A3PE3000-1FG324I vs A3PE3000L-1FG324I Comparação
Comparação detalhada lado a lado de A3PE3000-1FG324I por Microchip Technology e A3PE3000L-1FG324I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000-1FG324I - ProASIC3E FPGA 3M Gates 324-FBGA | Microchip
A3PE3000-1FG324I ✓ AtivoMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000-1FG324I | A3PE3000L-1FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $196,00 | $135,00 |
| Logic Cells | 75264 | — |
| System Gates | 3000000 | 3000000 |
| Family | ProASIC3E | ProASIC3L Low Power Flash FPGA |
| Series | A3PE3000 | — |
| Number of I/Os | 221 | — |
| Maximum Operating Frequency | 272 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS flash |
| Encapsulamento / Caixa | 324-FBGA | — |
| Estilo de montagem | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Quiescent Supply Current | 25 mA | — |
| Configuration Memory | Flash (non-volatile, single-chip) | Non-volatile on-chip flash (single chip, secure) |
| Programming Type | In-system reprogrammable | — |
| Packaging | Tray | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | — | 221 |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Low Power Feature | — | Flash*Freeze technology |
| Temperatura de operação | — | -40C to +100C (industrial, I suffix) |
| Encapsulamento | — | 324-ball FBGA (FG324) |
| Tipo de montagem | — | Surface Mount |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |