5CSEBA4U23C8N vs 5CSEBA4U23C6N Comparação
Comparação detalhada lado a lado de 5CSEBA4U23C8N por Intel e 5CSEBA4U23C6N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
5CSEBA4U23C8N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C8N ✓ AtivoIntel
5CSEBA4U23C6N - Cyclone V SE SoC FPGA 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C6N ✓ AtivoComparação de especificações
| Parâmetro | 5CSEBA4U23C8N | 5CSEBA4U23C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $138,20 | $86,20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements (LE) | 40,000 | — |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Frequency | 600 MHz | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP count] | — |
| Multipliers | 18x18 dedicated multipliers | — |
| Maximum User I/O | 188 | — |
| Encapsulamento | 672-pin UBGA (UBGA-672, 23x23 mm) | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, CAN, UART, SPI, I2C, NAND, SDXC | — |
| Memory Controller (HPS) | DDR3/DDR3L/LPDDR2 with hard PHY | — |
| Temperatura de operação | [DATA_NEEDED: industrial Tj range] | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 40,000 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | — | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | — | 112 |
| HPS Processor Cores | — | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | — | 925 MHz |
| Hard Memory Controller | — | DDR3 / DDR3L / LPDDR2 |
| Core Voltage (VCC) | — | 1.1 V |
| General-Purpose FPGA I/Os | — | 188 |
| Transceivers | — | Not integrated on SE device |
| Temperatura de junção de operação | — | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | — | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |