A3PE3000L-FG896I vs A3PE3000L-1FGG896 Comparação
Comparação detalhada lado a lado de A3PE3000L-FG896I por Microchip Technology e A3PE3000L-1FGG896 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
A3PE3000L-FG896I ✓ AtivoMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FG896I | A3PE3000L-1FGG896 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $255,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | 75264 |
| User I/O | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage (minimum) | 1.2 V | — |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Nonvolatile flash (single-chip) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) | — |
| Encapsulamento | 896-BGA (FBGA-896) | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (-I suffix) | — |
| Reprogrammability | Yes (in-system reprogrammable) | — |
| Status RoHS | RoHS Non-Compliant (per distributor listing) | — |
| Lead Free Status | Contains Lead (per distributor listing) | — |
| Speed Grade | [DATA_NEEDED: speed grade / grade code] | -1 |
| Faixa de temperatura de operação | [DATA_NEEDED: exact operating temperature range in C] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM block capacity] | — |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |