10M40DAF256C7G vs 10M40DCF256C8G Comparação
Comparação detalhada lado a lado de 10M40DAF256C7G por Intel e 10M40DCF256C8G por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | 10M40DAF256C7G | 10M40DCF256C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $46,83 | $71,80 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | MAX 10 | MAX 10 |
| Non-volatile FPGA | Yes | — |
| Number of Logic Elements | 40000 | — |
| Total RAM Bits | 1290240 bits | — |
| Embedded Memory | 1.23 Mbit | — |
| Number of User I/Os | 178 | — |
| Core Supply Voltage | 1.2 V | — |
| Minimum Operating Temperature | 0C | — |
| Maximum Operating Temperature | +85C | — |
| Encapsulamento / Caixa | FBGA-256 (256-LBGA) | — |
| Package Body Size | 17 mm x 17 mm | — |
| Package Pitch | 1 mm | — |
| Estilo de montagem | SMD/SMT | — |
| Packaging Type | Tray | — |
| Status RoHS | Compliant | Compliant |
| Device Option Code | DAF256C7G | — |
| ADC Input Count | [DATA_NEEDED: Number of analog-to-digital converter inputs] | — |
| Supported I/O Standards | [DATA_NEEDED: Supported I/O standards] | — |
| Configuration Modes | [DATA_NEEDED: Configuration modes supported] | — |
| Family | — | MAX 10 FPGA |
| Logic Elements (LE) | — | 40,000 |
| Embedded Memory (bits) | — | 1,290,240 |
| Tipo de memória | — | Embedded SRAM (block RAM) |
| Number of I/O | — | 178 (MAX) |
| Number of Logic Blocks / LABs | — | [DATA_NEEDED: LAB count] |
| Number of Registers | — | [DATA_NEEDED: register count] |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| On-die Flash | — | Yes (non-volatile configuration) |
| Integrated ADC | — | Yes (MAX 10 family feature) |
| Process Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Supply Voltage Range | — | [DATA_NEEDED: VCCINT/VCCIO range] |
| Speed Grade | — | -8 (fastest commercial) |
| Temperatura de operação | — | 0 °C to 85 °C (TJ, commercial, C-suffix) |
| Encapsulamento | — | 256-FBGA (F256, 17 mm × 17 mm) |
| Tipo de montagem | — | Surface Mount (BGA) |
| Terminal Finish | — | Lead-free / Pb-free (G suffix, RoHS) |
| Nível MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | Yes |
| Configuration Method | — | On-die flash (instant-on) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |
| AEC-Q100 | — | Not qualified (use I-suffix variants for industrial) |