A3P600L-FGG484 vs A3P600-FGG484 Comparação

Comparação detalhada lado a lado de A3P600L-FGG484 por Microchip Technology e A3P600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
A3P600L-FGG484 A3P600L-FGG484 - 600K Gate Flash FPGA 484-BGA | Microchip

A3P600L-FGG484 - 600K Gate Flash FPGA 484-BGA | Microchip

A3P600L-FGG484 ✓ Ativo
Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ Ativo

Comparação de especificações

Parâmetro A3P600L-FGG484 A3P600-FGG484
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $54,90 $44,75
Family ProASIC3L ProASIC3
Equivalent Gates 600000 gates —
Logic Cells / CLBs 13824 —
User I/O 235 —
Maximum System Frequency 350 MHz 231 MHz
Core Voltage 1.2 V (1.2 V to 1.5 V supported) —
Technology 130 nm CMOS flash —
Configuration Memory On-chip flash (non-volatile, single chip) Flash-based (non-volatile, single chip)
Encapsulamento FBGA-484 (PBGA484) 484-Pin FBGA (FGG484)
Package Dimensions 23 x 23 mm —
Package Height 2.23 mm —
Ball Pitch 1 mm —
Tipo de montagem Surface Mount Surface Mount
Temperatura de operação [DATA_NEEDED: operating temperature range] —
Soft Processor Support ARM Cortex-M1 —
Status RoHS Green (RoHS compliant per Jotrin listing) Lead Free
Speed Grade Suffix Standard (no dash number in this ordering code) —
System Gates — 600K
Process Technology — 130 nm CMOS
Core Supply Voltage — 1.5 V
User I/O Count — 235
Terminal Form — Ball
Package Shape — Square BGA
Temperature Grade — Commercial
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Operating Temperature Minimum — 0 C
Operating Temperature Maximum — [DATA_NEEDED: maximum operating temperature]
Number of Logic Elements (LEs) — [DATA_NEEDED: logic element count]
Embedded Memory — [DATA_NEEDED: embedded SRAM capacity]

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