A3P600-2FG256 vs M1AFS600-2FG256 Comparação

Comparação detalhada lado a lado de A3P600-2FG256 por Microchip Technology e M1AFS600-2FG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3P600-2FG256 A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip

A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip

A3P600-2FG256 ✓ Ativo
Microchip Technology
M1AFS600-2FG256 M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip

M1AFS600-2FG256 ✓ Ativo

Comparação de especificações

Parâmetro A3P600-2FG256 M1AFS600-2FG256
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $57,43 $46,75
Logic Family ProASIC3 —
System Gates 600000 gates 600000 gates
User I/O Count 177 —
Speed Grade -2 —
Maximum System Frequency 310 MHz —
Core Voltage 1.5 V —
Process Technology 130 nm CMOS flash —
Configuration Memory On-chip Flash (non-volatile) —
I/O Banks 4 —
Encapsulamento 256-FBGA (LBGA) —
Tipo de montagem Surface Mount —
Soft CPU Support Optional soft ARM —
Instant-On Operation Yes —
Temperatura de operação [DATA_NEEDED: operating temperature range] —
Embedded Memory [DATA_NEEDED: embedded memory bit count] —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Programmability Reprogrammable (flash) —
Series — M1AFS600 (Fusion)
Logic Elements — 110592
Embedded Processor — ARM Cortex-M1
Number of I/Os — 119 I/O
Core Supply Voltage — 1.5 V
Technology — 130 nm flash-based
Encapsulamento / Caixa — 256-LBGA (FBGA-256)
Estilo de montagem — SMD/SMT
Operating Temperature - Minimum — 0 C
Operating Temperature - Maximum — +70 C
Packaging — Tray
Analog Peripherals — Configurable analog block (Fusion mixed-signal)
On-chip Memory — Large flash memory blocks
Clock Management — On-chip clock generation and management (PLL)
Configuration — Flash-based, live at power-up, no external config PROM required
Maximum Operating Frequency — [DATA_NEEDED: maximum fabric operating frequency]

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