A3PE3000-2FG484 vs A3PE3000-FG484 Comparação
Comparação detalhada lado a lado de A3PE3000-2FG484 por Microchip Technology e A3PE3000-FG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484 ✓ AtivoMicrochip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000-2FG484 | A3PE3000-FG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $152,00 | $139,75 |
| Family | ProASIC3E Flash FPGAs | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells (DFF-equivalent) | 75,264 | — |
| VersaTiles | 75,264 | — |
| User I/O | 341 | 341 |
| Embedded SRAM | 516,096 bits | — |
| Core Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm CMOS flash process | — |
| Maximum System Performance | 310 MHz | — |
| Speed Grade | -2 | — |
| Configuration | Non-volatile Flash (single-chip, instant-on) | — |
| Soft ARM Support | Yes (optional Cortex-M1 soft core) | — |
| Encapsulamento | 484-ball FBGA (FG484) | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height |
| Tipo de montagem | Surface Mount | Surface Mount |
| Operating Temperature (commercial) | 0C to +85C | — |
| Status RoHS | Non-G suffix (standard package); G-suffix variants are RoHS-compliant | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) |
| I/O Standards | Voltage-referenced I/O supported (VREF per minibank) | — |
| Logic Cells (DFEs) | — | 75264 |
| System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm flash CMOS |
| Configuration Memory | — | On-chip flash (non-volatile, single-chip) |
| Soft CPU Support | — | Optional soft ARM support |
| Differential I/O Standards | — | LVDS, LVPECL |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible |
| Packaging | — | Tray |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Embedded Memory | — | [DATA_NEEDED: embedded block RAM capacity] |