation, and the exposed pad provides a low 32-lead QFN thermal resistance for sustained switching currents. Supply current is typically 2 mA, and the operating temperature spans -40 °C to +85 °C for industrial environments. The LTC1923EUH uses a voltage-mode PWM architecture with synchronous rectification to maximize efficiency across the TEC's wide dynamic load range. The two complementary output pairs produce a true bidirectional H-bridge, allowing current direction reversal without external relay switching. Internal dead-time control and adaptive break-before-make logic prevent shoot-through, while programmable soft-start limits inrush current to the TEC element at power-up. Typical applications include temperature-controlled laser diode mounts for DWDM and Raman spectroscopy, optical transceiver modules, 5G optical components, DNA amplification (PCR) thermal blocks, and medical diagnostic instruments. In each case, the LTC1923EUH replaces a discrete op-amp + MOSFET + thermistor solution with a single IC, reducing PCB area and BOM cost. When designing with this IC, ensure the exposed pad is soldered to a sufficiently large copper pour (at least 1 square inch) to dissipate the gate-driver and bias losses. Decouple VCC with a 1 µF ceramic capacitor placed within 5 mm of the IC, and select the output inductor and TEC current-sense resistor using the formulas in the manufacturer's datasheet typical application circuit. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
The NXP MC34903CP5EK is a second-generation System Basis Chip (SBC) that integrates two 5.0 V/400 mA low-dropout regulators, a high-speed CAN transceiver, multiple wake-up inputs, and supervisory functions in a single 32-pin SOIC package, designed as an analog companion for MCUs in industrial modules. A System Basis Chip (SBC) is a category of power management IC that consolidates voltage regulation, communication transceivers (CAN, LIN, SPI), and housekeeping functions (watchdog, reset, wake-up) into one package. In the system hierarchy, an SBC sits between the raw battery/bus supply and the MCU, reducing PCB area, BOM count, and quiescent current versus discrete implementations. The MC34903 family targets industrial 12 V/24 V modules and complements NXP S08, S12, and Kinetis microcontroller families. Key features include two on-board 5.0 V LDO regulators rated at 400 mA each, a high-speed CAN physical layer compliant with ISO 11898-2/5, three configurable wake-up inputs (supporting cyclic sense, edge, and level wake-up), low-power standby with typical 2 mA quiescent current, and an operating voltage range of 5.5 V to 28 V with load-dump survivability up to 40 V. The device operates across -40 °C to +125 °C and is qualified to AEC-Q100 for automotive-grade reliability. Architecturally, the MC34903 combines an internal bandgap reference, dual series-pass LDOs with foldback current limit, a CAN transceiver with slope control for EMI reduction, and an SPI-controlled state machine that orchestrates normal, standby, sleep, and wake transitions. The high-speed CAN physical layer supports bit rates up to 1 Mbaud with recessive bus fault detection. Typical applications include industrial CAN nodes (sensors, actuators, motor inverters), automotive body and chassis ECUs, building automation gateways, and 24 V industrial sensor hubs. The 5.5 V to 28 V supply range suits both 12 V automotive and 24 V industrial rails, while the integrated HS-CAN eliminates the need for a standalone transceiver IC. When designing with this SBC, place 100 nF decoupling capacitors close to V1 and V2 output pins and add 4.7 µF to 10 µF bulk capacitance at each LDO output. Tie the unused wake-up inputs to GND through a 10 kΩ resistor to prevent false wake events. According to NXP, the high-speed CAN bus pins (CANH, CANL) require a 120 Ω split termination for proper signaling at 1 Mbaud. This page synthesizes distributor pricing, drop-in alternatives, application notes, and lifecycle status not always found in the manufacturer datasheet alone, helping engineers select the right SBC for industrial and automotive designs.
MC34904C3EK - 3.3V SBC PMIC, 2x LDO, 4 Wakeup, SOIC-32 | NXP
The NXP MC34904C3EK is a second-generation System Basis Chip (SBC) combining two integrated 3.3V/400 mA low-dropout (LDO) regulators, four wake-up inputs, a high-speed CAN transceiver, and a SPI-controlled companion interface for an external MCU. Packaged in a 32-pin SOIC with exposed pad (SOIC-32 EP), it targets industrial module designs where multiple regulated rails, wake-on-activity behavior, and a robust in-vehicle network interface must coexist on a single die. The two parallel 3.3V LDO outputs serve a host MCU core and a 5V-tolerant CAN domain simultaneously, eliminating external regulation stages and shrinking BOM count. An SBC (System Basis Chip) is a power management + communication companion IC that integrates voltage regulators, physical-layer transceivers, supervisory functions, and wake-up logic around an automotive or industrial microcontroller. Within the broader hierarchy, the MC34904C3EK belongs to the power management IC (PMIC) class, specialized for body and chassis modules, and is paired with an MCU through a standardized SPI status/control link. This consolidation lowers quiescent current in sleep mode, centralizes fault handling, and standardizes software drivers across module variants. Key features include 400 mA continuous current per LDO, a high-speed CAN interface compliant with ISO 11898, four configurable wake-up inputs with edge detection, programmable watchdog timer, and low quiescent current in standby mode. The device operates over a wide supply range suitable for 12V automotive bus rails, and the exposed thermal pad on SOIC-32 supports sustained load dissipation with proper board copper. Multiple reset sources and a fail-safe state machine reduce software complexity for the host MCU. Architecturally, the MC34904C3EK uses bandgap-referenced linear regulation with separate analog and digital grounds to minimize digital switching noise coupling into the analog 3.3V rail. The integrated CAN transceiver supports up to 1 Mbit/s classical CAN frames with slope control for EMI mitigation. The wake-up logic is debounced and interrupt-mapped to a single GPIO line, allowing software to poll a register rather than service four separate interrupt vectors. Typical applications include industrial CAN node modules, building automation controllers, body control modules, sensor hubs, and HVAC actuator drivers. The two-LDO + CAN combination is especially well suited to 12V-bus-powered sensor and actuator nodes where size, cost, and standby current must be minimized simultaneously. When designing with this device, allocate sufficient board copper under the exposed pad and place both LDO output capacitors within 2 mm of their respective pins to maintain load-step regulation. The wake-up inputs require proper debouncing configuration in software to avoid false wakes on noisy industrial lines. This page consolidates distributor pricing, drop-in alternatives within the NXP SBC family, and design notes not found in the manufacturer datasheet alone.
MCZ33797EKR2 - 4-Channel Squib Driver IC | NXP Semiconductors
The NXP MCZ33797EKR2 is a four-channel squib driver IC engineered as a complete squib diagnostic and deployment interface for automotive air bag modules, housed in a 32-pin SOIC (0.295", 7.50 mm width) package and shipped on tape-and-reel. The device integrates high-side and low-side drivers per channel, deploy loops with dual high-side and dual low-side FETs, and a dedicated diagnostic interface for monitoring squib resistance, short-circuit, open-circuit, and battery-voltage conditions during assembly and in-vehicle service. A squib driver is a specialized interface IC within the automotive safety and power management hierarchy (squib driver -> airbag deployment IC -> automotive safety IC -> integrated circuit) that sits between the airbag electronic control unit (ECU) and the pyrotechnic initiator in the inflator. Its primary role is to deliver a controlled, high-current deployment pulse on command from the ECU, while continuously monitoring squib health so the system can detect a missing, shorted, or aged initiator before it becomes a safety liability. Key features include four independent deployment channels, programmable deployment current and timer profiles, integrated diagnostic functions (squib resistance measurement, short-to-ground, short-to-battery, and open-load detection), an SPI-compatible serial communications interface for ECU command/status exchange, and built-in fault counters. The device operates over the automotive battery range and is qualified to operate from -40 C to +85 C ambient. It includes watchdog and fault-output pins and supports both single-point and dual-point deployment configurations. Technically, each channel combines a deploy high-side FET, deploy low-side FET, and a diagnostic analog front end. The diagnostic engine performs ratiometric resistance measurements against internal references, enabling detection of squib values outside the safe envelope. Deployment is initiated via SPI commands and executed with hardware handshaking to ensure deterministic timing. Typical applications include driver-side airbag modules, passenger-side airbag modules, side-curtain airbag modules, knee airbag modules, and seat-belt pretensioner modules. Most commonly used by Tier-1 airbag ECU suppliers building dual-stage inflator systems where each squib is independently controllable and diagnosable. Design consideration: the deployment energy is delivered by energy stored on bulk capacitors, so the board must include low-ESR bulk capacitance sized for the worst-case deployment profile. Pin 1 orientation and SOIC-32 pinout should be cross-checked against the manufacturer datasheet before PCB layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer product page.
TPS65981ABTRTQR - USB Type-C PD Controller, 56-VQFN | TI
The Texas Instruments TPS65981ABTRTQR is a stand-alone USB Type-C and USB Power Delivery (PD) controller with integrated power switch and high-speed multiplexer, housed in a 56-pin VQFN (RTQ) 8x8 mm package with exposed thermal pad. The device operates across an industrial temperature range of -40C to +105C and integrates fully managed power paths providing up to 3 A downstream at 5 V for legacy and Type-C USB power applications. A USB Type-C controller and Power Delivery IC is a specialized power management device that implements the USB-C cable-plug/orientation detection, the USB PD 2.0 contract negotiation, port-power switching, and high-speed signal multiplexing needed to make a USB-C port function on a host, hub, dock, or notebook. These devices sit in the power management IC (PMIC) family and provide the glue logic between a USB-C connector and an application processor, display controller, or PCIe/USB3.1 mux. Key features include cable-plug and orientation detection at the USB Type-C connector, integrated high-speed multiplexer for USB SS (SuperSpeed) lines, full USB PD 2.0 contract negotiation, up to 3 A port power switching, and field-upgradeable firmware via I2C. The integrated mux switches USB SS pairs based on CC pin orientation, eliminating the need for an external mux IC in most USB-C designs. Typical applications include notebook and laptop USB-C ports, USB-C docking stations, USB-C monitors, Thunderbolt alternate-mode adapters, and USB-C wall chargers. The 56-VQFN 0.5 mm pitch footprint is compatible with 2-layer PCB manufacturing, lowering board cost compared with BGA USB-C controllers. When designing with this device, ensure the CC pull-up/pull-down resistors meet USB-C current advertisement requirements and that the high-speed mux traces are length-matched within the USB3.1 differential pair specification. The TPS65981 requires firmware configuration for each application profile - download the latest configuration tool from TI before laying out the PCB.