A3PE3000L-1FGG896M vs A3PE3000L-1FGG896 Comparação
Comparação detalhada lado a lado de A3PE3000L-1FGG896M por Microchip Technology e A3PE3000L-1FGG896 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
A3PE3000L-1FGG896M ✓ AtivoMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-1FGG896M | A3PE3000L-1FGG896 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $432,00 | $255,00 |
| Family | ProASIC3L (Flash FPGA) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Elements | 35 KLEs (per Mouser listing) | — |
| Number of I/O | 620 | — |
| Total Memory Bits (DigiKey listing) | 516096 | — |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Process Technology | 130 nm Flash | 130 nm flash |
| Configuration Technology | Flash (nonvolatile, single-chip) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Encapsulamento | 896-ball FBGA | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Tipo de montagem | Surface Mount | Surface Mount |
| Supply Voltage - I/O | as low as 1.2 V (per Microchip product page) | — |
| Speed Grade | -1 | -1 |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Cells | — | 75264 |
| User I/O | — | 620 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |