A3PE1500-1FG676I vs A3PE1500-2FGG676I Comparação
Comparação detalhada lado a lado de A3PE1500-1FG676I por Microchip Technology e A3PE1500-2FGG676I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE1500-1FG676I - ProASIC3E FPGA 1.5M Gates | Microchip
A3PE1500-1FG676I ✓ AtivoMicrochip Technology
A3PE1500-2FGG676I - ProASIC3E FPGA 1.5M Gates 444 I/O | Microchip
A3PE1500-2FGG676I ✓ AtivoComparação de especificações
| Parâmetro | A3PE1500-1FG676I | A3PE1500-2FGG676I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $65,89 | $0,00 |
| Family | ProASIC3E | ProASIC3E |
| System Gates | 1.5M | 1500000 |
| Logic Elements (CLBs) | 38400 | — |
| User I/Os | 444 | — |
| Total RAM Bits | 276480 | — |
| Max System Performance | 272MHz | — |
| Core Supply Voltage | 1.5V | 1.5 V |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| Process Technology | 130nm, 7-layer metal (6 copper), Flash-based CMOS | — |
| Package Type | FBGA-676 (27 x 27 mm, 1 mm pitch, 2.23 mm height) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Faixa de temperatura de operação | 0°C to 70°C (per DigChip listing) | — |
| Configuration | Non-volatile Flash (single-chip, live at power-up) | — |
| Programming | In-system programmable (ISP) via JTAG | — |
| Total Power Consumption | [DATA_NEEDED: total power consumption] | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Status RoHS | RoHS non-compliant (per DigChip listing) | — |
| Lead-Free Status | Contains lead (per DigChip listing) | — |
| Logic Elements / CLBs | — | 38400 |
| User I/O | — | 444 |
| Configuration Bits | — | 276480 |
| Maximum Frequency | — | 310 MHz (per Kynix/FPGAkey listing) |
| Technology | — | 130 nm CMOS flash |
| Speed Grade | — | -2 |
| Encapsulamento | — | 676-BGA (FBGA, square, 1.0 mm ball pitch) |
| Terminal Form | — | Ball |
| Number of Terminals | — | 676 |
| Temperature Grade | — | Industrial (I) |
| Programming Technology | — | Flash (nonvolatile, single-chip) |
| Soft ARM Support | — | Optional (per ProASIC3E datasheet) |