A3P600-1FG484 vs A3P600-FG484 Comparação
Comparação detalhada lado a lado de A3P600-1FG484 por Microchip Technology e A3P600-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3P600-1FG484 - ProASIC3 600K-Gate Flash FPGA 484-FBGA | Microchip
A3P600-1FG484 ✓ AtivoMicrochip Technology
A3P600-FG484 - ProASIC3 600K-Gate Flash FPGA, 484-BGA | Microchip
A3P600-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3P600-1FG484 | A3P600-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $27,50 | $56,30 |
| System Gates | 600000 gates | — |
| Distributor Listing Resource Count | 110592 (per DigiKey listing) | — |
| User I/O | 235 | — |
| Embedded Memory | 13.5 kbit SRAM | Embedded block SRAM (18 kbit blocks) |
| System Performance | 272 MHz | 231 MHz |
| Process Technology | 130 nm flash | 130 nm, 7-layer metal flash |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V |
| Logic Family | CMOS | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | On-chip flash (non-volatile, instant-on) |
| Package Type | 484-ball FBGA, 1 mm ball pitch | — |
| Temperatura de operação | 0 to 70 C | 0C to +85C (TJ) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Speed Grade | -1 | — |
| Reprogrammability | Yes (JTAG reprogrammable) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | RoHS3 Compliant (lead-free per FGG variant) |
| I/O Supply Voltage | [DATA_NEEDED: VCCIO range] | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Total Gates | — | 600000 gates |
| Number of Registers | — | 13824 |
| VersaTiles (Logic Elements) | — | 13824 |
| Maximum User I/O | — | 235 I/O |
| Soft Processor Support | — | ARM Cortex-M1 (optional soft core) |
| Encapsulamento | — | 484-pin FBGA, 23x23 mm |
| Packaging | — | Tray |
| Programming | — | In-system programmable via JTAG, no external boot device |