10CL006ZE144I8G vs 10CL016ZE144I8G Comparação
Comparação detalhada lado a lado de 10CL006ZE144I8G por Altera e 10CL016ZE144I8G por Altera. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10CL006ZE144I8G | 10CL016ZE144I8G |
|---|---|---|
| Marca | Altera | Altera |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $35,88 | $18,40 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Cyclone 10 LP | — |
| Logic Cell Count | 6,272 cells | — |
| Embedded Memory | 276,480 bits | — |
| User I/O Count | 88 I/O | — |
| Package Type | 144-pin LQFP with exposed pad | — |
| Tipo de montagem | Surface Mount | — |
| Programmable Logic Technology | FPGA | — |
| Configuration Storage Technology | [DATA_NEEDED: configuration memory technology] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Faixa de temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Speed Grade | [DATA_NEEDED: speed grade] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone 10 LP |
| Family | — | Cyclone 10 LP (10CL016) |
| Logic Elements (LE) | — | 15,408 |
| Number of Logic Array Blocks | — | 942 |
| Number of LABs/CLBs | — | 942 LAB |
| Total Memory Bits | — | 516,096 bit |
| Embedded Memory (M9K blocks) | — | 56 blocks |
| 18x18 Multipliers | — | 56 |
| PLLs | — | 4 |
| User I/O Pins | — | 78 |
| I/O Banks | — | 8 |
| Encapsulamento | — | 144-LQFP Exposed Pad (EQFP-144) |
| Temperatura de operação | — | -40C to +100C (Industrial) |
| Configuration Method | — | In-system flash (no external boot PROM required) |
| Process Node | — | 60 nm low-power CMOS |